Transport system for wafer cassettes

Abstract

A wafer cassette transport system includes a carrier disk and a track compatible with the carrier disk. The carrier disk includes a base, a through hole, a wall, and a pair of first positioning features. The through hole is disposed at a center of the base, wherein the through hole has a first directional axis and a second directional axis perpendicular to the first directional axis. The wall extends from a surface of the base and surrounds the through hole, wherein the wall divides the base into an inner region and an outer region. Each of the first positioning features has a first horizontal height, and the first positioning features are arranged in the inner region and parallel to the first directional axis. The carrier disk is compatible with different types of wafer cassettes, and the carrier disk and the other wafer cassettes are compatible with the same track, thereby increasing the versatility and universality of wafer automation and reducing the production cost of a semiconductor factory.

Description

Technical Field

[0001] This invention relates to a wafer cassette transport system, and more particularly to different types of wafer cassette carrier disks. Background Technology

[0002] With the development of semiconductor factory automation, various automated wafer handling methods have emerged. Wafer cassettes are used to transport or store wafers during the process, protecting them from contamination. A single automated wafer handling unit is limited to a single-sized wafer cassette. If the wafer cassette sizes differ, multiple automated wafer handling units are required, increasing production costs and limiting the versatility of automated wafer handling. Furthermore, when a wafer fab produces different types of wafers (with the same-sized wafer cassette) but with varying cassette dimensions, different wafer types cannot satisfy all automated wafer handling units. Therefore, solutions to these problems are needed. Summary of the Invention

[0003] One embodiment of the present invention provides a transfer system for a wafer cassette. The transfer system includes a carrier disk and tracks compatible with the carrier disk. The carrier disk includes a base, a through-hole, a wall, a pair of first positioning features, a pair of second positioning features, a pair of third positioning features, and a pair of fourth positioning features. The through-hole is disposed at the center of the base, wherein the through-hole has a first direction axis and a second direction axis perpendicular to the first direction axis. The wall extends from the surface of the base and surrounds the through-hole, wherein the wall divides the base into an inner region and an outer region. The pair of first positioning features in the inner region have a first horizontal height and are arranged parallel to the first direction axis. The pair of second positioning features in the inner region have a second horizontal height and are arranged parallel to the first direction axis, wherein the first horizontal height is higher than the second horizontal height. The pair of third positioning features in the inner region have a third horizontal height and are arranged parallel to the first direction axis. The pair of fourth positioning features in the inner region have a fourth horizontal height and are arranged parallel to the first direction axis, wherein the third horizontal height is higher than the fourth horizontal height. The minimum distance between each first positioning feature and the second direction axis is greater than the minimum distance between each second positioning feature and the second direction axis. The minimum distance between each third positioning feature and the first direction axis is greater than the minimum distance between each fourth positioning feature and the first direction axis.

[0004] In some embodiments, the first and second directional axes intersect at the center of the through hole. The wall includes a first inner surface, a second inner surface, a third inner surface, and a fourth inner surface. The second and third inner surfaces are respectively connected to and perpendicular to the two sides of the first inner surface of the wall, with the second inner surface parallel to the third inner surface. The second and third inner surfaces are respectively connected to and perpendicular to the two sides of the fourth inner surface of the wall, with the first inner surface parallel to the fourth inner surface. The distance between the second inner surface of the wall and the first directional axis is greater than the minimum distance between each third positioning feature and the first directional axis.

[0005] In some embodiments, each of the first positioning features is disposed opposite to each other on both sides of a first direction axis, and the pair of first positioning features is disposed on a first inner surface of the wall. Each of the second positioning features is respectively connected to each of the first positioning features, and each of the second positioning features is disposed opposite to each other on a second inner surface or a third inner surface of the wall.

[0006] In some embodiments, each of the third positioning features is disposed opposite to both sides of the first direction axis, and each of the third positioning features is disposed opposite to both sides of the second or third inner surface of the wall. Each of the fourth positioning features is disposed opposite to both sides of the first direction axis, and each of the fourth positioning features is disposed opposite to both of the third positioning features.

[0007] In some embodiments, the transmission system further includes a fifth positioning feature having a fifth horizontal height, the fifth positioning feature being located in the inner region and arranged between the pair of first positioning features. The first and second horizontal heights are higher than the fifth horizontal height.

[0008] In some embodiments, the transmission system further includes a groove in the fifth positioning feature. A first direction axis passes through the center of the fifth positioning feature and the center of the groove. The minimum distance between each of the pair of second positioning features and the second direction axis is greater than the minimum distance between the groove of the fifth positioning feature and the second direction axis.

[0009] In some embodiments, the transmission system further includes a sixth positioning feature having a sixth horizontal height, the sixth positioning feature being located in the inner region. The distance between the fourth inner surface of the wall and the second direction axis is greater than the minimum distance between the sixth positioning feature and the second direction axis. The first direction axis passes through the center of the sixth positioning feature.

[0010] In some embodiments, the transmission system further includes a first gap channel and a second gap channel. The first gap channel divides each of the pair of third positioning features into two third parts and each of the pair of fourth positioning features into two fourth parts. The second gap channel divides the fifth positioning feature into two fifth parts and the sixth positioning feature into two sixth parts.

[0011] In some embodiments, the first positioning feature, the second positioning feature, the third positioning feature, and the fourth positioning feature extend from the surface of the base.

[0012] In some embodiments, the transmission system further includes a plurality of seventh positioning features having a seventh horizontal height and a plurality of eighth positioning features having an eighth horizontal height, the seventh and eighth positioning features being located in an inner area. The plurality of seventh positioning features are arranged at the four corners of the adjacent wall, and the seventh horizontal height is lower than the surface of the base. The plurality of eighth positioning features are arranged at the four corners of the adjacent wall, and the eighth horizontal height is lower than the surface of the base.

[0013] In some embodiments, the transmission system further includes multiple first wafer cassettes and second wafer cassettes of different types within the transmission system, with a carrier disk compatible with these first wafer cassettes. The length of the carrier disk is equal to the length of the second wafer cassette, and the width of the carrier disk is equal to the width of the second wafer cassette.

[0014] In some embodiments, the transmission system further includes a radio frequency identification tag disposed on the base and a pair of grip structures extending from the surface of the base, the pair of grip structures being disposed in the outer area. Attached Figure Description

[0015] The various aspects of the invention can be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be understood that, in accordance with standard industry practice, the various features are not drawn to scale. In fact, for clarity, the dimensions of the various features can be arbitrarily increased or decreased.

[0016] Figure 1 and Figure 2 This is a perspective view of a carrier disk according to an embodiment of the present invention.

[0017] Figure 3 for Figure 1 A top view of the carrier plate in the middle.

[0018] Figure 4 for Figure 1 A bottom view of the support plate in the middle.

[0019] Figure 5 This is a perspective view of a loading / unloading port according to some embodiments of the present invention.

[0020] Figure 6A For placing a wafer cassette according to an embodiment of the present invention Figure 1 A three-dimensional view of the support plate in the image, in which the walls of the support plate are not shown.

[0021] Figure 6B for Figure 6AThe wafer cassette is placed in Figure 1 A top view of the carrier plate in the middle.

[0022] Figure 6C for Figure 6A A bottom view of the wafer cassette.

[0023] Figure 7A For placing a wafer cassette according to an embodiment of the present invention Figure 1 A three-dimensional view of the support plate in the image, in which the walls of the support plate are not shown.

[0024] Figure 7B for Figure 7A The wafer cassette is placed in Figure 1 A top view of the carrier plate in the middle.

[0025] Figure 7C for Figure 7A A bottom view of the wafer cassette.

[0026] Figure 8A For placing a wafer cassette according to an embodiment of the present invention Figure 1 A three-dimensional view of the support plate in the image, in which the walls of the support plate are not shown.

[0027] Figure 8B for Figure 8A The wafer cassette is placed in Figure 1 A top view of the carrier plate in the middle.

[0028] Figure 8C for Figure 8A A bottom view of the wafer cassette.

[0029] Figure 9 This is a perspective view of a loading / unloading port according to some embodiments of the present invention.

[0030] Figure 10 This is a perspective view of a wafer cassette transport system according to some embodiments of the present invention.

[0031] Figure 11 and Figure 12 This is a perspective view of a carrier disk according to an alternative embodiment of the present invention.

[0032] Figure 13 for Figure 11 A top view of the carrier plate in the middle.

[0033] The symbols in the attached diagram are briefly explained as follows:

[0034] 1000, 1000A: Carrier plate; 1100: Base; 1100s: Surface; 1200: Through hole; 1300, 1310, 1320, 1330, 1340: Wall; 1310s, 1320s, 1330s, 1340s: Inner surface; 1400, 1410, 1420, 1430, 1440, 1450, 1460, 1470, 1480: Positioning features; 1420s: Side surface; 1 430s1, 1430s2: Side surfaces; 1430-1, 1430-2: Third part; 1440s1: Top surface; 1440s2: Side surfaces; 1440-1, 1440-2: Fourth part; 1450-1, 1450-2: Fifth part; 1460s1, 1460s2, 1460s3, 1460s4, 1460s5: Side surfaces; 1460-1, 1460-2: Sixth part; 150 0: Radio Frequency Identification (RFID) tag; 1600: Grip structure; 1700: Groove; 5000, 5000A: Loading / unloading port; 5100: Loading / unloading platform; 5200: Track; 6100: Protrusion; 6200: Bottom contact surface; 7100: Protrusion; 7200: Bottom contact surface; 8100: Protrusion; ss1, ss2, ss3, ss4, ss5, ss6, ss7, ss8, ss9 SS10, SS11: Side surfaces; A1: First direction axis; A2: Second direction axis; C1, C2, C3, C4: Wafer cells; D1, D2, D3, D4, D5, D6, D7, D8: Distances; G1, G2: Gap channels; H1, H2, H3, H4, H5, H6: Horizontal heights; S: Transmission system; T: Storage device; R, R1, R2: Grooves; Ri: Internal area; Re: External area; X, Y, Z: Directions. Detailed Implementation

[0035] The following discloses many different implementations or embodiments for achieving various features of the invention. Specific embodiments of components and arrangements are described below to simplify the invention. These are, of course, merely embodiments and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include an embodiment where the first and second features are formed in direct contact, or an embodiment where another feature may be formed between the first and second features so that the first and second features are not in direct contact. Furthermore, reference numerals or words may be repeated in different instances of the invention. The purpose of repetition is to simplify and clarify the description, not to define the relationships between the different implementations and configurations discussed.

[0036] It will be understood that although terms such as “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of the embodiments, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0037] In addition, spatial relative terms such as "below," "below," "lower than," "above," and other similar terms are used here for the convenience of describing the relationship between one element or feature and another element or feature in the figure. Spatial relative terms cover not only the orientation depicted in the figure, but also other orientations of the device during use or operation. The device may be oriented in other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein can be interpreted accordingly.

[0038] Please refer to Figures 1 to 3 . Figure 1 and Figure 2 A perspective view of a carrier disk 1000 according to an embodiment of the present invention. Figure 3 for Figure 1 Top view of the carrier plate 1000.

[0039] refer to Figure 1 The carrier plate 1000 includes a base 1100, a through hole 1200, a wall 1300, and a plurality of positioning features 1400. The through hole 1200 is located at the center of the base 1100. The wall 1300 extends from the surface 1100s of the base 1100 and surrounds the through hole 1200. The wall 1300 divides the base 1100 into an inner region Ri and an outer region Re. The plurality of positioning features 1400 includes first positioning features 1410 to eighth positioning features 1480. (See reference) Figure 3 The through-hole 1200 has a first directional axis A1 and a second directional axis A2 perpendicular to the first directional axis A1. The first directional axis A1 is parallel to direction X, and the second directional axis A2 is parallel to direction Y. In some embodiments, the first directional axis A1 and the second directional axis A2 intersect at the center of the through-hole 1200. In some embodiments, the carrier plate 1000 may be made of an antistatic plastic, such as ultra-high molecular weight polyethylene (UPE), polyoxymethylene (POM), or polyetheretherketone (PEEK).

[0040] refer to Figures 1 to 3The support plate 1000 has a wall 1300 formed by a first wall 1310 having a first inner surface 1310s, a second wall 1320 having a second inner surface 1320s, a third wall 1330 having a third inner surface 1330s, and a fourth wall 1340 having a fourth inner surface 1340s. The second inner surface 1320s and the third inner surface 1330s are respectively connected to and perpendicular to the two sides of the first inner surface 1310s of the wall 1300, and the second inner surface 1320s is parallel to the third inner surface 1330s. The second inner surface 1320s and the third inner surface 1330s are respectively connected to and perpendicular to the two sides of the fourth inner surface 1340s of the wall 1300, and the first inner surface 1310s is parallel to the fourth inner surface 1340s.

[0041] like Figure 1 and Figure 3 As shown in the carrier plate 1000, a pair of first positioning features 1410 having a first horizontal height H1 are located in the inner region Ri and arranged parallel to the first direction axis A1. Specifically, each of the pair of first positioning features 1410 is disposed opposite to each other on both sides of the first direction axis A1, and the pair of first positioning features 1410 is disposed on the first inner surface 1310s of the wall 1300. More specifically, the first positioning features 1410 extend along the direction Y, and one sidewall of the first positioning feature 1410 contacts the first inner surface 1310s of the wall 1300. The pair of first positioning features 1410 extends from the surface 1100s of the base 1100.

[0042] like Figure 1 and Figure 3 As shown in the carrier plate 1000, a pair of second positioning features 1420 having a second horizontal height H2 are located in the inner region Ri and arranged parallel to the first direction axis A1. Specifically, each of the pair of second positioning features 1420 is connected to each of the pair of first positioning features 1410, and each of the pair of second positioning features 1420 is disposed opposite to a second inner surface 1320s or a third inner surface 1330s of the wall 1300. More specifically, one sidewall of each second positioning feature 1420 contacts the first inner surface 1310s of the wall 1300, and the other sidewall of each second positioning feature 1420 contacts the second inner surface 1320s or the third inner surface 1330s of the wall 1300. This pair of second positioning features 1420 extends from the surface 1100s of the base 1100.

[0043] like Figure 1 and Figure 3As shown in the carrier plate 1000, a pair of third positioning features 1430, each having a third horizontal height H3, are located in the inner region Ri and arranged parallel to the first direction axis A1. Specifically, each of these third positioning features 1430 is disposed opposite to each other on both sides of the first direction axis A1, and each of these third positioning features 1430 is disposed opposite to each other on the second inner surface 1320s or the third inner surface 1330s of the wall 1300. More specifically, the third positioning features 1430 extend along the direction X, and one sidewall of the third positioning feature 1430 contacts the second inner surface 1320s or the third inner surface 1330s of the wall 1300. This pair of third positioning features 1430 extends from the surface 1100s of the base 1100.

[0044] like Figure 1 and Figure 1 As shown in the carrier plate 1000, a pair of fourth positioning features 1440, each having a fourth horizontal height H4, are located in the inner region Ri and arranged parallel to the first direction axis A1. Specifically, each of these fourth positioning features 1440 is disposed opposite to each other on both sides of the first direction axis A1, and each of these fourth positioning features 1440 is disposed opposite to each of these third positioning features 1430. More specifically, the fourth positioning features 1440 extend along the direction X, and one sidewall of each fourth positioning feature 1440 contacts one sidewall of each third positioning feature 1430. This pair of fourth positioning features 1440 extends from the surface 1100s of the base 1100.

[0045] like Figure 1 and Figure 3 As shown in the carrier plate 1000, a fifth positioning feature 1450 with a fifth horizontal height H5 is located in the inner region Ri and is disposed between the first positioning features 1410. The fifth positioning feature 1450 also includes a groove R in the fifth positioning feature 1450. In detail, the fifth positioning feature 1450 extends from the surface 1100s of the base 1100. The groove R extends downward to the surface 1100s of the base 1100. More specifically, a first direction axis A1 passes through the center of the fifth positioning feature 1450 and the center of the groove R.

[0046] like Figure 2 and Figure 3 As shown in the carrier plate 1000, a sixth positioning feature 1460 with a sixth horizontal height H6 is located in the inner region Ri. Specifically, one sidewall of the sixth positioning feature 1460 contacts the fourth inner surface 1340s of the wall 1300. The sixth positioning feature 1460 extends from the surface 1100s of the base 1100. More specifically, a first directional axis A1 passes through the center of the sixth positioning feature 1460.

[0047] like Figures 1 to 3As shown in the carrier plate 1000, a plurality of seventh positioning features 1470 with a seventh horizontal height are located in the inner area Ri. The plurality of seventh positioning features are arranged adjacent to the four corners of the wall 1300, and the seventh horizontal height is lower than the surface 1100s of the base 1100. Specifically, each seventh positioning feature 1470 is a circular groove in the base 1100. A plurality of eighth positioning features 1480 with an eighth horizontal height are located in the inner area Ri. The plurality of eighth positioning features are arranged adjacent to the four corners of the wall 1300, and the eighth horizontal height is lower than the surface 1100s of the base 1100. Specifically, each eighth positioning feature 1480 is an L-shaped groove in the base 1100.

[0048] It is understood that the first horizontal height H1 of the first positioning feature 1410 is the vertical distance between the top surface of the first positioning feature 1410 and the surface 1100s of the base 1100. Similar features are indicated by similar element symbols, and will not be described further here. Please refer to [reference needed]. Figure 2 and Figure 2 In some embodiments, the first horizontal height H1, the second horizontal height H2, the third horizontal height H3, the fourth horizontal height H4, and the fifth horizontal height H5 are not the same as each other. In some embodiments, the first horizontal height H1 is higher than the second horizontal height H2. In some embodiments, the third horizontal height H3 is higher than the fourth horizontal height H4. In some embodiments, the first horizontal height H1 is substantially the same as the fourth horizontal height H4. In some embodiments, the first horizontal height H1 and the second horizontal height H2 are higher than the fifth horizontal height H5. In some embodiments, the sixth horizontal height H6, the third horizontal height H3, and the height of wall 1300 are the same as each other.

[0049] Please refer to this again. Figure 1 The carrier tray 1000 also includes a radio frequency identification (RFID) tag 1500 and a pair of grip structures 1600. The RFID tag 1500 is disposed on the base 1100. The RFID tag 1500 is configured to send and receive information related to the carrier tray 1000 from wafer cassettes C1 / C2 / C3 located above the carrier tray 1000. The pair of grip structures 1600 extend from the surface 1100s of the base 1100 and are disposed within the outer area Re of the base 1100.

[0050] Please refer to this again. Figure 3The minimum distance D1 between each first positioning feature 1410 and the second direction axis A2 is greater than the minimum distance D2 between each second positioning feature 1420 and the second direction axis A2. The minimum distance D3 between each third positioning feature 1430 and the first direction axis A1 is greater than the minimum distance D4 between each fourth positioning feature 1440 and the first direction axis A1. The distance D8 between the second inner surface 1320s of the wall 1300 and the first direction axis A1 is greater than the minimum distance D3 between each third positioning feature 1430 and the first direction axis A1. The minimum distance D2 between each second positioning feature 1420 and the second direction axis A2 is greater than the minimum distance D5 between the groove R of the fifth positioning feature 1450 and the second direction axis A2. The distance D7 between the fourth inner surface 1340s of the wall 1300 and the second direction axis A2 is greater than the minimum distance D6 between the sixth positioning feature 1460 and the second direction axis A2.

[0051] Figure 4 for Figure 1 A bottom view of the support plate 1000. The support plate 1000 also includes a plurality of recesses 1700 disposed in the base 1100. The plurality of recesses 1700 are configured to accommodate the track 5200 (shown in the figure). Figure 5 and Figure 10 (in China) 1000 transport or storage pallets.

[0052] Various positioning features in the carrier disk 1000 are configured to limit the position of the wafer cassettes (for example, wafer cassettes C1, C2, and C3 as described below). Wafer cassettes C1, C2, and C3 will be positioned below... Figures 6A to 8C This will be discussed in detail later.

[0053] Please refer to Figures 5 to 8C . Figure 5 This is a perspective view of a load / unload port 5000 according to some embodiments of the present invention. Figures 6A to 6C Various views related to wafer cassette C1 are shown. Figures 7A to 7C Various views related to wafer cassette C2 are shown. Figures 8A to 8C Various views related to wafer cassette C3 are shown.

[0054] exist Figure 5 In the middle, wafer cells C1, C2, C3 and Figure 1The carrier tray 1000 is placed in the loading / unloading port 5000, and wafer cassettes C1, C2, and C3 are mounted on the carrier tray 1000. Here, wafer cassettes C1, C2, and C3 represent different types of wafer cassettes. The loading / unloading port 5000 includes a loading / unloading stage 5100 and a track 5200. The loading / unloading stage 5100 and track 5200 are located below the carrier tray 1000. An RFID reader (not shown) is located below the carrier tray 1000 and uses RFID tags 1500 to track, identify, and manage the wafer cassettes C1 / C2 / C3 above the carrier tray 1000 and the carrier tray 1000 (not shown). Figure 1 (Middle). An infrared sensor is mounted on track 5200 to determine the position of the carrier plate 1000 through through hole 1200.

[0055] Understandable Figure 5 The wafer cells C1, C2, and C3 shown can be respectively Figures 6A to 6C The wafer cassette C1 shown Figures 7A to 7C The wafer cassette C2 shown, or Figures 8A to 8C The wafer cassette C3 is shown. Furthermore, for clarity of discussion, Figures 6A to 8C Only the bottom portions of wafer cassettes C1, C2, and C3 are shown. Wafer cassettes C1, C2, and C3 are placed above the surface 1100s of the base 1100 and are assembled into the carrier tray 1000 via multiple positioning features and surfaces (including side and top surfaces). Each positioning feature in the carrier tray 1000 corresponds to a feature in wafer cassette C1, C2, or C3. In other words, the carrier tray 1000 is compatible with different types of wafer cassettes C1, C2, and C3.

[0056] Figure 6A According to an embodiment of the present invention, wafer cassette C1 is placed in... Figure 1 A perspective view of the carrier plate 1000, wherein the wall 1300 of the carrier plate 1000 is not shown for clarity. Figure 6B for Figure 6A The wafer cell C1 is placed in Figure 1 Top view of the carrier plate 1000. Figure 6C for Figure 6A A bottom view of wafer cell C1.

[0057] When the wafer cassette C1 is positioned on the surface 1100s of the base 1100, there will be two bottom contact surfaces 6200 (indicated by dashed lines), such as Figure 6C As shown. The bottom contact surface 6200 is the contact surface between the wafer cassette C1 and the surface 1100s of the carrier disk 1000. The wafer cassette C1 includes a pair of protrusions 6100, as shown. Figure 6A and Figure 6C As shown. Please refer to. Figure 3 , Figure 6B and Figure 6C One of the protrusions 6100 is configured to mate with the groove R of the fifth positioning feature 1450 of the carrier disk 1000. Please refer to... Figure 6B and Figure 6C Side surface SS1 of wafer cell C1 contacts side surface 1460s1 of sixth positioning feature 1460. Side surface SS2 of wafer cell C1 contacts side surface 1460s2 of sixth positioning feature 1460. Side surface SS3 of wafer cell C1 contacts side surface 1430s1 of third positioning feature 1430. It can be understood that side surfaces SS1, SS2, and SS3 are inclined or curved surfaces.

[0058] In other words, the bottom horizontal height of wafer cell C1 in the vertical direction (direction Z) is determined by the bottom contact surface 6200 of wafer cell C1. The horizontal position of wafer cell C1 in the directions X and Y is determined by the side surfaces ss1, ss2 and ss3 of wafer cell C1.

[0059] Figure 7A According to an embodiment of the present invention, wafer cassette C2 is placed in... Figure 1 A perspective view of the carrier plate 1000, wherein the wall 1300 of the carrier plate 1000 is not shown for clarity. Figure 7B for Figure 7A The wafer cassette C2 is placed in Figure 1 Top view of the carrier plate 1000. Figure 7C for Figure 7A A bottom view of wafer cell C2.

[0060] When wafer cell C2 is positioned on surface 1100s of base 1100, there will be two bottom contact surfaces 7200 (indicated by dashed lines), such as Figure 7C As shown. The bottom contact surface 7200 is the contact surface between the wafer cassette C2 and the surface 1100s of the carrier disk 1000. The wafer cassette C2 includes a plurality of protrusions 7100 adjacent to the four corners of the wafer cassette C2, as shown. Figure 7C As shown. Please refer to. Figure 3 , Figure 7B and Figure 7C Each protrusion 7100 is configured to mate with each seventh positioning feature 1470 of the carrier disk 1000. Please refer to... Figure 7B and Figure 7CThe side surface SS1 of wafer cell C2 contacts the side surface 1460s3 of the sixth positioning feature 1460. The side surface SS2 of wafer cell C2 contacts the side surface 1420s of the second positioning feature 1420. The side surface SS3 of wafer cell C2 contacts the top surface 1440s1 of the fourth positioning feature 1440. It can be understood that side surfaces SS1, SS2, and SS3 are inclined or curved surfaces.

[0061] In other words, the bottom horizontal height of wafer cell C2 in the vertical direction (direction Z) is determined by the protrusion 7100 and the bottom contact surface 7200 of wafer cell C2. The horizontal position of wafer cell C2 in the directions X and Y is determined by the side surfaces ss1, ss2 and ss3 of wafer cell C2.

[0062] Figure 8A According to an embodiment of the present invention, wafer cassette C3 is placed in... Figure 1 A perspective view of the carrier plate 1000, wherein the wall 1300 of the carrier plate 1000 is not shown for clarity. Figure 8B for Figure 8A The wafer cell C3 is placed in Figure 1 Top view of the carrier plate 1000. Figure 8C for Figure 8A A bottom view of wafer cell C3.

[0063] like Figure 8A and Figure 8C As shown, wafer cell C3 includes multiple protrusions 8100 at the four corners of wafer cell C3, and each protrusion 8100 has an L-shaped structure. Please refer to... Figure 3 , Figures 8A to 8C Each protrusion 8100 is configured to mate with each of the eighth positioning features 1480 of the carrier disk 1000. Please refer to... Figure 8B and Figure 8CSide surface ss1 of wafer cell C3 contacts the first inner surface 1310s of the first wall 1310. Side surface ss2 of wafer cell C3 contacts the second inner surface 1320s of the second wall 1320. Side surface ss3 of wafer cell C3 contacts the third inner surface 1330s of the third wall 1330. Side surface ss4 of wafer cell C3 contacts the side surface 1430s2 of the third positioning feature 1430 and the side surface 1440s2 of the fourth positioning feature 1440. Side surface ss5 of wafer cell C3 contacts the second inner surface 1320s of the second wall 1320. Side surface ss6 of wafer cell C3 contacts the fourth inner surface 1340s of the fourth wall 1340. Side surface ss7 of wafer cell C3 contacts the side surface 1460s4 of the sixth positioning feature 1460. Side surface SS8 of wafer cell C3 contacts side surface 1460s5 of sixth positioning feature 1460. Side surface SS9 of wafer cell C3 contacts fourth inner surface 1340s of fourth wall 1340. Side surface SS10 of wafer cell C3 contacts third inner surface 1330s of third wall 1330. Side surface SS11 of wafer cell C3 contacts side surface 1430s2 of third positioning feature 1430 and side surface 1440s2 of fourth positioning feature 1440. It is understood that side surfaces SS1 to SS11 are inclined or curved surfaces.

[0064] In other words, the bottom horizontal height of wafer cell C3 in the vertical direction (direction Z) is determined by the protrusion 8100 of wafer cell C3. The horizontal position of wafer cell C3 in the directions X and Y is determined by the side surface ss1 to the side surface ss11 of wafer cell C3.

[0065] Figure 9 This is a perspective view of a loading / unloading port 5000A according to some embodiments of the present invention. It is understood that... Figure 5 The wafer cells C1, C2, C3 and carrier disk 1000 in the middle are replaced with Figure 9 The wafer cassette C4 is placed in the load / unload port 5000A and is mounted on the load / unload stage 5100. In some embodiments, the bottom structure of the wafer cassette C4 is... Figure 4 The structures shown are identical; therefore, wafer cell C4 and wafer cells C1, C2, and C3 are all compatible with track 5200 (e.g., Figure 5 and Figure 10 (As shown).

[0066] Please refer to Figure 5 and Figure 9The width W of the carrier tray 1000 is the same as the width W of the wafer cassette C4. The length L of the carrier tray 1000 is the same as the length L of the wafer cassette C4. Compared to wafer cassette C4, wafer cassettes C1, C2, and C3 are wafer cassettes for smaller wafer sizes. For example, wafer cassettes C1, C2, and C3 may be 8-inch wafer cassettes, while wafer cassette C4 may be a 12-inch wafer cassette. In other embodiments, wafer cassettes C1, C2, and C3 may be 8-inch or 12-inch wafer cassettes, while wafer cassette C4 may be a 20-inch wafer cassette. However, wafer cassettes of other sizes may also be included within the scope of this invention. Wafer cassettes C1, C2, C3, and C4 are front-opening unified pods (FOUP). It is understood that the carrier tray 1000 may serve as a medium between wafer cassettes C1, C2, and C3 and track 5200.

[0067] Figure 10 This is a perspective view of a transport system S for wafer cassettes C1, C2, C3, and C4 according to some embodiments of the present invention. The transport system S includes a storage device T, a track 5200, and loading / unloading ports 5000 and 5000A. Wafer cassette C4 and wafer cassettes C1, C2, and C3 with carrier disks 1000 are housed in the storage device T. The track 5200 is configured to transport wafer cassettes C1, C2, C3, and C4. Since the bottom dimensions and structure of the carrier disk 1000 are the same as the bottom dimensions and structure of the wafer cassette C4, both the carrier disk 1000 and the wafer cassette C4 are compatible with the track 5200, thereby increasing the versatility and commonality of automated wafer transport. It is understood that the number of wafer cassettes C1, C2, C3, and C4 with carrier disks 1000 is not limited. Figure 10 The quantities shown in the figure.

[0068] Figure 11 and Figure 12 This is a perspective view of a carrier disk 1000A according to an alternative embodiment of the present invention. Figure 13 for Figure 11 Top view of the carrier plate 1000A. Figure 11 The carrier disk 1000A and Figure 1 The difference between the 1000 bearing disks in the middle is that... Figure 11 The carrier plate 1000A also includes a first gap channel G1 and a second gap channel G2.

[0069] like Figures 11 to 13As shown, the first gap channel G1 divides each third positioning feature 1430 into two third parts 1430-1 and 1430-2, and divides each fourth positioning feature 1440 into two fourth parts 1440-1 and 1440-2. The second gap channel G2 divides the fifth positioning feature 1450 into two fifth parts 1450-1 and 1450-2, and divides the sixth positioning feature 1460 into two sixth parts 1460-1 and 1460-2. Specifically, the groove R is divided into two grooves R1 and R2. More specifically, the first gap channel G1 divides the second wall 1320 into two second walls and the third wall 1330 into two third walls. The second gap channel G2 divides the first wall 1310 into two first walls and the fourth wall 1340 into two fourth walls.

[0070] exist Figures 11 to 13 In this drawing, the element symbols are repeated to indicate the same as those in the accompanying drawings. Figures 1 to 3 The same or similar features are shown, and the above description also applies to the embodiments described below, and the details therein will not be repeated. Furthermore, the above description... Figure 5 , Figure 6A , Figure 6B , Figure 7A , Figure 7B , Figure 8A , Figure 8B as well as Figure 10 The carrier disk 1000 in the middle can be replaced by Figure 11 The carrier disk 1000A in the middle. Figure 11 The bottom view of the carrier plate 1000A in the middle can be the same as Figure 4 The carrier disk in the middle is 1000.

[0071] This invention provides two types of carrier trays for wafer cassettes used in transport systems. The carrier trays of this invention are compatible with different types of wafer cassettes used for wafers of the same size (e.g., wafer cassettes C1, C2, and C3 are different wafer cassettes used for the same wafer size). The bottom dimensions and bottom structure of the carrier trays of this invention are the same as those of other wafer cassettes that do not require the carrier trays of this invention. Therefore, the carrier trays of this invention are compatible with other wafer cassettes on the same tracks, thereby increasing the versatility and adaptability of automated wafer transport and reducing production costs in semiconductor manufacturing plants.

[0072] The above description is merely a preferred embodiment of the present invention, but it is not intended to limit the scope of the present invention. Any person skilled in the art can make further improvements and changes on this basis without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims of this application.

Claims

1. A wafer cassette transmission system, characterized in that, include: The carrier disk includes: Base; A through hole is provided at the center of the base, wherein the through hole has a first directional axis and a second directional axis perpendicular to the first directional axis; A wall extends from the surface of the base and surrounds the through-hole, wherein the wall divides the base into an inner area and an outer area; A pair of first positioning features having a first horizontal height are located in the inner region and arranged parallel to the first direction axis; A pair of second positioning features having a second horizontal height are located in the inner region and arranged parallel to the first direction axis, wherein the first horizontal height is higher than the second horizontal height; A pair of third positioning features, having a third horizontal height, are located within the internal region and arranged parallel to the first direction axis; and A pair of fourth positioning features with a fourth horizontal height are located in the inner region and arranged parallel to the first direction axis, wherein the third horizontal height is higher than the fourth horizontal height. Wherein, the minimum distance between each of the first positioning features and the second direction axis is greater than the minimum distance between each of the second positioning features and the second direction axis. Wherein, the minimum distance between each of the third positioning features and the first direction axis is greater than the minimum distance between each of the fourth positioning features and the first direction axis; and The track is compatible with the support plate.

2. The wafer cassette transport system according to claim 1, wherein the first directional axis and the second directional axis intersect at the center of the via. The wall includes a first inner surface, a second inner surface, a third inner surface, and a fourth inner surface. The second inner surface and the third inner surface are respectively connected to and perpendicular to the two sides of the first inner surface of the wall, and the second inner surface is parallel to the third inner surface. The second inner surface and the third inner surface are respectively connected to and perpendicular to the two sides of the fourth inner surface of the wall, and the first inner surface is parallel to the fourth inner surface. The distance between the second inner surface of the wall and the first directional axis is greater than the minimum distance between each of the pair of third positioning features and the first directional axis.

3. The wafer cassette transport system according to claim 2, wherein each of the pair of first positioning features is disposed opposite to each other on both sides of the first direction axis, and the pair of first positioning features is disposed on the first inner surface of the wall. Each of the pair of second positioning features is connected to each of the pair of first positioning features, and each of the pair of second positioning features is disposed opposite to the second inner surface or the third inner surface of the wall.

4. The wafer cassette transport system according to claim 2, wherein each of the pair of third positioning features is disposed opposite to each other on both sides of the first direction axis, and each of the pair of third positioning features is disposed opposite to each other on the second inner surface or the third inner surface of the wall. Each of the fourth positioning features is positioned opposite to each other on the first direction axis, and each of the fourth positioning features is positioned opposite to each of the third positioning features.

5. The transfer system of the wafer cassette according to claim 2, further comprising a fifth positioning feature having a fifth horizontal height, the fifth positioning feature being located in the inner region and arranged between the pair of first positioning features, wherein the first horizontal height and the second horizontal height are higher than the fifth horizontal height.

6. The wafer cassette transport system of claim 5, further comprising a groove in the fifth positioning feature, wherein the first directional axis passes through the center of the fifth positioning feature and the center of the groove. The minimum distance between each of the second positioning features and the second direction axis is greater than the minimum distance between the groove of the fifth positioning feature and the second direction axis.

7. The wafer cassette transport system of claim 5 further includes a sixth positioning feature having a sixth horizontal height, the sixth positioning feature being located within the internal region. Wherein the distance between the fourth inner surface of the wall and the second directional axis is greater than the minimum distance between the sixth positioning feature and the second directional axis, The first directional axis passes through the center of the sixth positioning feature.

8. The wafer cassette transmission system according to claim 7 further includes a first gap channel and a second gap channel. The first gap channel divides each of the pair of third positioning features into two third parts, and divides each of the pair of fourth positioning features into two fourth parts. The second gap channel divides the fifth positioning feature into two fifth parts and the sixth positioning feature into two sixth parts.

9. The transfer system of the wafer cassette according to claim 1, wherein the pair of first positioning features, the pair of second positioning features, the pair of third positioning features and the pair of fourth positioning features extend from the surface of the base.

10. The wafer cassette transmission system of claim 1, further comprising a plurality of seventh positioning features having a seventh horizontal height and a plurality of eighth positioning features having an eighth horizontal height, the plurality of seventh positioning features and the plurality of eighth positioning features being located within the internal region. The plurality of seventh positioning features are arranged near the four corners of the wall, and the horizontal height of the seventh feature is lower than the surface of the base. The plurality of eighth positioning features are arranged near the four corners of the wall, and the horizontal height of the eighth feature is lower than the surface of the base.

11. The wafer cassette transmission system according to claim 1, further comprising a plurality of first wafer cassettes and second wafer cassettes of different types in the transmission system, wherein the carrier disk is compatible with the plurality of first wafer cassettes of different types, the length of the carrier disk is equal to the length of the second wafer cassette, and the width of the carrier disk is equal to the width of the second wafer cassette.

12. The transmission system of the wafer cassette according to claim 1, further comprising a radio frequency identification tag disposed on the base and a pair of grip structures extending from the surface of the base, the pair of grip structures being disposed in the outer area.

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