Motion platform and lithography machine
Patent Information
- Application Number
- CN202311606643.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-29
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2043-11-29
AI Technical Summary
[0006]有鉴于此,本发明实施例提供一种运动平台及光刻机,以解决运动平台运行时产生的摩擦影响光刻机精度的问题
一、采用了气浮装置和线性集成模组,并通过气垫支撑和多轴向运动的正交设计,实现了高精度的位置控制和稳定性,有助于满足微米级和亚纳米级的制程要求。其中,气浮装置减少了工件台与底部的接触,降低了摩擦和磨损,延长了设备的寿命并减少了维护需求,具有高精度和稳定性的优点。
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Figure CN117572727B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of lithography machine technology, and particularly to a motion platform and a lithography machine. Background Technology
[0002] The positioning platform of a lithography machine is one of the most crucial components in semiconductor manufacturing, responsible for ensuring the accuracy, stability, and repeatability of photolithography exposure on semiconductor wafers. Photolithography is used in semiconductor manufacturing to define patterns for circuits and components. Process requirements are typically at the micrometer level, or even higher at the sub-nanometer level. This necessitates that the positioning platform achieve high-precision movement and alignment to ensure the accuracy of the exposed pattern's position and size.
[0003] The positioning platform needs excellent dynamic performance, enabling it to move, stop, and stabilize rapidly within a short timeframe to adapt to the demands of different process steps. This includes stepping, scanning, and leveling operations. Stability is crucial for maintaining process consistency. The positioning platform must be able to reduce vibration and mechanical straying to ensure exposure quality. This is typically achieved through carefully designed mechanical structures, vibration damping technologies, and control systems.
[0004] Existing ultra-precision positioning platforms play a crucial role in lithography machines. They need to achieve nanometer-level or even sub-nanometer-level precision under high speed and high acceleration to meet the requirements of modern integrated circuit manufacturing processes. Their performance directly affects the lithography machine's wafer yield, process accuracy, and product quality. However, traditional motion platforms typically rely on linear guides to guide the workpiece stage, which leads to friction with the bottom, thus affecting accuracy. Because friction and mechanical contact introduce errors, more calibration and adjustment are required, limiting the lithography machine's ability to achieve sub-nanometer-level process requirements.
[0005] To address these technical problems, a motion platform and a lithography machine are proposed. Summary of the Invention
[0006] In view of this, embodiments of the present invention provide a motion platform and a lithography machine to solve the problem that friction generated during the operation of the motion platform affects the accuracy of the lithography machine.
[0007] The technical solution of this invention is implemented as follows: On one hand, a motion platform is provided for mask lithography in a lithography machine, the motion platform comprising: Workpiece stage; air flotation device, which is disposed at the bottom of the workpiece stage to provide air pressure support to the workpiece stage; linear integrated module, which is mounted on the workpiece stage and driven by air flotation, so that the linear integrated module outputs at least two linear degrees of freedom in orthogonally stacked staggered axes; mask stage, which is disposed at the end of the linear integrated module, so that the linear integrated module drives the mask stage to achieve tracking and positioning when performing the linear degrees of freedom.
[0008] In the above implementation: the motion platform adopts a combination design of air-bearing device, workpiece stage, linear integrated module and mask stage. The air-bearing device provides air pressure support to the workpiece stage, and the linear integrated module driven by air-bearing is mounted on the workpiece stage. The end of the linear integrated module is used to set the mask stage, so that the mask stage can selectively perform high-precision movement in multiple directions for tracking and positioning operations.
[0009] In one embodiment: the air flotation device includes a rectangular housing and a counter-torque buffer mechanism mounted at the four corners inside the housing; the counter-torque buffer mechanism abuts against the bottom of the workpiece stage.
[0010] In the above implementation: the air flotation device adopts a rectangular housing, with a counter-torque buffer mechanism at the four corners inside. The counter-torque buffer mechanism is used to contact and abut against the bottom of the workpiece table to provide air pressure support.
[0011] In one embodiment: the reaction torque buffer mechanism is an air-floating vibration isolator, the middle part of which is placed in the functional chamber (2) above the housing, and both the air-floating vibration isolator and the linear integrated module are powered by the power transmission system.
[0012] In one embodiment: the air-bearing vibration isolator includes a base unit and a floating unit. The base unit is fixed to the housing, and the floating unit is fixed to the workpiece stage. There is a vertical distance between the floating unit and the base unit. A force is generated between the floating unit and the base unit to eliminate the torque generated by the center of gravity shift during the movement of the workpiece stage and to attenuate the vibration transmitted from the workpiece stage to the housing.
[0013] In the above implementation: the base unit is fixed on the housing and the floating unit is fixed on the workpiece stage, and there is a vertical distance between the two so that a torque is generated between them to eliminate the torque generated by the shift of the center of gravity of the workpiece stage during the movement, and at the same time, the vibration transmitted by the workpiece stage to the base frame (i.e., the direction of the housing) below the air flotation device is reduced.
[0014] In one embodiment: the linear integrated module includes an orthogonal truss, a moving stage, and a first air-bearing module and a second air-bearing module for outputting the linear degree of freedom; the first air-bearing module drives the orthogonal truss in a linear axial direction; the second air-bearing module is interposed with the first air-bearing module and disposed at the end of the orthogonal truss away from the first air-bearing module, and the second air-bearing module is used to linearly drive the moving stage; the moving stage is provided with the mask stage so that when the linear integrated module executes the linear degree of freedom, it drives the mask stage to achieve tracking and positioning.
[0015] In the above implementation: the linear drive of the mask stage is achieved by using the first air-bearing module, the orthogonal truss, and the second air-bearing module.
[0016] In one embodiment, the air flotation surfaces of the first air flotation module and the second air flotation module are arranged in a grid pattern.
[0017] In the above implementation: the air flotation surfaces of the first air flotation module and the second air flotation module are arranged in a grid pattern to support the movement of the workpiece stage and the mask stage.
[0018] In one embodiment, the movable stage is connected to the mask stage via an air flotation unit.
[0019] On the other hand, a lithography machine is also provided, characterized in that the lithography machine comprises: The motion platform and controller provided above, wherein the controller is electrically connected to the air flotation device and the linear integrated module of the motion platform respectively; The controller, electrically connected to both the air flotation device and the linear integrated module of the motion platform, is configured to: When the wafer to be processed is positioned at a predetermined processing position on the workpiece stage of the motion platform. Control the air flotation device to provide air pressure support to the workpiece stage; The linear integrated module is controlled to drive the mask stage of the motion platform via air flotation, so that the mask stage and the wafer to be processed are aligned. The light source is projected onto the wafer to be processed through the mask on the mask stage to achieve mask lithography on the wafer to be processed.
[0020] In one embodiment, the lithography machine further includes: A communication component, the communication component being used to establish a remote communication connection with a user equipment; The controller is also configured to: When the air pressure support provided by the air flotation device to the workpiece stage meets the support alarm conditions, an alarm message is generated and sent to the user equipment through the communication component.
[0021] In one embodiment, the supporting alarm conditions include at least one of the following: The pressure exerted by the workpiece stage on the air flotation device is greater than the preset pressure. The duration during which the air pressure value provided by the air flotation device to the workpiece stage is lower than the preset air pressure value is longer than the preset duration.
[0022] Compared with the prior art, the beneficial effects of the present invention are: First, it employs an air flotation device and a linear integrated module, and through an orthogonal design with air cushion support and multi-axial motion, achieves high-precision position control and stability, helping to meet the process requirements at the micron and sub-nanometer levels. The air flotation device reduces the contact between the workpiece stage and the bottom, lowering friction and wear, extending equipment life, and reducing maintenance needs, while offering advantages in high precision and stability.
[0023] Second, the linear integrated module of the present invention provides at least two intersecting axes of linear freedom and is arranged in an orthogonal stack, enabling the positioning platform to perform precise movements in multiple dimensions and meet various application requirements.
[0024] Third, this invention reduces the structural complexity of the positioning platform through integrated design, implements multi-axial motion through linear integrated modules, simplifies the assembly and maintenance process, and reduces operation and maintenance costs. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a three-dimensional schematic diagram of the present invention from one perspective; Figure 2 This is a three-dimensional schematic diagram from another perspective of the present invention; Figure 3 This is a three-dimensional schematic diagram of the air flotation device of the present invention; Figure 4 This is a three-dimensional schematic diagram of the workpiece stage of the present invention.
[0027] Diagram: 1. Air flotation device; 2. Functional chamber; 3. Workpiece stage; 4. Mask stage; 101. Housing; 102. Reaction torque buffer mechanism; 103. Energy transmission system; 301. First air flotation module; 302. Orthogonal truss; 303. Second air flotation module; 304. Moving stage; 305. Air flotation unit. Detailed Implementation
[0028] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below; It is important to note that terms such as "first," "second," "symmetric," and "array" are used only to distinguish between descriptive and positional descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified with terms such as "first" or "symmetric" may explicitly or implicitly include one or more of that feature; similarly, when the quantity of certain features is not limited by words such as "two" or "three," it should be noted that such features also explicitly or implicitly include one or more features. In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. Simultaneously, all axial descriptions, such as the X-axis, Y-axis, Z-axis, one end of the X-axis, the other end of the Y-axis, or the other end of the Z-axis, are based on the Cartesian coordinate system.
[0029] In this invention, unless otherwise explicitly specified and limited, terms such as "installation," "connection," and "fixation" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection, a direct connection, a welding connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the accompanying drawings and specific circumstances.
[0030] The technical field and related terms of the embodiments of this application are briefly described below.
[0031] Terms like "degree of freedom" refer to the connection relationship of at least one component and the relationship of applied forces. For example, "linear degree of freedom" means that a component is connected to one or more other components through the linear degree of freedom and applies forces to them, so that they can slide or apply forces in a straight line direction; "rotational degree of freedom" means that a component can rotate freely about at least one rotation axis and can apply torque or withstand torque.
[0032] The pneumatic gravity compensation module is used to achieve air support. It utilizes internally maintained air pressure to generate supporting force, counteracting the gravity on the workpiece stage and mask stage. The air pressure causes the workpiece stage and mask stage to float, reducing contact with the bottom and lowering friction and wear.
[0033] A grating measurement system is used for position feedback. This system uses optical principles to measure the position of the workpiece stage and mask stage in real time. First, a grating scale (a transparent film precisely engraved with grating lines) is placed; then, by shining a laser beam onto the grating and measuring the reflected light signal, the position and displacement of the workpiece stage and mask stage can be determined, providing real-time position feedback so that the motion platform can be precisely controlled and adjusted.
[0034] A linear motor is a device that achieves linear motion through the principle of electromagnetic induction. Typically, a linear motor consists of a fixed part (base unit) and a moving part (floating unit). An energized coil on the base unit generates a magnetic field, and a permanent magnet on the floating unit interacts with this magnetic field, thus producing linear motion. Precise linear displacement can be achieved by controlling the magnitude and direction of the current.
[0035] Precision guideways are used to support and guide the movement of workpiece stages and mask stages. They can employ designs such as ball bearings or sliders to reduce friction and provide highly precise guidance.
[0036] In existing technologies, motion platforms typically rely on linear guides to guide the workpiece stage, which leads to friction and wear between the stage and the bottom, reducing system lifespan and affecting accuracy. This can be limiting in achieving sub-nanometer process requirements because friction and mechanical contact introduce errors, requiring more calibration and adjustment.
[0037] Based on this, to solve the above problems, this application proposes a motion platform and a lithography machine. The technical solutions of the embodiments of this application and how these solutions solve the above-mentioned technical problems will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the various embodiments or technical features described below can be arbitrarily combined to form new embodiments. The same or similar concepts or processes may not be repeated in some embodiments. Obviously, the described embodiments are only some embodiments of this application, not all embodiments.
[0038] Example of a motion platform.
[0039] See Figure 1 This application provides a motion platform, including an air-float device 1, a workpiece stage 3, and a mask stage 4. The workpiece stage 3 is equipped with a linear integrated module driven by air-float. The linear integrated module outputs at least two intersecting axial linear degrees of freedom, and each linear degree of freedom is stacked orthogonally to each other. The mask stage 4 is mounted on the linear degree of freedom executed at the end of the linear integrated module, and the mask stage 4 is driven to perform tracking and positioning.
[0040] In this design, the motion platform employs a combination of an air-bearing device 1, a workpiece stage 3, and a mask stage 4. The workpiece stage 3 is equipped with an air-bearing driven linear integrated module, which provides at least two intersecting linear degrees of freedom. These linear degrees of freedom are stacked orthogonally, enabling the motion platform provided in this embodiment to perform high-precision movements in multiple directions. The mask stage 4 is located at the end of the linear integrated module and is connected to the linear degrees of freedom for tracking and positioning operations.
[0041] Specifically, this design utilizes an air-float device 1 and a linear integrated module to achieve movement between the workpiece stage 3 and the mask stage 4. The linear integrated module provides at least two linear degrees of freedom, allowing the workpiece stage 3 to move freely in both the horizontal and vertical directions. These linear degrees of freedom are stacked orthogonally, enabling movement in multiple directions, thus achieving high flexibility and precision. The mask stage 4, located at the end of the linear integrated module, connects to the linear degrees of freedom to track and position the workpiece or wafer on the workpiece stage 3, ensuring the accuracy of the photolithography process. Simultaneously, the air-float device 1 provides air pressure support for the workpiece stage 3, reducing friction between the workpiece stage 3 and the guide rails, thereby achieving smooth movement.
[0042] Specifically, all electrical components of the lithography machine can be powered by mains electricity; specifically, the electrical components are conventionally electrically connected to the mains output port through devices such as relays, transformers, and button panels to meet the power supply needs of all electrical components, which will not be elaborated further in this application.
[0043] Specifically, the lithography machine is also equipped with an external controller, which is used to connect and control all electrical components of the lithography machine to drive according to the preset program as preset values and drive modes. It should be noted that the above drive modes can correspond to the corresponding start-stop time intervals, speed, power and other output parameters between electrical components, that is, to meet the requirements of the relevant electrical components to drive the lithography machine to operate according to the functions they describe.
[0044] Preferably, the controller is a lithography machine controller.
[0045] It is understood that in this specific embodiment, the key function of this motion platform is to achieve high-precision positioning and tracking to support the photolithography process. Through the use of the air-bearing device 1, the workpiece stage 3 can move without friction, thereby reducing wear and improving accuracy. The linear integrated module provides at least two linear degrees of freedom, enabling the workpiece stage 3 to move precisely in multiple directions, meeting the requirements of micron- and sub-nanometer-scale processes. The tracking and positioning function of the mask stage 4 ensures accurate alignment of the workpiece or wafer with the mask, thereby achieving high-quality photolithography exposure, which is crucial for the success of semiconductor manufacturing. The motion platform provided in this embodiment can be widely used in the semiconductor manufacturing field and is of great significance for improving the throughput and process quality of photolithography machines.
[0046] In some specific embodiments of this application, see [reference]. Figure 1 and Figure 3 The air flotation device 1 includes a rectangular housing 101 and a counter-torque buffer mechanism 102 mounted at the four corners inside the housing 101. The counter-torque buffer mechanism 102 abuts against the bottom of the workpiece stage 3.
[0047] The air flotation device 1 adopts a rectangular housing 101, with a counter-torque buffer mechanism 102 at the four corners inside, for contacting and abutting the bottom of the workpiece table 3.
[0048] This can be understood as the rectangular housing 101 providing a closed gas container to maintain a certain gas pressure. The counter-torque buffer mechanism 102 is located at the four corners of the housing 101 to respond to the load on the workpiece stage 3 and counteract the pressure on the workpiece stage 3 by applying a counter-force to the bottom of the workpiece stage 3. This design allows the workpiece stage 3 to suspend above the gas, thereby reducing friction with the bottom and enabling smooth movement of the workpiece stage 3.
[0049] The air pressure maintained within the housing 101 reduces the contact between the workpiece stage 3 and the bottom, thereby decreasing friction and wear. The air-float device 1 provides air-float support for the workpiece stage 3 via a counter-torque buffer mechanism 102, counteracting the pressure applied by the workpiece stage 3 and ensuring stable suspension and the ability to withstand the workpiece load. This design improves the accuracy and stability of the workpiece stage 3 during the photolithography process.
[0050] In some specific embodiments of this application, the counter-torque buffer mechanism 102 (i.e., air-bearing vibration isolator) includes a base unit and a floating unit. The base unit is fixed on the housing 101, and the floating unit is fixed on the workpiece stage 3. There is a vertical distance between the floating unit and the base unit. A force is generated between the floating unit and the base unit to eliminate the torque generated by the center of gravity shift during the movement of the workpiece stage 3 and to attenuate the vibration transmitted from the workpiece stage 3 to the housing 101.
[0051] In this design, the counter-torque buffer mechanism 102 consists of two key parts: a base unit and a floating unit. The base unit is fixed to the housing 101, while the floating unit is fixed to the workpiece stage 3. A certain vertical distance exists between the floating unit and the base unit, and a force is generated between them. This force eliminates the torque generated by the shift of the center of gravity of the workpiece stage 3 during movement, and simultaneously reduces the vibration transmitted from the workpiece stage 3 to the housing 101.
[0052] Specifically, the principle of this anti-torque buffer mechanism 102 is to eliminate torque and attenuate vibration through the interaction force between the base unit and the floating unit. The base unit is typically fixed to the housing 101, while the floating unit is fixed to the workpiece stage 3. When the workpiece stage 3 moves, a torque is generated due to the shift in the center of gravity or uneven load distribution, which disturbs the balance of the workpiece stage 3. The vertical distance between the floating unit and the base unit, as well as the torque generated between them, is used to counteract the disturbing torque, thereby maintaining the stability of the workpiece stage 3. At the same time, it can also absorb and reduce the vibration transmitted from the workpiece stage 3 to the housing, ensuring that the motion platform remains stable during operation.
[0053] It is understood that in this specific embodiment, the main function of the counter-torque buffer mechanism 102 is to provide stability and reduce vibration. By eliminating the torque generated by the shift in the center of gravity, the counter-torque buffer mechanism 102 ensures the smoothness and accuracy of the workpiece stage 3 during movement. At the same time, the counter-torque buffer mechanism 102 also helps to attenuate the vibration transmitted by the workpiece stage 3 towards the machine housing, further improving the stability of the motion platform and the accuracy of the lithography machine in the lithography process.
[0054] In some specific embodiments of this application, the reaction torque buffer mechanism 102 is preferably an air-bearing vibration isolator. The middle part of the air-bearing vibration isolator is placed in the functional chamber 2 of the housing 101, and both the air-bearing vibration isolator and the linear integrated module are powered by the power transmission system 103. The functional chamber 2 can be understood as a cavity located above the housing 101 and surrounded by a partition plate, used to house a part of the air-bearing vibrator and wires, air pipes, etc.
[0055] In this design: the counter-torque buffer mechanism 102 employs an air-floating vibration isolator, with the central portion of the air-floating vibration isolator positioned within the functional chamber 2 above the housing 101. Both the air-floating vibration isolator and the linear integrated module are powered by the power supply system 103. The power supply system 103 ensures that all components within the lithography machine receive the necessary energy for normal operation.
[0056] Specifically, the power transmission system 103 may include: A power supply unit to provide the electrical energy required by the motion platform; The air supply unit is used to provide gases such as compressed air or nitrogen, which can support the operation of the air-bearing vibration isolator and generate air pressure support for the air-bearing vibration isolator. The platform communication unit is used to communicate with various components in the lithography machine, monitor their performance and status, and perform fault diagnosis.
[0057] Specifically, air-bearing vibration isolators are used to buffer reaction torque and isolate vibration. The air-bearing vibration isolator may contain air bladders to adjust their internal air pressure, thereby generating a reaction force when subjected to external forces to counteract the torque on the workpiece stage 3 and reduce its vibration. The central part of the air-bearing vibration isolator is located within the functional chamber 2, which helps isolate external vibrations and disturbances. Furthermore, the power supply system 103 provides the necessary energy and / or control signals to ensure the normal operation of the air-bearing vibration isolator and the linear integrated module.
[0058] It is understood that in this specific embodiment: because the air-bearing vibration isolator can provide a high degree of vibration isolation and stability, it is used as a counter-torque buffer mechanism to counteract the torque on the workpiece stage 3 and reduce the impact caused by external vibration. The functional chamber 2, located above the housing 101, helps isolate external vibration sources, ensuring the stability and accuracy of the lithography machine. The power supply system 103 is responsible for providing the necessary energy and / or control signals to the air-bearing vibration isolator and the linear integrated module to maintain their normal operation. In summary, this technical solution helps meet the high precision and high stability requirements of semiconductor manufacturing processes.
[0059] For some specific embodiments of this application, please refer to Figure 1 and Figure 4The linear integrated module includes a first air-bearing module 301 and a second air-bearing module 303 for outputting linear degrees of freedom. The first air-bearing module 301 drives an orthogonal truss 302 in a linear axial direction. The second air-bearing module 303 is mounted on the orthogonal truss 302. The second air-bearing module 303 is interposed with the first air-bearing module 301 and linearly drives a moving stage 304. A mask stage 4 is provided on the moving stage 304. The linear degrees of freedom output by the second air-bearing module 303 are the linear degrees of freedom of the end effector.
[0060] Specifically, linear degrees of freedom can be achieved by stacking (first and second) air-bearing modules. This design allows for high-precision linear movement between the workpiece stage 3 and the mask stage 4 in multiple directions, while ensuring the accurate positioning of the mask stage 4.
[0061] Understandably, in this specific embodiment, multiple staggered linear degrees of freedom are provided to support precise movement between the workpiece stage 3 and the mask stage 4. The first air-bearing module 301 and the orthogonal truss 302 provide one linear degree of freedom, while the second air-bearing module 303 and the moving stage 304 provide another. This design allows the mask stage 4 to move precisely in multiple directions to meet micron- and sub-nanometer process requirements. The air-bearing design of the linearly integrated modules also reduces friction with the guide rails, improving stability and accuracy. This is crucial for the high precision requirements of the photolithography process.
[0062] Preferably, the first air-bearing module 301 and the second air-bearing module 303 respectively include a pneumatic gravity compensation module, a grating measurement system, a linear motor and a precision guide rail.
[0063] Integrating a pneumatic gravity compensation module, a grating measurement system, a linear motor, and a precision guide rail, the first air-bearing module 301 and the second air-bearing module 303 can achieve high-precision and stable linear motion through air support, grating measurement, linear motors, and precision guide rails, respectively, and provide multi-axial linear degrees of freedom to meet the high requirements for precision and stability in fields such as semiconductor manufacturing. The pneumatic gravity compensation module, grating measurement system, linear motor, and precision guide rail work together to enable the motion platform to achieve precise position control and movement in multiple dimensions.
[0064] Furthermore, each linear degree of freedom is stacked orthogonally to the others. This orthogonal arrangement indicates that each linear degree of freedom is independent and located along a different axis. This allows the motion platform to perform linear movements simultaneously in multiple directions (horizontal, vertical, and oblique dimensions). Because movements in different directions may need to be performed simultaneously, this technical solution can meet complex process requirements and achieve precise alignment. Simultaneously, the orthogonal arrangement of linear degrees of freedom simplifies motion control. The independence between different degrees of freedom means that movements along each axis can be achieved through independent control (signals) without complex coupling control, helping to reduce control complexity and improve motion controllability and adjustability. Since each degree of freedom is orthogonal, high-precision positioning and movement can be achieved more easily, helping to ensure process quality and accuracy.
[0065] For some specific embodiments of this application, please refer to Figure 1 and Figure 4 The air-bearing surfaces of the first air-bearing module 301 and the second air-bearing module 303 are arranged in a grid pattern to support the movement of the workpiece stage 3 and the mask stage 4.
[0066] Specifically, the grid-shaped air-bearing surface layout provides stable support through a specific arrangement. The air-bearing modules are distributed in a grid pattern, allowing the workpiece stage 3 and mask stage 4 to receive uniform support in all directions. This helps reduce contact with the bottom, lowers friction, and maintains the stability of the air-bearing module.
[0067] It is understood that in this specific embodiment, the function of the grid-shaped air-float layout is to provide uniform support to support the smooth movement of the workpiece stage 3 and the mask stage 4. Through this layout, the workpiece stage 3 and the mask stage 4 can achieve high-precision linear movement in multiple directions, and the uniform support helps reduce friction with the bottom, reducing wear and ensuring the stability and accuracy of the motion platform while meeting the requirements of micron-level and sub-nanometer-level processes.
[0068] For some specific embodiments of this application, please refer to Figure 1 and Figure 2 The moving stage 304 is connected to the mask stage 4 via the air flotation unit 305.
[0069] Specifically, the support force can be generated by adjusting the air pressure to support and connect the moving stage 304 and the mask stage 4. This connection method allows the mask stage 4 to move smoothly on the moving stage 304 and maintain precise positioning.
[0070] It is understandable that in this specific embodiment, the air-bearing unit 305 connects and supports the moving stage 304 and the mask stage 4, which is crucial for the high precision requirements of the photolithography process. It also helps reduce contact with the bottom, lowers friction, and improves stability and accuracy.
[0071] In summary, addressing the related problems in traditional technologies, this specific embodiment, based on the motion platform provided above, achieves at least one or more of the following beneficial effects through the aforementioned technical means: First, it employs an air flotation device and a linear integrated module, and through an orthogonal design with air cushion support and multi-axial motion, achieves high-precision position control and stability, helping to meet the process requirements at the micron and sub-nanometer levels. The air flotation device reduces the contact between the workpiece stage and the bottom, lowering friction and wear, extending the equipment's lifespan and reducing maintenance needs, while offering advantages in high precision and stability.
[0072] Second, the linear integrated module of the present invention provides at least two intersecting axes of linear freedom and is arranged in an orthogonal stack, enabling the positioning platform to perform precise movements in multiple dimensions and meet various application requirements.
[0073] Third, this invention reduces the structural complexity of the positioning platform through integrated design, implements multi-axial motion through linear integrated modules, simplifies the assembly and maintenance process, and reduces operation and maintenance costs.
[0074] Implementation example of a photolithography machine.
[0075] This application embodiment also provides a lithography machine, the lithography machine comprising: Sports platform; The controller, which is electrically connected to the air flotation device 1 and the linear integrated module of the motion platform, is configured to: When the wafer to be processed is placed at a predetermined processing position on the workpiece stage 3 of the motion platform, the controller is configured to: The air flotation device 1 is controlled to provide air pressure support to the workpiece stage; The linear integrated module is controlled to drive the mask stage 4 of the motion platform via air flotation, so that the mask stage 4 and the wafer to be processed are aligned. The light source is projected onto the wafer to be processed through the mask on the mask stage 4 to form the microstructure corresponding to the mask, thereby realizing the mask lithography of the wafer to be processed.
[0076] The motion platform mentioned in this lithography machine embodiment has the same structure and function as the motion platform mentioned in the motion platform embodiment, and will not be described again here.
[0077] This can be understood as follows: the workpiece stage 3 is a platform for placing the wafer to be processed; the air flotation device 1 provides air pressure support to reduce friction and vibration during the operation of the moving platform; and the linear integrated module driven by air flotation can provide at least two orthogonal linear degrees of freedom to achieve position control of the wafer during processing. The mask stage 4 can be installed at the end of the linear integrated module to be used to position the mask and ensure that the mask is aligned with the wafer to be processed.
[0078] When the wafer to be processed is placed at the predetermined processing position on the workpiece stage 3, the air flotation device 1 is controlled to provide air pressure support to ensure reduced friction during the movement of the mask stage 4. Then, the linear integrated module is controlled to drive the mask stage 4 through air flotation to align it with the wafer to be processed.
[0079] The light source passes through the mask on the mask stage 4 and projects onto the wafer to be processed, so that the pattern on the mask is copied onto the wafer to form a microstructure. In this embodiment, the light source can be a device capable of generating a high-energy, monochromatic light beam, such as an ultraviolet light source or a laser source.
[0080] Therefore, this technical solution, through highly precise position control and alignment, can ensure that the pattern on the mask is accurately projected onto the wafer to be processed, which helps to achieve high-precision manufacturing of microstructures. The air flotation device 1 provides air pressure support, reducing the physical contact between the workpiece stage 3 and the guide rail, thereby reducing vibration and friction, which helps to achieve high-precision photolithography of the wafer to be processed.
[0081] In some specific embodiments of this application, the lithography machine further includes: A communication component, the communication component being used to establish a remote communication connection with a user equipment; The controller is also configured to: When the air pressure support provided by the air flotation device 1 to the workpiece stage meets the support alarm conditions, an alarm message is generated and sent to the user equipment through the communication component.
[0082] The communication component and the user equipment can be connected via 3G, 4G, or 5G remote communication; this application does not impose any restrictions. The user equipment may be, for example, a mobile phone, tablet, or laptop.
[0083] This can be understood as follows: when the lithography machine performs the lithography process, (using sensors) it monitors the air pressure support provided by the air float device 1 to the workpiece stage 3. If the air pressure support reaches or exceeds the set support alarm condition, it indicates that there is a problem with the performance of the air float device 1 or that maintenance is required, and an alarm will be triggered.
[0084] Therefore, in this embodiment of the application, the communication component enables the lithography machine to establish a remote communication connection with the user equipment, allowing operators or maintenance personnel to monitor the performance and status of the lithography machine in real time. When a problem occurs with the pneumatic support, the problem can be detected promptly, and alarm information can be used to prompt the user to take necessary maintenance measures, thereby reducing equipment downtime and maintenance costs.
[0085] In some specific embodiments of this application, the supporting alarm conditions include at least one of the following: The pressure exerted by the workpiece stage 3 on the air flotation device 1 is greater than the preset pressure; The duration during which the air pressure value provided by the air flotation device 1 to the workpiece stage is lower than the preset air pressure value is longer than the preset duration.
[0086] This application does not limit the preset pressure and preset duration, which may be, for example, 10 MPa, 8 MPa, 7.5 MPa, or 4 MPa. The preset duration may be, for example, 1 minute, 30 seconds, or 15 seconds.
[0087] Therefore, by supporting the real-time monitoring of the air flotation device 1 in the alarm conditions, it is helpful to detect air pressure problems in advance, thereby reducing the risk of lithography equipment failure.
[0088] The above embodiments merely illustrate implementation methods for relevant practical applications of the present invention, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A motion platform, characterized in that, The motion platform is used for mask lithography in a photolithography machine, and the motion platform includes: Workpiece stage (3); An air flotation device (1) is provided at the bottom of the workpiece stage (3) to provide air pressure support to the workpiece stage (3); A linear integrated module is mounted on the workpiece stage (3) and driven by air flotation so that the linear integrated module outputs at least two linear degrees of freedom in the staggered axes arranged in an orthogonal manner. A mask stage (4) is disposed at the end of the linear integrated module so that the linear integrated module drives the mask stage (4) to achieve tracking and positioning when performing the linear degrees of freedom; The air flotation device (1) includes a rectangular housing (101) and a counter-torque buffer mechanism (102) mounted at the four corners inside the housing (101). The counter-torque buffer mechanism (102) abuts against the bottom of the workpiece stage (3); The linear integrated module includes an orthogonal truss (302), a moving stage (304), and a first air-bearing module (301) and a second air-bearing module (303) for outputting the linear degrees of freedom. The first air-bearing module (301) drives the orthogonal truss (302) in a linear axial direction; The second air-bearing module (303) is interposed with the first air-bearing module (301) and is disposed at the end of the orthogonal truss (302) away from the first air-bearing module (301). The second air-bearing module (303) is used to linearly drive the moving stage (304). The moving stage (304) is provided with the mask stage (4) so that when the linear integrated module performs the linear degree of freedom, it drives the mask stage (4) to achieve tracking and positioning; The moving stage (304) is connected to the mask stage (4) via an air flotation unit (305).
2. The motion platform according to claim 1, characterized in that: The reaction torque buffer mechanism (102) is an air-floating vibration isolator, and the middle part of the air-floating vibration isolator is placed in the functional chamber above the casing.
3. The motion platform according to claim 2, characterized in that: The air-bearing vibration isolator includes a base unit and a floating unit; The base unit is fixed to the housing (101), the floating unit is fixed to the workpiece stage (3), there is a vertical distance between the floating unit and the base unit, and a force is generated between the floating unit and the base unit.
4. The motion platform according to claim 1, characterized in that: The air flotation surfaces of the first air flotation module (301) and the second air flotation module (303) are arranged in a grid pattern.
5. A lithography machine, characterized in that, The lithography machine includes: The motion platform as described in any one of claims 1-4; The controller is electrically connected to the air flotation device and the linear integrated module of the motion platform, respectively. When the wafer to be processed is placed at the predetermined processing position on the workpiece stage (3) of the motion platform, the controller is configured to: Control the air flotation device (1) to provide air pressure support to the workpiece stage (3); The linear integrated module is controlled to drive the mask stage (4) of the motion platform through air flotation so that the mask stage (4) and the wafer to be processed are aligned. The light source is projected onto the wafer to be processed through the mask on the mask stage (4) to achieve mask lithography of the wafer to be processed.
6. The lithography machine according to claim 5, characterized in that, The lithography machine also includes: A communication component, the communication component being used to establish a remote communication connection with a user equipment; The controller is also configured to: When the air pressure support provided by the air flotation device (1) to the workpiece stage (3) meets the support alarm conditions, an alarm message is generated and sent to the user equipment through the communication component.
7. The lithography machine according to claim 6, characterized in that, The supporting alarm conditions include at least one of the following: The pressure exerted by the workpiece stage (3) on the air flotation device (1) is greater than the preset pressure; The duration during which the air pressure value provided by the air flotation device (1) to the workpiece stage (3) is lower than the preset air pressure value is greater than the preset duration.
Citation Information
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