Wafer binning control and yield management method and apparatus based on mes

By implementing an automated wafer binning and yield management method based on MES, the complexity caused by manual intervention in wafer manufacturing has been solved, achieving efficient product processing and quality control, and improving product yield and management efficiency.

CN117558651BActive Publication Date: 2026-07-21JIANGSU DAODA INTELLIGENT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGSU DAODA INTELLIGENT TECH CO LTD
Filing Date
2023-10-27
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In the existing wafer manufacturing process, the manual binning and yield management processes are complex, resulting in wasted time and costs, and making it difficult to achieve efficient product processing and quality control.

Method used

An automated wafer binning control and yield management method based on MES is adopted. The equipment engineer configures the recipe parameters and the MES system establishes the specification values. The host computer of the equipment confirms the incoming material information, measures the silicon wafer parameters and automatically bins them. The MES system processes and verifies the results to achieve automated yield management.

Benefits of technology

It improved product processing efficiency, reduced manual intervention, ensured consistent product quality, increased product yield, and enabled centralized management and traceability of defective products.

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Abstract

The application discloses a wafer Bin control and yield management method and device based on MES, and relates to the technical field of semiconductor production; in order to solve the problem of manual full-process operation in the production and manufacturing process of silicon wafers; specifically comprising the following steps: a device engineer maintains device Recipe parameters and configures the circulation of defective products, an MES system establishes different specification values; a device host computer confirms incoming material information of products arriving at a feeding port of the device, inquires a Recipe of product processing of the MES system, and issues the Recipe to the device; the device measures parameters of the silicon wafers during product processing, and automatically performs Bin division according to the Recipe and actual measurement values of the silicon wafers; after product processing is completed, the silicon wafers and wafer basket numbers of each discharging port are reported to the MES system by the device host computer. The application has high automation degree, reduces manual participation, and can effectively improve product processing efficiency and product yield.
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