Semiconductor temperature control cooling system and refrigeration method

Abstract

The application provides a semiconductor temperature control refrigeration system and a refrigeration method, and relates to the technical field of refrigeration. The semiconductor temperature control refrigeration system comprises a compressor, a vortex tube, a first condenser, an ejector, a first evaporator, a first gas-liquid separator, a second condenser, a valve body, a second evaporator and a second gas-liquid separator. The outlet of the compressor, the inlet of the vortex tube, the first end outlet of the vortex tube, the first condenser, the ejector, the first evaporator and the inlet of the compressor are sequentially connected to form a refrigeration cycle of a high-temperature zone; and the outlet of the compressor, the inlet of the vortex tube, the second end outlet of the vortex tube, the second condenser, the valve body, the second evaporator and the inlet of the compressor are sequentially connected to form a refrigeration cycle of a low-temperature zone. The semiconductor temperature control refrigeration method is applied to the semiconductor temperature control refrigeration system. The semiconductor temperature control refrigeration system and the refrigeration method can realize refrigeration in the temperature ranges of the low-temperature zone and the high-temperature zone.

Description

Technical Field

[0001] This invention relates to the field of refrigeration technology, and more specifically, to a semiconductor temperature-controlled refrigeration system and refrigeration method. Background Technology

[0002] Semiconductor temperature control equipment is used to provide fast, accurate, and stable temperature output for semiconductor integrated circuit etching process equipment to ensure the precise manufacturing of integrated circuits. It is one of the important pieces of equipment in the upstream support link of the semiconductor industry.

[0003] The inventors discovered that existing refrigeration systems can only control temperature within a single temperature range, which cannot meet the requirement of simultaneous control of different temperature zones in semiconductor processing equipment. Summary of the Invention

[0004] The present invention aims to provide, for example, a semiconductor temperature control cooling system and cooling method that can achieve temperature control over multiple temperature ranges while meeting the processing temperature requirements of semiconductor equipment in different temperature zones.

[0005] In a first aspect, the present invention provides a semiconductor temperature-controlled refrigeration system, comprising a compressor, a vortex tube, a first condenser, an ejector, a first evaporator, a first gas-liquid separator, a second condenser, a valve body, a second evaporator, and a second gas-liquid separator, wherein:

[0006] The compressor outlet is connected to the inlet of the vortex tube. The vortex tube includes a first end outlet and a second end outlet. The temperature of the first end outlet is higher than that of the second end outlet. The first end outlet is connected to the inlet of the first condenser. The outlet of the first condenser is connected to the pressure end inlet of the ejector. The outlet of the ejector is connected to the inlet of the first evaporator. The outlet of the first evaporator is connected to the inlet of the first gas-liquid separator. The gas outlet of the first gas-liquid separator is connected to the inlet of the compressor.

[0007] The second outlet is connected to the inlet of the second condenser. The outlet of the second condenser is connected to the inlet of the second evaporator via the valve body. The outlet of the second evaporator is connected to the inlet of the second gas-liquid separator. The gas outlet of the second gas-liquid separator is connected to the inlet of the compressor. A vortex tube divides the gas from the compressor outlet into cold and hot branches, achieving refrigeration in both low and high temperature ranges. Simultaneously, an ejector replaces the valve body in the high-temperature zone, reducing throttling losses. The gas outlet of the gas-liquid separator is connected to the compressor to form a complete loop, achieving cyclic refrigeration in both high and low temperature zones, while preventing liquid from entering the compressor and affecting its efficiency.

[0008] In an optional embodiment, the liquid outlet of the first gas-liquid separator is connected to the inlet of the ejector, and the liquid outlet of the second gas-liquid separator is connected to the inlet of the ejector. By separating the liquid produced by the evaporator through the gas-liquid separator and delivering it to the ejector as the ejector medium, the refrigerant medium is recycled, saving resources.

[0009] In an optional embodiment, the semiconductor temperature-controlled refrigeration system further includes a third gas-liquid separator. The second end outlet of the vortex tube is connected to the inlet of the third gas-liquid separator, and the gas outlet of the third gas-liquid separator is connected to the inlet of the second condenser. By providing the third gas-liquid separator, the low-temperature gas at the second end outlet of the vortex tube is separated from a small amount of liquid, thereby improving the efficiency of the second condenser and the second evaporator.

[0010] In an optional embodiment, the liquid outlet of the third gas-liquid separator is connected to the ejector inlet.

[0011] In an optional embodiment, the gas outlet and liquid outlet of the first gas-liquid separator are located at the top and bottom of the first gas-liquid separator, respectively; the gas outlet and liquid outlet of the second gas-liquid separator are located at the top and bottom of the second gas-liquid separator, respectively.

[0012] In an optional embodiment, the first evaporator further includes a first pipeline, the two ends of which are respectively connected to the injector and the first gas-liquid separator; the second evaporator further includes a second pipeline, the two ends of which are respectively connected to the valve body and the second gas-liquid separator; the first evaporator further includes a third pipeline, and the second evaporator further includes a fourth pipeline, the third pipeline and the fourth pipeline being connected.

[0013] In an optional embodiment, the first end outlet of the vortex tube is provided with a regulating valve.

[0014] In a second aspect, the present invention provides a semiconductor temperature control cooling method, applied to a semiconductor temperature control cooling system as described in any of the foregoing embodiments, comprising a high-temperature zone cooling process S1 and a low-temperature zone cooling process S2.

[0015] S1, Cooling process in the high-temperature zone:

[0016] S1-1. The high-temperature and high-pressure gas discharged from the compressor is input into the vortex tube, and the hot gas is discharged through the first end outlet of the vortex tube.

[0017] S1-2. The hot gas discharged from the first end outlet of the vortex tube is fed into the first condenser for condensation to obtain the first condensate.

[0018] S1-3. The first condensate is fed into the ejector as the working medium and sprayed into the first evaporator for refrigeration.

[0019] S1-4. The medium from the outlet of the first evaporator is fed into the first gas-liquid separator for gas-liquid separation.

[0020] S1-5. Input the gas output from the gas outlet of the first gas-liquid separator into the compressor for further compression;

[0021] S2, Low-temperature refrigeration process:

[0022] S2-1. The high-temperature and high-pressure gas discharged from the compressor is input into the vortex tube, and the cold gas is discharged through the second end outlet of the vortex tube.

[0023] S2-2. The cold gas discharged from the second end outlet of the vortex tube is fed into the second gas-liquid separator for gas-liquid separation.

[0024] S2-3. The gas output from the gas outlet of the second gas-liquid separator is fed into the second condenser for condensation to obtain the second condensate;

[0025] S2-4. The second condensate is fed into the valve body and then enters the second evaporator for refrigeration.

[0026] S2-5. The medium from the outlet of the second evaporator is fed into the third gas-liquid separator for gas-liquid separation.

[0027] S2-6. The gas output from the gas outlet of the third gas-liquid separator is fed into the compressor for further compression.

[0028] In an optional embodiment, step S1 further includes step S1-6: inputting the liquid output from the liquid outlet of the first gas-liquid separator into the ejector inlet of the ejector as an ejector medium; step S2 further includes step S2-7: inputting the liquid output from the liquid outlet of the third gas-liquid separator into the ejector inlet of the ejector as an ejector medium; step S2 further includes step S2-2-1: inputting the liquid output from the liquid outlet of the second gas-liquid separator into the ejector inlet of the ejector as an ejector medium.

[0029] In an optional implementation, when the semiconductor temperature control cooling system cools the same device, it first undergoes a high-temperature cooling process in step S1, and then a low-temperature cooling process in step S2.

[0030] The beneficial effects of the embodiments of the present invention include, for example:

[0031] The semiconductor temperature-controlled refrigeration system of this invention uses a vortex tube to divide the gas outlet of the compressor into cold and hot streams, achieving refrigeration in both low and high temperature ranges. Simultaneously, an ejector replaces the valve body in the high-temperature zone, reducing throttling losses. The gas outlet of the gas-liquid separator is connected to the compressor to form a complete loop, achieving cyclic refrigeration in both high and low temperature zones, while preventing liquid from entering the compressor and affecting its efficiency.

[0032] Furthermore, the semiconductor temperature-controlled refrigeration system of the present invention can either use the first evaporator and the second evaporator to control the temperature of devices with different temperature requirements, or it can connect the first evaporator and the second evaporator in series in a single circulation system to achieve temperature control through secondary refrigeration of the same device. When used on the same device, the refrigerant first undergoes preliminary cooling through the first evaporator, and then undergoes further cooling through the second evaporator. The advantage of secondary cooling is that it reduces the impact of temperature fluctuations caused by the device on the refrigeration system, reduces the temperature change range required for each cooling process, and improves temperature control accuracy. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the semiconductor temperature-controlled cooling system according to an embodiment of the present invention;

[0035] Figure 2 This is a flowchart illustrating the high-temperature cooling process of the semiconductor temperature-controlled cooling method according to an embodiment of the present invention.

[0036] Figure 3 This is a flowchart of the low-temperature refrigeration process of the semiconductor temperature-controlled refrigeration method according to an embodiment of the present invention;

[0037] Figure 4 This is a flowchart illustrating the recycling process of the refrigerant in an embodiment of the present invention.

[0038] Icons: 100-Semiconductor temperature-controlled refrigeration system; 10-Compressor; 20-Vortex tube; 21-First end outlet; 22-Second end outlet; 30-First condenser; 31-Second condenser; 40-Ejector; 41-Pressure end inlet; 42-Ejector end inlet; 50-First evaporator; 51-Second evaporator; 60-First gas-liquid separator; 61-Second gas-liquid separator; 62-Third gas-liquid separator; 70-Valve body. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0042] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0043] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0044] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0045] Please refer to Figure 1 The semiconductor temperature-controlled refrigeration system 100 of this embodiment includes a compressor 10, a vortex tube 20, a first condenser 30, an ejector 40, a first evaporator 50, a first gas-liquid separator 60, a second condenser 31, a valve body 70, a second evaporator 51, and a second gas-liquid separator 61, wherein:

[0046] The outlet of compressor 10 is connected to the inlet of vortex tube 20. The first end outlet 21 of vortex tube 20 is connected to the inlet of first condenser 30. The outlet of first condenser 30 is connected to the pressure end inlet 41 of ejector 40. The outlet of ejector 40 is connected to the inlet of first evaporator 50. The outlet of first evaporator 50 is connected to the inlet of first gas-liquid separator 60. The gas outlet of first gas-liquid separator 60 is connected to the inlet of compressor 10. The liquid outlet of first gas-liquid separator 60 is connected to the ejector end inlet 42 of ejector 40.

[0047] It is understood that the ejector 40 includes an outlet, a pressure-end inlet 41, and an ejector-end inlet 42. The high-temperature, high-pressure gas output from the compressor 10 enters the vortex tube 20 and is separated into two fluids, a cold fluid and a hot fluid. The first gas enters the first condenser 30 and condenses to form condensate. The condensate enters the ejector 40 from the pressure-end inlet 41 as the working medium. The liquid output from the liquid outlet of the first gas-liquid separator 60 enters the ejector 40 from the ejector end as the ejector medium, mixes with the working medium, and is ejected from the outlet of the ejector 40 into the first evaporator 50 for evaporation and heat absorption, thereby achieving cooling in the high-temperature zone. The gas outlet of the first gas-liquid separator 60 is connected to the inlet of the compressor 10, and the separated gas enters the compressor 10 for further compression, thus achieving cyclic cooling in the high-temperature zone.

[0048] The second outlet 22 of the vortex tube 20 is connected to the inlet of the second condenser 31. The outlet of the second condenser 31 is connected to the inlet of the second evaporator 51 via the valve body 70. The outlet of the second evaporator 51 is connected to the inlet of the second gas-liquid separator 61, and the gas outlet of the second gas-liquid separator 61 is connected to the inlet of the compressor 10. The liquid outlet of the second gas-liquid separator 61 is connected to the ejector end inlet 42 of the ejector 40.

[0049] It should be noted that in this embodiment, both the first condenser 30 and the second condenser 31 are spiral tubular structures. Vapor passes through the condenser tubes, and heat is dissipated into the air through the tube walls, forming condensate. Optionally, both the first condenser 30 and the second condenser 31 are equipped with heat dissipation fins.

[0050] Similar to the refrigeration cycle in the high-temperature zone, refrigeration in the low-temperature zone is achieved through a series of interconnected components: compressor 10, second outlet 22 of vortex tube 20, second condenser 31, valve body 70, second evaporator 51, and second gas-liquid separator 61. The gas exiting from second outlet 22 enters the second condenser 31 for condensation, then passes through valve body 70 for further cooling and pressure reduction before entering the second evaporator 51 for low-temperature refrigeration. It then enters the second gas-liquid separator 61 for gas-liquid separation, and the separated gas enters the compressor 10 for further compression. Similarly, the liquid separated by the second gas-liquid separator 61 enters the ejector inlet 42 of ejector 40 as the ejector medium.

[0051] Unlike the refrigeration cycle in the high-temperature zone, which uses an ejector 40, the refrigeration cycle in the low-temperature zone uses a valve body 70. The ejector 40 reduces throttling losses. In this embodiment, the valve body 70 is an electronic expansion valve.

[0052] Furthermore, in this embodiment, the semiconductor temperature-controlled refrigeration system 100 also includes a third gas-liquid separator 62. The third gas-liquid separator 62 is connected between the second end outlet 22 of the vortex tube 20 and the second condenser 31. The second end outlet 22 of the vortex tube 20 is connected to the inlet of the third gas-liquid separator 62. The gas outlet of the third gas-liquid separator 62 is connected to the inlet of the second condenser 31. The liquid outlet of the third gas-liquid separator 62 is connected to the ejector end inlet 42 of the ejector 40. Since the gas temperature at the second end outlet 22 is lower than the temperature of the gas at the first end, the gas at the second end outlet 22 is prone to contain liquid. The function of the third gas-liquid separator 62 is to separate the second end gas from a small amount of liquid at the second end outlet 22, thereby improving the efficiency of the subsequent second condenser 31 and second evaporator 51. The liquid separated by the third gas-liquid separator 62 enters the ejector end inlet 42 of the ejector 40 to serve as the ejector medium.

[0053] To facilitate gas-liquid separation, the gas outlet and liquid outlet of the first gas-liquid separator 60 are located at the top and bottom, respectively. Similarly, the gas outlet and liquid outlet of the second gas-liquid separator 61 are located at the top and bottom, respectively. The gas outlet and liquid outlet of the third gas-liquid separator 62 are located at the top and bottom, respectively. It is understood that since the density of gas is less than that of liquid, when the gas-liquid separators are operating, gas is output from the top and liquid is output from the bottom.

[0054] In this embodiment, a pressure detection element is provided at the inlet of the vortex tube 20 to detect the pressure at the inlet of the vortex tube 20. Furthermore, a regulating valve is provided at the first outlet 21 of the vortex tube 20. The pressure detection element detects the pressure, and the inlet pressure of the vortex tube 20 is adjusted by adjusting the power of the compressor 10. The cold flow ratio can be changed by adjusting the regulating valve at the first outlet 21, thereby changing the cold and hot flow temperatures and achieving precise temperature control.

[0055] Furthermore, the first evaporator 50 and the second evaporator 51 can be used independently or in combination. Specifically, in this embodiment, the first evaporator 50 further includes a first pipe, with its two ends connected to the ejector 40 and the first gas-liquid separator 60, respectively. The second evaporator 51 further includes a second pipe, with its two ends connected to the valve body 70 and the second gas-liquid separator 61, respectively. The first evaporator 50 also includes a third pipe, and the second evaporator 51 further includes a fourth pipe, with the third and fourth pipes connected in series. It can be understood that the third and fourth pipes connect the first evaporator 50 and the second evaporator 51 in series in a single system to achieve secondary cooling of the same device. In other embodiments, the third and fourth pipes are respectively installed in different devices to meet the temperature requirements of different devices.

[0056] The semiconductor temperature-controlled refrigeration system 100 of the present invention can either use the first evaporator 50 and the second evaporator 51 to control the temperature of devices with different temperature requirements, or it can connect the first evaporator 50 and the second evaporator 51 in series in a single circulation system to achieve temperature control through secondary refrigeration of the same device. When used on the same device, the refrigerant first undergoes preliminary cooling through the first evaporator 50, and then undergoes further cooling through the second evaporator 51. The advantage of secondary cooling is that it reduces the impact of temperature fluctuations caused by the device on the refrigeration system and improves the temperature control accuracy.

[0057] Please combine Figures 2-4 This embodiment provides a semiconductor temperature-controlled cooling method applied to the aforementioned semiconductor temperature-controlled cooling system 100, which includes a high-temperature cooling process S1 and a low-temperature cooling process S2.

[0058] S1, Cooling process in the high-temperature zone:

[0059] S1-1. The high-temperature and high-pressure gas discharged from the compressor 10 is input into the vortex tube 20, and the hot gas is discharged through the first end outlet 21 of the vortex tube 20.

[0060] S1-2. The hot gas discharged from the first end outlet 21 of the vortex tube 20 is input into the first condenser 30 for condensation to obtain the first condensate.

[0061] S1-3. The first condensate is fed into the ejector 40 as the working medium and then injected into the first evaporator 50 through the ejector 40 for refrigeration.

[0062] S1-4. The medium from the outlet of the first evaporator 50 is fed into the first gas-liquid separator 60 for gas-liquid separation.

[0063] S1-5. The gas output from the gas outlet of the first gas-liquid separator 60 is input into the compressor 10 for further compression.

[0064] S1-6: The liquid output from the liquid outlet of the first gas-liquid separator 60 is fed into the ejector inlet of the ejector 40 to serve as the ejector medium.

[0065] S2, Low-temperature refrigeration process:

[0066] S2-1. The high-temperature and high-pressure gas discharged from the compressor 10 is input into the vortex tube 20, and the cold gas is discharged through the second end outlet 22 of the vortex tube 20.

[0067] S2-2. The cold gas discharged from the second end outlet 22 of the vortex tube 20 is input into the second gas-liquid separator 61 for gas-liquid separation.

[0068] S2-2-1: The liquid output from the liquid outlet of the second gas-liquid separator 61 is fed into the ejector inlet of the ejector 40 to serve as the ejector medium.

[0069] S2-3. The gas output from the gas outlet of the second gas-liquid separator 61 is fed into the second condenser 31 for condensation to obtain the second condensate.

[0070] S2-4. The second condensate is fed into valve body 70 and then enters the second evaporator 51 for refrigeration.

[0071] S2-5. The medium from the outlet of the second evaporator 51 is fed into the third gas-liquid separator 62 for gas-liquid separation.

[0072] S2-6. The gas output from the gas outlet of the third gas-liquid separator 62 is input into the compressor 10 for further compression.

[0073] S2-7: The liquid output from the liquid outlet of the third gas-liquid separator 62 is fed into the ejector inlet of the ejector 40 to serve as the ejector medium.

[0074] The beneficial effects of the semiconductor temperature-controlled cooling system 100 in this embodiment are:

[0075] The semiconductor temperature-controlled refrigeration system 100 of this invention uses a vortex tube 20 to divide the gas outlet of the compressor 10 into cold and hot streams, achieving refrigeration in both low and high temperature ranges. Simultaneously, an ejector 40 replaces the valve body 70 in the high-temperature zone, reducing throttling losses. The gas outlet of the gas-liquid separator is connected to the compressor 10 to form a complete loop, achieving cyclic refrigeration in both high and low temperature zones. At the same time, it prevents liquid from entering the compressor 10 and affecting its operating efficiency.

[0076] Furthermore, the semiconductor temperature-controlled refrigeration system 100 of the present invention can either use the first evaporator 50 and the second evaporator 51 to control the temperature of devices with different temperature requirements, or it can connect the first evaporator 50 and the second evaporator 51 in series in a single circulation system to achieve temperature control through secondary refrigeration of the same device. When used on the same device, the refrigerant first undergoes preliminary cooling through the first evaporator 50, and then undergoes further cooling through the second evaporator 51. The advantage of secondary cooling is that it reduces the impact of temperature fluctuations caused by the device on the refrigeration system, reduces the temperature change range required for each cooling process, and improves temperature control accuracy.

[0077] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A semiconductor temperature-controlled cooling system (100), characterized in that, It includes a compressor (10), a vortex tube (20), a first condenser (30), an ejector (40), a first evaporator (50), a first gas-liquid separator (60), a second condenser (31), a valve body (70), a second evaporator (51), and a second gas-liquid separator (61), wherein: The outlet of the compressor (10) is connected to the inlet of the vortex tube (20). The vortex tube (20) includes a first end outlet (21) and a second end outlet (22). The temperature of the first end outlet (21) is higher than that of the second end outlet (22). The first end outlet (21) is connected to the inlet of the first condenser (30). The outlet of the first condenser (30) is connected to the pressure end inlet (41) of the ejector (40). The outlet of the ejector (40) is connected to the inlet of the first evaporator (50). The outlet of the first evaporator (50) is connected to the inlet of the first gas-liquid separator (60). The gas outlet of the first gas-liquid separator (60) is connected to the inlet of the compressor (10). The second end outlet (22) is connected to the inlet of the second condenser (31), the outlet of the second condenser (31) is connected to the inlet of the second evaporator (51) through the valve body (70), the valve body (70) is an electronic expansion valve, the outlet of the second evaporator (51) is connected to the inlet of the second gas-liquid separator (61), and the gas outlet of the second gas-liquid separator (61) is connected to the inlet of the compressor (10); The liquid outlet of the first gas-liquid separator (60) is connected to the ejector inlet (42) of the injector (40), and the liquid outlet of the second gas-liquid separator (61) is connected to the ejector inlet (42) of the injector (40).

2. The semiconductor temperature-controlled cooling system (100) according to claim 1, characterized in that, The semiconductor temperature-controlled refrigeration system (100) further includes a third gas-liquid separator (62), the second end outlet (22) of the vortex tube (20) is connected to the inlet of the third gas-liquid separator (62), and the gas outlet of the third gas-liquid separator (62) is connected to the inlet of the second condenser (31).

3. The semiconductor temperature-controlled cooling system (100) according to claim 2, characterized in that, The liquid outlet of the third gas-liquid separator (62) is connected to the ejector inlet (42) of the ejector (40).

4. The semiconductor temperature-controlled cooling system (100) according to claim 1, characterized in that, The gas outlet and liquid outlet of the first gas-liquid separator (60) are located at the top and bottom of the first gas-liquid separator (60), respectively; the gas outlet and liquid outlet of the second gas-liquid separator (61) are located at the top and bottom of the second gas-liquid separator (61), respectively.

5. The semiconductor temperature-controlled cooling system (100) according to claim 1, characterized in that, The first evaporator (50) further includes a first pipeline, the two ends of which are respectively connected to the injector (40) and the first gas-liquid separator (60); the second evaporator (51) further includes a second pipeline, the two ends of which are respectively connected to the valve body (70) and the second gas-liquid separator (61); the first evaporator (50) further includes a third pipeline, and the second evaporator (51) further includes a fourth pipeline, the third pipeline and the fourth pipeline being connected.

6. The semiconductor temperature-controlled cooling system (100) according to claim 1, characterized in that, The first end outlet (21) of the vortex tube (20) is equipped with a regulating valve.

7. A semiconductor temperature-controlled cooling method, characterized in that, Applied to the semiconductor temperature-controlled cooling system (100) as described in any one of claims 1-6, which includes a high-temperature cooling process S1 and a low-temperature cooling process S2; S1, Cooling process in the high-temperature zone: S1-1. The high-temperature and high-pressure gas discharged from the compressor (10) is input into the vortex tube (20) and discharged through the first end outlet (21) of the vortex tube (20); S1-2, The hot gas discharged from the first end outlet (21) of the vortex tube (20) is fed into the first condenser (30) for condensation to obtain the first condensate; S1-3. The first condensate is fed into the ejector (40) as the working medium and is injected into the first evaporator (50) through the ejector (40) for refrigeration. S1-4. The medium from the outlet of the first evaporator (50) is fed into the first gas-liquid separator (60) for gas-liquid separation. S1-5. The gas output from the gas outlet of the first gas-liquid separator (60) is input into the compressor (10) for further compression; S2, Low-temperature refrigeration process: S2-1. The high-temperature and high-pressure gas discharged from the compressor (10) is input into the vortex tube (20), and the cold gas is discharged through the second end outlet (22) of the vortex tube (20). S2-2, The cold gas discharged from the second end outlet (22) of the vortex tube (20) is input into the second gas-liquid separator (61) for gas-liquid separation; S2-3. The gas output from the gas outlet of the second gas-liquid separator (61) is fed into the second condenser (31) for condensation to obtain the second condensate. S2-4. The second condensate is fed into the valve body (70) and then enters the second evaporator (51) through the valve body (70) for refrigeration. S2-5. The medium from the outlet of the second evaporator (51) is fed into the third gas-liquid separator (62) for gas-liquid separation. S2-6. The gas output from the gas outlet of the third gas-liquid separator (62) is fed into the compressor (10) for compression again.

8. The semiconductor temperature-controlled cooling method according to claim 7, characterized in that, Step S1 further includes step S1-6: inputting the liquid output from the liquid outlet of the first gas-liquid separator (60) into the ejector inlet of the ejector (40) as an ejector medium; Step S2 further includes step S2-7: inputting the liquid output from the liquid outlet of the third gas-liquid separator (62) into the ejector inlet of the ejector (40) as an ejector medium; Step S2 further includes step S2-2-1: inputting the liquid output from the liquid outlet of the second gas-liquid separator (61) into the ejector inlet of the ejector (40) as an ejector medium.

9. The semiconductor temperature-controlled cooling method according to claim 7, characterized in that, When the semiconductor temperature control cooling system (100) cools the same device, it first goes through the high-temperature cooling process in step S1, and then goes through the low-temperature cooling process in step S2.

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