一种用于低温共烧陶瓷体系的填孔浆料及填孔方法
By combining gold powder and glass powder in a specific ratio and using an organic carrier, along with an appropriate sintering process, the problem of pore filling in low-temperature co-fired ceramic systems was solved, resulting in a smooth surface, reduced glass powder aggregation, and improved pore filling effect.
CN117564263BActive Publication Date: 2026-07-17SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
- Filing Date
- 2023-11-16
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The existing technology lacks filling slurries suitable for low-temperature co-fired ceramic systems, resulting in poor filling effect and problems such as glass powder aggregation and surface unevenness after filling.
Method used
A low-temperature co-fired ceramic pore-filling slurry was prepared by using a specific ratio of gold powder and glass powder, combined with ethyl cellulose and terpineol as organic carriers and additives, and by using appropriate sintering processes, including isostatic pressing and sintering temperature control.
Benefits of technology
Effective pore filling of the low-temperature co-fired ceramic system was achieved, reducing glass powder aggregation, ensuring surface smoothness, and improving electrical performance.
✦ Generated by Eureka AI based on patent content.
Abstract
本发明公开了一种用于低温共烧陶瓷体系的填孔浆料及填孔方法，用于低温共烧陶瓷体系的填孔浆料，包括：金粉、玻璃粉、有机载体、添加剂和表面活性剂；其中，当玻璃粉的软化温度不高于551℃时，金粉与玻璃粉的质量比为(29～88)：1；当玻璃粉的软化温度不低于627℃时，金粉与玻璃粉的质量比为29：1。本发明解决了低温共烧陶瓷体系的填孔问题，同时，填孔后的低温共烧陶瓷体系，具有表面平整，玻璃粉聚集现象少等特点。
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