Fitting device, fitting method, display module and display device
By combining the contour clamping structure and the bonding structure, the problems of air bubbles and glue separation in the bonding process between the cover plate and the flexible display panel in the three-dimensional structure display module are solved, realizing efficient three-dimensional shape structure bonding and improving product yield and bonding efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-12-25
- Publication Date
- 2026-07-14
AI Technical Summary
In three-dimensional display modules, defects such as air bubbles and glue separation can easily occur during the bonding process between the cover plate and the flexible display panel, affecting the yield rate.
The first material is moved by a contour clamping structure, so that it fits against the contour surface of the contour jig. Through the combined action of the contour clamping structure and the contour jig, the first material is formed into the target shape. The bonding structure is used to bond the first material with the second material, avoiding defects such as air bubbles and delamination.
It improved the yield rate of 3D structure display modules, reduced the occurrence of defects such as bubbles and delamination, simplified the contouring process, and improved bonding efficiency and product quality.
Smart Images

Figure CN117577013B_ABST