Thermal management integrated components, systems, and vehicles

Abstract

The heat management integrated component, system and vehicle, the heat management integrated component includes a water route base plate and a refrigerant frame; the water route base plate includes a first layer and a second layer, the second layer is stacked on the first layer, and the area of the second layer is smaller than that of the first layer; the first layer and the second layer are provided with cooling liquid flow channels; the refrigerant frame includes a first area and a second area; the first area is provided with a refrigerant module, and the refrigerant module is provided with a refrigerant flow channel; the second area is a hollow area; the water route base plate and the refrigerant frame are integrated together, the second layer is embedded in the second area, and the first area is embedded in the recess interval formed between the second layer and the first layer. The application can reduce the volume of the heat management system integrated module.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and more specifically, to a thermal management integrated component, system, and vehicle. Background Technology

[0002] With the continuous development of vehicles, the integration of vehicle thermal management systems has become a trend in order to improve production and assembly efficiency, facilitate quality control, and reduce the space occupied by thermal management systems. However, current integrated thermal management system modules are relatively large and occupy a significant amount of space, making the reduction of the overall size of these modules a pressing issue. Summary of the Invention

[0003] This application provides a thermal management integrated component, system, and vehicle that can reduce the size of the thermal management system integrated module.

[0004] In a first aspect, this application provides a thermal management integrated component, which includes a water channel substrate and a refrigerant frame;

[0005] The aforementioned water channel substrate includes a first layer and a second layer, the aforementioned second layer is stacked on the aforementioned first layer, and the area of ​​the aforementioned second layer is smaller than that of the aforementioned first layer; both the aforementioned first layer and the aforementioned second layer are provided with coolant flow channels;

[0006] The aforementioned refrigerant frame includes a first region and a second region; a refrigerant module is provided in the first region, and a refrigerant flow channel is provided in the refrigerant module; the aforementioned second region is a hollow region;

[0007] The aforementioned water channel substrate and the aforementioned refrigerant frame are integrated together, the aforementioned second layer is embedded in the aforementioned second region, and the aforementioned first region is embedded in the recessed area formed between the aforementioned second layer and the aforementioned first layer.

[0008] In the above solution, on the one hand, the water channel substrate and refrigerant frame are integrated using a raised and hollowed-out nesting arrangement, which reduces the overall thickness of the integrated thermal management component and thus reduces its volume. On the other hand, the water channel substrate is designed as a two-layer structure, with coolant channels also incorporated into the second layer to meet the layout requirements of the coolant channels. This avoids the problem of placing all the channels in the first layer, which would result in an excessively large area for the first layer, thus reducing the length or width of the first layer. Furthermore, by concentrating the high-pressure resistant refrigerant channels into a smaller refrigerant module, the use of high-pressure resistant metal materials can be reduced, resulting in weight reduction and savings in material and manufacturing costs.

[0009] In one possible implementation, the area of ​​the second layer is between 40% and 60% of the area of ​​the first layer.

[0010] In the above solution, within this area ratio range, the cost of the water circuit board can be reduced to the minimum while ensuring that the water circuit board can be equipped with the required number of coolant flow channels, thus balancing cost and functionality.

[0011] In one possible implementation, the area of ​​the aforementioned second region is larger than the area of ​​the aforementioned second layer, and the ratio of the area of ​​the aforementioned second region to the area of ​​the aforementioned refrigerant frame is between 50% and 70%.

[0012] In the above scheme, within this area ratio range, the cost of the refrigerant frame can be reduced to the minimum while ensuring that the area of ​​the refrigerant module is sufficient to set the number of refrigerant flow channels that meet the requirements, thus balancing cost and function.

[0013] In one possible implementation, the area of ​​the aforementioned refrigerant module is between 30% and 50% of the area of ​​the aforementioned refrigerant frame.

[0014] In the above scheme, the area ratio of the refrigerant module to the refrigerant frame is within this range, which can minimize the cost of the refrigerant module and ensure that the refrigerant module can be configured with the required number of refrigerant flow channels, thus balancing cost and functionality.

[0015] In one possible implementation, the ratio of the thickness of the aforementioned refrigerant module to the thickness of the aforementioned refrigerant frame is between 50% and 100%.

[0016] In the above solution, the thickness ratio of the refrigerant module to the refrigerant frame is within this thickness ratio range, which can minimize the material cost of the refrigerant module and ensure that the cross-sectional size of the refrigerant flow channel set in the refrigerant module meets the flow requirements, thus balancing cost and function.

[0017] In one possible implementation, the aforementioned refrigerant module is manufactured by forging, and the parts of the aforementioned refrigerant frame other than the refrigerant module are manufactured by die casting or sheet metal processing.

[0018] In the above scheme, the refrigerant module is made by forging to withstand the flow of high-pressure refrigerant, while the refrigerant frame is made by die casting or sheet metal to reduce manufacturing costs.

[0019] In one possible implementation, the aforementioned refrigerant module is provided with a first refrigerant flow channel interface; the aforementioned refrigerant frame is also provided with a first heat exchange device;

[0020] The aforementioned first heat exchange device includes a first refrigerant inlet and a first refrigerant outlet; the aforementioned first refrigerant inlet is located on a first side of the aforementioned first heat exchange device, and the aforementioned first refrigerant outlet is located on a second side opposite to the first side of the aforementioned first heat exchange device;

[0021] The aforementioned first refrigerant inlet is used to connect with the compressor; the aforementioned first refrigerant outlet is connected to the aforementioned first refrigerant flow channel interface.

[0022] In the above scheme, the refrigerant inlet of the first heat exchanger is used to connect with the compressor. The compressor is not integrated on the refrigerant module. Therefore, the refrigerant inlet of the first heat exchanger is not connected to the refrigerant flow channel interface of the refrigerant module. Instead, it is designed on the other side to facilitate connection with the compressor. This eliminates the need to set up a flow channel on the refrigerant module to connect the compressor refrigerant outlet and the refrigerant inlet of the first heat exchanger, thereby reducing the area of ​​the refrigerant module and lowering the cost.

[0023] In one possible implementation, the aforementioned first heat exchange device includes a first coolant inlet and a first coolant outlet; the aforementioned first coolant inlet and the aforementioned first coolant outlet are located on the second side of the aforementioned first heat exchange device;

[0024] The aforementioned water channel substrate is provided with a first coolant flow channel interface and a second coolant flow channel interface, and the aforementioned second region includes a first hollow region;

[0025] The aforementioned first coolant flow channel interface passes through the aforementioned first hollow area and connects with the aforementioned first coolant inlet;

[0026] The aforementioned second coolant flow channel interface passes through the aforementioned first hollow area and connects with the aforementioned first coolant outlet, or the aforementioned second coolant flow channel interface passes through a through hole on the aforementioned plate-shaped area and connects with the aforementioned first coolant outlet.

[0027] In the above scheme, the coolant flow channel interface of the substrate passes through the hollow area of ​​the refrigerant frame and is directly connected to the coolant inlet and outlet of the first heat exchanger. The refrigerant flow channel interface of the refrigerant module is directly connected to the refrigerant outlet of the first heat exchanger. There is no need for pipelines or other flow channel transfers, which reduces the transfer sealing interface and reduces the flow resistance caused by pipeline transfers.

[0028] In one possible implementation, the aforementioned refrigerant module is provided with a second refrigerant flow channel interface; the aforementioned refrigerant frame is also used to fix the second heat exchange device;

[0029] The aforementioned second heat exchange device includes a second refrigerant inlet and a second refrigerant outlet; the aforementioned second refrigerant inlet is located on the first side of the aforementioned second heat exchange device, and the aforementioned second refrigerant outlet is located on the second side opposite to the first side of the aforementioned second heat exchange device;

[0030] The aforementioned second refrigerant inlet is connected to the aforementioned second refrigerant flow channel interface; the aforementioned second refrigerant outlet is used to connect to the compressor.

[0031] In the above scheme, the refrigerant outlet of the second heat exchanger is used to connect to the compressor. The compressor is not integrated into the refrigerant module. Therefore, the refrigerant outlet of the second heat exchanger is not connected to the refrigerant flow channel interface of the refrigerant module. Instead, it is designed on the other side to facilitate connection with the compressor. This eliminates the need to set up a flow channel on the refrigerant module that connects the compressor refrigerant inlet and the refrigerant outlet of the second heat exchanger, thereby reducing the area of ​​the refrigerant module and lowering the cost.

[0032] In one possible implementation, the aforementioned second heat exchange device includes a second coolant inlet and a second coolant outlet; the aforementioned second coolant inlet and the aforementioned second coolant outlet are located on a first side of the aforementioned second heat exchange device;

[0033] The aforementioned water channel substrate is provided with a third coolant flow channel interface and a fourth coolant flow channel interface, and the aforementioned second region includes a second hollow region;

[0034] The aforementioned third coolant flow channel interface passes through the aforementioned second hollow area and connects with the aforementioned second coolant inlet, and the aforementioned fourth coolant flow channel interface passes through the aforementioned first area and connects with the aforementioned first coolant outlet.

[0035] In the above scheme, the coolant flow channel interface of the substrate passes through the hollow area of ​​the refrigerant frame and is directly connected to the coolant inlet and outlet of the second heat exchanger. The refrigerant flow channel interface of the refrigerant module is directly connected to the refrigerant outlet of the second heat exchanger. There is no need for pipelines or other flow channel transfers, which reduces the transfer sealing interface and reduces the flow resistance caused by pipeline transfers.

[0036] In one possible implementation, the aforementioned refrigerant module is provided with a third refrigerant flow channel interface and a fourth refrigerant flow channel interface; the refrigerant container is integrated on the aforementioned refrigerant module and is connected to the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned third refrigerant flow channel interface and the aforementioned fourth refrigerant flow channel interface.

[0037] In the above scheme, a refrigerant container can also be integrated into the refrigerant module to increase integration and reduce the refrigerant transfer path.

[0038] In one possible implementation, the refrigerant container includes a first side and a second side, wherein the orientation of the first side of the refrigerant container and the orientation of the second side of the refrigerant container are opposite to each other.

[0039] The first side of the aforementioned refrigerant container is provided with a third refrigerant inlet and a third refrigerant outlet. The aforementioned third refrigerant inlet is connected to the aforementioned third refrigerant flow channel interface in the aforementioned refrigerant module, and the aforementioned third refrigerant outlet is connected to the aforementioned fourth refrigerant flow channel interface in the aforementioned refrigerant module.

[0040] The second side of the aforementioned refrigerant container is the bottom of the aforementioned refrigerant container, and the direction from the second side of the aforementioned refrigerant container to the first side of the aforementioned refrigerant container is perpendicular to the aforementioned refrigerant module; or,

[0041] The direction from the second side of the aforementioned refrigerant container to the first side of the aforementioned refrigerant container is parallel to the aforementioned refrigerant module.

[0042] In the above scheme, the refrigerant container's tank is perpendicular to the refrigerant module. This reduces the impact on the refrigerant circuit caused by insufficient refrigerant in the tank, which would prevent the refrigerant from being supplied normally. Furthermore, the perpendicularity of the tank to the refrigerant module allows for easy replacement with a longer tank to increase the refrigerant capacity. In addition, the refrigerant container can also be placed parallel to the refrigerant module, offering flexible layout options.

[0043] In one possible implementation, the aforementioned refrigerant module is provided with a fifth refrigerant flow channel interface;

[0044] The expansion valve is integrated into the aforementioned refrigerant module and is connected to the refrigerant channel in the aforementioned refrigerant module through the aforementioned fifth refrigerant channel interface.

[0045] In the above solution, an expansion valve can also be integrated into the refrigerant module to improve the integration level.

[0046] In one possible implementation, the aforementioned refrigerant frame is disposed on the first side of the aforementioned water channel substrate, and the orientation of the second side of the aforementioned water channel substrate is opposite to the orientation of the first side of the aforementioned water channel substrate.

[0047] A multi-way valve, a first water pump, a second water pump, and a third water pump are arranged sequentially along the longer side of the second side of the aforementioned water circuit substrate.

[0048] In the above scheme, since the multi-way valve and water pump are both connected to the coolant channels in the substrate, this arrangement can optimize the layout of the coolant channels in the substrate, reduce channel overlap, and make the most of the substrate area to lay out more channels, thereby improving the utilization rate of the substrate.

[0049] In a second aspect, this application provides a thermal management system that includes a thermal management integrated component as described in any of the first aspects above.

[0050] Thirdly, this application provides a vehicle that includes a thermal management integrated component as described in any of the first aspects above, or the aforementioned vehicle includes a thermal management system as described in the second aspect. Attached Figure Description

[0051] Figures 1 to 9 This is a schematic diagram of the structure of the thermal management integrated component provided in the embodiments of this application;

[0052] Figure 9A , Figure 10 and Figure 10A This is a schematic diagram of the structure of the thermal management integrated component provided in the embodiments of this application;

[0053] Figure 11 and Figure 12 This is a schematic diagram of the structure of the thermal management integrated component provided in the embodiments of this application;

[0054] Figures 13 to 16 This is a schematic diagram of the layout and positional relationships provided for an embodiment of this application;

[0055] Figure 17 This is a schematic diagram of the structure of the thermal management system provided in an embodiment of this application;

[0056] Figure 18 This is a schematic diagram of the vehicle structure provided in an embodiment of this application.

[0057] Figure label:

[0058] 00 - Thermal management integrated component; 01 to 30 - Interface; 100 - Water circuit substrate; 101 - First layer of substrate; 102 - Second layer of substrate; 1021 - First sublayer of second layer of substrate; 1022 - Second sublayer of second layer of substrate; 200 - Refrigerant frame; 201 - First area of ​​refrigerant frame 200; 202 - Second area of ​​refrigerant frame 200; 110 - Multi-port valve 110; 111 (including 1111, 1112 and 1113) - Water pump; 120 - Refrigerant module; 121 - First heat exchanger; 122 - Second heat exchanger; 123 - Refrigerant container; 124 - Expansion valve. Detailed Implementation

[0059] In this application embodiment, "multiple" refers to two or more. In this application embodiment, "and / or" is used to describe the association relationship of related objects, indicating three relationships that can exist independently. For example, A and / or B can mean: A exists alone, B exists alone, or A and B exist simultaneously. The description methods used in this application embodiment, such as "at least one of a1, a2, ... and an (or at least one of them)," include the case where any one of a1, a2, ... and an exists alone, as well as the case where any combination of any multiple of a1, a2, ... and an exists alone. Each case can exist alone. For example, the description method of "at least one of a, b, and c" includes the cases where a, b, c, a and b combined, a and c combined, b and c combined, or a, b, and c combined.

[0060] In this application, the terms "first," "second," etc., are used to distinguish identical or similar items with substantially the same function. It should be understood that there is no logical or temporal dependency between "first," "second," and "nth," nor does it limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," etc., to describe various elements, these elements should not be limited by the terms. These terms are merely used to distinguish one element from another.

[0061] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between the various embodiments are consistent and can be referenced by each other. Technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0062] The thermal management integrated component and thermal management system (which includes the thermal management integrated component) provided in this application are applicable to vehicles and other thermal management scenarios requiring cooling (heat dissipation) and / or heating. For example, the thermal management integrated component and thermal management system provided in this application can be applied to electric vehicles. Specifically, the electric vehicle is a vehicle driven by an electric drive system. Electric vehicles can be pure electric vehicles (pure EV / battery EV), hybrid electric vehicles (HEV), range-extended electric vehicles (REEV), plug-in hybrid electric vehicles (PHEV), or new energy vehicles (NEV), etc.

[0063] The thermal management system of this application embodiment can use water to heat or dissipate heat from the managed object. In some possible implementations, the managed object can be a crew compartment, battery, electric drive, and control system, etc. In this application, water is used to transfer heat energy. In some possible implementations, the thermal management system of this application can also use coolants such as water and refrigerants to heat or dissipate heat from the managed object. The refrigerant can transfer heat through evaporation and condensation. It should be understood that water can also be replaced with other coolants to transfer heat energy, and this application embodiment does not specifically limit this.

[0064] Current thermal management system integration modules are relatively large. To reduce the size of the integrated thermal management system and minimize its space occupation, this application provides a thermal management integration component 00. The thermal management integration component 00 includes a water channel substrate 100 and a refrigerant frame 200;

[0065] The water channel substrate 100 includes a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101. The area of ​​the second layer 102 is smaller than that of the first layer 101. Coolant channels are provided in both the first layer 101 and the second layer 102. The refrigerant frame 200 includes a first region 201 and a second region 202. The second region 202 is a hollowed-out region. A refrigerant module 120 is provided in the first region 201, and refrigerant channels are provided in the refrigerant module 120. The water channel substrate 100 and the refrigerant frame 200 are integrated together. The second layer 102 is embedded in the second region 202, and the first region 201 is embedded in the recessed area formed between the second layer 102 and the first layer 101.

[0066] To facilitate understanding of the thermal management integrated component 00 provided in the embodiments of this application, it will be described below with reference to the accompanying drawings. It should be understood that the configurations of the various devices shown in the accompanying drawings of the embodiments of this application are merely illustrative and are not intended to limit the embodiments of this application.

[0067] One possible implementation can be exemplified by [example to be provided]. Figure 1 An exploded structural diagram of a thermal management integrated component 00 provided in an embodiment of this application is shown as an example.

[0068] exist Figure 1 As can be seen, the thermal management integrated component 00 may include a water circuit board 100, a refrigerant frame 200, and a refrigerant module 120.

[0069] For example, the water channel substrate 100 is provided with coolant flow channels. Figure 1 As shown, the water channel substrate 100 includes a first layer 101 and a second layer 102. The water channel substrate 100 may include a first side and a second side, with the orientations of the first side and the second side facing away from each other. The second layer 102 is located on the second side of the water channel substrate 100. Exemplarily, the water channel substrate 100 may be, for example, an injection-molded part made of plastic, or a metal water channel substrate made of metal, or a water channel substrate made of other materials; this application embodiment does not limit this.

[0070] One possible implementation is, such as Figure 1As shown, the second layer 102 may include two sub-layers, namely a first sub-layer 1021 and a second sub-layer 1022. The first sub-layer 1021 and the second sub-layer 1022 are stacked on the first layer 101, and the area of ​​the second layer 102 (i.e., the sum of the areas of the first sub-layer 1021 and the second sub-layer 1022) is smaller than the area of ​​the first layer 101. Coolant flow channels are provided in the first layer 101, the first sub-layer 1021, and the second sub-layer 1022.

[0071] For example, such as Figure 1 As shown, the refrigerant frame 200 may include a first region 201 (a textured area) and a second region 202. The first region 201 is a plate-like region. The second region 202 may include two sub-regions: a first hollowed-out region 2021 and a second hollowed-out region 2022. In one possible implementation, a through hole 2011 is provided on the first region 201. Exemplarily, the refrigerant frame 200 may be made of metal, for example, it may be manufactured by a low-cost processing method such as die casting or sheet metal work.

[0072] For example, such as Figure 1 As shown, the refrigerant module 120 is provided with interfaces 23 to 27, which communicate with the refrigerant flow channels located within the refrigerant module 120. A description of interfaces 23 to 27 can be found later. Figure 5 and Figure 7 The relevant descriptions are not detailed here. For example, the refrigerant module 120 may be a plate made of metal. For example, in order to achieve high pressure resistance and high airtightness of the refrigerant flow channel to meet the flow of high-pressure refrigerant, the refrigerant module 120 may be manufactured by a forging process.

[0073] The refrigerant module 120 is fixedly disposed in the first region 201 of the refrigerant frame 200. For example, the refrigerant module 120 and the refrigerant frame 200 may be integrally molded. Alternatively, the refrigerant module 120 and the frame 200 may be independent components, fixedly connected together by means of bolts, hinges, ultrasonic connections, or welding.

[0074] For example, when the water channel substrate 100 and the refrigerant frame 200 are integrated together, the second layer 102 is embedded in the second region 202, as can be seen from [reference needed]. Figure 2As shown, the refrigerant frame 200 is disposed on the second side of the water channel substrate 100. Exemplarily, the refrigerant frame 200 can be fixed to the second side of the water channel substrate 100 by means of bolt connection, hinge, ultrasonic connection, or welding. Exemplarily, when the water channel substrate 100 and the refrigerant frame 200 are integrated together, the first sub-layer 1021 is embedded in the first hollow area 2021 of the refrigerant frame 200, and the second sub-layer 1022 is embedded in the second hollow area 2022 of the refrigerant frame 200. Interfaces 10 and 11 on the water channel substrate 100 pass through the first hollow area 2021 along with the first sub-layer 1021. Interfaces 08, 09, 13, and 14 on the water channel substrate 100 pass through the second hollow area 2022 along with the second sub-layer 1022. Furthermore, the first area 201 of the refrigerant frame 200 is embedded in the recessed area formed between the second layer 102 and the first layer 101 of the water channel substrate 100.

[0075] For example, in another possible implementation, the first region 201 of the refrigerant frame 200 may not have a metal plate. Instead, the refrigerant module can be directly fixed to the frame of the first region 201 by means of bolts or welding. This can further save metal materials and reduce costs and weight.

[0076] In the above implementation scheme, the water channel substrate 100 and the refrigerant frame 200 are arranged with protrusions and hollow nesting, which reduces the overall thickness of the integrated water channel substrate 100 and the refrigerant frame 200, thereby reducing the overall thickness and volume of the thermal management integrated component 00. On the other hand, the water channel substrate 100 is designed as a two-layer structure, and the second layer is also provided with coolant channels to meet the layout requirements of the coolant channels. This avoids the problem of the first layer having an excessively large area due to setting all the channels in the first layer, that is, reducing the length or width of the first layer, thereby reducing the volume of the thermal management integrated component 00.

[0077] In another possible implementation, the first cutout area 2021 can be expanded to cover the area where the through hole 2011 is located. For example, see [reference needed]. Figure 3 As shown. Compared to the above Figure 1 , Figure 3 In this embodiment, the area of ​​the first region 201 is reduced, while the area of ​​the first hollowed-out region 2021 is increased. This implementation saves on material costs for the first region 201 without requiring additional through holes 2011. It is understood that the shape of the refrigerant module 120 can be a regular polygon or any irregular shape. This application embodiment does not limit the specific shape of the refrigerant module 120.

[0078] For example, the area ratio of the second layer 102 of the aforementioned water channel substrate 100 to the area ratio of the first layer 101 is between 40% and 60%. Within this area ratio range, the cost of the water channel substrate can be minimized while ensuring that the water channel substrate can be provided with the required number of coolant flow channels, thus balancing cost and functionality.

[0079] For example, the area of ​​the refrigerant module 120 is much smaller than the area of ​​the refrigerant frame 200. For example, the ratio of the area of ​​the refrigerant module 120 to the area of ​​the refrigerant frame 200 can be between 30% and 70%. In order to meet the flow of high-pressure refrigerant, the materials used in the refrigerant module (the metal used also needs to have high pressure resistance) and the manufacturing cost are relatively high. Therefore, in this embodiment of the application, the refrigerant flow channel is concentrated in the smaller refrigerant module 120, which can effectively save costs. Moreover, since the refrigerant module 120 is made of metal, reducing the area of ​​the refrigerant module 120 can also reduce the overall weight of the thermal management integrated component.

[0080] For example, the thickness of the refrigerant module 120 can be much less than or equal to the thickness of the refrigerant frame 200. For example, the ratio of the thickness of the refrigerant module 120 to the thickness of the refrigerant frame 200 can be between 50% and 100%. Within this thickness ratio range, the material cost of the refrigerant module can be minimized while ensuring that the cross-sectional size of the refrigerant flow channel in the refrigerant module meets the flow rate requirements, thus balancing cost and functionality. Furthermore, if the thickness of the refrigerant module 120 is much less than the thickness of the refrigerant frame 200, the overall thickness of the thermal management integrated component 00 can also be reduced, thus shrinking its volume.

[0081] In one possible implementation, a multi-way valve 110 and a water pump 111 may also be provided on the first side of the substrate 100. The multi-way valve 110 and the water pump 111 can communicate with the coolant flow channel in the substrate 100. A first heat exchange device 121 and a second heat exchange device 122 may also be fixedly provided on the frame 200. For example, the first heat exchange device 121 may be a heat exchange device such as a condenser. The second heat exchange device 122 may be a heat exchange device such as a cooler. The embodiments of this application do not limit the specific type and form of the two heat exchange devices.

[0082] For ease of understanding, please refer to the examples provided. Figure 4 The exploded structural diagram of the thermal management integrated component 00 is shown. Figure 4 In this example, water pump 111 may include three water pumps, namely water pump 1111, water pump 1112 and water pump 1113.

[0083] exist Figure 4As can be seen, the first side of the water circuit board 100 is provided with interfaces 01 to 04. Interface 01 is used to connect to the multi-way valve 110, so that the multi-way valve 110 communicates with the coolant flow channel provided in the water circuit board 100. Interface 02 is used to connect to the water pump 1111, so that the water pump 1111 communicates with the coolant flow channel provided in the water circuit board 100. Interface 03 is used to connect to the water pump 1112, so that the water pump 1112 communicates with the coolant flow channel provided in the water circuit board 100. Interface 04 is used to connect to the water pump 1113, so that the water pump 1113 communicates with the coolant flow channel provided in the water circuit board 100.

[0084] For example, the multi-way valve 110 described above may be a three-way valve, an eight-way valve, or a nine-way valve, etc., and the embodiments of this application do not limit this.

[0085] For example, such as Figure 4 As shown, the multi-way valve 110, water pump 1111, water pump 1112, and water pump 1113 can be arranged sequentially along the longer side of the first side of the water circuit board 100. This arrangement optimizes the layout of the coolant flow channels in the water circuit board 100, reduces channel overlap, and maximizes the utilization of the area of ​​the water circuit board 100 to accommodate more flow channels, thereby improving the utilization rate of the water circuit board 100.

[0086] For example, such as Figure 4 As shown, the first side of the aforementioned water circuit substrate 100 is further provided with interfaces 05, 06, and 07. Interfaces 05, 06, and 07 communicate with the coolant flow channels in the water circuit substrate 100 and are also used to connect to circuits in the thermal management system. For example, interface 05 is connected to a water heater (positive temperature coefficient, PTC), and interfaces 06 and 07 are connected to a battery circuit. It is understood that this is only an example, and the specific devices connected to interfaces 05, 06, and 07 in this embodiment are not limited, and can be determined according to the actual thermal management circuit design.

[0087] For example, such as Figure 4 As shown, the second side of the aforementioned water channel substrate 100 is provided with interface 08, interface 09, and interface 10. Interfaces 08, 09, and 10 communicate with the coolant flow channels in the water channel substrate 100 and are also used to connect to the loop in the thermal management system. For example, interfaces 08 and 10 are used to communicate with the interface of the electric drive module; interface 09 is used to communicate with the heat sink. It is understood that this is only an example, and the specific devices that interfaces 08, 09, and 10 are specifically connected to in this embodiment are not limited, and can be determined according to the actual thermal management loop design.

[0088] For example, the second side of the water channel substrate 100 may also be provided with other interfaces. See, for example, [link to relevant documentation]. Figure 5 An exploded view of the second side of the water channel substrate 100 is shown. It can be seen that the second side of the water channel substrate 100 may also be provided with interfaces 11 to 14. These interfaces 11 to 14 communicate with the coolant flow channels in the water channel substrate 100. Interfaces 11 and 12 are also used to connect to the first heat exchange device 121; interfaces 13 and 14 are also used to connect to the second heat exchange device 122. For ease of understanding, the following description... Figure 4 The first heat exchanger 121 and the second heat exchanger 122 shown are described.

[0089] For example, in Figure 4 In the first heat exchange device 121, there are interfaces 15 and 16. One of these interfaces 15 and 16 is the coolant inlet of the first heat exchange device 121, and the other is the coolant outlet. Which one is the inlet or outlet depends on the actual application requirements, and this embodiment does not impose any restrictions on this. The second heat exchange device 122 includes interfaces 17 and 18. One of these interfaces 17 and 18 is the coolant inlet of the second heat exchange device 122, and the other is the coolant outlet. Which one is the inlet or outlet depends on the actual application requirements, and this embodiment does not impose any restrictions on this. Combined with... Figure 4 and Figure 5 The interface 11 on the second side of the water channel substrate 100 passes through the first hollow area 2021 and connects with the interface 15 of the first heat exchange device 121. The interface 12 on the second side of the water channel substrate 100 passes through the through hole 2011 and connects with the interface 16 of the first heat exchange device 121. Alternatively, in Figure 3 In the illustrated configuration, interface 12 on the second side of the water channel substrate 100 passes through the first cutout area 2021 and connects with interface 16 of the first heat exchange device 121. Interface 13 on the second side of the water channel substrate 100 passes through the second cutout area 2022 and connects with interface 17 of the second heat exchange device 122. Interface 14 on the second side of the water channel substrate 100 passes through the second cutout area 2022 and connects with interface 18 of the second heat exchange device 122.

[0090] For example, in Figure 4 As can also be seen, the first heat exchange device 121 further includes interface 19 and interface 20. Interface 19 can be the refrigerant inlet of the first heat exchange device 121; interface 20 can be the refrigerant outlet of the first heat exchange device 121. For example, interface 19 can be used to connect to a compressor. For instance, interface 19 can be used to connect to the compressor outlet.

[0091] For example, in Figure 4As can also be seen, the second heat exchanger 122 further includes interface 21 and interface 22. Interface 21 can be the refrigerant inlet of the second heat exchanger 122; interface 22 can be the refrigerant outlet of the second heat exchanger 122. For example, interface 22 can be used to connect to a compressor. For instance, interface 22 can be used to connect to the compressor inlet.

[0092] For example, interfaces 20 and 21 are connected to the refrigerant flow channel interface in the refrigerant module 120. For ease of understanding, in conjunction with... Figure 5 The refrigerant module 120 shown is described below. Figure 5 As can be seen, the refrigerant module 120 is provided with interfaces 23 to 27. These interfaces 23 to 27 are connected to the refrigerant flow channels provided in the refrigerant module 120. The interface 20 of the first heat exchange device 121 can be connected to the interface 23 on the refrigerant module 120. The interface 21 of the second heat exchange device 122 can be connected to the interface 24 on the refrigerant module 120.

[0093] For example, in the above Figure 4 As can be seen, the aforementioned interface 19 is located on one side of the first heat exchanger 121 (hereinafter referred to as the first side). The aforementioned interface 20, along with interfaces 15 and 16, is located on the other side of the first heat exchanger 121 (hereinafter referred to as the second side). The orientation of the second side of the first heat exchanger 121 is opposite to the orientation of the first side, or in other words, the second side of the first heat exchanger 121 is opposite to the first side. Furthermore, the second side of the first heat exchanger 121 can be the side that contacts and connects to the refrigerant frame 200. It is understood that the refrigerant inlet (i.e., interface 19) of the first heat exchanger 121 is used to connect to the compressor. The compressor is not integrated into the refrigerant module 120; therefore, interface 19 of the first heat exchanger 121 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Therefore, by designing the interface 19 on the other side (i.e. the first side of the first heat exchange device 121) to facilitate connection with the compressor, it is not necessary to set a flow channel on the refrigerant module 120 to connect the compressor interface and the interface 19 of the first heat exchange device 121, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0094] Similarly, exemplarily, in the above Figure 4As can be seen, interface 21, along with interfaces 17 and 18, is located on one side of the second heat exchanger 122 (referred to as the first side). Interface 22 is located on the other side of the second heat exchanger 122 (referred to as the second side). The orientation of the second side of the second heat exchanger 122 is opposite to the orientation of the first side, or in other words, the second side of the second heat exchanger 122 and the first side of the second heat exchanger 122 are opposite to each other. The first side of the second heat exchanger 122 can be the side that contacts and connects to the refrigerant frame 200. It is understood that the refrigerant outlet (i.e., interface 22) of the second heat exchanger 122 is used to connect to the compressor. The compressor is not integrated into the refrigerant module; therefore, interface 22 of the second heat exchanger 122 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Therefore, by designing the interface 22 on the other side (i.e. the second side of the second heat exchange device 122) to facilitate connection with the compressor, it is not necessary to set a flow channel on the refrigerant module 120 to connect the compressor interface and the interface 22 of the second heat exchange device 122, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0095] For example, interfaces 25 and 26 in the refrigerant module 120 described above can be used to connect to the refrigerant container 123, and interface 27 can be used to connect to the expansion valve 124. For ease of understanding, please refer to... Figure 6 and Figure 7 .exist Figure 6 As can be seen, the refrigerant container 123 is provided with interface 28 and interface 29. One of these interfaces 28 and 29 is the refrigerant inlet of the refrigerant container 123, and the other is the refrigerant outlet. Which one is the inlet or outlet depends on the actual application requirements, and this embodiment does not impose any restrictions on this. The expansion valve 124 is provided with interface 30. Combined with... Figure 7 As shown, interface 28 of refrigerant container 123 is connected to interface 25 on refrigerant module 120. Interface 29 of refrigerant container 123 is connected to interface 26 on refrigerant module 120. Interface 30 of expansion valve 124 is connected to interface 27 on refrigerant module 120.

[0096] In one possible implementation, the refrigerant container and / or expansion valve can be integrated into the refrigerant module 120. In this case, interface 28 and interface 25 are directly connected; interface 29 and interface 26 are directly connected; and interface 30 and interface 27 are directly connected. Alternatively, in another possible implementation, the refrigerant container and / or expansion valve may not be integrated into the refrigerant module 120. In this case, interface 28 and interface 25 are connected via piping; interface 29 and interface 26 are connected via piping; and interface 30 and interface 27 are connected via piping. It is understood that this is merely an example and does not constitute a limitation on the embodiments of this application.

[0097] For example, the refrigerant container 123 described above can be a liquid storage tank. Its shape can be cylindrical, cubic, or any other arbitrary shape, and this application embodiment does not limit this.

[0098] In one possible implementation, for ease of understanding the overall appearance of the thermal management integrated component 00 provided in this application embodiment, please refer to the example provided. Figure 8 and Figure 9 . Figure 8 and Figure 9 The example shown is that the refrigerant container 123 and the expansion valve 124 are integrated on the refrigerant module 120. Figure 8 The diagram shows the overall appearance of the thermal management integrated component 00 as seen from the first side of the water channel substrate 100 after all the components are integrated onto the water channel substrate 100. Figure 9 This is a schematic diagram showing the overall appearance of the thermal management integrated component 00, as seen from the second side of the water channel substrate 100 after all components have been integrated onto it. It is understood that... Figure 8 and Figure 9 The examples shown are merely illustrative and constitute a limitation on the embodiments of this application. Exemplarily, Figure 8 and Figure 9 In the thermal management integrated component 00 shown, other devices (such as shut-off valves (SOV), three-way valves, or compressors, etc.) can also be integrated on the water circuit substrate 100. This application embodiment does not limit this. For example, see also exemplary embodiments. Figure 9A As shown, a shut-off valve 125 can also be integrated on the refrigerant module 120. This shut-off valve 125 is connected to the refrigerant flow channel in the refrigerant module 120 via a refrigerant flow channel interface provided on the refrigerant module 120. Exemplarily, the shut-off valve can also be called a throttle valve, etc., and this application embodiment does not impose any limitations on this.

[0099] For example, in the above Figure 9 As can be seen, the refrigerant container 123 and the expansion valve 124 are located between the first heat exchanger 121 and the second heat exchanger 122. Exemplarily, in a specific thermal management refrigerant circuit, the refrigerant is driven into the first heat exchanger 121 by the compressor. After heat exchange, it flows out of the first heat exchanger 121 to the refrigerant container 123. Then, the refrigerant flows from the refrigerant container 123 to the expansion valve 124, and after passing through the expansion valve 124, it flows to the second heat exchanger 122. After heat exchange, the refrigerant flows out of the second heat exchanger 122 and back to the compressor, forming a refrigerant circuit. Based on this, the embodiment of this application places the refrigerant container 123 and the expansion valve between the first heat exchanger 121 and the second heat exchanger 122, which can save the length of the refrigerant flow path. This further reduces the area of ​​the refrigerant module 120, thereby further reducing the cost and weight of the thermal management integrated component 00.

[0100] For example, the above Figure 9 In this configuration, the refrigerant container 123 is positioned perpendicular to the water circuit substrate 100 (and also perpendicular to the refrigerant module 120). Specifically, assuming the side of the refrigerant container 123 with the aforementioned interfaces 28 and 29 is designated as the first side, and the side facing away from the first side is designated as the second side (i.e., the bottom of the refrigerant container is the second side), the direction from the second side of the refrigerant container 123 to the first side is perpendicular to the refrigerant module. Furthermore, interfaces 28 and 29 are directly connected to interfaces 25 and 26 on the refrigerant module 120, respectively. The perpendicularity of the refrigerant container 123 to the refrigerant module 120 reduces the impact on the refrigerant circuit caused by insufficient refrigerant supply when the refrigerant level in the container is low. Additionally, the perpendicularity of the container to the refrigerant module facilitates increasing the refrigerant capacity by replacing it with a longer container.

[0101] By way of example, in another possible implementation, the refrigerant container 123 may also be arranged laterally on the refrigerant module 120. Specifically, the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is parallel to the refrigerant module 120. For ease of understanding, please refer to the example provided. Figure 10 and Figure 10A . Figure 10 and Figure 10A A schematic diagram is shown showing the refrigerant container 123 arranged horizontally on the refrigerant module 120. Figure 10 and Figure 10A The difference lies in the positions of the refrigerant inlet and outlet on the refrigerant container 123. With this arrangement, interfaces 25 and 28, and interfaces 26 and 29, can be connected via shorter pipes or welding. For example, the positions of interfaces 25 and 26 on the refrigerant module 120 can be adapted to the placement of the refrigerant container 123, and this embodiment does not impose any limitations on this. Laterally arranging the refrigerant container 123 on the refrigerant module 120 can further reduce the thickness of the thermal management integrated component 00.

[0102] For example, the above Figures 1 to 10 The diagram shown is merely a schematic representation of an embodiment of this application. The specific shape and size of each device are shown schematically, as are the shape and size of each interface. The shape and size of the water channel substrate 100 are also schematic. The water channel substrate 100 can be any regular square, ellipse, or irregular shape; this embodiment does not impose any limitations on this. For example, in one possible implementation, if the water channel substrate 100 has other shapes, the layout positions of the interfaces and devices disposed on the water channel substrate can be adaptively adjusted. For ease of understanding, please refer to the exemplary embodiments. Figure 11 and Figure 12 . Figure 11 and Figure 12 The shape of the water channel substrate 100 shown is different from that described above. Figure 4 and Figure 5 The shape of the water channel substrate 100 shown.

[0103] For example, Figure 11 The diagram shown is an exploded view of the thermal management integrated component 00 as seen from the first side of the water channel substrate 100. Figure 12 The diagram shown is an exploded view of the thermal management integrated component 00 as seen from the second side of the water channel substrate 100. Figure 11 and Figure 12 As can be seen, the shape and size of the water channel substrate 100 are different. Figure 4 and Figure 5 The shape and size of the water channel substrate 100 shown; the layout of the devices disposed on the water channel substrate 100 is also different. Figure 4 and Figure 5 The layout shown.

[0104] For example, such as Figure 11 As shown, the multi-way valve 110, water pump 111, water pump 112, and water pump 113 are still located on the first side of the water circuit board 100. However, compared to the above... Figure 4 As shown, the relative positions of the multi-way valve 110, water pump 111, water pump 112, and water pump 113 have changed. For example, the multi-way valve 110, water pump 111, water pump 112, and water pump 113 are respectively positioned at the four corners of the water circuit board 100. This adaptive adjustment of the positional layout is to reduce the intersection of refrigerant flow channels in the water circuit board 100, so as to make the most of the area of ​​the water circuit board 100 to arrange more flow channels and improve the utilization rate of the water circuit board 100. Regarding the first side of the water circuit board 100, the connection relationship between the multi-way valve 110, water pump 111, water pump 112, and water pump 113 and the interfaces on the water circuit board 100 can be referred to the above. Figure 4 The relevant information will not be elaborated here.

[0105] For example, such as Figure 12 As shown, the refrigerant module 120, the first heat exchanger 121, and the second heat exchanger 122 are still mounted on the refrigerant frame 200. Specifically, the refrigerant module 120 is mounted in the first region 201 of the refrigerant frame 200. Figure 12 (Medium-twill area); the first heat exchanger 121 and the second heat exchanger 122 are mounted on the refrigerant frame 200 and are connected to the coolant flow channel interfaces (including interfaces 11 to 14) on the water channel substrate 100 that pass through the second region 202. However, compared to the above... Figure 5 As shown, the relative positions of the refrigerant module 120, the first heat exchanger 121, and the second heat exchanger 122 have changed. For example, Figure 5 In this configuration, the refrigerant module 120 is positioned in the middle region of the refrigerant frame 200 (the first region 201 is located in the middle region of the refrigerant frame 200), and the first heat exchanger 121 and the second heat exchanger 122 are respectively positioned on both sides of the refrigerant frame 200, sandwiching the refrigerant module 120 in the middle. Figure 12 In this configuration, the refrigerant module 120 is located on one side of the refrigerant frame 200 (the first region 201 is located on one side of the refrigerant frame 200), and the first heat exchanger 121 and the second heat exchanger 122 are located on the opposite side of the refrigerant frame 200. The first heat exchanger 121 and the second heat exchanger 122 are located side-by-side on the same side of the refrigerant module 120 (referred to as the first side). As an example, a refrigerant container 123 and an expansion valve 124 are also provided on the refrigerant module 120, and these are located on the opposite side of the first side. Furthermore, the refrigerant container 123 is positioned closer to the first heat exchanger 121, and the expansion valve 124 is positioned closer to the second heat exchanger 122. This arrangement allows for a shorter refrigerant transfer path.

[0106] For example, in Figure 12 In this embodiment, the water channel substrate 100 may include a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101, and the area of ​​the second layer 102 is smaller than the area of ​​the first layer 101. Coolant channels are provided in the second layer 102. When the water channel substrate 100 and the refrigerant frame 200 are integrated together, the second layer 102 is embedded in the second region 202, and the interfaces 08 to 14 on the water channel substrate 100 pass through the second region 202 along with the second layer 102. Alternatively, in another possible implementation, it is possible to... Figure 12 A through hole is provided in 201 shown. Figure 12 (Not shown in the drawing), interface 12 passes through the through hole 2011 and connects with interface 16 of the first heat exchange device 121. For specific examples, please refer to the above description. Figure 4 The relevant descriptions are not repeated here.

[0107] It is understandable that the above Figure 11 and Figure 12 The examples shown are merely illustrative and do not constitute a limitation on the embodiments of this application.

[0108] In one possible implementation, the arrangement of the devices on the second side of the water channel substrate 100 is not limited to the above. Figure 5 (or Figure 7 )or Figure 12 The layout shown can also be other layout positions. For example, see [example image]. Figures 13 to 16 . Figure 13 The above is shown. Figure 7The diagram shows the positional relationship of the second side of the water channel substrate 100 in the thermal management integrated component 00. Figure 14 The above is shown. Figure 12 This is a schematic planar view showing the positional relationship of the second side of the water channel substrate 100 in the thermal management integrated component 00. Figure 13 and Figure 14 The schematic diagram illustrates, for example, the layout of the refrigerant module 120, the first heat exchanger 121, the second heat exchanger 122, the refrigerant container 123, and the expansion valve 124 integrated on the second side of the water circuit board 100. In another possible implementation, the layout of the devices integrated on the second side of the water circuit board 100 can also be found in, for example, [reference needed]. Figure 15 or Figure 16 As shown.

[0109] For example, in Figure 15 In this configuration, the long sides of the first heat exchanger 121 and the second heat exchanger 122 can be arranged perpendicular to the long side direction of the water circuit substrate 100. The refrigerant module 120 is disposed in the middle region of the second side of the water circuit substrate 100, and the refrigerant container 123 and the expansion valve 124 integrated on the refrigerant module 120 are disposed between the first heat exchanger 121 and the second heat exchanger 122.

[0110] For example, in Figure 16 In this context, the layout and positional relationship of the refrigerant module 120, the first heat exchanger 121, the second heat exchanger 122, the refrigerant container 123, and the expansion valve 124 are as described above. Figure 14 The layout shown is a mirror image. Figure 16 In this configuration, the refrigerant module 120 is disposed on one side of the second side of the water circuit substrate 100, and the first heat exchanger 121 and the second heat exchanger 122 are disposed on the other side of the second side of the water circuit substrate 100. The first heat exchanger 121 and the second heat exchanger 122 are located side by side on the same side of the refrigerant module 120 (referred to as the first side). As an example, a refrigerant container 123 and an expansion valve 124 are also disposed on the refrigerant module 120, and the refrigerant container 123 and the expansion valve 124 are located on the opposite side from the first side. Furthermore, the refrigerant container 123 is disposed close to the first heat exchanger 121, and the expansion valve 124 is disposed close to the second heat exchanger 122.

[0111] For example, the above Figures 13 to 16 In the layout shown, the refrigerant container 123 is positioned close to the refrigerant outlet of the first heat management device 121, and the expansion valve 124 is positioned close to the refrigerant inlet of the second heat exchange device 122. The refrigerant container 123 and the expansion valve 124 are also positioned as close as possible to each other, which can greatly shorten the length of the refrigerant flow channel and thus greatly reduce the area of ​​the refrigerant module 120.

[0112] In summary, in this embodiment, on the one hand, the water channel substrate and the refrigerant frame are integrated using a nested arrangement of protrusions and cutouts, which reduces the overall thickness of the integrated thermal management component and thus reduces its volume. On the other hand, the water channel substrate is designed as a two-layer structure, and the second layer also contains coolant channels to meet the layout requirements of the coolant channels, thereby avoiding the problem of the first layer having an excessively large area due to the placement of all channels in the first layer, thus reducing the length or width of the first layer. Furthermore, by concentrating the high-pressure resistant refrigerant channels into a smaller refrigerant module, the use of high-pressure resistant metal materials can be reduced, reducing weight while saving on material and manufacturing costs.

[0113] This application also provides a thermal management system, for example, see [link to relevant documentation]. Figure 17 As shown. The thermal management system 1700 may include a thermal management integration component 1701. The thermal management integration component 1701 may be, for example, a thermal management integration component in any of the possible embodiments described above. For details, please refer to the foregoing description, which will not be repeated here.

[0114] This application also provides a vehicle, for example, see [link to relevant documentation]. Figure 18 As shown. The vehicle 1800 may include a thermal management integrated component 1801. The thermal management integrated component 1801 may be, for example, a thermal management integrated component in any of the possible embodiments described above. For details, please refer to the foregoing description, which will not be repeated here.

[0115] It should be understood that in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0116] It should also be understood that the term “comprising” (also referred to as “includes”, “including”, “comprises” and / or “comprising”) as used in this specification specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0117] It should also be understood that the phrases "an embodiment," "an embodiment," and "a possible implementation" used throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment or implementation is included in at least one embodiment of this application. Therefore, the phrases "in an embodiment," "an embodiment," or "a possible implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thermal management integrated component, characterized in that, The integrated thermal management component includes a water circuit substrate and a refrigerant frame; The water circuit substrate includes a first layer and a second layer, with the second layer stacked on the first layer and the area of ​​the second layer being smaller than that of the first layer; both the first layer and the second layer are provided with coolant flow channels. The refrigerant frame includes a first region and a second region; a refrigerant module is disposed in the first region, and a refrigerant channel is disposed in the refrigerant module; the second region is a hollow region; The water channel substrate and the refrigerant frame are integrated together, the second layer is embedded in the second region, and the first region is embedded in the recessed area formed between the second layer and the first layer.

2. The thermal management integrated component according to claim 1, characterized in that, The area of ​​the second layer is between 40% and 60% of the area of ​​the first layer.

3. The integrated thermal management component according to claim 1 or 2, characterized in that, The area of ​​the second region is larger than the area of ​​the second layer, and the ratio of the area of ​​the second region to the area of ​​the refrigerant frame is between 50% and 70%.

4. The thermal management integrated component according to any one of claims 1-3, characterized in that, The area of ​​the refrigerant module is between 30% and 50% of the area of ​​the refrigerant frame.

5. The thermal management integrated component according to any one of claims 1-4, characterized in that, The ratio of the thickness of the refrigerant module to the thickness of the refrigerant frame is between 50% and 100%.

6. The thermal management integrated component according to any one of claims 1-5, characterized in that, The refrigerant module is manufactured by forging, and the parts of the refrigerant frame other than the refrigerant module are manufactured by die casting or sheet metal processing.

7. The thermal management integrated component according to any one of claims 1-6, characterized in that, The refrigerant module is provided with a first refrigerant flow channel interface; the refrigerant frame is also provided with a first heat exchange device; The first heat exchange device includes a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located on a first side of the first heat exchange device, and the first refrigerant outlet is located on a second side opposite to the first side of the first heat exchange device; The first refrigerant inlet is used to connect with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

8. The thermal management integrated component according to claim 7, characterized in that, The first heat exchange device includes a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device; The water circuit substrate is provided with a first coolant flow channel interface and a second coolant flow channel interface, and the second region includes a first hollow region. The first coolant flow channel interface passes through the first hollow area and connects with the first coolant inlet; The second coolant flow channel interface passes through the first hollow area and connects with the first coolant outlet, or the second coolant flow channel interface passes through a through hole on the plate-shaped area and connects with the first coolant outlet.

9. The thermal management integrated component according to any one of claims 1-8, characterized in that, The refrigerant module is provided with a second refrigerant flow channel interface; the refrigerant frame is also used to fix the second heat exchange device. The second heat exchange device includes a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located on a first side of the second heat exchange device, and the second refrigerant outlet is located on a second side opposite to the first side of the second heat exchange device; The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to connect to the compressor.

10. The thermal management integrated component according to claim 9, characterized in that, The second heat exchange device includes a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device; The water circuit substrate is provided with a third coolant flow channel interface and a fourth coolant flow channel interface, and the second region includes a second hollow region. The third coolant flow channel interface passes through the second hollow area and connects with the second coolant inlet, and the fourth coolant flow channel interface passes through the second hollow area and connects with the second coolant outlet.

11. The thermal management integrated component according to any one of claims 1-10, characterized in that, The refrigerant module is provided with a third refrigerant flow channel interface and a fourth refrigerant flow channel interface; the refrigerant container is integrated on the refrigerant module and is connected to the refrigerant flow channel in the refrigerant module through the third refrigerant flow channel interface and the fourth refrigerant flow channel interface.

12. The thermal management integrated component according to claim 11, characterized in that, The refrigerant container includes a first side and a second side, wherein the orientation of the first side of the refrigerant container and the orientation of the second side of the refrigerant container are opposite to each other; The refrigerant container is provided with a third refrigerant inlet and a third refrigerant outlet on its first side. The third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module. The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or, The direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

13. The thermal management integrated component according to any one of claims 1-12, characterized in that, The refrigerant module is provided with a fifth refrigerant flow channel interface; an expansion valve is integrated on the refrigerant module and communicates with the refrigerant flow channel in the refrigerant module through the fifth refrigerant flow channel interface; and / or, The refrigerant module is provided with a sixth refrigerant flow channel interface; the shut-off valve is integrated on the refrigerant module and is connected to the refrigerant flow channel in the refrigerant module through the sixth refrigerant flow channel interface.

14. The thermal management integrated component according to any one of claims 1-13, characterized in that, The refrigerant frame is disposed on the first side of the water channel substrate, and the orientation of the second side of the water channel substrate is opposite to the orientation of the first side of the water channel substrate. A multi-way valve, a first water pump, a second water pump, and a third water pump are arranged sequentially along the longer side of the second side of the water circuit substrate.

15. A thermal management system, characterized in that, The thermal management system includes the thermal management integrated component as described in any one of claims 1-14.

16. A vehicle, characterized in that, The vehicle includes a thermal management integrated component as described in any one of claims 1 to 14, or the vehicle includes a thermal management system as described in claim 15.

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