Electronic device
By using a composite design of heat dissipation layer and support layer in foldable screen devices, the problem of the bending rebound force of steel sheet affecting user experience is solved, achieving the device to be thin, light, low power consumption and high heat dissipation, thus improving user experience and device performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2023-12-01
- Publication Date
- 2026-07-21
AI Technical Summary
During the transition between unfolded and folded states, existing foldable electronic devices experience significant rebound force due to the bending of the steel sheet, which affects the user's comfort when holding the device and the overall experience of opening/closing torque, hovering torque, and flattening torque.
The design combines a flexible display screen with composite components, including a heat dissipation layer and a support layer. The support layer is adhered to the heat dissipation layer instead of the hinge door panel. The heat dissipation layer is connected to the frame. The support layer has room to move during bending, reducing rebound force, and is fixed by adhesive backing, avoiding the need for glue application process, thus reducing energy consumption and cost.
The user experience has been optimized, the rebound force during the bending process of the support layer has been reduced, the overall thickness and energy consumption have been reduced, the process cost has been lowered, abnormal noise and oil sticking problems have been avoided, and the heat dissipation and impact resistance of the equipment have been improved.
Smart Images
Figure CN117558206B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of communication technology, and specifically relates to an electronic device. Background Technology
[0002] Currently, in the design of foldable phones, an ultra-thin steel sheet is added between the hinge and the main screen to improve the impact and static pressure resistance of the bending area of the foldable screen. The ultra-thin steel sheet is bonded to the hinge panel. During the transition between the unfolded and folded states of the foldable phone, the steel sheet bends. The bending process generates a large rebound force, which affects the opening and closing torque, hovering torque, and torque held in the flattened state of the entire device. It can also produce abnormal noises, affecting the user experience. Summary of the Invention
[0003] The purpose of this application is to provide an electronic device that can solve the problem that the bending of the steel sheet during the switching between unfolded and folded states in existing foldable electronic devices generates a large rebound force, reducing the user's comfort when holding the device.
[0004] This application provides an electronic device, including:
[0005] A first frame and a second frame are connected by a hinge assembly;
[0006] A flexible display screen, which covers the hinge assembly and is connected to the first frame and the second frame respectively;
[0007] The composite component includes a heat dissipation layer and a support layer, the support layer being adhered to the heat dissipation layer, the heat dissipation layer being connected to the first frame and the second frame respectively, and the support layer being disposed between the heat dissipation layer and the hinge assembly.
[0008] The electronic device in this embodiment includes a first frame and a second frame, which are connected by a hinge assembly; a flexible display screen, which covers the hinge assembly and is connected to the first and second frames respectively; and a composite component, including a heat dissipation layer and a support layer. The support layer is adhered to the heat dissipation layer and is connected to the first and second frames respectively. The support layer is disposed between the heat dissipation layer and the hinge assembly and is connected to the first and second frames respectively through the heat dissipation layer. The support layer is adhered to the heat dissipation layer, rather than being glued to the hinge panel. In this way, the support layer has a certain amount of room to move during the switching between the unfolded and switched states of the electronic device. While maintaining the strength of the bending area, it can reduce the rebound force of the support layer during the bending process and optimize the impact of the existing steel sheet on the hinge torque-related experience. Attached Figure Description
[0009] Figure 1 It is a top view of the existing electronic device;
[0010] Figure 2 yes Figure 1 Schematic diagram of the cross section along line A'-A';
[0011] Figure 3 yes Figure 2 Enlarged structural diagram of the middle circle B';
[0012] Figure 4 This is an exploded structural diagram of the electronic device according to an embodiment of this application;
[0013] Figure 5 This is a top view of the electronic device according to an embodiment of this application;
[0014] Figure 6 yes Figure 5 A schematic diagram of the cross-section along line CC;
[0015] Figure 7 yes Figure 6 Enlarged structural diagram of center circle B;
[0016] Figure 8 This is a partially exploded structural diagram of the electronic device according to an embodiment of this application;
[0017] Figure 9 This is one of the cross-sectional schematic diagrams of the electronic device in the unfolded state according to an embodiment of this application;
[0018] Figure 10 This is a second cross-sectional schematic diagram of the electronic device in the unfolded state according to an embodiment of this application;
[0019] Figure 11 This is a cross-sectional schematic diagram of the electronic device in the present application when it is in a folded state;
[0020] Figure 12 yes Figure 11 Enlarged structural diagram of center circle A;
[0021] Figure 13 This is one of the structural schematic diagrams of the support layer in an embodiment of this application;
[0022] Figure 14 This is a second schematic diagram of the support layer structure in an embodiment of this application;
[0023] Figure 15 This is the third schematic diagram of the support layer structure in an embodiment of this application;
[0024] Figure 16 This is the fourth schematic diagram of the support layer structure in an embodiment of this application;
[0025] Figure 17 This is the fifth schematic diagram of the support layer in an embodiment of this application. Detailed Implementation
[0026] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0027] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0028] Figures 1 to 3 This is a schematic diagram of the existing ultra-thin steel sheet stacking effect. In the existing solution, the ultra-thin steel sheets 102 are all bonded to the hinge door panel 104 using double-sided adhesive 101, with the thickness of the double-sided adhesive (or spot adhesive) generally being 0.1-0.2mm. Simultaneously, an isolation pad 103 is added to the front of the ultra-thin steel sheet 102 to prevent direct contact between the ultra-thin steel sheet and the bottom of the main screen, avoiding abnormal noise; a buffer pad 105 is also added to the bottom of the ultra-thin steel sheet to increase buffering and isolate the large surface of the ultra-thin steel sheet from direct contact with the hinge area, preventing abnormal noise. The existing solution has a relatively thick overall ultra-thin steel sheet stacking thickness; moreover, in the existing solution, the ultra-thin steel sheet structure generally uses spliced steel sheets or a single sheet of steel, and the fixed end of the ultra-thin steel sheet is generally designed in the hinge door panel plane area, requiring the fixed and movable ends of the ultra-thin steel sheet to have relatively regular shapes. Large, uniformly shaped ultra-thin steel sheets can cause significant rebound forces during bending, affecting the overall opening and closing torque, hovering torque, and torque retention when flattened. Furthermore, existing solutions require spot adhesive application or large-area adhesive bonding to ensure reliable bonding of the ultra-thin steel sheets. Additionally, the hinge panel surface requires a high degree of cleanliness, typically necessitating alcohol wiping or plasma treatment before bonding the ultra-thin steel sheets, all of which incur substantial processing costs.
[0029] To address the aforementioned technical problems, embodiments of this application provide an electronic device. The electronic device provided in this application will be described in detail below with reference to the accompanying drawings and specific embodiments and application scenarios.
[0030] like Figures 4 to 12As shown in the figure, this application provides an electronic device, which includes: a first frame 1 and a second frame 2, the first frame 1 and the second frame 2 being connected by a hinge assembly 3; a flexible display screen 4, which covers the hinge assembly 3 and is respectively connected to the first frame 1 and the second frame 2; and a composite component, including a heat dissipation layer 5 and a support layer 6, the support layer 6 being adhered to the heat dissipation layer 5, the heat dissipation layer 5 being respectively connected to the first frame 1 and the second frame 2, and the support layer 6 being disposed between the heat dissipation layer 5 and the hinge assembly 3.
[0031] Here, the first frame 1 and the second frame 2 are used to support and accommodate other components. The first frame 1 and the second frame 2 rotate relative to the hinge assembly 3, thereby enabling the flexible display screen 4 to switch between a folded state and an unfolded state. The hinge assembly 3 connects the first frame 1 and the second frame 2, providing limiting and guiding functions during connection and rotation. In some embodiments, the hinge assembly 3 can be connected to the first frame 1 and the second frame 2 via screws, specifically in series.
[0032] In some embodiments, see Figure 4 The flexible display screen 4 can be bonded and fixed to the first frame 1 and the second frame 2 using double-sided adhesive 200. The electronic device in this embodiment also includes a frame decorative ring 400, which is bonded and fixed to the first frame 1 and the second frame 2 using adhesive.
[0033] The electronic device of this application is connected to the first frame 1 and the second frame 2 respectively via a heat dissipation layer 5. The support layer 6 is adhered to the heat dissipation layer 5, rather than to the hinge panel of the hinge assembly 3. This allows the support layer some room to move during the switching between the unfolded and switched states, reducing the rebound force during bending and optimizing the impact of existing steel sheets on the hinge torque-related experience. Simultaneously, the heat dissipation layer 5 reduces the heat generated by the mechanical movement of the hinge assembly 3 and the support layer 6 during the switching between the unfolded and switched states, thereby lowering the temperature of the electronic device and reducing energy consumption. Furthermore, since the support layer 6 is not directly adhered to the hinge panel of the hinge assembly 3, the associated adhesive and bonding process costs are eliminated, resulting in a lower overall cost.
[0034] In some embodiments, see Figure 9 and Figure 10 The heat dissipation layer 5 is provided with at least one extension portion 500. When the electronic device is in the unfolded state, the extension portion 500 is in the retracted state; when the electronic device is in the folded state, the extension portion 500 is in the unfolded state, so that the heat dissipation layer 5 is stretched to fit against the flexible display screen 4.
[0035] In some embodiments, see Figure 10There is one extension section 500, which is disposed on one side of the support layer 6. Specifically, the extension section 500 can be in "state one", that is, one side is in an expanded state (tense state) and the other side is in a contracted state (relaxed state).
[0036] In some embodiments, see Figure 9 There are two extension portions 500, located on both sides of the support layer 6. Specifically, the extension portions 500 can be in "state two", that is, both sides are in a contracted state (relaxed state).
[0037] The extension section 500 is in a retracted state (relaxed state) when the electronic device is in the unfolded state. When the flexible display screen 4 is in the folded state, it will no longer bend, but will be in the unfolded state (tensioned state) and stretched to fit against the flexible display screen 4. See [link to relevant documentation]. Figures 11-12 .
[0038] Here, the extension 500 is used to accommodate the length difference of the heat dissipation layer 5 between the folded and unfolded states of the electronic device.
[0039] In some embodiments, the side of the heat dissipation layer 5 facing away from the flexible display screen 4 is provided with adhesive backing. The electronic device also includes a cover 7, which is attached to the extension portion 500 by the adhesive backing. See [link to documentation]. Figure 7 and Figure 8 .
[0040] The first frame 1, the support layer 6, and the second frame 2 are all bonded to the heat dissipation layer 5 by the adhesive backing provided on the heat dissipation layer 5.
[0041] In other words, the side of the heat dissipation layer 5 facing away from the flexible display screen 4 is provided with adhesive, and the support layer 6 is attached to the heat dissipation layer 5 by the adhesive. It does not need to be fixed to the hinge panel in the hinge assembly 3 by spot glue or double-sided adhesive. Therefore, the thickness of the area where the hinge assembly 3 is located in the direction perpendicular to the flexible display screen 4 can be reduced, thereby reducing the overall thickness of the electronic device. Using the design of the electronic device according to this embodiment, the thickness of the area where the hinge assembly 3 is located in the direction perpendicular to the flexible display screen 4 can be relatively reduced by 0.1mm to 0.2mm of the bonding space, corresponding to a reduction of approximately 0.1mm to 0.2mm in the overall thickness of the device.
[0042] See Figure 4 The heat dissipation layer 5 covers the entire area where the hinge assembly 3 is located, which ensures that there are no holes or breaks in the area where the hinge assembly 3 is located. It can also isolate the lubricating oil from overflowing in the area where the hinge assembly 3 is located, prevent oil from adhering to the flexible display screen 4, and avoid problems such as oil sticking and abnormal noise.
[0043] The cover 7 is attached to the extension 500 with adhesive backing. The purpose of this arrangement is to ensure that the extension 500 can always be suspended in a free state, avoiding contact with or adhesion to other structural components.
[0044] It should be noted that the material of the cover 7 can be PET film. The thickness of the cover 7 is 0.003mm to 0.01mm.
[0045] The heat dissipation layer 5 described in this embodiment not only has the functions of heat conduction and heat dissipation, but also has a certain bending characteristic, which can ensure that the electronic device can switch between a folded state and an unfolded state. Optionally, the heat dissipation layer 5 is made of graphite.
[0046] In some embodiments, the heat dissipation layer 5 may be selected from thermally conductive graphite heat dissipation film or pyrolytic graphite sheet (PGS) heat dissipation film to further realize rapid heat diffusion within the electronic device and improve the heat dissipation performance of the electronic device.
[0047] In some embodiments, the support layer 6 can withstand greater impacts; that is, under the same impact, the support layer 6 has a higher elastic modulus and produces less deformation. Therefore, the support layer 6 may optionally be a steel sheet, titanium alloy, carbon fiber, etc.
[0048] In some embodiments, see Figure 7 and Figure 8 The electronic device of this application is also provided with a buffer layer 8, which is disposed between the composite and the hinge assembly 3, and the buffer layer 8 is bonded to the support layer 6.
[0049] Optionally, the two opposing surfaces of the buffer layer 8 are provided with adhesive backing; the buffer layer 8 is bonded to the support layer 6 and the hinge assembly 3 respectively through the adhesive backing.
[0050] It should be noted that the buffer layer 8 can isolate the composite component from direct contact with the parts in the hinge assembly 3, thus preventing abnormal noise. At the same time, the buffer layer 8 can also absorb energy, increasing the impact resistance of the flexible display screen 4 and further protecting the electronic equipment.
[0051] In some embodiments, the buffer layer 8 at least partially covers the area where the hinge assembly 3 is located. In one embodiment, the buffer layer 8 is designed to fully cover the area where the hinge assembly 3 is located.
[0052] In some embodiments, the buffer layer 8 may be foam. Foam has a series of characteristics such as elasticity, light weight, rapid pressure-sensitive fixation, ease of use, flexibility, ultra-thin size, and reliable performance. The thickness of the buffer layer 8 is between 0.05 mm and 0.15 mm.
[0053] See Figures 13-17 The support layer 6 is provided with a slit 61, the extension direction of which is perpendicular to the unfolding direction of the extension portion 500, so that when the electronic device is folded, the support layer 6 bends along with the heat dissipation layer 5.
[0054] It should be noted that by making a cutting seam treatment, the impact of the rebound force brought by the elastic plate during the folding process can be greatly reduced, and the impact of the existing steel plate on the hinge torque-related experience (including opening and closing torque, hovering torque, and flattened holding torque experience) can be optimized.
[0055] In some embodiments, see Figure 13 There are multiple fractures 61, which are symmetrically distributed about the centerline of the support layer 6. The distance between two adjacent fractures 61 is equal from the centerline of the support layer 6 to the edge.
[0056] By setting more gaps 61 on the support layer 6, the impact of the rebound force brought about by the folding process of the support layer can be further reduced.
[0057] In some embodiments, see Figure 14 There are multiple fractures 61, which are symmetrically distributed about the centerline of the support layer 6. The distance between two adjacent fractures 61 gradually decreases from the centerline of the support layer 6 to the edge.
[0058] It should be noted that during the folding process of electronic devices, the deformation at the edge of the support layer 6 is greater than that near the center line of the support layer 6. Based on the formula for calculating rebound force, rebound force = elastic modulus × rebound deformation, the rebound force at the edge of the support layer 6 is greater than that near the center line of the support layer 6. Therefore, from the center line to the edge of the support layer 6, the spacing between two adjacent slits 61 gradually decreases. In other words, more slits 61 are set in the area of the support layer 6 closer to the edge, which can further reduce the impact of the rebound force brought by the support layer during the folding process.
[0059] In some embodiments, see Figure 15 There are multiple fractures 61, which are divided into multiple fracture groups 62. The fracture groups 62 are symmetrically distributed about the centerline axis of the support layer 6. Each fracture group 62 includes multiple fractures 61 arranged at intervals, and fractures 61 are provided on both sides of each interval.
[0060] By setting multiple joint groups 62 on the support layer 6, and multiple joints 61 are spaced apart in each joint group 62, with joints 61 on both sides of each space, the joint groups formed by the large number of staggered joints can disperse and reduce more rebound force, thereby further reducing the impact of rebound force on the support layer during the folding process.
[0061] In some embodiments, the support layer 6 only needs to cover high-risk areas within the region where the hinge assembly 3 is located, such as hinge holes, edges, and protrusions, which are prone to contact damage with the heat dissipation layer 5. It is sufficient to ensure complete coverage of these high-risk areas by the support layer 6. This reduces the probability of the heat dissipation layer 5 being damaged by the hinge assembly 3 during folding and further reduces the impact of the rebound force generated by the support layer during the folding process. Therefore, in some embodiments, see... Figure 17 There are two support layers 6 (support layer 6 with the gap 61), corresponding to the two ends of the hinge assembly 3. Alternatively, in some embodiments, see... Figure 16 The support layer 6 forms a shape that covers the target area of the hinge assembly 3. The target area includes the aforementioned high-risk area.
[0062] It should be noted that the electronic devices in the embodiments of this application include the mobile electronic devices and non-mobile electronic devices described above.
[0063] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. An electronic device, characterized in that, include: A first frame (1) and a second frame (2) are connected by a hinge assembly (3); A flexible display screen (4) covers the hinge assembly (3) and is connected to the first frame (1) and the second frame (2) respectively; The composite component includes a heat dissipation layer (5) and a support layer (6), wherein the support layer (6) is adhered to the heat dissipation layer (5), the heat dissipation layer (5) is connected to the first frame (1) and the second frame (2) respectively, and the support layer (6) is disposed between the heat dissipation layer (5) and the hinge assembly (3); The heat dissipation layer (5) is provided with at least one extension portion (500). When the electronic device is in the unfolded state, the extension portion (500) is in the retracted state. When the electronic device is in the folded state, the extension portion (500) is in the unfolded state, so that the heat dissipation layer (5) is stretched to fit the flexible display screen (4).
2. The electronic device according to claim 1, characterized in that, There are two extension portions (500), which are disposed on both sides of the support layer (6).
3. The electronic device according to claim 1, characterized in that, The heat dissipation layer (5) has an adhesive backing on the side facing away from the flexible display screen (4). The electronic device also includes a cover (7), which is attached to the extension portion (500) by the adhesive backing.
4. The electronic device according to claim 1, characterized in that, A buffer layer (8) is also provided, which is disposed between the composite and the hinge assembly (3), and the buffer layer (8) is bonded to the support layer (6).
5. The electronic device according to claim 1, characterized in that, The support layer (6) is provided with a slit (61) and the extension direction of the slit is perpendicular to the unfolding direction of the extension portion (500) so that when the electronic device is folded, the support layer (6) bends along with the heat dissipation layer (5).
6. The electronic device according to claim 5, characterized in that, There are multiple seams (61), and the seams (61) are symmetrically distributed about the centerline of the support layer (6). From the centerline of the support layer (6) to the edge, the distance between two adjacent seams (61) gradually decreases.
7. The electronic device according to claim 5, characterized in that, There are multiple seams (61), which are divided into multiple seam groups (62). The seam groups (62) are symmetrically distributed about the centerline axis of the support layer (6). Each seam group (62) includes multiple seams (61) spaced apart, and seams (61) are provided on both sides of each space.
8. The electronic device according to claim 5, characterized in that, There are two support layers (6), which are set corresponding to the two ends of the hinge assembly (3).
9. The electronic device according to claim 1, characterized in that, The heat dissipation layer (5) is made of graphite.