Electrochemical deposition system, visually locating deposition positions and method of correcting a mounting platform

Abstract

Electrochemical deposition system, visual positioning deposition position and installation platform correction method belong to the field of electrochemical metal additive manufacturing. The problem of difficult positioning of deposition sites for micro-nano manufacturing scale and the need to increase the number of visual systems to position the deposition position mode to cause the electrochemical deposition system to be heavy and large is solved. The system uses a glass nozzle and an overhead microscopic vision system to image, align the deposition site to be deposited with the nozzle tip. Since it also depends on the system to correct the levelness of the substrate installation platform to correct the deposition path, it is beneficial to the accurate control of the deposition shape. The present application is mainly used for the additive manufacturing of metals.

Description

Technical Field

[0001] This invention belongs to the field of electrochemical metal additive manufacturing, and relates to an electrochemical deposition system, a strategy for controlling the deposition position, and a method for correcting the mounting platform. Specifically, it is a system and method for three-dimensional layer-by-layer printing of metal using electrochemical reactions, which can precisely control the position of the metal deposit through the electrochemical deposition system. Background Technology

[0002] Meniscus electrochemical deposition (MECD) is an additive manufacturing method for metals. It involves forming a meniscus liquid bridge between a glass microtube filled with electrolyte and a conductive substrate, and then applying voltage to induce a reduction reaction in the electrolyte to fabricate the metal structure. MECD offers advantages such as simple fabrication and the elimination of the need for masks. However, in applications such as chip interconnects, precise positioning of the deposition site is crucial. The micro- and nano-scale fabrication process presents challenges to this positioning. Current technologies largely rely on increasing the number of vision systems to accurately locate the deposition site, resulting in a cumbersome and bulky system. These issues require further solutions. Summary of the Invention

[0003] The purpose of this invention is to solve the problem of difficulty in locating deposition sites at the micro-nano scale, and the problem that the electrochemical deposition system is heavy and bulky due to the need to increase the number of vision systems to locate the deposition site. This invention provides an electrochemical deposition system, a vision-based method for locating the deposition site, and a method for correcting the mounting platform.

[0004] The electrochemical deposition system includes an FPGA controller, a three-degree-of-freedom motion platform, a base, a glass nozzle, an anode, a cathode substrate, a humidity-keeping housing, a humidity retainer, a nozzle fixture, a current amplifier, a side-view microscopy system, and a top-view microscopy system.

[0005] An electrolyte is contained inside the glass nozzle. One end of the anode extends into the glass nozzle, and the other end is connected to the power supply terminal of the FPGA controller. The cathode substrate is placed on a three-degree-of-freedom motion platform via a substrate mounting platform. The three-degree-of-freedom motion platform is located on the base. A humidity-keeping housing covers the cathode substrate, and there is a gap between the housing and the three-degree-of-freedom motion platform. A humidity retainer is installed inside the humidity-keeping housing.

[0006] The current input terminal of the current amplifier is electrically connected to the cathode substrate, and the current output terminal of the current amplifier is connected to the data signal input terminal of the FPGA controller; the FPGA controller controls the movement of the three-degree-of-freedom motion platform according to the current output of the current amplifier.

[0007] The side-view microscopy system is used to acquire side-view images of a glass nozzle and a cathode substrate within the same field of view; the top-view microscopy system is used to acquire top-view images of a glass nozzle and a cathode substrate within the same field of view.

[0008] Preferably, the FPGA controller controls the movement of the three-degree-of-freedom motion platform based on the current output from the current amplifier in the following manner:

[0009] When the current output of the current amplifier exceeds the set threshold and continues for the set deposition time, the FPGA controller controls the three-degree-of-freedom motion platform to move.

[0010] Preferably, the electrochemical deposition system further includes a device for positioning the humidity-retaining housing, the side-view microscopic vision system, the top-view microscopic vision system, and the nozzle fixture;

[0011] The side-view microscopy system and the top-view microscopy system are implemented using side-view cameras and top-view cameras, respectively;

[0012] The glass nozzle can be a straight glass nozzle or a curved glass nozzle.

[0013] Humidity retainers are used to maintain the humidity inside the humidity retaining housing at 50%-60%;

[0014] The three-degree-of-freedom motion platform is a three-degree-of-freedom nanopiezoelectric platform that enables nanoscale positioning of the cathode substrate.

[0015] A method for visually locating deposition sites using an electrochemical deposition system, comprising the following steps:

[0016] A1. Calibrate the top-view field-of-view coordinate system of the top-view microscopic vision system The base coordinate system of the cathode substrate Angle between The top-view microscopic vision system is used to acquire top-view images of a glass nozzle and a cathode substrate within the same field of view.

[0017] A2. Calculate the position of the glass nozzle tip in the top-view coordinate system. coordinates within Values;

[0018] A3. In the top-down view coordinate system Select the coordinates of a deposition point within the area to be deposited. According to the included angle right and Perform a coordinate transformation to obtain the base coordinate system. The tip coordinates of the lower glass nozzle and coordinates of the deposition point Based on two coordinates and The deviation between the two points is controlled by moving the point to be deposited on the cathode substrate horizontally below the tip of the glass nozzle or by moving the tip of the glass nozzle horizontally above the point to be deposited on the cathode substrate, thereby achieving alignment between the tip of the glass nozzle and the point to be deposited.

[0019] Preferably, in step A3,

[0020] , .

[0021] Preferably, the included angle is obtained in step A1. The implementation method is as follows:

[0022] A11. Control the movement of the cathode substrate until it contacts the electrolyte in the glass nozzle, forming a liquid bridge and generating current. The electrolyte undergoes an electrochemical deposition reaction, and a deposition point No. 1 is deposited in the non-deposition area on the cathode substrate. Control the cathode substrate in its local substrate coordinate system. Inner edge Move a certain distance in the axial direction After making deposition point 1 appear in the field of view of the top-view microscopic vision system, the top-view image is preserved.

[0023] A12, Control the cathode substrate along Continue moving a certain distance along the axis And ensure that deposition point 1 still appears in the field of view of the top-view microscopic vision system, thus preserving the top-view image;

[0024] A13. After fusing the features of the two top-view images, determine the base coordinate system in the field of view of the top-view microscopic vision system based on the line connecting the two deposition points No. 1 in the fused image. of Axial direction, combined with the field of view coordinate system of The direction of the axis in the field of view coordinate system Internal determination Axial direction and axial direction angle and their included angle As the field of view coordinate system of the top-down microscopic vision system The base coordinate system of the cathode substrate The included angle.

[0025] Preferably, in step A2, the tip of the glass nozzle is calculated in the top-view coordinate system. coordinates within The method for obtaining the value is as follows:

[0026] The cathode substrate is controlled to move until it comes into contact with the electrolyte in the glass nozzle to form a liquid bridge and generate current. The electrolyte undergoes an electrochemical deposition reaction and a deposition point No. 2 is deposited in the non-deposition area on the cathode substrate.

[0027] Assuming the tip of the glass nozzle is in the field of view coordinate system The coordinates inside are In the base coordinate system Internal control cathode substrate along Move a certain distance in the axial direction Then, deposition point 2 appeared in the field of view coordinate system. Inside, in the field of view coordinate system Identify the coordinates of sediment point No. 2. At this time, the field of view coordinate system The coordinates of Inner No. 2 sedimentation point are still... Therefore, the tip of the glass nozzle in the field of view coordinate system is calculated. coordinates within .

[0028] A method for correcting the substrate mounting platform using an electrochemical deposition system is employed to obtain the substrate coordinate system where the cathode substrate is located. coordinate system of the three-degree-of-freedom motion platform The conversion relationship between the two is used to realize the control of the cathode substrate by the three-degree-of-freedom motion platform;

[0029] The cathode substrate is mounted on the substrate mounting platform, and the two are parallel; the three-degree-of-freedom motion platform is parallel to the horizontal plane and is used to drive the cathode substrate to move in three-dimensional space.

[0030] Preferably, the correction method includes the following steps:

[0031] B1. Control the three-degree-of-freedom motion platform to move vertically upwards, so that the glass nozzle contacts any three non-collinear points on the cathode substrate, and obtain the coordinate system of the three-degree-of-freedom motion platform. 3D coordinates of the three inner points , , These three points are not coplanar in the horizontal plane;

[0032] B2. Based on the three-dimensional coordinates of the three points , , Determine the normal vectors of the three points within the plane containing the cathode base, and thus obtain the angle between the normal vector of the plane containing the cathode base and the normal vector of the plane containing the three-degree-of-freedom motion platform. ;

[0033] B3. Based on the included angle Obtain the coordinate system of the three-degree-of-freedom motion platform The base coordinate system of the cathode substrate Rotation matrix between ; through rotation matrix Obtain the base coordinate system where the cathode substrate is located. Transform any point within the coordinate system into the coordinate system of the three-degree-of-freedom motion platform. The conversion relationships within are as follows: .

[0034] Preferably,

[0035] ;

[0036] in, , Let be the rotation vector. Let be the normal vector of the plane containing the cathode substrate. Let be the normal vector of the plane containing the three-degree-of-freedom motion platform. For the rotation vector in the base coordinate system of Components on the axis.

[0037] The beneficial effects of this invention are as follows:

[0038] 1. The electrochemical deposition system, visual positioning deposition location, and mounting platform correction method provided by this invention can achieve the manufacture of high-precision deposition structures. The deposition system has nanometer-level positioning accuracy and microsecond-level motion response, enabling precise control of the contact and disengagement movement between the substrate and the nozzle at the nanometer level, precise control of the conductive substrate's movement, and precise control of deposition time at the millisecond level. Furthermore, by correcting the substrate mounting platform—that is, correcting the flatness of the cathode substrate—and by calculating and correcting the deposition path, it facilitates precise control of the deposition shape.

[0039] 2. Achieve precise positioning of the deposition site. By using a glass nozzle and a top-view microscope for imaging, combined with relevant algorithms, the nozzle tip can be accurately moved to the deposition site, achieving alignment between the tip of the glass nozzle and the deposition point.

[0040] 3. The electrochemical deposition system has a simple structure and a simple positioning process. Only one top-view microscopic vision system is needed to accurately locate the deposition site. This avoids the defects of existing technologies that rely on increasing the number of vision systems to accurately locate the deposition position, namely, the defect that the tip of the glass nozzle cannot be accurately aligned with the point to be deposited. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the electrochemical deposition system described in this invention;

[0042] Figure 2 This is a schematic diagram showing the state when a liquid bridge is formed between the meniscus at the tip of the glass nozzle 1 and the cathode substrate 3;

[0043] Figure 3 This is a structural schematic diagram of a glass curved nozzle and its nozzle clamp.

[0044] Figure 4 It is to obtain the tip of glass nozzle 1 in the field of view coordinate system coordinates within A flowchart for obtaining values; Figure 5 This is a flowchart of the method for correcting the base mounting platform. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0047] Electrolyte within a glass nozzle forms a meniscus at the tip. Meniscus electrochemical deposition is a crucial method for achieving small-scale, high-precision metal additive manufacturing, playing a vital role in sensor manufacturing, electrical component manufacturing, and chip interconnection. To overcome the difficulties in locating deposition sites in traditional electrochemical deposition methods, and the resulting bulky and cumbersome systems due to the need to increase the number of vision systems for positioning, this invention provides an electrochemical deposition system, a vision-based method for locating deposition sites, and a mounting platform correction method. The invention mainly includes an electrochemical deposition mechanism, a substrate mounting platform horizontal correction strategy, and a visual positioning deposition position strategy: 1) The electrochemical deposition mechanism is used for coarse and fine positioning during the deposition process, and can clamp the glass microtube and control the precise movement of the conductive substrate; 2) The visual positioning deposition position strategy uses a top-view microscopic vision system to locate the deposition position, uses a glass straight tube or curved tube as a nozzle, observes the deposition site from the top-view microscopic vision system, and then uses a program to accurately locate the deposition position, so that the tip of the nozzle is aligned with the point to be deposited; 3) The substrate mounting platform horizontal correction strategy uses a three-degree-of-freedom motion platform to correct the levelness of the substrate plane and corrects the deposition path through calculation.

[0048] Detailed Implementation Method 1, see [link / reference] Figure 1This embodiment describes an electrochemical deposition system, which includes an FPGA controller, a three-degree-of-freedom motion platform, a base, a glass nozzle 1, an anode 2, a cathode substrate 3, a humidity-keeping housing 4, a humidity retainer 5, a nozzle clamp 6, a current amplifier, a side-viewing microscopy system, and a top-viewing microscopy system.

[0049] An electrolyte 7 is provided inside the glass nozzle 1. One end of the anode 2 extends into the glass nozzle 1, and the other end is connected to the power supply terminal of the FPGA controller. The cathode substrate 3 is placed on a three-degree-of-freedom motion platform through a substrate mounting platform. The three-degree-of-freedom motion platform is located on the base. The humidity holding shell 4 covers the cathode substrate 3 and there is a gap between it and the three-degree-of-freedom motion platform. A humidity holder 5 is provided inside the humidity holding shell 4.

[0050] The current input terminal of the current amplifier is electrically connected to the cathode substrate 3, and the current output terminal of the current amplifier is connected to the data signal input terminal of the FPGA controller; the FPGA controller controls the movement of the three-degree-of-freedom motion platform according to the current output of the current amplifier.

[0051] The side-view microscopic vision system is used to acquire side-view images of the glass nozzle 1 and the cathode substrate 3, which are in the same field of view; the top-view microscopic vision system is used to acquire top-view images of the glass nozzle 1 and the cathode substrate 3, which are in the same field of view.

[0052] When using an electrochemical deposition system for metal additive manufacturing, there are many additive manufacturing methods available, and the method can be set as needed. It is not limited to the methods described below. As an example, a specific electrochemical metal additive manufacturing method using an electrochemical deposition system is given below, including:

[0053] S1. Turn on the humidity retainer 5 to maintain the humidity in the humidity retainer housing 4 at 50%-60%, and the FPGA controller supplies power to the anode 2; as an example, the anode 2 can be made of copper.

[0054] S2. After moving the cathode substrate 3 below the glass nozzle 1, control the glass nozzle 1 to extend into the humidity-maintaining housing 4 and descend above the cathode substrate 3. At the same time, make the cathode substrate 3 and the glass nozzle 1 appear in the acquisition field of view of both the side-view microscopic vision system and the top-view microscopic vision system.

[0055] S3, the FPGA controller controls the movement of the cathode substrate 3 through a three-degree-of-freedom motion platform, so that the tip of the glass nozzle 1 is in the non-deposition area within the field of view of the top-view microscopic vision system;

[0056] S4. Calibrate the top-view field-of-view coordinate system of the top-view microscopic vision system. The base coordinate system of cathode substrate 3 Angle between ;

[0057] S5. Control the horizontal movement of the deposition point on the cathode substrate 3 to below the tip of the glass nozzle 1 or control the horizontal movement of the tip of the glass nozzle 1 to above the deposition point on the cathode substrate 3 to achieve alignment between the tip of the glass nozzle 1 and the deposition point.

[0058] S6, see also Figure 2 The cathode substrate 3 rises along a preset motion path until it contacts the electrolyte 7 inside the glass nozzle 1, forming a liquid bridge that generates current. The electrolyte undergoes an electrochemical deposition reaction to achieve metal deposition. When the current exceeds a set threshold and continues for a set deposition time, the FPGA controller controls the three-degree-of-freedom motion platform to detach the glass nozzle 1 from the cathode substrate 3, forming a metal deposition layer on the cathode substrate 3. This process of contacting and detaching the cathode substrate 3 from the electrolyte 7 inside the glass nozzle 1 is repeated to achieve metal additive manufacturing.

[0059] As an example, the anode 2 can be made of copper, the cathode substrate 3 can be made of gold-plated cathode, the electrolyte 7 can be a copper sulfate solution, and the metal growth structure on the substrate during electrochemical deposition is a copper metal part.

[0060] Furthermore, the FPGA controller controls the movement of the three-degree-of-freedom motion platform based on the current output of the current amplifier as follows: when the current output of the current amplifier exceeds a set threshold and continues for a set deposition time, the FPGA controller controls the movement of the three-degree-of-freedom motion platform. This method can control the timing of the separation of the cathode substrate 3 from the electrolyte 7 inside the glass nozzle 1, thereby controlling the deposition time.

[0061] The electrochemical deposition system further includes a device for positioning the humidity-retaining housing 4, the side-view microscopic vision system, the top-view microscopic vision system, and the nozzle fixture 6.

[0062] The side-view microscopy system and the top-view microscopy system are implemented using side-view cameras and top-view cameras, respectively;

[0063] Glass nozzle 1 is a straight glass nozzle or a curved glass nozzle;

[0064] Humidity retainer 5 is used to maintain the humidity in the humidity retaining housing 4 at 50%-60%;

[0065] The three-degree-of-freedom motion platform is a three-degree-of-freedom nanopiezoelectric platform, which enables nanoscale positioning of the cathode substrate 3.

[0066] In practical applications, to avoid the problem in existing technologies where increasing the number of vision systems is necessary to accurately position the deposition point on the cathode substrate 3 below the tip of the glass nozzle 1 (i.e., aligning the deposition point on the cathode substrate 3 with the glass nozzle 1), a visual positioning method for deposition is provided, as detailed in Specific Implementation Method Two.

[0067] Detailed implementation method two, see below. Figure 1 This embodiment describes a method for visually locating deposition positions using the electrochemical deposition system described in Embodiment 1. This method includes the following steps:

[0068] A1. Calibrate the top-view field-of-view coordinate system of the top-view microscopic vision system The base coordinate system of cathode substrate 3 Angle between The top-view microscopic vision system is used to acquire top-view images of the glass nozzle 1 and the cathode substrate 3, which are within the same field of view.

[0069] As an example: Obtaining the included angle in step A1 The implementation method is as follows:

[0070] A11. Control the movement of the cathode substrate 3 until it contacts the electrolyte in the glass nozzle 1, forming a liquid bridge and generating current. The electrolyte undergoes an electrochemical deposition reaction, and a deposition point No. 1 is deposited in the non-deposition area on the cathode substrate 3. Control the cathode substrate 3 in its local substrate coordinate system. Inner edge Move a certain distance in the axial direction After making deposition point 1 appear in the field of view of the top-view microscopic vision system, the top-view image is preserved.

[0071] A12, Control the cathode substrate 3 along Continue moving a certain distance along the axis And ensure that deposition point 1 still appears in the field of view of the top-view microscopic vision system, thus preserving the top-view image;

[0072] A13. After fusing the features of the two top-view images, determine the base coordinate system in the field of view of the top-view microscopic vision system based on the line connecting the two deposition points No. 1 in the fused image. of Axial direction, combined with the field of view coordinate system of The direction of the axis in the field of view coordinate system Internal determination Axial direction and axial direction angle and their included angle As the field of view coordinate system of the top-down microscopic vision system The base coordinate system of cathode substrate 3 The included angle.

[0073] A2. Calculate the position of the tip of glass nozzle 1 in the top-view coordinate system. coordinates within Values; see Figure 4 Specifically, the cathode substrate 3 is controlled to move until it comes into contact with the electrolyte 7 in the glass nozzle 1 to form a liquid bridge and generate current. The electrolyte undergoes an electrochemical deposition reaction and a deposition point No. 2 is deposited in the non-deposition area on the cathode substrate 3.

[0074] Assume the tip of glass nozzle 1 is in the field of view coordinate system The coordinates inside are In the base coordinate system Internal control cathode substrate 3 along Move a certain distance in the axial direction Then, deposition point 2 appeared in the field of view coordinate system. Inside, in the field of view coordinate system Identify the coordinates of sediment point No. 2. At this time, the field of view coordinate system The coordinates of Inner No. 2 sedimentation point are still... Therefore, the tip of glass nozzle 1 in the field of view coordinate system is calculated. coordinates within ;

[0075] A3. In the top-down view coordinate system Select the coordinates of a deposition point within the area to be deposited. According to the included angle right and Perform a coordinate transformation to obtain the base coordinate system. The tip coordinates of the lower glass nozzle 1 and coordinates of the deposition point Based on two coordinates and The deviation between the two is controlled by moving the deposited point on the cathode substrate 3 horizontally below the tip of the glass nozzle 1 or by moving the tip of the glass nozzle 1 horizontally above the deposited point on the cathode substrate 3, thus achieving alignment between the tip of the glass nozzle 1 and the deposited point. Furthermore, , .

[0076] In practical applications, due to assembly errors between the cathode substrate on the mounting platform and the three-degree-of-freedom motion platform, the substrate plane cannot be guaranteed to be parallel to the plane of the three-degree-of-freedom motion platform, which will affect the shape of the deposited structure. Therefore, the mounting platform is calibrated to obtain the transformation relationship between the substrate coordinate system where the cathode substrate is located and the coordinate system where the three-degree-of-freedom motion platform is located, thereby achieving precise control of the cathode substrate movement by the three-degree-of-freedom motion platform. Therefore, a correction strategy for the mounting platform is provided, as detailed in Specific Implementation Method 3.

[0077] Detailed implementation method three, see also Figure 1 This embodiment describes a method for correcting the substrate mounting platform using the electrochemical deposition system described in Embodiment 1. This correction method is used to obtain the substrate coordinate system where the cathode substrate 3 is located. coordinate system of the three-degree-of-freedom motion platform The conversion relationship between the two is used to realize the control of the cathode substrate 3 by the three-degree-of-freedom motion platform;

[0078] The cathode substrate 3 is mounted on the substrate mounting platform, and the two are parallel; the three-degree-of-freedom motion platform is parallel to the horizontal plane and is used to drive the cathode substrate 3 to move in three-dimensional space.

[0079] Further, see Figure 5 The correction method includes the following steps:

[0080] B1. Control the three-degree-of-freedom motion platform to move vertically upwards, so that the glass nozzle 1 contacts any three non-collinear points on the cathode substrate 3, thereby obtaining the coordinate system of the three-degree-of-freedom motion platform. 3D coordinates of the three inner points , , These three points are not coplanar in the horizontal plane;

[0081] B2. Based on the three-dimensional coordinates of the three points , , Determine the normal vectors of the three points within the plane containing the cathode base 3, and thus obtain the angle between the normal vector of the plane containing the cathode base 3 and the normal vector of the plane containing the three-degree-of-freedom motion platform. ;

[0082] B3. Based on the included angle Obtain the coordinate system of the three-degree-of-freedom motion platform The base coordinate system of cathode substrate 3 Rotation matrix between ; through rotation matrix Obtain the base coordinate system where cathode substrate 3 is located. Transform any point within the coordinate system into the coordinate system of the three-degree-of-freedom motion platform. The conversion relationships within are as follows: ;

[0083] ;

[0084] in, , Let be the rotation vector. Let be the normal vector of the plane containing the cathode substrate 3. Let be the normal vector of the plane containing the three-degree-of-freedom motion platform. For the rotation vector in the base coordinate system of Components on the axis.

[0085] The principle of the method for visually locating deposition positions using an electrochemical deposition system is analyzed, and its visual positioning strategy is as follows:

[0086] Because the orientation of a top-view microscopy system affects the horizontality of the field of view, it is necessary to calibrate the system. The calibration method involves depositing a deposition point in the top-view field of view using any method, while controlling the substrate's position within the substrate coordinate system. of By comparing the positional changes of the deposition points before and after the axis movement, the basal coordinate system in the field of view of the top-view microscopic vision system can be determined. Axial direction, combined with the top-view coordinate system of The direction of the axis determines the base coordinate system within the top-view coordinate system. Axial direction relative to the top view coordinate system axial direction angle The expression for the coordinate transformation from the top-view coordinate system to the base coordinate system is as follows:

[0087] .

[0088] For glass straight nozzles, the straight section of the nozzle obstructs the top-view view, making the tip of nozzle 1 invisible. Therefore, it is necessary to first deposit a deposition point in a non-deposition area near the nozzle, and then control the substrate movement until the deposition point appears in the top-view view, recording the substrate movement. , Axial distance, transform this distance to the top-view coordinate system. In the top-down view coordinate system By identifying the location of the deposited area, the pixel coordinates of the deposited point in the field of view can be obtained. Then, the position of the needle tip can be obtained based on the distance the substrate moves. Subsequently, another point is selected in the area to be deposited, and the position coordinate difference between the point to be deposited and the tip of the glass nozzle 1 is calculated. By controlling the movement of the substrate, the tip of the glass nozzle 1 can be moved to the point to be deposited.

[0089] For glass bend nozzles, see Figure 3 The straight tube clamp is replaced with a bent tube clamp, which has two joints to facilitate adjustment of the angle between the bent tube nozzle end face and the horizontal plane. The advantage of using a bent tube nozzle is that the approximate position of the tip of glass nozzle 1 can be found in the top-view field of view, but the precise position cannot be determined. The positioning process remains the same as with the straight tube nozzle; after calibrating the top-view microscopic vision system, a deposition point is deposited in the non-deposition area, and then the substrate is moved a certain distance, and the movement of the substrate is recorded. , Axial distance, transform this distance to the top-view coordinate system. The subsequent process remains the same as that of a straight nozzle.

[0090] The principle of the method for correcting the substrate mounting platform using an electrochemical deposition system is analyzed, and the substrate platform horizontal correction strategy is as follows:

[0091] Due to assembly errors between the cathode substrate on the substrate mounting platform and the three-degree-of-freedom motion platform, the substrate plane cannot be guaranteed to be parallel to the plane of the three-degree-of-freedom motion platform, which will affect the shape of the deposited structure. Therefore, the substrate mounting platform is calibrated to obtain the transformation relationship between the substrate coordinate system where the cathode substrate is located and the coordinate system where the three-degree-of-freedom motion platform is located, thereby realizing the precise control of the cathode substrate motion by the three-degree-of-freedom motion platform.

[0092] The three-degree-of-freedom motion platform is controlled to move vertically upwards, causing the base and nozzle to contact at three non-collinear points. The three-dimensional coordinates of these three points in the coordinate system of the three-degree-of-freedom motion platform are obtained, and are denoted as follows in the coordinate system of the three-degree-of-freedom motion platform: , , These three points determine the normal vector of the base plane, denoted as... Furthermore, since the normal vector of the plane containing the three-degree-of-freedom motion platform is known... ,get and The angle between According to the included angle The rotation matrix between the base and the three-degree-of-freedom motion platform is obtained. The rotation matrix can be used to transform any point in the base coordinate system to the coordinate system of the three-degree-of-freedom motion platform.

[0093] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A method for visually locating deposition positions using an electrochemical deposition system, the electrochemical deposition system including an FPGA controller, a three-degree-of-freedom motion platform, a base, a glass nozzle (1), an anode (2), a cathode substrate (3), a humidity-retaining shell (4), a humidity retainer (5), a nozzle fixture (6), a current amplifier, a side-view microscopic vision system, and a top-view microscopic vision system; An electrolyte (7) is provided inside the glass nozzle (1). One end of the anode (2) extends into the glass nozzle (1), and the other end is connected to the power supply terminal of the FPGA controller. The cathode substrate (3) is placed on a three-degree-of-freedom motion platform through a substrate mounting platform. The three-degree-of-freedom motion platform is located on the base. The humidity retaining shell (4) covers the cathode substrate (3) and there is a gap between it and the three-degree-of-freedom motion platform. A humidity retainer (5) is provided inside the humidity retaining shell (4). The current input terminal of the current amplifier is electrically connected to the cathode substrate (3), and the current output terminal of the current amplifier is connected to the data signal input terminal of the FPGA controller; the FPGA controller controls the movement of the three-degree-of-freedom motion platform according to the current output of the current amplifier. The side-view microscopic vision system is used to acquire side-view images of the glass nozzle (1) and the cathode substrate (3) within the same field of view; the top-view microscopic vision system is used to acquire top-view images of the glass nozzle (1) and the cathode substrate (3) within the same field of view. Its features are, The method includes the following steps: A1. Calibrate the top-view field-of-view coordinate system of the top-view microscopic vision system The base coordinate system of the cathode substrate (3) Angle between The top-view microscopic vision system is used to acquire top-view images of the glass nozzle (1) and the cathode substrate (3) within the same field of view; A2. Calculate the position of the tip of the glass nozzle (1) in the top-view coordinate system. coordinates within Values; A3. In the top-down view coordinate system Select the coordinates of a deposition point within the area to be deposited. According to the included angle right and Perform a coordinate transformation to obtain the base coordinate system. Tip coordinates of the lower glass nozzle (1) and coordinates of the deposition point Based on two coordinates and The deviation between the two is controlled by moving the point to be deposited on the cathode substrate (3) horizontally below the tip of the glass nozzle (1) or moving the tip of the glass nozzle (1) horizontally above the point to be deposited on the cathode substrate (3), thereby achieving alignment between the tip of the glass nozzle (1) and the point to be deposited.

2. The method for visually locating deposition positions using an electrochemical deposition system according to claim 1, characterized in that, In step A3, ， 。 3. The method for visually locating deposition positions using an electrochemical deposition system according to claim 1, characterized in that, Obtain the included angle in step A1 The implementation method is as follows: A11. Control the cathode substrate (3) to move until it contacts the electrolyte in the glass nozzle (1) to form a liquid bridge and generate current. The electrolyte undergoes an electrochemical deposition reaction and deposits a deposition point No. 1 in the non-deposition area on the cathode substrate (3). Control the cathode substrate (3) in its substrate coordinate system. Inner edge Move a certain distance in the axial direction After making deposition point 1 appear in the field of view of the top-view microscopic vision system, the top-view image is preserved. A12, Control the cathode substrate (3) along Continue moving a certain distance along the axis And ensure that deposition point 1 still appears in the field of view of the top-view microscopic vision system, thus preserving the top-view image; A13. After fusing the features of the two top-view images, determine the base coordinate system in the field of view of the top-view microscopic vision system based on the line connecting the two deposition points No. 1 in the fused image. of Axial direction, combined with the field of view coordinate system of The direction of the axis in the field of view coordinate system Internal determination Axial direction and axial direction angle and their included angle As the field of view coordinate system of the top-view microscopic vision system The base coordinate system of the cathode substrate (3) The included angle.

4. The method for visually locating deposition positions using an electrochemical deposition system according to claim 1, characterized in that, In step A2, the tip of the glass nozzle (1) in the top-view coordinate system is calculated. coordinates within The method for obtaining the value is as follows: Control the cathode substrate (3) to move until it comes into contact with the electrolyte (7) in the glass nozzle (1) to form a liquid bridge and generate current. The electrolyte undergoes an electrochemical deposition reaction and deposits a No. 2 deposition point in the non-deposition area on the cathode substrate (3). Assume the tip of the glass nozzle (1) is in the field of view coordinate system The coordinates inside are In the base coordinate system Internal control cathode substrate (3) along Move a certain distance in the axial direction Then, deposition point 2 appeared in the field of view coordinate system. Inside, in the field of view coordinate system Identify the coordinates of sediment point No.

2. At this time, the field of view coordinate system The coordinates of Inner No. 2 sedimentation point are still... Therefore, the tip of the glass nozzle (1) in the field of view coordinate system is calculated. coordinates within .

5. The method for visually locating deposition positions using an electrochemical deposition system according to claim 1, characterized in that, The FPGA controller controls the movement of the three-degree-of-freedom motion platform based on the current output from the current amplifier as follows: When the current output of the current amplifier exceeds the set threshold and continues for the set deposition time, the FPGA controller controls the three-degree-of-freedom motion platform to move.

6. The method for visually locating deposition positions using an electrochemical deposition system according to claim 1, characterized in that, The electrochemical deposition system also includes a device for positioning the humidity-retaining housing (4), the side-view microscopic vision system, the top-view microscopic vision system, and the nozzle fixture (6); The side-view microscopy system and the top-view microscopy system are implemented using side-view cameras and top-view cameras, respectively; The glass nozzle (1) is a straight glass nozzle or a curved glass nozzle; The humidity retainer (5) is used to maintain the humidity in the humidity retaining housing (4) at 50%-60%; The three-degree-of-freedom motion platform is a three-degree-of-freedom nanopiezoelectric platform, which realizes nanoscale positioning of the cathode substrate (3).

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