Quantum chip package box detection method and device and readable storage medium

Abstract

The application discloses a quantum chip packaging box detection method, and belongs to the technical field of quantum bit chips. The quantum chip packaging box detection method applies a first detection signal to a second welding point without a connected bonding wire, obtains a first Rabi oscillation curve of a quantum bit, and detects whether the second welding point has a signal leakage state. Since weak signal leakage may cause crosstalk, if the second welding point has signal leakage, the leaked signal will cause the quantum bit to generate Rabi oscillation. Therefore, according to the Rabi oscillation frequency in the first Rabi oscillation curve information and a first preset frequency threshold, it can be accurately determined whether the second welding point has signal leakage, and detection on whether the bonding point of the internal connection printed circuit board of the quantum chip packaging box has signal leakage can be completed.

Description

Technical Field

[0001] This application belongs to the field of quantum chip technology, and in particular, it relates to a method, apparatus and readable storage medium for detecting quantum chip packaging boxes. Background Technology

[0002] Quantum chips should not be directly exposed to the environment. Therefore, multiple layers of encapsulation and shielding measures must be introduced to house the quantum chip within a package to prevent interference from external environmental signals. Quantum bits operate in a superconducting cryogenic environment, where detecting signal leakage at the bonding points inside the quantum chip's encapsulation package containing the qubits is extremely difficult.

[0003] Therefore, designing a quantum chip packaging box detection method that can detect whether there is signal leakage at the bonding points and bonding lines of the printed circuit board inside the quantum chip packaging box is an urgent problem to be solved. Summary of the Invention

[0004] This application provides an example of a quantum chip package detection method, apparatus, and readable storage medium, which can accurately detect whether there is signal leakage at the bonding points and bonding lines of the printed circuit board inside the quantum chip package.

[0005] The solution presented in this application example is implemented through the following steps.

[0006] In a first aspect, examples of this application present a method for detecting qubit packages, the method comprising:

[0007] A quantum chip package is obtained, the quantum chip package comprising a quantum chip having a signal-connectable qubit and a first solder point, and a second solder point for connecting to a printed circuit board;

[0008] A first detection signal is applied to the second bonding point where no bonding wire is connected, and the first Rabi oscillation curve information of the quantum bit is obtained;

[0009] Based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, it is determined whether there is signal leakage at the second solder joint, which serves as the first detection information for the quantum chip packaging box.

[0010] According to some examples of this application, in the obtained quantum chip package, the second solder joint is connected to the first solder joint via the bonding wire, and the second solder joint without the bonding wire is obtained in the following way:

[0011] Disconnect the bonding wire from the second solder joint while keeping the bonding wire connected to the first solder joint; or, disconnect the bonding wire from both the first solder joint and the second solder joint.

[0012] According to some examples of this application, determining whether there is signal leakage at the second welding point based on the first Rabi oscillation frequency in the first Rabi oscillation curve information and the first preset frequency threshold includes:

[0013] When the first Rabi oscillation frequency is greater than the first preset frequency threshold, it is determined that there is signal leakage at the second welding point.

[0014] According to some examples of this application, determining whether there is signal leakage at the second welding point based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information includes:

[0015] When the first Rabi oscillation frequency is less than or equal to the first preset frequency threshold, it is determined that there is no signal leakage at the second welding point.

[0016] According to some examples of this application, the method further includes:

[0017] When there is no signal leakage at the second solder joint, the second solder joint is bonded to the first solder joint via the bonding wire, and the signal transmission between the first solder joint and the quantum bit is interrupted.

[0018] A second detection signal is applied to the second welding point to obtain the second Rabi oscillation curve information of the quantum bit;

[0019] Based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, it is determined whether there is signal leakage in the bonding line, which serves as the second detection information for the quantum chip packaging box.

[0020] According to some examples of this application, interrupting the signal transmission between the first welding point and the quantum bit includes:

[0021] Ground the first welding point;

[0022] Alternatively, the first welding point and the quantum bit can be set to an open circuit state.

[0023] According to some examples of this application, determining whether the bonding wire has signal leakage based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information includes:

[0024] When the second Rabi oscillation frequency is greater than the second preset frequency threshold, it is determined that there is signal leakage in the bonding wire.

[0025] According to some examples of this application, determining whether the bonding wire has signal leakage based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information includes:

[0026] When the second Rabi oscillation frequency is less than or equal to the second preset frequency threshold, it is determined that there is no signal leakage in the bonding wire.

[0027] In a second aspect, this application provides an example of a quantum chip package inspection device, the device comprising:

[0028] A packaging box acquisition module is used to obtain a quantum chip packaging box, the quantum chip packaging box including a quantum chip with signal-connectable qubits and a first solder point and a second solder point for connecting to a printed circuit board;

[0029] The first Rabi oscillation curve acquisition module is used to apply a first detection signal to the second bonding point where no bonding wire is connected, and to obtain the first Rabi oscillation curve information of the quantum bit;

[0030] The first detection information determination module is used to determine whether there is signal leakage at the second solder joint based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, as the first detection information of the quantum chip package.

[0031] According to some examples of this application, in the quantum chip package obtained by the package acquisition module, the second solder point is connected to the first solder point by the bonding wire;

[0032] The first Rabi oscillation curve acquisition module is also used for:

[0033] Disconnect the bonding wire from the second solder joint while keeping the bonding wire connected to the first solder joint; or, disconnect the bonding wire from both the first solder joint and the second solder joint.

[0034] According to some examples in this application, the first detection information determination module is specifically used for:

[0035] When the first Rabi oscillation frequency is greater than the first preset frequency threshold, it is determined that there is signal leakage at the second welding point.

[0036] According to some examples in this application, the first detection information determination module is specifically used for:

[0037] When the first Rabi oscillation frequency is less than or equal to the first preset frequency threshold, it is determined that there is no signal leakage at the second welding point.

[0038] According to some examples of this application, the quantum chip package detection device further includes:

[0039] The bonding state control module is used to connect the second bonding point to the first bonding point via the bonding wire and interrupt the signal transmission between the first bonding point and the quantum bit when there is no signal leakage at the second bonding point.

[0040] The second Rabi oscillation curve acquisition module is used to apply a second detection signal to the second welding point to obtain the second Rabi oscillation curve information of the quantum bit.

[0041] The second detection information determination module is used to determine whether there is signal leakage in the bonding line based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, as the second detection information of the quantum chip packaging box.

[0042] According to some examples of this application, the weld point bonding state control module is specifically used for:

[0043] Ground the first welding point;

[0044] Alternatively, the first welding point and the quantum bit can be set to an open circuit state.

[0045] According to some examples in this application, the second detection information determination module is specifically used for:

[0046] When the second Rabi oscillation frequency is greater than the second preset frequency threshold, it is determined that there is signal leakage in the bonding wire.

[0047] According to some examples in this application, the second detection information determination module is specifically used for:

[0048] When the second Rabi oscillation frequency is less than or equal to the second preset frequency threshold, it is determined that there is no signal leakage in the bonding wire.

[0049] In a third aspect, this application provides an example of a readable storage medium having a computer program stored thereon, which, when executed by a processor, can implement the quantum chip package detection method described in the first aspect above.

[0050] In the quantum chip package detection method described in the foregoing example of this application, a first detection signal is applied to the second solder joint where no bonding wire is connected to obtain a first Rabi oscillation curve of the qubit, thereby detecting whether there is a signal leakage at the second solder joint. Since even a weak signal leakage can cause crosstalk, if there is a signal leakage at the second solder joint, the leakage signal will cause the qubit to generate Rabi oscillations. Therefore, based on the Rabi oscillation frequency and a first preset frequency threshold in the information of the first Rabi oscillation curve, it is possible to accurately determine whether there is a signal leakage at the second solder joint, thus completing the detection of whether there is a signal leakage at the bonding points of the printed circuit board connected inside the quantum chip package. Attached Figure Description

[0051] To illustrate this more clearly, the accompanying drawings used in the description will be briefly introduced below.

[0052] Figure 1 This is a flowchart of a quantum chip packaging box detection method for detecting the second solder joint, as shown in this application example.

[0053] Figure 2 a to 2c are schematic diagrams of the structure of a quantum chip packaging box in one example of this application;

[0054] Figure 3 This is a flowchart of a quantum chip packaging box detection method for detecting bonding lines, as shown in the example of this application.

[0055] Figure 4 This is a schematic diagram of the quantum chip packaging box detection device in the example of this application.

[0056] Figure labeling: 200 - Quantum chip package; 210 - First bonding point; 220 - Quantum bit; 230 - Second bonding point; 240 - Bonding line. Detailed Implementation

[0057] The specific embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0058] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] Quantum bits operate in a superconducting cryogenic environment, and detecting signal leakage at the bonding points inside the quantum chip package containing the qubits is extremely difficult in this environment. Therefore, as... Figure 1 As shown, the first embodiment of the present invention provides a method for detecting a quantum bit package, the method comprising:

[0060] S11: Obtain a quantum chip package, which includes a quantum chip with signal-connectable qubits and a first solder point, and a second solder point for connecting to a printed circuit board.

[0061] In this context, the first bonding point refers to the chip pad of the control and readout layer (base layer) in the quantum chip. Specifically, the first bonding point can be an XY signal transmission point, connected to the quantum bit via an XY signal transmission line, used to receive XY signals and transmit them to the quantum bit. The second bonding point refers to the PCB-bonding pad connecting the printed circuit board (PCB). It should be noted that this application does not specifically limit the connection relationship between the first bonding point and the quantum bit.

[0062] In one embodiment of this application, when the first welding point is an XY signal transmission point, no XY signal transmission line is provided between the first welding point and the quantum bit, so as to avoid crosstalk of transmission lines on the quantum chip.

[0063] Specifically, such as Figure 2 As shown in Figure a, this is a structural schematic diagram of the quantum chip packaging box 200 in an embodiment of this application. The quantum chip packaging box 200 includes a first solder point 210 and a quantum bit 220 located on the quantum chip and a second solder point 230 connected to the PCB board. The PCB board is a printed circuit board, which can also be other circuit boards or signal transmission lines used to transmit quantum signals, or integrated signal transmission lines. This application uses a printed circuit board as an example, but is not limited to this.

[0064] It should be noted that, during the implementation of the method in this application, the quantum chip packaging box 200 is placed in a low-temperature superconducting working environment. Furthermore, the second solder point 230 is located on the quantum chip packaging box 200 and is used to connect to the PCB board outside the packaging box 200. This application does not specifically limit whether the PCB board is located inside or outside the quantum chip packaging box 200.

[0065] S12: Apply a first detection signal to the second bonding point where the bonding wire is not connected, and obtain the first Rabi oscillation curve information of the quantum bit.

[0066] Specifically, the fact that the second solder point 230 is not bonded to the bonding line 240 indicates that the second solder point 230 and the bonding line 240 are in an unconnected state, without limiting the connection state between the bonding line 240 and the first solder point 210. Furthermore, the quantum chip may include multiple qubits 220 and multiple second solder points 230. For any one second solder point 230, applying a first detection signal to the second solder point 230 yields the Rabi oscillation information of any one qubit 220 on the quantum chip.

[0067] S13: Based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, determine whether there is signal leakage at the second solder joint, which serves as the first detection information for the quantum chip packaging box.

[0068] Since even a slight signal leakage can cause crosstalk, if signal leakage occurs at the second solder joint 230, the leaked signal will cause the qubit 220 on the quantum chip to generate Rabi oscillations. Furthermore, the terminal stores a first preset frequency threshold corresponding to the first detection signal. This first preset frequency threshold is used to determine whether signal leakage at the second solder joint 230 causes crosstalk. The first preset frequency threshold is the product of the Rabi oscillation frequency generated by the qubit 220 under the action of the first detection signal when the first detection signal is applied without loss and a preset coefficient. It should be noted that this preset coefficient is related to the crosstalk coefficient, and the setting of this preset coefficient can be adjusted according to actual needs.

[0069] Since the second solder point 230 and the bonding line 240 are not bonded together, when the first detection signal is applied to the second solder point 230, if there is signal leakage at the second solder point 230, the leaked signal exists inside the quantum chip package 200. This leaked signal will cause the qubit 220 to oscillate in Rabi. Based on this, the relationship between the obtained first Rabi oscillation frequency of the qubit 220 and the first preset frequency threshold can be used to determine whether there is signal leakage at the second solder point 230, causing crosstalk, thus completing the detection of the signal leakage status of the bonding points connecting the printed circuit board inside the quantum chip package 200.

[0070] In one embodiment of this application, in the obtained quantum chip package, the second solder joint is connected to the first solder joint via a bonding wire, and the second solder joint without a bonding wire is obtained in the following way:

[0071] Disconnect the bonding wire from the second solder joint while keeping the bonding wire connected to the first solder joint; or disconnect the bonding wire from both the first and second solder joints respectively.

[0072] Specifically, if there is no bonding wire 240 between the first solder point 210 and the second solder point 230 within the obtained quantum chip packaging box 200, then the second solder point 230 will always remain unconnected to the bonding wire 240; if the first solder point 210 and the second solder point 230 within the obtained quantum chip packaging box 200 are connected by the bonding wire 240, then the connection between the second solder point 230 and the bonding wire 240 needs to be disconnected, without limiting the connection relationship between the bonding wire 240 and the first solder point 210.

[0073] Therefore, when the first solder point 210 and the second solder point 230 within the obtained quantum chip package 200 are connected by bonding wire 240, as... Figure 2 As shown in b, a second solder point 230 without the bond wire 240 can be obtained by disconnecting the bond wire 240 from the second solder point 230 while keeping the bond wire 240 connected to the first solder point 210; or, as shown in b. Figure 2 As shown in Figure c, the bonding wire 240 is disconnected from the first solder point 210 and the second solder point 230 respectively, resulting in a second solder point 230 without the bonding wire 240 connected.

[0074] In one embodiment of this application, step S13 above, which involves determining whether there is signal leakage at the second solder joint based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, as the first detection information for the quantum chip packaging box, includes:

[0075] When the first Rabi oscillation frequency is greater than the first preset frequency threshold, it is determined that there is signal leakage at the second welding point.

[0076] In one embodiment of this application, step S13 above, which involves determining whether there is signal leakage at the second solder joint based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, as the first detection information for the quantum chip packaging box, includes:

[0077] When the first Rabi oscillation frequency is less than or equal to the first preset frequency threshold, it is determined that there is no signal leakage at the second welding point.

[0078] Specifically, the first preset frequency threshold is the product of the Rabi oscillation frequency generated by the qubit 220 under the action of the first detection signal and a preset coefficient, which is related to the crosstalk coefficient. Therefore, when the obtained first Rabi oscillation frequency is greater than the first preset frequency threshold, the second welding point 230 is determined to be in a signal leakage state, causing crosstalk in the qubit 220; when the obtained first Rabi oscillation frequency is less than or equal to the first preset frequency threshold, the second welding point 230 is determined not to cause crosstalk in the qubit 220, and is in a state without signal leakage.

[0079] like Figure 3 As shown, in one embodiment of this application, the quantum bit package detection method further includes:

[0080] S31: When there is no signal leakage at the second solder point, the second solder point is bonded to the first solder point via a bonding wire, and the signal transmission between the first solder point and the quantum bit is interrupted.

[0081] Because crosstalk in the quantum chip package 200 may occur due to the combined effect of one or both of the PCB-bonding pad and bonding wire 240, when the PCB-bonding pad and bonding wire 240 are connected, it is impossible to specifically determine whether there is signal leakage in the PCB-bonding pad or bonding wire 240. It is necessary to check for signal leakage in each PCB-bonding pad or bonding wire 240 individually. Specifically, the PCB-bonding pad must first be disconnected from the bonding wire 240, and signal leakage in the PCB-bonding pad must be checked. If signal leakage is found in the PCB-bonding pad, the PCB-bonding pad with the leakage will be corrected until it is determined that there is no signal leakage in the PCB-bonding pad. Then, the bonding wire 240 connected to it will be checked for signal leakage.

[0082] S32: Apply a second detection signal to the second welding point to obtain the second Rabi oscillation curve information of the qubit.

[0083] The first detection signal and the second detection signal can be the same detection signal. The first detection signal corresponds to a first preset frequency threshold, and the second detection signal corresponds to a second preset frequency threshold.

[0084] S33: Based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, determine whether there is signal leakage in the bonding line, which serves as the second detection information for the quantum chip packaging box.

[0085] Since there is no signal leakage between the PCB and the bonding pad, and the signal transmission between the first solder point 210 and the quantum bit 220 is interrupted, if there is signal leakage on the bonding wire 240, the leaked signal exists inside the quantum chip package 200. This leaked signal will cause the quantum bit 220 to oscillate using Rabi. Based on this, the relationship between the second Rabi oscillation frequency of the quantum bit 220 and the second preset frequency threshold can be used to determine whether there is signal leakage on the bonding wire 240, causing crosstalk, thus completing the detection of the signal leakage status of the bonding wire 240 connected inside the quantum chip package 200.

[0086] Furthermore, the quantum chip package 200 contains multiple PCB-bonding pads, each connected to multiple bonding wires 240. Therefore, signal leakage is detected for each PCB-bonding pad individually. For PCB-bonding pads that are determined to have no signal leakage, they are connected one by one to the bonding wires 240 to detect whether there is signal leakage on the connected bonding wires 240.

[0087] In one embodiment of this application, step S31 above, interrupting the signal transmission between the first welding point and the quantum bit, includes:

[0088] Ground the first welding point;

[0089] Alternatively, the first welding point can be set to an open circuit state with respect to the qubit.

[0090] Specifically, the first solder point 210 (chip pad) is grounded, or the signal transmission line between the first solder point 210 and the quantum bit 220 is disconnected, so as to prevent the second detection signal from passing through the PCB-bonding-pad, bonding line 240, and chip pad to the quantum bit 220, causing the quantum bit 220 to oscillate.

[0091] In one embodiment of this application, step S33: determining whether there is signal leakage in the bond wire based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, includes:

[0092] When the second Rabi oscillation frequency is greater than the second preset frequency threshold, it is determined that there is signal leakage in the bonding wire.

[0093] In one embodiment of this application, step S33: determining whether there is signal leakage in the bond wire based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, includes:

[0094] When the second Rabi oscillation frequency is less than or equal to the second preset frequency threshold, it is determined that there is no signal leakage in the bonding wire.

[0095] Specifically, the second preset frequency threshold is the product of the Rabi oscillation frequency generated by the qubit 220 under the action of the second detection signal when the second detection signal is applied losslessly to the qubit 220 and a preset coefficient, which is related to the crosstalk coefficient. Therefore, when the obtained second Rabi oscillation frequency is greater than the second preset frequency threshold, the bonding line 240 is determined to be in a signal leakage state, causing crosstalk to the qubit 220; when the obtained second Rabi oscillation frequency is less than or equal to the second preset frequency threshold, the bonding line 240 is determined not to cause crosstalk to the qubit 220, and is in a state where there is no signal leakage.

[0096] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0097] Based on the same inventive concept, this application also provides a quantum chip package detection device for implementing the quantum chip package detection method described above. The solution provided by this device is similar to the implementation described in the above method; therefore, the specific limitations in one or more embodiments of the quantum chip package detection device provided below can be found in the limitations of the quantum chip package detection method described above, and will not be repeated here.

[0098] like Figure 4 As shown, in one embodiment of this application, a quantum chip packaging box detection device 400 is provided, comprising:

[0099] The packaging box acquisition module 410 is used to acquire a quantum chip packaging box, which includes a quantum chip with signal-connectable qubits and a first solder point, and a second solder point for connecting to a printed circuit board.

[0100] The first Rabi oscillation curve acquisition module 420 is used to apply a first detection signal to the second bonding point where the bonding wire is not connected, and to obtain the first Rabi oscillation curve information of the quantum bit;

[0101] The first detection information determination module 430 is used to determine whether there is signal leakage at the second welding point based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, as the first detection information of the quantum chip package.

[0102] In one embodiment of this application, in the quantum chip package obtained by the package acquisition module 410, the second solder point is connected to the first solder point by a bonding wire;

[0103] The first Rabi oscillation curve acquisition module 420 is also used for:

[0104] Disconnect the bonding wire from the second solder joint while keeping the bonding wire connected to the first solder joint; or disconnect the bonding wire from both the first and second solder joints respectively.

[0105] In one embodiment of this application, the first detection information determination module 430 is specifically used for:

[0106] When the first Rabi oscillation frequency is greater than the first preset frequency threshold, it is determined that there is signal leakage at the second welding point.

[0107] In one embodiment of this application, the first detection information determination module 430 is specifically used for:

[0108] When the first Rabi oscillation frequency is less than or equal to the first preset frequency threshold, it is determined that there is no signal leakage at the second welding point.

[0109] In one embodiment of this application, the quantum chip package detection device 400 further includes:

[0110] The bonding state control module is used to bond the second bonding point to the first bonding point via a bonding wire and interrupt the signal transmission between the first bonding point and the quantum bit when there is no signal leakage at the second bonding point.

[0111] The second Rabi oscillation curve acquisition module is used to apply a second detection signal to the second welding point to obtain the second Rabi oscillation curve information of the quantum bit.

[0112] The second detection information determination module is used to determine whether there is signal leakage in the bonding line based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, as the second detection information of the quantum chip package.

[0113] In one embodiment of this application, the solder joint bonding state control module is specifically used for:

[0114] Ground the first welding point;

[0115] Alternatively, the first welding point can be set to an open circuit state with respect to the qubit.

[0116] In one embodiment of this application, the second detection information determination module is specifically used for:

[0117] When the second Rabi oscillation frequency is greater than the second preset frequency threshold, it is determined that there is signal leakage in the bonding wire.

[0118] In one embodiment of this application, the second detection information determination module is specifically used for:

[0119] When the second Rabi oscillation frequency is less than or equal to the second preset frequency threshold, it is determined that there is no signal leakage in the bonding wire.

[0120] It is understood that the package acquisition module 410, the first Rabi oscillation curve acquisition module 420, and the first detection information determination module 430 can be implemented in one device, or any one of these modules can be split into multiple sub-modules. Alternatively, at least part of the functionality of one or more of the packages acquisition module 410, the first Rabi oscillation curve acquisition module 420, and the first detection information determination module 430 can be combined with at least part of the functionality of other modules and implemented in one functional module. According to embodiments of the present invention, at least one of the packages acquisition module 410, the first Rabi oscillation curve acquisition module 420, and the first detection information determination module 430 can be at least partially implemented as hardware circuitry, such as a field-programmable gate array (FPGA), a programmable logic array (PLA), a system-on-a-chip, a system-on-a-substrate, a system-on-a-package, an application-specific integrated circuit (ASIC), or can be implemented in hardware or firmware in any other reasonable manner of integrating or packaging the circuitry, or in a suitable combination of software, hardware, and firmware implementations. Alternatively, at least one of the encapsulation box acquisition module 410, the first Rabi oscillation curve acquisition module 420, and the first detection information determination module 430 can be at least partially implemented as a computer program module, which can perform the functions of the corresponding module when the program is run by a computer.

[0121] Based on the same inventive concept, embodiments of the present invention also propose a readable storage medium storing a computer program thereon, which, when executed by a processor, can implement the quantum chip package detection method described above.

[0122] A readable storage medium can be a tangible device capable of holding and storing instructions for use by an instruction execution device, such as, but not limited to, electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination thereof. The computer programs described herein can be downloaded from the readable storage medium to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. Networks can include copper transmission cables, fiber optic transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. Each computing / processing device's network adapter card or network interface receives and forwards a computer program from the network for storage on a readable storage medium within the respective computing / processing device. The computer program used to perform the operations of this invention can be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as "C" or similar languages. The computer program can execute entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuits, such as programmable logic circuits, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), are personalized by utilizing state information from a computer program. These electronic circuits can execute computer-readable program instructions, thereby realizing various aspects of the present invention.

[0123] Various aspects of the present invention are described herein with reference to flowchart illustrations and / or block diagrams of methods, systems, and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by a computer program. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. These computer programs can also be stored in a readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the readable storage medium storing the computer program comprises an article of manufacture including instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams.

[0124] A computer program may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the computer program executing on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0125] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," or "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0126] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.

Claims

1. A method for detecting quantum chip packaging boxes, characterized in that, The method includes: A quantum chip package is obtained, the quantum chip package includes a quantum chip and a second solder joint for connecting to a printed circuit board, the quantum chip has a signal-connectable qubit and a first solder joint; A first detection signal is applied to the second solder joint where no bonding wire is connected, and the first Rabi oscillation curve information of the quantum bit is obtained. The bonding wire is used to connect the first solder joint and the second solder joint. Based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, it is determined whether there is signal leakage at the second solder joint, which serves as the first detection information for the quantum chip packaging box.

2. The quantum chip packaging box detection method according to claim 1, characterized in that, In the obtained quantum chip package, the second solder joint is connected to the first solder joint via the bonding wire, and the second solder joint without the bonding wire is obtained in the following way: Disconnect the bonding wire from the second solder joint while keeping the bonding wire connected to the first solder joint; or, disconnect the bonding wire from both the first solder joint and the second solder joint.

3. The quantum chip packaging box detection method according to claim 1, characterized in that, The step of determining whether there is signal leakage at the second welding point based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information includes: When the first Rabi oscillation frequency is greater than the first preset frequency threshold, it is determined that there is signal leakage at the second welding point.

4. The quantum chip packaging box detection method according to claim 1 or 3, characterized in that, The step of determining whether there is signal leakage at the second welding point based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information includes: When the first Rabi oscillation frequency is less than or equal to the first preset frequency threshold, it is determined that there is no signal leakage at the second welding point.

5. The quantum chip packaging box detection method according to claim 1, characterized in that, The method further includes: When there is no signal leakage at the second solder joint, the second solder joint is bonded to the first solder joint via the bonding wire, and the signal transmission between the first solder joint and the quantum bit is interrupted. A second detection signal is applied to the second welding point to obtain the second Rabi oscillation curve information of the quantum bit; Based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information, it is determined whether there is signal leakage in the bonding line, which serves as the second detection information for the quantum chip packaging box.

6. The quantum chip packaging box detection method according to claim 5, characterized in that, The interruption of signal transmission between the first welding point and the quantum bit includes: Ground the first welding point; Alternatively, the first welding point and the quantum bit can be set to an open circuit state.

7. The quantum chip packaging box detection method according to claim 5, characterized in that, The step of determining whether there is signal leakage in the bonding wire based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information includes: When the second Rabi oscillation frequency is greater than the second preset frequency threshold, it is determined that there is signal leakage in the bonding wire.

8. The quantum chip packaging box detection method according to claim 5 or 7, characterized in that, The step of determining whether there is signal leakage in the bonding wire based on the second Rabi oscillation frequency and the second preset frequency threshold in the second Rabi oscillation curve information includes: When the second Rabi oscillation frequency is less than or equal to the second preset frequency threshold, it is determined that there is no signal leakage in the bonding wire.

9. A quantum chip packaging box testing device, characterized in that, The device includes: A packaging box acquisition module is used to obtain a quantum chip packaging box, the quantum chip packaging box including a quantum chip and a second solder joint for connecting a printed circuit board, the quantum chip having a signal-connectable qubit and a first solder joint; The first Rabi oscillation curve acquisition module is used to apply a first detection signal to the second bonding point where no bonding wire is connected, and to obtain the first Rabi oscillation curve information of the quantum bit, wherein the bonding wire is used to connect the first bonding point and the second bonding point; The first detection information determination module is used to determine whether there is signal leakage at the second solder joint based on the first Rabi oscillation frequency and the first preset frequency threshold in the first Rabi oscillation curve information, as the first detection information of the quantum chip package.

10. A readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it can implement the quantum chip package detection method according to any one of claims 1-8.

Images