A multi-modal temperature difference control system integrating cold and heat sources

Abstract

The present application relates to a kind of cold and hot source integrated multimodal temperature difference control system, the multimodal temperature difference control system includes heating module, experimental cavity, refrigeration module, control panel, water-cooling heat sink module, power supply and box;Heating module, experimental cavity, control panel and water-cooling heat sink module are sequentially arranged from top to bottom;Experimental cavity is fixedly connected with heating module and control panel by thread with sealing ring;Refrigeration module is set to experimental cavity inner bottom;Experimental cavity is used to place experimental material;Water-cooling heat sink module is placed in box;Power supply is embedded on box;Control panel is used to control heating module, refrigeration module and water-cooling heat sink module to adjust experimental temperature.The above-mentioned multimodal temperature difference control system has the characteristics of high heat transfer efficiency, fast response, small volume, modularization, simple operation, test convenient, function rich.

Description

Technical Field

[0001] This invention relates to the field of testing technology, and in particular to a multimodal temperature difference control system integrating cold and heat sources. Background Technology

[0002] Energy is the foundation and driving force of economic and social development. Low- and medium-temperature waste heat is a promising sustainable and clean energy source. As is well known, heat energy harvesting is spontaneous, which broadens its applicability. If this low- and medium-temperature waste heat can be collected and then converted into electricity, it can effectively save energy and reduce environmental pollution. Currently, many technologies support waste heat harvesting. Among them, only thermoelectric generators can effectively harvest low-temperature waste heat. Therefore, developing thermoelectric charging equipment based on high-efficiency heat conversion materials is of great significance.

[0003] When assembling thermoelectric rechargeable wearable electronic devices, testing instruments are generally required to provide an adjustable and stable temperature difference between the cold and hot ends to simulate the temperature difference generated in real life. However, the development of laboratory temperature difference testing platforms that meet general standards is not mature. Often, basic performance tests, Seebeck coefficients of materials, and heat conversion efficiency are completed by building simple temperature difference devices. Simple devices are often limited in function and have unsatisfactory accuracy. Moreover, the lack of standardized testing instruments is not conducive to the evaluation of thermoelectric device performance and the diversified design of devices, and it is difficult to establish analytical models.

[0004] Therefore, it is urgent to develop a multimodal temperature difference control system that integrates cold and heat sources. Summary of the Invention

[0005] This invention provides a multimodal temperature difference control system integrating cold and heat sources. This multimodal temperature difference control system integrates cold and heat sources and features high heat transfer efficiency, fast response, small size, modularity, simple operation, convenient testing, and rich functionality.

[0006] To achieve the above objectives, the present invention provides the following technical solution: To achieve the above objectives, the present invention provides the following technical solution: A multimodal temperature difference control system integrating cold and heat sources, comprising a heating module, an experimental chamber, a cooling module, a control panel, a water-cooled heat dissipation module, a power supply, and a housing; The heating module, the experimental chamber, the control panel, and the water-cooled heat dissipation module are arranged sequentially from top to bottom; the experimental chamber is fixedly connected to the heating module and the control panel; The refrigeration module is located at the bottom of the experimental chamber and is fixedly connected to the top surface of the control panel; The experimental chamber is used to place experimental materials; The water-cooled heat dissipation module is placed inside the box and is used to dissipate heat for the cooling module; The power supply is mounted on the housing; The control panel is used to control the heating module, the cooling module, and the water-cooled heat dissipation module to adjust the experimental temperature, and to display the ambient temperature and humidity of the experimental chamber. It also serves as a cover for the water-cooled heat dissipation module.

[0007] Furthermore, the heating module consists of a cylindrical cavity and a lifting heating unit disposed inside the cylindrical cavity; The cylindrical cavity integrates a first temperature sensor and a humidity sensor. The cylindrical cavity has openings on the upper left and right sides, and vacuum hose connectors are sealed at the openings. The vacuum hose connector extends to the inner bottom of the cylindrical cavity via a connecting hose; The lifting heating unit is embedded in the middle of the cylindrical cavity and fixed with vacuum sealant, and consists of a miniature electric push rod arranged in the vertical direction and a heating plate hinged to the bottom end of the miniature electric push rod; The heating element is electrically connected to the PID heating controller of the control panel via wires; The PID heating controller is used to precisely control and display the temperature of the heating element; The miniature electric actuator is electrically connected to the forward and reverse controller of the control panel; The forward and reverse controller is used to control the raising and lowering of the miniature electric push rod, and the miniature electric push rod provides a constant pressure to press the experimental material against the top of the refrigeration module; The first temperature sensor is connected to the first temperature digital display of the control panel via a wire, and the humidity sensor is connected to the humidity digital display of the control panel via a wire.

[0008] Furthermore, the first temperature sensor and the humidity sensor are fixed to the partition inside the cylindrical cavity by ABS glue; The heating element is a rectangular heating element made of heat-resistant silicone rubber wrapped with a nickel-chromium alloy coil; a second temperature sensor for monitoring and controlling its temperature is provided on the upper surface of the heating element, and a third temperature sensor for monitoring the temperature of the upper surface of the experimental material is provided on the lower surface. The second temperature sensor is electrically connected to the PID heating controller via a wire.

[0009] The third temperature sensor is connected to the second temperature digital display of the control panel via a wire.

[0010] Furthermore, the experimental chamber is a cylindrical cavity with an open bottom, and a "sliding door" experimental platform formed by two movable cover plates is provided on the top surface; After the movable cover is opened, it is slowly lowered by the micro electric push rod, so that the heating element and the cooling element form a temperature difference structure to achieve "sandwich" heat conduction; The "sliding gate" experimental platform is equipped with two metal probes and a fourth temperature sensor; the metal probes are used to extract electrochemical data of the experimental materials; the fourth temperature sensor is connected to the third temperature digital display of the control panel by wires and is used to monitor the lower surface temperature of the experimental materials.

[0011] Furthermore, the cooling module consists of a semiconductor cooling chip disposed opposite to the heating chip and a cooling chip heat sink fixedly connected to the control panel; The heating surface of the semiconductor refrigeration chip is bonded to the top surface of the refrigeration chip heat sink with silicone grease, and the cooling surface of the semiconductor refrigeration chip is bonded to a fifth temperature sensor with copper tape. Coolant circulates in the heat sink of the thermoelectric cooler, which carries away the heat released by the thermoelectric cooler. The fifth temperature sensor and the semiconductor refrigeration chip are electrically connected to the PID refrigeration controller of the control panel via wires. The PID refrigeration controller is used to accurately control and display the temperature of the semiconductor refrigeration chip.

[0012] Furthermore, the control panel, serving as a functional control center and data display center, is equipped with the PID heating controller, the PID cooling controller, the first temperature digital display, the humidity digital display, the second temperature digital display, the third temperature digital display, the fourth temperature digital display, a water-cooled heat dissipation switch, a heating element switch, and a cooling element switch. The water-cooled heat dissipation switch is used to control the flow of coolant; The heating element switch is used to control the switching of the heating element; The thermoelectric switch is used to control the switching of the thermoelectric cooler.

[0013] Furthermore, the PID heating controller, the PID cooling controller, the first temperature digital display, the humidity digital display, the second temperature digital display, the third temperature digital display, the fourth temperature digital display, the water-cooled heat dissipation switch, the heating element switch, and the cooling element switch are formed on the control panel by 3D printing.

[0014] Furthermore, the water-cooled heat dissipation module also includes a coolant tank, heat sink, heat dissipation copper pipe, fan, coolant storage tank, circulating water pump, delivery pipe, and a sixth temperature sensor; The heat sink is attached to both sides of the coolant tank, and the coolant is cooled by the cooling surface of the heat sink; the heating surface of the heat sink is connected to the heat dissipation copper pipe, and the fan is used for heat equalization and dissipation. The coolant storage tank contains coolant; the coolant storage tank is connected to the coolant cooling tank via the circulating water pump and the delivery pipe. The cooling chip heat sink is connected to the coolant cooling tank and the coolant storage tank via a hose; The sixth temperature sensor is placed inside the coolant storage tank and connected to the fourth temperature digital display for monitoring the coolant temperature.

[0015] Furthermore, the power supply includes a three-prong socket, a main power switch, and a transformer; The transformer is electrically connected to the main power switch; The three-prong plug is connected to a 220V three-phase AC power supply.

[0016] Furthermore, the enclosure is a polytetrafluoroethylene (PTFE) enclosure.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The multimodal temperature difference control system of this invention integrates a heat source and a cold source, employing a "sandwich" heating method. Utilizing a one-dimensional steady-state heat transfer method, the experimental material is sandwiched between a cooling plate and a heating plate via a heating module and a cooling module. Thermal equilibrium is achieved through heat conduction, improving the stability, controllability, and accuracy of the experiment. First, the integrated heating and cooling modules allow for testing at different temperature differences, as well as independent testing at low temperatures as low as -50°C and high temperatures as high as 200°C. The set target temperature is dynamically adjusted via multi-level feedback through the control panel, and the constant temperature difference result is displayed on the control panel. Second, the lifting heating unit of the heating module adjusts the distance between the heating plate and the cooling plate according to the thickness of the experimental material. A miniature electric push rod provides constant pressure to compress the experimental material, eliminating the influence of pressure and allowing for better heat conduction within the material, resulting in more efficient heat transfer and more accurate test results. Third, the experimental chamber is equipped with a "sliding door" experimental platform. Closing the sliding cover of the experimental chamber allows for separate testing of the cold or heat source. Therefore, opening and closing the sliding cover enables testing in different forms, such as high temperature, low temperature, and temperature difference. The bimetallic probe built into the experimental platform can also output the physicochemical properties of the materials. Fourth, the cylindrical cavity of the heating module can create a vacuum testing environment, minimizing the impact of thermal radiation. It can also be used to introduce the required experimental atmosphere as needed, and temperature and humidity sensors enable real-time monitoring of temperature and humidity to ensure the consistency of the testing environment.

[0018] Compared with the prior art, the multimodal temperature difference control system of the present invention has the characteristics of high precision, fast response, small size, modularity, simple operation, convenient testing and rich functions. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the multimodal temperature difference control system of the present invention: Figure 2 for Figure 1 Cross-sectional views of the heating module, experimental chamber, and cooling module; Figure 3 for Figure 2 Three cross-sectional views of a medium vacuum hose connector; Figure 4 for Figure 2 Schematic diagram of the structure of the central lifting heating unit; Figure 5 for Figure 1 Schematic diagram of the experimental chamber in the middle; Figure 6 for Figure 1 A schematic diagram of the structure of the refrigeration module; Figure 7 for Figure 1 A schematic diagram of the control panel structure; Figure 8 for Figure 1 Schematic diagram of the water-cooled heat dissipation module; Figure 9 for Figure 8 Cross-sectional view of the water-cooled heat dissipation module (AA section); Figure 10 for Figure 8 Cross-sectional view of the water-cooled heat dissipation module (BB section); Figure 11 for Figure 8 Cross-sectional view of the water-cooled heat dissipation module (CC section); Figure 12 for Figure 1 A schematic diagram of the power supply structure.

[0020] Among them, 1-heating module, 2-experimental chamber, 3-cooling module, 4-control panel, 5-water-cooled heat dissipation module, 6-power supply, 11-cylindrical cavity, 12-lifting heating unit, 13-first temperature sensor and humidity sensor, 14-vacuum hose connector, 21-metal probe, 22-thread, 23-experimental platform, 24-fourth temperature sensor, 31-semiconductor cooling chip, 32-cooling chip heat sink, 33-fifth temperature sensor, 121-miniature electric actuator, 122-heating chip, 123-second temperature sensor, 124-third temperature sensor 125-Reverse rotation controller, 411-PID heating controller, 412-PID cooling controller, 421-Second temperature digital display, 422-Third temperature digital display, 423-Fourth temperature digital display, 424-Humidity digital display, 431-Heating element switch, 432-Cooling element switch, 433-Water cooling switch, 51-Coolant tank, 52-Heat sink, 54-Fan, 55-Coolant storage tank, 56-Circulating water pump, 57-Delivery pipe, 61-Triangular connector, 62-Main power switch, 63-Transformer. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This invention provides a multimodal temperature difference control system integrating cold and heat sources, such as... Figure 1As shown, the multimodal temperature difference control system includes a heating module 1, an experimental chamber 2, a cooling module 3, a control panel 4, a water-cooled heat dissipation module 5, a power supply 6, and a housing; the heating module 1, the experimental chamber 2, the control panel 4, and the water-cooled heat dissipation module 5 are arranged sequentially from top to bottom; the experimental chamber 2 is fixedly connected to the heating module 1 and the control panel 4 through a thread 22 with a sealing ring; Heating module 1 can generate high temperatures of 25℃ to 200℃; The cooling module 3 is located at the bottom of the experimental chamber 2 and is fixedly connected to the top surface of the control panel 4; the cooling module 3 can generate a low temperature of -50℃ to 25℃. Experimental chamber 2 is used to place experimental materials; the experimental materials are thermoelectric testing materials. The water-cooled heat dissipation module 5 is placed inside the box to dissipate heat for the cooling module 3; The power supply 6 is mounted on the enclosure; the enclosure can be a polytetrafluoroethylene enclosure. The control panel 4 is used to control the heating module 1, the cooling module 3 and the water-cooled heat dissipation module 5 to adjust the experimental temperature, and to display the ambient temperature and humidity of the experimental chamber 2. It also serves as a cover for the water-cooled heat dissipation module 5.

[0023] like Figure 2 and Figure 4 As shown, the heating module 1 consists of a cylindrical cavity 11 and a lifting heating unit 12 disposed inside the cylindrical cavity 11; the cylindrical cavity 11 integrates a first temperature sensor and a humidity sensor 13, and has openings on the upper left and right sides of the cylindrical cavity 11, with vacuum hose connectors 14 sealed at the openings; the first temperature sensor and the humidity sensor are fixed to the partition inside the cylindrical cavity 11 by ABS glue. The vacuum hose connector 14 extends to the inner bottom of the cylindrical cavity 11 via a connecting hose; the vacuum hose connector 14 is a pagoda-shaped vacuum hose connector 14, and can be available in three models: such as Figure 3 As shown, Model I is a combination of two pagoda-shaped vacuum hose connectors 14, with one end outside the cylindrical cavity 11 for connecting to a vacuum pump or serving as a gas input interface, and the other end connected to a hose that extends to the bottom of the cylindrical cavity 11; Model II is a pagoda-flat round hole plug connector combination, wherein the flat round hole plug is inside the cylindrical cavity 11 and is perforated for the circulation of experimental gas; Model III is a two-end flat round hole plug combination, where the flat round hole plug outside the cylindrical cavity 11 is not perforated, serving as a vacuum sealing function, and can be directly replaced with the pagoda connector of Model II; The lifting heating unit 12 is embedded in the middle of the cylindrical cavity 11 and fixed with vacuum sealant. It consists of a miniature electric push rod 121 arranged in the vertical direction and a heating plate 122 hinged to the bottom of the miniature electric push rod 121. The heating element 122 is electrically connected to the PID heating controller 411 of the control panel 4 via a wire. The heating element 122 is a rectangular heating element made of heat-resistant silicone rubber wrapped with a nickel-chromium alloy coil. The heating element 122 can be made into a rectangular heating element 122 of 4cm×4cm. A second temperature sensor 123 for monitoring and controlling its temperature is provided on the upper surface of the heating element 122, and a third temperature sensor 124 for monitoring the temperature of the upper surface of the experimental material is provided on the lower surface. The second temperature sensor 123 is electrically connected to the PID heating controller 411 via a wire. The third temperature sensor 124 is connected to the second temperature digital display 421 of the control panel 4 via a wire. The PID heating controller 411 is used to precisely control and display the temperature of the heating element 122; The miniature electric actuator 121 is electrically connected to the forward and reverse controller 125 of the control panel 4; the forward and reverse controller 125 is used to control the lifting and lowering of the miniature electric actuator 121, and provides a constant pressure to press the experimental material against the top of the cooling module 3 through the miniature electric actuator 121; the first temperature sensor is connected to the first temperature digital display of the control panel 4 through a wire, and the humidity sensor is connected to the humidity digital display 424 of the control panel 4 through a wire.

[0024] like Figure 5 As shown, experimental chamber 2 is a cylindrical cavity with an open bottom. The top surface is equipped with a sliding door-type experimental platform 23 formed by two movable cover plates. After the sliding cover plates are opened, they are slowly lowered by a miniature electric push rod 121, causing the heating element 122 and the cooling element to form a temperature difference structure, achieving "sandwich-style" heat conduction. The sliding door-type experimental platform 23 is equipped with two metal probes 21 and a fourth temperature sensor 24. The metal probes 21 are used to extract electrochemical data of the experimental materials. The fourth temperature sensor 24 is connected to the third temperature digital display 422 of the control panel 4 by wires and is used to monitor the lower surface temperature of the experimental materials. After the sliding cover plates are closed, experimental chamber 2 can also be used as a single-sided heating platform.

[0025] like Figure 6 As shown, the cooling module 3 consists of a semiconductor cooling chip 31 and a cooling chip heat sink 32 disposed opposite to the heating element 122. The heating surface of the semiconductor cooling chip 31 is bonded to the top surface of the cooling chip heat sink 32 with silicone grease, and the cooling surface of the semiconductor cooling chip 31 is opposite to the bottom surface of the heating element 122, and a fifth temperature sensor 33 is bonded thereto with copper tape. The bottom surface of the cooling chip heat sink 32 is fixedly connected to the top surface of the control panel 4. Coolant circulates in the cooling chip heat sink 32, which carries away the heat released by the semiconductor cooling chip 31. The fifth temperature sensor 33 and the semiconductor cooling chip 31 are electrically connected to the PID cooling controller 412 of the control panel 4 through wires. The PID cooling controller 412 is used to accurately control and display the temperature of the semiconductor cooling chip 31.

[0026] like Figure 7 As shown, the control panel 4 serves as the functional control center and data display center, and is equipped with a PID heating controller 411, a PID cooling controller 412, a first temperature digital display, a humidity digital display 424, a second temperature digital display 421, a third temperature digital display 422, a fourth temperature digital display 423, a water-cooled heat dissipation switch 433, a heating element switch 431, and a cooling element switch 432. The PID heating controller 411, PID cooling controller 412, first temperature digital display, humidity digital display 424, second temperature digital display 421, third temperature digital display 422, fourth temperature digital display 423, water-cooled heat dissipation switch 433, heating element switch 431, and cooling element switch 432 are formed on the control panel 4 by 3D printing.

[0027] The water-cooled heat dissipation switch 433 is used to control the flow of coolant; the heating element switch 431 is used to control the switching of the heating element 122; and the cooling element switch 432 is used to control the switching of the semiconductor cooling element 31.

[0028] like Figure 8 , Figure 9 , Figure 10 as well as Figure 11 As shown, the water-cooled heat dissipation module 5 also includes a coolant tank 51, heat sinks 52, heat dissipation copper pipes, a fan 54, a coolant storage tank 55, a circulating water pump 56, a delivery pipe 57, and a sixth temperature sensor. Multiple heat sinks 52 are attached to both sides of the coolant tank 51, and the coolant is cooled by the cooling surfaces of the heat sinks 52. The heating surfaces of the heat sinks 52 are connected to the heat dissipation copper pipes, and the fan 54 is used for heat equalization and dissipation. The coolant storage tank 55 stores coolant. The coolant storage tank 55 is connected to the coolant tank 51 via the circulating water pump 56 and the delivery pipe 57. The cooling fin heat sink 32 is connected to the coolant tank 51 and the coolant storage tank 55 via a flexible hose. The sixth temperature sensor is placed inside the coolant storage tank 55 and connected to a fourth temperature digital display 423 for monitoring the coolant temperature.

[0029] like Figure 1 and Figure 12 As shown, the power supply 6 includes a three-prong plug 61, a main power switch 62, and a transformer 63; the transformer 63 is electrically connected to the main power switch 62; the three-prong plug 61 is connected to a 220V three-phase AC power supply.

[0030] When using the above-mentioned multimodal temperature difference control system for temperature difference testing, the experimental material is placed on the semiconductor cooling chip 31. The micro electric push rod 121 is adjusted according to the thickness of the experimental material so that the heating element 122 fully contacts the experimental material and presses it tightly. If necessary, vacuuming and ventilation can also be performed. After setting the temperature and waiting for the temperature to stabilize, the test begins.

[0031] The aforementioned multimodal temperature difference control system integrates heat and cold sources, employing a "sandwich" heating method. Utilizing a one-dimensional steady-state heat transfer method, the experimental material is sandwiched between the heating and cooling plates via a heating module and a cooling module. Thermal equilibrium is achieved through heat conduction, improving the stability, controllability, and accuracy of the experiment. First, the integrated heating and cooling modules allow for testing at different temperature differences, as well as independent testing at low temperatures as low as -50℃ and high temperatures as high as 200℃. The set target temperature is dynamically adjusted via multi-level feedback through the control panel, and the constant temperature difference result is displayed on the control panel. Second, the lifting heating unit of the heating module adjusts the distance between the heating and cooling plates according to the thickness of the experimental material. A miniature electric push rod provides constant pressure, effectively eliminating the influence of pressure and allowing for better heat conduction within the material, resulting in more efficient heat transfer and more accurate test results. Third, the experimental chamber is equipped with a "sliding door" experimental platform. Closing the sliding cover of the experimental chamber allows for separate testing of the cold or heat source. Therefore, opening and closing the sliding cover enables testing in different forms, such as high temperature, low temperature, and temperature difference. The bimetallic probe built into the experimental platform can also output the physicochemical properties of the materials. Fourth, the cylindrical cavity of the heating module can create a vacuum testing environment, minimizing the impact of thermal radiation. It can also be used to introduce the required experimental atmosphere as needed, and temperature and humidity sensors enable real-time monitoring of temperature and humidity to ensure the consistency of the testing environment.

[0032] Compared with existing technologies, the above-mentioned multimodal temperature difference control system has the characteristics of high precision, fast response, small size, modularity, simple operation, convenient testing, and rich functions.

[0033] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the invention. Therefore, if these modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A multi-modal temperature difference control system with cold and heat source integration, characterized in that, It includes a heating module (1), an experimental chamber (2), a cooling module (3), a control panel (4), a water-cooled heat dissipation module (5), a power supply (6), and a housing; The heating module, the experimental chamber, the control panel, and the water-cooled heat dissipation module are arranged sequentially from top to bottom; the experimental chamber is fixedly connected to the heating module and the control panel; The refrigeration module is located at the bottom of the experimental chamber and is fixedly connected to the top surface of the control panel; The experimental chamber is used to place experimental materials; The water-cooled heat dissipation module is placed inside the box and is used to dissipate heat for the cooling module; The power supply is mounted on the housing; The control panel is used to control the heating module, the cooling module and the water-cooled heat dissipation module to adjust the experimental temperature, and to display the ambient temperature and humidity of the experimental chamber. It also serves as a cover for the water-cooled heat dissipation module. The heating module consists of a cylindrical cavity (11) and a lifting heating unit (12) disposed inside the cylindrical cavity; The cylindrical cavity integrates a first temperature sensor and a humidity sensor (13). The cylindrical cavity has openings on the left and right sides above it, and a vacuum hose connector (14) is sealed at the opening. The vacuum hose connector extends to the inner bottom of the cylindrical cavity via a connecting hose; The lifting heating unit is embedded in the middle of the cylindrical cavity and fixed with vacuum sealant. It consists of a miniature electric push rod (121) arranged in the vertical direction and a heating plate (122) hinged to the bottom of the miniature electric push rod.

2. The multi-modal temperature difference control system of claim 1, wherein, The heating element is electrically connected to the PID heating controller (411) of the control panel via a wire; The PID heating controller is used to precisely control and display the temperature of the heating element; The miniature electric actuator is electrically connected to the forward and reverse controller (125) of the control panel; The forward and reverse controller is used to control the raising and lowering of the miniature electric push rod, and the miniature electric push rod provides a constant pressure to press the experimental material against the top of the refrigeration module; The first temperature sensor is connected to the first temperature digital display of the control panel via a wire, and the humidity sensor is connected to the humidity digital display of the control panel via a wire.

3. The multimodal temperature difference control system according to claim 2, characterized in that, The first temperature sensor and the humidity sensor are fixed to the partition inside the cylindrical cavity by ABS glue; The heating element is a rectangular heating element made of heat-resistant silicone rubber wrapped with a nickel-chromium alloy coil; a second temperature sensor (123) for monitoring and controlling its temperature is provided on the upper surface of the heating element, and a third temperature sensor (124) for monitoring the temperature of the upper surface of the experimental material is provided on the lower surface. The second temperature sensor is electrically connected to the PID heating controller (411) via a wire; The third temperature sensor is connected to the second temperature digital display (421) of the control panel via a wire.

4. The multimodal temperature difference control system according to claim 3, characterized in that, The experimental chamber is a cylindrical cavity with an open bottom and a sliding door-type experimental platform (23) formed by two sliding cover plates on the top surface. After the movable cover is opened, it is slowly lowered by the micro electric push rod, so that the heating element and the cooling element form a temperature difference structure to achieve "sandwich" heat conduction; The "sliding gate" experimental platform is equipped with two metal probes (21) and a fourth temperature sensor (24); the metal probes are used to export the electrochemical data of the experimental materials; the fourth temperature sensor is connected to the third temperature digital display of the control panel by wires and is used to monitor the lower surface temperature of the experimental materials.

5. The multimodal temperature difference control system according to claim 4, characterized in that, The cooling module consists of a semiconductor cooling chip (31) disposed opposite to the heating chip and a cooling chip heat sink (32) fixedly connected to the control panel; The heating surface of the semiconductor cooling chip is bonded to the top surface of the cooling chip heat sink with silicone grease, and the cooling surface of the semiconductor cooling chip is bonded to the fifth temperature sensor (33) with copper tape. Coolant circulates in the heat sink of the thermoelectric cooler, which carries away the heat released by the thermoelectric cooler. The fifth temperature sensor and the semiconductor refrigeration chip are electrically connected to the PID refrigeration controller (412) of the control panel via wires. The PID refrigeration controller is used to accurately control and display the temperature of the semiconductor refrigeration chip.

6. The multimodal temperature difference control system according to claim 5, characterized in that, The control panel serves as the functional control center and data display center, and is equipped with the PID heating controller (411), the PID cooling controller (412), the humidity digital display (424), the first temperature digital display, the second temperature digital display (421), the third temperature digital display (422), the fourth temperature digital display (423), the water cooling switch (433), the heating element switch (431), and the cooling element switch (432). The water-cooled heat dissipation switch is used to control the flow of coolant; The heating element switch is used to control the switching of the heating element; The thermoelectric switch is used to control the switching of the thermoelectric cooler.

7. The multimodal temperature difference control system according to claim 6, characterized in that, The PID heating controller (411), the PID cooling controller (412), the humidity digital display (424), the first temperature digital display, the second temperature digital display (421), the third temperature digital display (422), the fourth temperature digital display (423), the water-cooled heat dissipation switch (433), the heating element switch (431), and the cooling element switch (432) are formed on the control panel by 3D printing.

8. The multimodal temperature difference control system according to claim 7, characterized in that, The water-cooled heat dissipation module also includes a coolant tank (51), heat sink (52), heat dissipation copper pipe, fan (54), coolant storage tank (55), circulating water pump (56), delivery pipe (57) and a sixth temperature sensor; The heat sink is attached to both sides of the coolant tank, and the coolant is cooled by the cooling surface of the heat sink; the heating surface of the heat sink is connected to the heat dissipation copper pipe, and the fan is used for heat equalization and dissipation. The coolant storage tank contains coolant; the coolant storage tank is connected to the coolant cooling tank via the circulating water pump and the delivery pipe. The cooling chip heat sink is connected to the coolant cooling tank and the coolant storage tank via a hose; The sixth temperature sensor is placed inside the coolant storage tank and connected to the fourth temperature digital display for monitoring the coolant temperature.

9. The multimodal temperature difference control system according to any one of claims 1-8, characterized in that, The power supply includes a three-prong socket, a main power switch, and a transformer; The transformer is electrically connected to the main power switch; The three-prong plug is connected to a 220V three-phase AC power supply.

10. The multimodal temperature difference control system according to any one of claims 1-8, characterized in that, The enclosure is made of polytetrafluoroethylene.

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