Silicon block like a gap type stick device and stick method

Abstract

The present application relates to a kind of silicon block equal gap type stick device and stick method, device includes base, which is equipped with two two-axis movement module;It also includes frame assembly, the outer frame length direction two ends are respectively connected with the output panel of two two-axis movement module, width direction two sides are respectively provided with guide rail, it is equipped with several pressing block on it, two adjacent pressing blocks are connected by equal length small connecting plate, and long waist hole and mounting hole are respectively arranged at both ends of small connecting plate, which are connected with front and rear pressing block by locking member;The pressing block of two sides guide rail is connected by partition plate correspondingly;One end pressing block is connected with outer frame by fixed end connecting plate, and the other end pressing block is connected with linear drive assembly by moving end connecting plate;The distance between two adjacent partition plates changes between maximum spacing and minimum spacing under the drive of linear drive assembly, so that each silicon block to be sticked is separated by partition plate and clamped.The present application realizes automatic equal gap clamping and stick of silicon block, and improves efficiency.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer bonding technology, and in particular to a silicon block slit bonding device and bonding method. Background Technology

[0002] In the field of solar cell processing, monocrystalline silicon rods are typically first squared into square rods, and then the square rods are processed into monocrystalline silicon wafers. Squaring monocrystalline silicon rods produces a large number of thin or short silicon blocks. Currently, to reduce costs and increase efficiency, these thin or short silicon blocks are spliced ​​together to form silicon block assemblies, then bonded together, and finally sliced, achieving secondary utilization of the scraps from the squaring process. In the process of forming silicon block assemblies, small silicon blocks need to be spliced ​​together, and a certain gap needs to be maintained between adjacent silicon blocks to facilitate subsequent slicing operations. In existing technologies, splicing is often done manually by applying adhesive, i.e., using double-sided tape to bond adjacent silicon blocks, and placing spacers on the bonding contact surfaces to maintain equal gaps. The problem with this method is that the adhesive layer and spacers cannot be removed, which not only easily affects the slicing operation, but also requires adhesive layer and spacer removal after slicing, resulting in multiple processing steps and impacting production efficiency. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a silicon block equal-gap sticking device and sticking method, aiming to achieve automatic equal-gap distribution and sticking of silicon blocks to be glued, avoiding manual glue application and improving production efficiency.

[0004] The technical solution adopted in this invention is as follows:

[0005] This invention provides a silicon block slotted rod bonding device, including a base, on which two two-axis moving modules are symmetrically arranged. The output panel of the two-axis moving modules can move in both horizontal and vertical directions. The base is also provided with a placement stage and a crystal holder.

[0006] It also includes a frame assembly, the structure of which includes an outer frame, the two ends of which are respectively connected to the output panels of two two-axis moving modules in the length direction, and guide rails are respectively provided on both sides in the width direction, the width direction being consistent with the horizontal direction, and several pressure blocks are provided on each side of the guide rail, with adjacent pressure blocks connected by small connecting plates of equal length.

[0007] The small connecting plate is provided with an elongated hole and a mounting hole at both ends. The elongated hole and the mounting hole are respectively engaged with the front and rear pressure blocks through locking parts. Each pressure block is engaged with the mounting hole of the front small connecting plate and the elongated hole of the rear small connecting plate through one of the locking parts.

[0008] The pressure blocks on both sides of the guide rail correspond one-to-one to form several pressure block groups. There is a partition between the two pressure blocks in each pressure block group, and the thickness of each partition is the same.

[0009] The two pressure blocks in the last pressure block group are connected by a fixed end connecting plate, which is fixedly connected to the outer frame; the two pressure blocks in the frontmost pressure block group are connected by a movable end connecting plate, which is poweredly connected to the linear drive assembly. When the linear drive assembly is working, the distance between two adjacent partitions can be adjusted between the maximum and minimum spacing, so that each silicon block to be glued is separated by the partition and can be clamped by the partition along the length of the outer frame.

[0010] The outer frame is also provided with a side-pushing component, which is used to align the silicon blocks to be glued along the length of the outer frame.

[0011] The further technical solution is as follows:

[0012] The outer frame is provided with guide rail seats on both sides in the width direction, and the inner side of the guide rail is used to install the guide rail.

[0013] The side-pushing assembly includes a baffle and several movable plates. The baffle is disposed on the top surface of one of the guide rail seats, and the top surface of the other guide rail seat is provided with a cylinder mounting plate, on which several first cylinders are disposed. The output ends of the several first cylinders pass through the cylinder mounting plate and are respectively connected to the several movable plates. The movable plates are used to push the silicon block so that it is pressed against the baffle for alignment.

[0014] The linear drive assembly includes a second cylinder disposed on the bottom surface of the guide rail seat.

[0015] The outer frame has guide rail connecting rods at both ends along its length. The two ends of the guide rail connecting rods are used to connect to the guide rail seats on both sides. The outer side of the guide rail connecting rods is used to connect to the output panel.

[0016] The placement stage and crystal holder are located between two biaxial moving modules and are spaced apart and arranged in parallel along the horizontal direction.

[0017] The pressure block is provided with a slot, and the slots on the two pressure blocks in each pressure block group correspond one-to-one and are respectively connected to the two ends of the partition.

[0018] The height of the partition is less than the height of the silicon block, and the length of the partition is greater than the length of the silicon block.

[0019] The back of the pressure block is connected to the slider, and the slider cooperates with the guide rail; the locking element is a screw.

[0020] The present invention also provides a method for bonding silicon blocks using the aforementioned slotted bonding device, comprising arranging silicon blocks such that the gaps between adjacent silicon blocks are equal, wherein the gap is the distance between two opposite faces of two adjacent silicon blocks, and comprising the following steps:

[0021] Several silicon blocks to be bonded are arranged at intervals on the placement platform;

[0022] Start the linear drive assembly, which drives each pressure block group and its partitions to move along the guide rail away from the fixed end connecting plate through the moving end connecting plate, so that the locking parts of each pressure block slide to the outermost end in the long slot of the small connecting plate connected to it, and the distance between adjacent partitions reaches the maximum spacing. At this time, each partition is evenly distributed.

[0023] Activate two two-axis moving modules to move the frame assembly directly above the placement stage, and then move it down so that each partition separates two adjacent silicon blocks from top to bottom;

[0024] The linear drive assembly is activated, which drives each pressure block group and its partitions along the guide rail towards the fixed end connecting plate via the moving end connecting plate. This causes the locking parts of each pressure block to move from the outermost end to the innermost end in the long slot of the small connecting plate connected to it. The distance between adjacent partitions gradually decreases and pushes each silicon block to move on the placement table until the adjacent partitions clamp the silicon blocks located between them, forming a silicon block group. The gap between two adjacent silicon blocks in the silicon block group is equal, that is, consistent with the thickness of the partition.

[0025] The side-push assembly is used to align the silicon blocks with equal spacing in the silicon block group along the length of the outer frame.

[0026] The further technical solution is as follows:

[0027] The silicon block arrangement also includes:

[0028] Two two-axis moving modules are activated, and the silicon block group that has been evenly spaced and aligned is transferred from the placement stage to the crystal tray using the frame assembly. The sticks are then attached using the adhesive layer coated on the surface of the crystal tray.

[0029] The beneficial effects of this invention are as follows:

[0030] The sticking device of the present invention uses a frame assembly to adjust the position of the partition, so that the partition can be in an open or closed state, separating the small silicon blocks while clamping them. After clamping, the silicon blocks are evenly spaced, and then the side push assembly is used to align them, thereby obtaining a silicon block group with evenly spaced arrangement and one end aligned. The frame assembly is used to transfer the silicon block group to the crystal tray for direct sticking.

[0031] Compared to traditional tooling-assisted manual bonding in gaps, the method of this invention greatly optimizes the processing flow, reduces operational difficulty, and improves production efficiency. Furthermore, the device has a high reusability rate, fully meeting the requirements of continuous, large-scale industrial production.

[0032] Other features and advantages of the invention will be set forth in the following description or may be learned by practicing the invention. Attached Figure Description

[0033] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present invention in its first working state.

[0034] Figure 2 This is a schematic diagram of the frame assembly of an embodiment of the present invention with each partition in the open state.

[0035] Figure 3 for Figure 2 Another perspective.

[0036] Figure 4 for Figure 1 Top view.

[0037] Figure 5 for Figure 1 The main view.

[0038] Figure 6 This is a three-dimensional structural diagram of an embodiment of the present invention in its second working state.

[0039] Figure 7 This is a partial structural diagram of the frame assembly in an embodiment of the present invention with each partition in a retracted state.

[0040] Figure 8 This is a schematic diagram showing the engagement state between the silicon block and the partition when the silicon block is clamped according to an embodiment of the present invention.

[0041] In the diagram: 1. Output panel; 2. Two-axis moving module; 3. Frame assembly; 4. Silicon block; 5. Placement stage; 6. Crystal tray; 7. Counterweight; 8. Base; 31. Guide rail seat; 32. Guide rail seat connecting rod; 33. Baffle; 34. Moving plate; 35. Moving end connecting plate; 36. Pressure block; 37. Partition; 38. Small connecting plate; 39. First cylinder; 310. Cylinder mounting plate; 311. Second cylinder; 312. Screw; 313. Guide rail; 314. Fixed end connecting plate; 381. Long slotted hole. Detailed Implementation

[0042] The specific embodiments of the present invention are described below with reference to the accompanying drawings.

[0043] See Figures 1 to 3 The silicon block and other slotted stick device of this embodiment includes a base 8, on which two two-axis moving modules 2 are symmetrically arranged. The output panel 1 of the two-axis moving modules 2 can move in the horizontal and vertical directions. The base 8 is also provided with a placement stage 5 and a crystal holder 6.

[0044] It also includes a frame component 3. The frame component 3 has an outer frame. The two ends of the outer frame in the length direction are respectively connected to the output panels 1 of the two two-axis moving modules 2. Guide rails 313 are respectively provided on both sides in the width direction. The width direction is consistent with the horizontal direction. Several pressure blocks 36 are provided on each side of the guide rail 313. Adjacent pressure blocks 36 are connected by small connecting plates 38 of equal length.

[0045] One end of the small connecting plate 38 is provided with an elongated slot 381 and the other end is provided with a mounting hole. The elongated slot 381 and the mounting hole of each small connecting plate 38 are respectively engaged with the front and rear pressure blocks 36 through locking parts. Each pressure block 36 is engaged with the mounting hole of the front small connecting plate 38 and the elongated slot 381 of the rear small connecting plate 38 through locking parts.

[0046] The pressure blocks 36 on both sides of the guide rail correspond to form several pressure block groups. A partition 37 is provided between the two pressure blocks 36 in each pressure block group. The thickness of each partition 37 is the same. The two pressure blocks 36 in the pressure block groups at both ends are connected by a moving end connecting plate 35 and a fixed end connecting plate 314, respectively. The fixed end connecting plate 314 is fixedly connected to the outer frame.

[0047] The frame assembly 3 is equipped with a linear drive assembly, the output end of which is connected to the moving end connecting plate 35. When the linear drive assembly is working, the distance between two adjacent partitions 37 can be adjusted between the maximum and minimum spacing, so that each silicon block to be glued is clamped along the length direction of the frame assembly 3.

[0048] The frame assembly 3 is also provided with a side-pushing assembly, which is used to align the silicon blocks to be glued along the length of the frame assembly 3.

[0049] Specifically, the back of the pressure block 36 is connected to the slider, and the slider cooperates with the guide rail, such as... Figure 2 As shown.

[0050] Specifically, the locking component is screw 312, such as... Figure 3 As shown.

[0051] Specifically, it can be understood that for the pressure block groups at both ends, the pressure block in one end of the pressure block group is engaged with the mounting hole of a small connecting plate through a locking member, while the pressure block in the other end of the pressure block group is engaged with the waist-shaped hole of a small connecting plate through a locking member.

[0052] Specifically, the placement stage 5 and the crystal holder 6 are located between the two biaxial moving modules 2, and are distributed horizontally at intervals and arranged in parallel, as shown in the figure. Figure 1 As shown.

[0053] Specifically, the pressure block 36 is provided with a slot, and the slots on the two pressure blocks 36 in each pressure block group correspond one-to-one and are respectively connected to the two ends of the partition 37.

[0054] like Figure 2 As shown, guide rail seats 31 are provided on both sides of the outer frame of the frame assembly 3 in the width direction, and the inner side of the guide rail 313 is used to install the guide rail 313. Guide rail seat connecting rods 32 are provided at both ends of the outer frame of the frame assembly 3 in the length direction. The two ends of the guide rail seat connecting rods 32 are used to connect the guide rail seats 31 on both sides, and the outer side of the guide rail seat connecting rods 32 is used to connect with the output panel 1.

[0055] The side-pushing assembly includes a baffle 33 and several movable plates 34. The baffle 33 is disposed on the top surface of one side guide rail seat 31, and the top surface of the other side guide rail seat 31 is provided with a cylinder mounting plate 310, on which several first cylinders 39 are provided. The output ends of the several first cylinders 39 pass through the cylinder mounting plate 310 and are respectively connected to the several movable plates 34. The movable plates 34 are used to push the silicon block so that it is pressed against the baffle 33 for alignment.

[0056] The linear drive assembly includes a second cylinder 311, which is mounted on the bottom surface of the guide rail seat 31. The piston rod of the second cylinder 311 is connected to... Figure 2 The movable end connecting plate 35 located on the left is connected to the fixed end connecting plate 314 located on the right, while the fixed end connecting plate 314 located on the right is fixedly connected to the two guide rail seats 31.

[0057] Therefore, when the piston rod of the second cylinder extends or retracts, the moving end connecting plate 35 at the left end drives the leftmost set of pressure blocks and the partition plate set on them to move. Then, the small connecting plates between each pressure block synchronously drive each pressure block set and partition plate to move along the guide rail. Through the cooperation of the locking part on the pressure block and the elongated hole connected to it, the distance between the partition plates can be increased or decreased synchronously, realizing the opening or retraction of the partition plates.

[0058] This embodiment also provides a method for bonding the silicon block equal-gap bonding device, including silicon block arrangement, wherein the silicon block arrangement is used to make the gap between two adjacent silicon blocks equal, the gap being the distance between two opposite faces of two adjacent silicon blocks, and includes the following steps:

[0059] (1) Arrange several silicon blocks 4 to be glued on the placement platform 5 at intervals;

[0060] (2) The linear drive assembly is activated, which drives each pressure block group and its partition 37 along the guide rail 313 away from the fixed end connecting plate 314 via the moving end connecting plate 35. At the same time, the locking member of each pressure block 36 slides to the outermost end (leftmost end) in the elongated hole 381 of the small connecting plate 38 connected to it. Figure 3 As shown, the distance between adjacent partitions 37 reaches the maximum spacing, at which point each partition 37 is equidistantly distributed;

[0061] (3) Activate the two two-axis moving modules 2 to move the frame assembly 3 directly above the placement platform 5, and then move it down as follows. Figure 5As shown, each partition 37 separates two adjacent silicon blocks 4 from top to bottom;

[0062] (4) Activate the linear drive assembly, which drives each pressure block group and its partition 37 along the guide rail 313 towards the fixed end connecting plate 314 via the moving end connecting plate 35. At the same time, the locking member of each pressure block 36 moves from the outermost end to the innermost end (rightmost end) in the elongated hole 381 of the small connecting plate 38 connected to it. The distance between adjacent partitions 37 gradually decreases and pushes each silicon block to move on the placement stage 5 until the adjacent partitions 37 clamp the silicon block located between them. After clamping, the engagement state of the locking member screw 312 and the elongated hole 381 is shown in the figure. Figure 7 As shown; in the clamped state, the gap between two adjacent silicon blocks 4 in the silicon block group is equal, that is, consistent with the thickness of the partition 37. The fit between the device and the silicon blocks in the clamped state can be seen in [reference]. Figure 6 ;

[0063] (5) Use the side-pushing component to align the silicon blocks 4 with the medium gap distribution in the silicon block group along the length direction of the outer frame of the frame component 3.

[0064] (6) Activate the two biaxial moving modules 2, and use the frame assembly 3 to transfer the silicon block group, which has been evenly spaced and aligned, from the placement stage 5 to the crystal tray 6. The sticks are attached using the adhesive layer coated on the surface of the crystal tray 6. Figure 6 As shown.

[0065] Specifically, in step (2), the piston rod of the second cylinder extends to the left, causing the partition to open. The open state can be seen in [reference needed]. Figures 1 to 5 During the opening process, the distance between adjacent partitions 37 gradually increases.

[0066] Specifically, in step (4), the piston rod of the second cylinder retracts to the right (see the direction of retraction). Figure 4 (As shown by the middle arrow), the partition contracts; the contraction state can be seen in [reference needed]. Figure 6 and Figure 7 During the shrinkage process, the distance between adjacent partitions 37 gradually decreases, eventually causing the partitions to clamp the silicon block. The state of the partitions and the silicon block in the clamped state is described in [reference needed]. Figure 8 . Figure 8 (a) is a top view of the silicon block 4 clamped in the retracted state of the partition 37. Figure 8 (b) is the front view of (a). The partition 37 ensures that the gaps (gap L) between each silicon block 4 are the same. The thickness of the partition 37 is preferably 1 mm. It can be understood that the minimum spacing between the partitions 37 is not less than the width of the silicon block 4 to be bonded, and the vertical dimension of the partition, i.e., the height of the partition, is less than the height of the silicon block to be bonded, to facilitate applying pressure to the top surface of the silicon block during subsequent bonding. During the bonding process, through… Figure 1 The counterweight 7 shown presses down on the silicon block 4, maintaining a certain downward pressure.

[0067] Specifically, in step (5), the side-push assembly is activated, and each silicon block 4 is pushed towards the baffle 3 by the moving plate 34, so that the end face of each silicon block 4 is in close contact with the baffle 3, thereby achieving the alignment of the silicon block group in the length direction of the outer frame of the frame assembly 3.

[0068] Specifically, in step (6), the frame assembly is kept in a clamped state, and then the silicon block group is bonded to the crystal tray to achieve equal gap bonding rods. The equal gap distribution of the silicon blocks is determined by the thickness of the separator and is not affected by the size of the silicon blocks.

[0069] It will be understood by those skilled in the art that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A slotted adhesive rod device for silicon blocks, characterized in that, Includes a base (8), on which two two-axis moving modules (2) are symmetrically arranged. The output panel (1) of the two-axis moving module (2) can move in the horizontal and vertical directions. The base (8) is also provided with a placement platform (5) and a crystal holder (6). It also includes a frame assembly (3), the structure of which includes an outer frame, the two ends of the outer frame in the length direction are respectively connected to the output panels (1) of two two-axis moving modules (2), and guide rails are respectively provided on both sides in the width direction. The width direction is consistent with the horizontal direction. Several pressure blocks (36) are provided on each side of the guide rail, and two adjacent pressure blocks (36) are connected by small connecting plates (38) of equal length. The small connecting plate (38) is provided with an elongated hole (381) and a mounting hole at both ends. The elongated hole (381) and the mounting hole are respectively engaged with the front and rear pressure blocks (36) through locking parts. Each pressure block (36) is engaged with the mounting hole of the front small connecting plate (38) and the elongated hole (381) of the rear small connecting plate (38) through one of the locking parts. The pressure blocks (36) on both sides of the guide rail correspond one-to-one to form several pressure block groups. A partition (37) is provided between the two pressure blocks (36) in each pressure block group. The thickness of each partition (37) is the same. The two pressure blocks (36) in the last pressure block group are connected by a fixed end connecting plate (314), which is fixedly connected to the outer frame; the two pressure blocks (36) in the frontmost pressure block group are connected by a movable end connecting plate (35), which is powered by the linear drive assembly. When the linear drive assembly is working, the distance between two adjacent partitions (37) can be adjusted between the maximum and minimum spacing, so that each silicon block to be glued is separated by the partition (37) and can be clamped by the partition (37) along the length direction of the outer frame; The outer frame is also provided with a side-pushing component, which is used to align the silicon blocks to be glued along the length of the outer frame. The outer frame is provided with guide rail seats (31) on both sides in the width direction, and the inner side of the guide rail is used to install the guide rail. The side-pushing assembly includes a baffle (33) and several movable plates (34). The baffle (33) is disposed on the top surface of one side guide rail seat (31), and the top surface of the other side guide rail seat (31) is provided with a cylinder mounting plate (310), on which several first cylinders (39) are provided. The output ends of the several first cylinders (39) pass through the cylinder mounting plate (310) and are respectively connected to the several movable plates (34). The movable plates (34) are used to push the silicon block so that it is close to the baffle (33) for alignment.

2. The silicon block slotted adhesive rod device according to claim 1, characterized in that, The linear drive assembly includes a second cylinder (311), which is disposed on the bottom surface of the guide rail seat (31).

3. The silicon block slotted adhesive rod device according to claim 1, characterized in that, The outer frame has guide rail connecting rods (32) at both ends along its length. The two ends of the guide rail connecting rods (32) are used to connect the guide rail seats (31) on both sides. The outer side of the guide rail connecting rods (32) is used to connect with the output panel (1).

4. The silicon block slotted adhesive rod device according to claim 1, characterized in that, The placement stage (5) and the crystal holder (6) are located between two two-axis moving modules (2) and are spaced apart and arranged in parallel along the horizontal direction.

5. The silicon block slotted adhesive rod device according to claim 1, characterized in that, The pressure block (36) is provided with a slot. The slots on the two pressure blocks (36) in each pressure block group correspond one-to-one and are respectively connected to the two ends of the partition (37).

6. The silicon block slotted adhesive rod device according to claim 1, characterized in that, The height of the partition (37) is less than the height of the silicon block, and the length of the partition (37) is greater than the length of the silicon block.

7. The silicon block slotted adhesive rod device according to claim 1, characterized in that, The back of the pressure block (36) is connected to the slider, and the slider cooperates with the guide rail; the locking element is a screw (312).

8. A method for bonding rods using the silicon block slotted rod bonding device according to any one of claims 1-7, characterized in that, This includes silicon block arrangement, wherein the silicon block arrangement is used to ensure that the gap between two adjacent silicon blocks is equal, wherein the gap is the distance between two opposite faces of two adjacent silicon blocks, and includes the following process: Arrange several silicon blocks to be bonded on the placement platform (5) at intervals; When the linear drive assembly is activated, it drives each pressure block group and its partition (37) to move along the guide rail away from the fixed end connecting plate (314) via the moving end connecting plate (35), so that the locking part of each pressure block (36) slides to the outermost end in the long waist hole (381) of the small connecting plate (38) connected to it, and the distance between adjacent partitions (37) reaches the maximum spacing. At this time, each partition (37) is evenly distributed. Activate two two-axis moving modules (2) to move the frame assembly (3) directly above the placement platform (5), and then move it down so that each partition (37) separates two adjacent silicon blocks from top to bottom; The linear drive assembly is activated, which drives each pressure block group and its partition (37) along the guide rail towards the fixed end connecting plate (314) via the moving end connecting plate (35). This causes the locking parts of each pressure block (36) to move from the outermost end to the innermost end in the long waist hole (381) of the small connecting plate (38) connected to it. The distance between adjacent partitions (37) gradually decreases and pushes each silicon block to move on the placement platform (5) until the adjacent partitions (37) clamp the silicon block located between them to form a silicon block group. The gap between two adjacent silicon blocks in the silicon block group is equal, that is, consistent with the thickness of the partition (37). The side-push assembly is used to align the silicon blocks with equal spacing in the silicon block group along the length of the outer frame.

9. The sticking rod method according to claim 8, characterized in that, The silicon block arrangement also includes: Two two-axis moving modules (2) are activated, and the silicon block group that has been evenly spaced and aligned is transferred from the placement stage (5) to the crystal tray (6) using the frame assembly (3), and the stick is attached by the adhesive layer coated on the surface of the crystal tray (6).

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