A device to prevent hardness test objective lenses from scratching wafers.

Abstract

This invention discloses a device for preventing hardness testing objective lenses from scratching wafers. The device includes a base, with a main cabinet and a lifting support fixedly arranged side-by-side on the upper end of the base. A processing stage is fixedly mounted on the upper end of the lifting support, used to place and move the wafer. An upper bracket is fixedly mounted on the upper part of the main cabinet, and a lens for focusing on the wafer surface is mounted on the upper bracket. A triggering mechanism is fixedly mounted on the processing stage, and a sensing mechanism is fixedly mounted on the main cabinet. The sensing mechanism includes a sensing base plate fixedly mounted on the main cabinet, and a limit switch cooperating with the triggering mechanism is fixedly mounted on the sensing base plate via a switch mounting plate. This invention not only achieves clear focusing of the wafer surface but also avoids the risk of product scratches and breakage due to operator error.

Description

Technical Field

[0001] This invention relates to the field of hardness testing technology, and more specifically to a device for preventing the objective lens of a hardness testing machine from scratching a wafer. Background Technology

[0002] The general gold bump manufacturing process includes the following steps: First, sputtering: sputtering a metal film onto the surface of the integrated circuit chip; Second, photoresist coating: coating the chip surface with photoresist with a thickness of 15-40 micrometers using a photoresist coating machine; Third, exposure: exposing the photoresist in areas where gold bumps do not need to be grown using an exposure machine; Fourth, development: removing the unexposed areas of photoresist using a developing machine and developing solution, opening windows in areas where gold bumps need to be grown; Fifth, gold electroplating: plating gold bumps with a height of 10-15 micrometers onto the photoresist windowed areas on the chip; Sixth, photoresist removal; Seventh, plasma treatment and gold etching to remove the gold layer from the sputtered metal film; Eighth, titanium-tungsten etching to remove... The purpose of this titanium-tungsten etching step, in addition to removing the sputtered titanium-tungsten film from both sides of the gold bumps, is to remove the sputtered titanium-tungsten film. The ninth step is metal toughening. The tenth step is hardness measurement: the hardness of the gold bumps is measured. When measuring the hardness of the gold bumps, after placing the wafer on the stage, the stage is moved upwards to focus on the wafer surface. If the stage rises too quickly or the operator does not observe the optimal focusing position, the wafer will directly collide with the machine lens, causing scratches or breakage, leading to a decrease in yield or scrap. Therefore, a device is needed to control the range of stage focusing, which not only ensures clear focusing of the wafer surface but also avoids the risk of product scratches and breakage due to operator error. Summary of the Invention

[0003] The purpose of this invention is to provide a device to prevent the objective lens of a hardness testing machine from scratching the wafer, and to solve the technical problem that when the stage rises too quickly or the operator does not observe the optimal focusing position, the wafer will directly hit the machine lens, causing the wafer to be scratched or broken, resulting in a decrease in yield or scrap.

[0004] The objective of this invention can be achieved through the following technical solutions:

[0005] A device for preventing hardness tester objective lenses from scratching wafers includes a device base, a main cabinet and a lifting support are fixedly arranged side by side on the upper end of the device base, a processing stage is fixedly installed on the upper end of the lifting support, the processing stage is used to place the wafer and drive the wafer to move up and down, an upper bracket is fixedly installed on the upper part of the main cabinet, a lens for focusing on the wafer surface is installed on the upper bracket, a triggering mechanism is fixedly installed on the processing stage, and a sensing mechanism is fixedly installed on the main cabinet;

[0006] The sensing mechanism includes a sensing base plate fixedly mounted on the main cabinet, and a limit switch that cooperates with the triggering mechanism is fixedly mounted on the sensing base plate via a switch mounting plate.

[0007] As a further aspect of the present invention: the processing stage includes a stage base, a guide rod is slidably connected through the stage base, and a carrier plate is fixedly connected to the upper end of the guide rod.

[0008] As a further embodiment of the present invention: a bidirectional lead screw is rotatably mounted inside the platform, and two sets of lead screw sliders are threadedly connected to the bidirectional lead screw. A lower support is fixedly mounted on the lead screw slider, and an upper support is fixedly mounted at the lower center of the carrier plate. Two sets of connecting rods are rotatably connected to the upper support, and the connecting rods are rotatably connected to the lower support. A lead screw moving motor for driving the bidirectional lead screw to rotate is fixedly mounted on the platform.

[0009] As a further aspect of the present invention: the triggering mechanism includes a mounting plate fixedly disposed on a carrier plate, and a trigger seat plate is fixedly disposed on the mounting plate.

[0010] As a further embodiment of the present invention: a threaded sleeve is fixedly provided at the lower end of the trigger seat plate, a threaded rod is threadedly connected to the threaded sleeve, a trigger plate is fixedly connected to the upper end of the threaded rod, and a drive handle is fixedly provided at the lower end of the threaded rod.

[0011] As a further embodiment of the present invention: an annular groove is provided at the lower end of the trigger plate, a limit block is slidably arranged in the annular groove, a scale is fixedly arranged at the lower end of the limit block, and the scale is slidably connected to the trigger base plate.

[0012] As a further embodiment of the present invention: the sensing mechanism further includes a connecting seat fixedly mounted on the main cabinet, a connecting shaft fixedly mounted on the connecting seat, a pulley mounted on the connecting shaft via a bearing, a connecting rope slidably connected to the pulley, one end of the connecting rope being fixedly connected to the trigger seat plate, and the other end of the connecting rope being fixedly connected to a counterweight.

[0013] As a further aspect of the present invention, a mounting bracket for placing counterweights is fixedly provided on the connecting seat.

[0014] As a further aspect of the present invention: an upper sensor for sensing the position of the wafer is fixedly installed at the lower end of the upper support.

[0015] As a further embodiment of the present invention: a lens mount is slidably disposed on the upper bracket, the lens is fixedly mounted on the lens mount, a drive connecting plate is fixedly disposed on the upper end of the lens mount, a drive cylinder is fixedly disposed on the upper end of the upper bracket, and the output end of the drive cylinder is fixedly connected to the drive connecting plate.

[0016] The beneficial effects of this invention are:

[0017] (1) The present invention can not only achieve clear focusing on the wafer surface, but also avoid the risk of product scratches and cracks caused by operator error.

[0018] (2) Two sets of lead screw sliders drive the carrier plate to move upward through the connecting rod. The carrier plate drives the wafer to move toward the lens, and at the same time drives the trigger mechanism to move upward. When the processing stage misses the best focusing position during the upward process, the processing stage continues to rise. The trigger mechanism will trigger the sensing mechanism, and the processing stage will immediately cut off the power and stop the processing stage from rising, thereby protecting the product.

[0019] (3) Conventional limit switches have a fixed detection range. Therefore, when the detection distance of the wafer changes, the limit switch needs to be replaced. This not only requires different limit switches, which increases costs, but also affects processing efficiency. However, by setting a threaded rod to adjust the position of the trigger plate and adjusting the distance between the trigger plate and the limit switch, the accuracy control can be maintained when detecting different wafers.

[0020] (4) By setting a counterweight block to lift the trigger seat plate, the trigger seat plate is kept horizontal, thereby improving the accuracy of wafer inspection.

[0021] (5) The upper sensor detects the rising height of the carrier board. If the carrier board continues to rise after exceeding the dangerous height, the upper sensor sends a signal to the drive cylinder. The drive cylinder drives the drive connecting plate and the lens mount to move upward. The lens mount drives the lens to lift upward, preventing the wafer from colliding with the lens and causing damage to the wafer. Attached Figure Description

[0022] The invention will now be further described with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the processing platform of the present invention;

[0025] Figure 3 This is a schematic diagram of the triggering mechanism and sensing mechanism of the present invention;

[0026] Figure 4 This is the circuit diagram of the limit switch of the present invention.

[0027] In the diagram: 1. Device base; 2. Main cabinet; 3. Lifting support; 4. Processing platform; 41. Platform base; 42. Carrier plate; 43. Lead screw moving motor; 44. Bidirectional lead screw; 45. Lead screw slider; 46. Lower support; 47. Connecting rod; 48. Upper support; 49. Guide rod; 5. Triggering mechanism; 51. Mounting plate; 52. Trigger base plate; 53. Threaded sleeve; 54. Threaded rod; 55. Drive handle; 56. Trigger plate; 57. Annular groove; 58. Limit block; 59. Scale; 6. Sensing mechanism; 61. Connecting seat; 62. Sensor base plate; 63. Limit switch; 64. Switch mounting plate; 65. Connecting shaft; 66. Bearing; 67. Pulley; 68. Connecting rope; 69. Counterweight; 610. Placement rack; 7. Upper bracket; 8. Upper sensor; 9. Lens mount; 10. Lens; 11. Drive cylinder; 12. Drive connecting plate; 13. Reset button. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1-3 As shown, the present invention is a device for preventing hardness testing objective lenses from scratching wafers. It includes a device base 1, with a main cabinet 2 and a lifting support 3 fixedly arranged side-by-side on the upper end of the base 1. A processing stage 4 is fixedly mounted on the upper end of the lifting support 3, and the processing stage 4 is used to place the wafer and move it up and down. An upper bracket 7 is fixedly mounted on the upper part of the main cabinet 2, and a lens 10 for focusing on the wafer surface is mounted on the upper bracket 7. A trigger mechanism 5 is fixedly mounted on the processing stage 4, and a sensing mechanism 6 is fixedly mounted on the main cabinet 2. The sensing mechanism 6 includes a sensing base plate 62 fixedly mounted on the main cabinet 2, and a limit switch 63 cooperating with the trigger mechanism 5 is fixedly mounted on the sensing base plate 62 via a switch mounting plate 64. A reset button 13 for resetting the limit switch 63 is also provided on the main cabinet 2.

[0030] The wafer is placed on the processing stage 4, and the lifting support 3 drives the processing stage 4 to rise and fall. After the processing stage 4 rises and falls to a certain position, the position of the wafer is finely adjusted by the processing stage 4 to ensure that the wafer can slowly rise and adjust the distance between it and the lens 10 so that the wafer surface is clearly focused. If the processing stage 4 misses the best focusing position during the rising process, the processing stage 4 continues to rise. The trigger mechanism 5 will trigger the sensing mechanism 6, and the processing stage 4 will immediately cut off the power and stop the processing stage 4 from rising further, thereby protecting the product.

[0031] The processing platform 4 includes a platform base 41, on which a guide rod 49 is slidably connected. A carrier plate 42 is fixedly connected to the upper end of the guide rod 49. A bidirectional lead screw 44 is rotatably mounted inside the platform base 41. Two sets of lead screw sliders 45 are threadedly connected to the bidirectional lead screw 44. A lower support 46 is fixedly mounted on the lead screw slider 45. An upper support 48 is fixedly mounted at the lower center of the carrier plate 42. Two sets of connecting rods 47 are rotatably connected to the upper support 48 and are rotatably connected to the lower support 46. A lead screw moving motor 43 for driving the bidirectional lead screw 44 to rotate is fixedly mounted on the platform base 41.

[0032] When it is necessary to measure the hardness of the wafer, the processing stage 4 moves upward to a certain height under the action of the lifting support 3. The lead screw moving motor 43 drives the bidirectional lead screw 44 to rotate. Under the action of the lead screw transmission, the bidirectional lead screw 44 synchronously drives the two sets of lead screw sliders 45 to slide towards each other. The two sets of lead screw sliders 45 drive the carrier plate 42 to move upward through the connecting rod 47. The carrier plate 42 drives the wafer to move towards the lens 10, and at the same time drives the trigger mechanism 5 to move upward. If the processing stage 4 misses the best focusing position during the rise, the processing stage 4 continues to rise. The trigger mechanism 5 will trigger the sensing mechanism 6, and the processing stage 4 will immediately cut off the power, stopping the processing stage 4 from continuing to rise, thereby protecting the product.

[0033] The triggering mechanism 5 includes a mounting plate 51 fixedly mounted on a carrier plate 42, and a trigger base plate 52 is fixedly mounted on the mounting plate 51.

[0034] Limit switch 63 is used to control the focusing range of the hardness tester lens. The circuit diagram of the limit switch is attached. Figure 4As shown, the specific working principle is as follows: The processing stage 4 rises to focus on the wafer surface. The carrier plate 42 rises to a distance of about 5mm from the lens 10 and can be clearly focused. If the carrier plate 42 continues to rise, the trigger plate 52 will trigger the limit switch 63. The limit switch 63 is a normally closed sensor. At this time, the lead screw motor 43 that controls the rise of the carrier plate 42 will be de-energized. At this time, there is about 2mm of space between the carrier plate 42 and the lens 10 to avoid the product hitting the lens 10. If the carrier plate 42 needs to be restored, the reset button 13 needs to be pressed and held. The lead screw motor 43 is energized. Click the carrier plate 42 to descend on the control software. After the trigger plate 52 is disengaged from the limit switch 63, the limit switch 63 closes, and the power supply of the lead screw motor 43 is completed. After releasing the reset button 13, the machine can be operated again.

[0035] A threaded sleeve 53 is fixedly provided at the lower end of the trigger seat plate 52. A threaded rod 54 is threadedly connected to the threaded sleeve 53. A trigger plate 56 is fixedly connected to the upper end of the threaded rod 54. A drive handle 55 is fixedly provided at the lower end of the threaded rod 54.

[0036] The detection range of a conventional limit switch 63 is fixed. Therefore, when the detection distance of the wafer changes, the limit switch 63 needs to be replaced. This not only increases the cost by requiring different limit switches 63, but also affects the processing efficiency. However, by setting the threaded rod 54 to adjust the position of the trigger plate 56 and adjusting the distance between the trigger plate 56 and the limit switch 63, the accuracy control can be maintained when detecting different wafers.

[0037] The trigger plate 56 has an annular groove 57 at its lower end. A limit block 58 is slidably disposed in the annular groove 57. A scale 59 is fixedly disposed at the lower end of the limit block 58. The scale 59 is slidably connected to the trigger base plate 52.

[0038] To ensure distance control during the inspection of different wafers, the drive handle 55 is rotated to drive the threaded rod 54 to rotate. The threaded rod 54 drives the trigger plate 56 to move up and down to adjust its position, thereby changing the relative distance between it and the limit switch 63. At the same time, the height adjustment distance of the trigger plate 56 is accurately read by the scale 59.

[0039] The sensing mechanism 6 further includes a connecting base 61 fixedly mounted on the main cabinet 2. A connecting shaft 65 is fixedly mounted on the connecting base 61. A pulley 67 is mounted on the connecting shaft 65 via a bearing 66. A connecting rope 68 is slidably connected to the pulley 67. One end of the connecting rope 68 is fixedly connected to the trigger seat plate 52, and the other end of the connecting rope 68 is fixedly connected to a counterweight 69. A placement rack 610 for placing the counterweight 69 is fixedly mounted on the connecting base 61.

[0040] Since the trigger plate 52 is fixedly connected to the carrier plate 42, and the trigger plate 56 is set on one side of the trigger plate 52, the weight of the trigger plate 56 and threaded sleeve 53 and other parts will cause the sensor plate 62 to tilt, thus affecting the measurement accuracy of the detection distance. Therefore, a counterweight 69 is set to lift the trigger plate 52, thereby ensuring that the trigger plate 52 remains horizontal and improving the accuracy of wafer inspection.

[0041] An upper sensor 8 for sensing the wafer position is fixedly installed at the lower end of the upper bracket 7. A lens mount 9 is slidably disposed on the upper bracket 7, and the lens 10 is fixedly mounted on the lens mount 9. A drive connecting plate 12 is fixedly disposed at the upper end of the lens mount 9, and a drive cylinder 11 is fixedly disposed at the upper end of the upper bracket 7. The output end of the drive cylinder 11 is fixedly connected to the drive connecting plate 12.

[0042] Since the limit switch 63 controls the lifting and lowering of the carrier plate 42, if the limit switch 63 fails, the carrier plate 42 will not stop after rising to the dangerous height. At this time, the upper sensor 8 detects the rising height of the carrier plate 42. If the carrier plate 42 continues to rise after exceeding the dangerous height, the upper sensor 8 sends a signal to the drive cylinder 11. The drive cylinder 11 drives the drive connecting plate 12 and the lens mount 9 to move upward. The lens mount 9 drives the lens 10 to lift upward, preventing the wafer from colliding with the lens 10 and causing damage to the wafer.

[0043] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A device for preventing hardness tester objective lenses from scratching wafers, comprising a device base (1), wherein a main cabinet (2) and a lifting support (3) are fixedly arranged side by side on the upper end of the device base (1), a processing stage (4) is fixedly installed on the upper end of the lifting support (3), the processing stage (4) is used to place the wafer and drive the wafer to move up and down, and an upper bracket (7) is fixedly arranged on the upper part of the main cabinet (2), wherein a lens (10) for focusing on the wafer surface is installed on the upper bracket (7), characterized in that, A triggering mechanism (5) is fixedly installed on the processing platform (4), and a sensing mechanism (6) is fixedly installed on the main cabinet (2). The sensing mechanism (6) includes a sensing base plate (62) fixedly mounted on the main cabinet (2), and a limit switch (63) cooperating with the triggering mechanism (5) is fixedly mounted on the sensing base plate (62) via a switch mounting plate (64). The triggering mechanism (5) includes a mounting plate (51) fixedly mounted on a carrier plate (42), and a trigger base plate (52) is fixedly mounted on the mounting plate (51). A threaded sleeve (53) is fixedly provided at the lower end of the trigger seat plate (52), and a threaded rod (54) is threadedly connected through the threaded sleeve (53). A trigger plate (56) is fixedly connected at the upper end of the threaded rod (54), and a drive handle (55) is fixedly provided at the lower end of the threaded rod (54). The trigger plate (56) has an annular groove (57) at its lower end. A limit block (58) is slidably arranged in the annular groove (57). A scale (59) is fixedly arranged at the lower end of the limit block (58). The scale (59) is slidably connected to the trigger base plate (52). The sensing mechanism (6) also includes a connecting seat (61) fixedly mounted on the main cabinet (2). A connecting shaft (65) is fixedly mounted on the connecting seat (61). A pulley (67) is mounted on the connecting shaft (65) via a bearing (66). A connecting rope (68) is slidably connected to the pulley (67). One end of the connecting rope (68) is fixedly connected to the trigger seat plate (52), and the other end of the connecting rope (68) is fixedly connected to a counterweight (69). The connecting seat (61) is fixedly provided with a placement rack (610) for placing the counterweight (69). The upper support (7) is fixedly equipped with an upper sensor (8) for sensing the position of the wafer. A lens mount (9) is slidably disposed on the upper bracket (7), and the lens (10) is fixedly mounted on the lens mount (9). A drive connecting plate (12) is fixedly disposed on the upper end of the lens mount (9), and a drive cylinder (11) is fixedly disposed on the upper end of the upper bracket (7). The output end of the drive cylinder (11) is fixedly connected to the drive connecting plate (12).

2. The device for preventing hardness tester objective lenses from scratching wafers according to claim 1, characterized in that, The processing platform (4) includes a platform base (41), a guide rod (49) is slidably connected through the platform base (41), and a carrier plate (42) is fixedly connected to the upper end of the guide rod (49).

3. The device for preventing hardness tester objective lenses from scratching wafers according to claim 2, characterized in that, A bidirectional lead screw (44) is rotatably installed inside the platform (41). Two sets of lead screw sliders (45) are threaded onto the bidirectional lead screw (44). A lower support (46) is fixedly installed on the lead screw slider (45). An upper support (48) is fixedly installed at the center of the lower end of the carrier plate (42). Two sets of connecting rods (47) are rotatably connected to the upper support (48). The connecting rods (47) are rotatably connected to the lower support (46). A lead screw moving motor (43) for driving the bidirectional lead screw (44) to rotate is fixedly installed on the platform (41).

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