Substrate and semiconductor substrate piece comprising a substrate

Abstract

A substrate including a glass substrate is provided. The glass substrate includes a first surface, a second surface, and an edge region connecting the first surface and the second surface; a groove portion formed from a portion of the edge region toward an inner direction of the glass substrate; and a protection device formed on the groove portion, wherein the groove portion penetrates the first surface and the second surface.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 235,847, filed August 23, 2021, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0003] The following description relates to a substrate and a packaging substrate that includes the substrate. Background Technology

[0004] The application of glass substrates in large-panel packaging processes, such as transportation and handling, may subject the glass substrates to impacts. Such impacts may cause problems such as, but not limited to, processing losses and defects.

[0005] Implementation methods for transporting, handling, etc., of glass substrates may typically include materials with high hardness, and may cause defects or cracks in the glass substrate, or may cause damage to the entire glass substrate.

[0006] Therefore, solutions that minimize damage, defects, or cracks in glass substrates during processes such as transportation and handling would be beneficial. Summary of the Invention

[0007] This summary is provided to introduce some concepts in a simplified form, which will be further described in the detailed description below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0008] In general, the substrate includes: a glass substrate including a first surface, a second surface, and an edge region configured to connect the first surface and the second surface; and a protective device disposed on at least a portion of the edge region, and wherein the protective device has a minimum thickness of 5 μm or greater than 5 μm.

[0009] The substrate may include a recessed portion extending through a first surface and a second surface toward an interior portion of the glass substrate, wherein a protective device is disposed at the recessed portion.

[0010] At least one of the first surface and the second surface of the glass substrate can be configured to have a quadrilateral to octagonal shape, wherein the glass substrate includes a through hole extending from the first surface to the second surface, and wherein the glass substrate includes at least one of an electrical conductive line and an electrical conductive layer in at least a portion of the glass substrate.

[0011] The protective device may include a first protective device and a second protective device, which are different from each other. The first protective device is disposed in an edge region that contacts a first side of the first surface, and the second protective device is disposed in an edge region that contacts a second side of the first surface. The first side and the second side are configured to be opposite each other.

[0012] The groove portion may include a first groove portion and a second groove portion, which are different from each other, and wherein the first groove portion and the second groove portion may be configured to be opposite each other, wherein a first surface is located between the first groove portion and the second groove portion.

[0013] The protective device may include a polymer layer with a total transmittance equal to or greater than 87%.

[0014] The polymer layer may be an elastic layer, and the protective device and glass substrate may be configured to have an adhesive strength of 5B according to ASTM D3359.

[0015] When the protective device is subjected to three impacts at a pressure of approximately 1.1 bar so that the protective device comes into direct contact with a pin having a cross-section corresponding to the cross-section of the groove portion, the damage to the glass substrate of the substrate may not be substantial.

[0016] When the protective device is subjected to fifty impacts at a pressure of approximately 1.1 bar to bring it into direct contact with a pin having a cross-section corresponding to the cross-section of the groove portion, the damage to the glass substrate of the substrate may not be substantial.

[0017] The groove portion can have a shape corresponding to either a circle or an ellipse, and the distance from the first point of the groove portion to the edge region can be from 1 mm to 15 mm.

[0018] The protective device can be constructed to have a pencil hardness of HB or higher according to ASTM D3363.

[0019] The polymer layer may include a UV-curable resin.

[0020] The glass substrate may include a cavity unit disposed in a portion of the glass substrate, and the thickness between the first surface and the second surface of the cavity unit may be thinner than the thickness between the first surface and the second surface of the glass substrate.

[0021] The glass substrate may include an upper redistribution layer and a lower redistribution layer, the upper redistribution layer being on a first surface and the lower redistribution layer being below a second surface.

[0022] A semiconductor substrate includes: a substrate according to the present application; and a semiconductor element mounted on the substrate.

[0023] Other features and other aspects will become apparent from the following detailed description. Attached Figure Description

[0024] Figure 1 A plan view of an example substrate according to one or more embodiments is shown.

[0025] Figure 2 A perspective view of an example glass substrate according to one or more embodiments is shown.

[0026] Figure 3 A perspective view of an example substrate according to one or more embodiments is shown.

[0027] Figure 4 A perspective view of an example glass substrate according to one or more embodiments is shown.

[0028] Figure 5 A front view of an example glass substrate according to one or more embodiments is shown.

[0029] Figure 6 A plan view of an example substrate according to one or more embodiments is shown.

[0030] Figure 7 The image shows the state of an example glass substrate according to one or more comparative embodiments after being subjected to three impacts on the grooved portion.

[0031] Figure 8 An image showing the state of an example substrate according to one or more embodiments after being subjected to fifty impacts on the grooved portion.

[0032] Figure 9 Images show the bonding state between a polydimethylsiloxane (PDMS) protective device and a recessed portion of one or more sample substrates.

[0033] Throughout the accompanying drawings and detailed description, the same reference numerals may refer to the same or similar elements. The drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0034] The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various variations, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent after understanding the disclosure of this application. For example, the sequences of operations described herein are merely examples and are not limited to those set forth herein, but can be modified, as will become apparent after understanding the disclosure of this application, except for operations that necessarily occur in a certain order. Furthermore, after understanding the disclosure of this application, descriptions of known features may be omitted for clarity and conciseness; note that the omission of features and their descriptions is not intended to acknowledge general knowledge of them.

[0035] The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples provided herein are merely illustrative of a number of possible ways to implement the methods, apparatus, and / or systems described herein, which will become apparent upon understanding the disclosure of this application.

[0036] While terms such as “first,” “second,” and “third” may be used herein to describe various elements, components, regions, layers, or parts, these elements, components, regions, layers, or parts are not limited to these terms. Rather, these terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, the first element, component, region, layer, or part mentioned in the examples described herein may also be referred to as the second element, component, region, layer, or part without departing from the teachings of the examples.

[0037] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or "attached to" the other element, or one or more other elements may be inserted between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, no other elements are inserted between the element and the other element. Similarly, expressions such as "between" and "immediately between," and "adjacent" and "closely adjacent" can also be interpreted as described above.

[0038] The terminology used herein is for the purpose of describing particular examples and is not intended to limit this disclosure. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more. As used herein, the terms “comprising,” “including,” and “having” specify the presence of stated features, numbers, operations, elements, components, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, operations, elements, components, and / or combinations thereof. The use of the term “may” in this document with respect to examples or implementations (e.g., what an example or implementation may include or implement) means that there is at least one example or implementation that includes or implements such a feature, but all examples are not limited thereto.

[0039] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains, consistent with and after understanding this disclosure. Terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0040] In this application, terms such as “first,” “second,” “A,” or “B” are used to distinguish the same terms from each other.

[0041] In this application, unless otherwise specified, the singular form is to be interpreted in the context as including both the plural and singular forms.

[0042] One or more examples may provide a substrate that can prevent the glass substrate from being impacted or damaged during packaging processes such as transportation and handling.

[0043] In one or more examples, protective devices may be provided in the substrate, thereby preventing excessive impact on the interior of the glass substrate during transport, handling, etc., in the packaging process.

[0044] Substrate 100

[0045] Reference Figure 1 and Figure 2In one or more examples, substrate 100 may include a glass substrate 10 and a protective device 20, the glass substrate 10 including a first surface 11, a second surface 12, and an edge region 13 connecting the first surface 11 and the second surface 12. In a non-limiting example, the protective device 20 may be disposed on at least a portion of the edge region 13, and in the example, the protective device 20 may include a polymer layer having a total transmittance of about 87% or more.

[0046] The glass substrate 10 may further include a recessed portion 14 that protrudes toward an interior portion of the glass substrate 10. The recessed portion 14 may extend through the first surface 11 and the second surface 12, and the recessed portion 14 may be disposed in at least a portion of the edge region 13, and the recessed portion 14 may be connected to the edge region 13. In a non-limiting example, a protective device 20 may be disposed on the recessed portion 14.

[0047] In a non-limiting example, when viewed from above, the first surface 11, excluding the recessed portion 14, may have a quadrilateral to octagonal shape, or it may have a square shape. The glass substrate 10 may have four sides and four edge regions.

[0048] In the example, the protective device 20 may include a first protective device and a second protective device, which are different from each other and can be spatially separated. The first protective device may be disposed in an edge region that contacts a first side of the first surface 11, and the second protective device may be disposed in an edge region that contacts a second side of the first surface 11, and the first and second sides may be opposite each other.

[0049] The groove portion 14 may include a first groove portion and a second groove portion, which are different from each other. The first groove portion and the second groove portion may be configured to be opposite to each other, such that the first surface 11 or the second surface 12 is located between the first groove portion and the second groove portion.

[0050] The recessed portion 14 and the protective device 20 formed on the recessed portion 14 can be included in a first edge region of the glass substrate 10 and a second edge region opposite to the first edge region, such as Figure 6 As shown. The groove portion and the protective device can be formed in multiple ways, and the groove portion and the protective device based on an edge region of the glass substrate can be formed in one to ten ways.

[0051] The substrate 100 may have a protective device 20, which is formed to extend in any one or more of the following regions: the edge region of the glass substrate 10 connected to the recessed portion 14, the first surface 11 connected to the recessed portion 14, and the second surface 12 connected to the recessed portion 14; and the protective device 20 may extend from 10 μm to 500 μm. Figure 1 As shown, the protective device 20 can also be configured to extend in the edge region other than the recessed portion 14.

[0052] The recessed portion 14 may have a shape that is recessed by a predetermined length from the edge region 13 toward the center of the first surface 11 or the second surface 12, such as... Figure 2 As shown. The protective device 20 can be formed on the inner circumferential surface of the recessed portion. The recessed portion 14 can have a maximum recess length of 2.5 mm or less, 1 mm or less than 1 mm, or 0.8 mm or less than 0.8 mm. The recessed portion can have a recess length of 0.2 mm or greater than 0.2 mm. The substrate 100 can have such a recess length, and thereby facilitates transportation and handling by means of a transport device that contacts the recessed portion.

[0053] The groove portion 14 may have substantially the same groove in both the first surface 11 and the second surface 12, and may have a through-type shape. When the first surface 11 is viewed from the upper position, or when the second surface 12 is viewed from the lower position, the cross-section of the groove portion 14 may be a cut circular shape or a cut elliptical shape. The cross-section of the groove portion 14 may include a circumferential portion of an ellipse or circle and an arc, or the cross-section of the groove portion 14 may include a curve. Furthermore, the distance from at least one point in the groove portion to the edge region may be from 1 mm to 15 mm.

[0054] The cross-section of the groove portion 14 may include a circumferential portion of a circle or semicircle with a diameter of 1 mm to 5 mm and an arc. The protective device 20 can be formed more stably by having such a shape, and the impact applied by the transport device, etc., can be minimized.

[0055] The protective device 20 may be formed on or in the recessed portion 14 to contact the recessed portion 14, such as... Figure 3 As shown, it can have a shape substantially the same as the circumferential portion along the groove portion 14.

[0056] In the example, based on the outer direction perpendicular to the thickness of the glass substrate 10 from the edge region 13, the thickness of the protective device 20 is at least 5 μm, or can be more than 5 μm, 10 μm to 1000 μm, 50 μm to 1000 μm, or 100 μm to 400 μm. The protective device 20, by having such a thickness, can minimize impacts applied via transport devices, etc.

[0057] The protective device 20 can be formed by uniformly applying a raw material composition to the groove portion 14 and then subjecting it to ultraviolet (UV) irradiation and / or heat treatment. In examples, the raw material composition may include monomers, oligomers, or prepolymers based on siloxanes, acetates, acetals, carbamates, or amides, and may include curing agents, curing catalysts, photoinitiators, solvents, etc. As a siloxane-based prepolymer, it may include polydimethylsiloxane, polydiphenylsiloxane, polyphenylmethylsiloxane, etc. Isocyanate- or amine-based compounds can be used as curing agents. The raw material composition may include reinforcing agents, adhesion enhancers, chain extenders, etc., as needed.

[0058] The raw material composition may be a first composition comprising a polydimethylsiloxane prepolymer, a curing agent, and a curing catalyst, or the raw material composition may be a second composition wherein a composition comprising a polydimethylsiloxane prepolymer and a curing catalyst and a composition comprising a polydimethylsiloxane prepolymer, a curing catalyst, and other additives are mixed in a predetermined ratio.

[0059] The polymer layer of the protective device 20 can be an elastic layer, and may include a UV-cured polymer resin, and may include a polymer resin with acid resistance and heat resistance. In examples, the polymer resin may include siloxane-based polymers, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral, polyurethane, polyether block amide, etc. As a siloxane-based polymer, it may include polydimethylsiloxane, polydiphenylsiloxane, polyphenylmethylsiloxane, etc. Polyvinyl acetate may be polyvinyl acetate with a vinyl acetate content of 20 wt% to 50 wt%. Polyvinyl butyral may be soft polyvinyl butyral including a plasticizer. Polyurethane may be a thermosetting, thermoplastic, and foamable polyurethane.

[0060] Based on the standard ASTM D3359, the adhesive strength between the protective device 20 and the recessed portion 14 of the glass substrate 10 can be 5B. 5B essentially means that no delamination occurs when an adhesive test is performed according to ASTM D3359. Additionally, according to ASTM D3363, the protective device 20 can have a pencil hardness of HB or higher, or H or lower. The protective device 20 can possess these adhesive strengths and hardnesses, thereby effectively preventing delamination of the protective device 20 and stably protecting the glass substrate 10 when the substrate 100 is transported.

[0061] The protective device 20 may have an elastic modulus of 0.5 MPa to 4 MPa or 1.8 MPa to 4 MPa.

[0062] The protection device 20 can have a thermal conductivity of 0.1 W / mK to 0.37 W / mK.

[0063] The protection device 20 can have a dielectric strength of 14 kV / mm to 24 kV / mm.

[0064] The protection device 20 can have a dielectric constant of 2 to 4 at 100 kHz.

[0065] The protective device 20 can have a coefficient of thermal expansion of 220 ppm / ℃ to 460 ppm / ℃.

[0066] The protective device 20 can have a tensile strength of 5.5 MPa to 7.9 MPa.

[0067] Based on a thickness of 20 μm, the protective device 20 can have a total transmittance of 87% or more, or 89% or more, for visible light. The total transmittance can be 95% or less. The protective device 20 can have such a total transmittance, thereby preventing problems such as interference caused by the addition of the protective device.

[0068] When subjected to 3 to 10 damage tests, the substrate 100 does not cause substantial damage to the glass substrate 10 during the damage test, which applies a pressure of 1.1 bar for one second to a protective device 20 having a cross-section corresponding to the cross-section of the groove portion 14. Even after performing at least fifty damage tests, the substrate 100 does not cause substantial damage to the glass substrate and does not crack. The degree of damage and cracking refers to the state where no cracks or breaks are observed in the glass substrate with the naked eye. A substrate with this characteristic can minimize impacts that may occur during transportation and handling via a transport device such as a pin and prevent cracking.

[0069] Reference Figure 4 The substrate 100 may further include a third recessed portion 15, which is formed along the circumferential portion of the edge region outside the recessed portion 14, and the substrate 100 may further include a third protective device (not shown) formed on the third recessed portion. In the example, the third recessed portion may have a shape that is recessed towards the center of one surface 11 or another surface 12 in the edge region outside the recessed portion.

[0070] When the glass substrate 10 is used as a substrate for packaging, the glass substrate 10 can shorten the wiring length between the components and the printed circuit board.

[0071] As a non-limiting example, the glass used as the glass substrate 10 may include tempered glass, borosilicate glass, alkali-free glass, etc. The glass substrate 10 may substantially exclude organic substrates.

[0072] There may be no separate adhesive or the like between the glass substrate 10 and the protective device 20.

[0073] The glass substrate 10 may have a thickness of 2000 μm or less, 100 μm to 1500 μm, or 100 μm to 1000 μm. A glass substrate with such a thickness can further improve the efficiency of electrical signal transmission and maintain appropriate mechanical properties when the protection device 20 is provided.

[0074] The glass substrate 10 may also include a plurality of vias and other vias, the plurality of vias having some routes formed in the thickness direction; the other vias having routes formed in a direction substantially perpendicular to the thickness direction.

[0075] The glass substrate 10 may include a through hole extending from the first surface 11 to the second surface 12.

[0076] The glass substrate 10 may include electrically conductive lines or electrically conductive layers disposed in at least a portion of the glass substrate 10, and the glass substrate 10 may include electrically conductive layers that electrically connect the first surface 11 and the second surface 12 through core vias, through-holes, etc.

[0077] The first surface 11 and / or the second surface 12 of the glass substrate 10 may include circuit patterns, and the opposite surface of the surface on which the components are placed may be electrically connected to the printed circuit board by means of an electrical connection device as a medium, such as a lead frame, solder balls, etc.

[0078] The glass substrate 10 may include a separately prepared cavity device, and the cavity device may be configured as an empty space inside the glass substrate.

[0079] Passive components can be disposed inside the glass substrate 10, and the passive components can be disposed and placed in cavities inside the glass substrate 10.

[0080] The substrate 100 may include an upper redistribution layer on one surface 11, and the substrate 100 may include a lower redistribution layer below another surface 12.

[0081] The substrate 100 may have a recessed portion 14 disposed throughout the edge region 13, the first surface 11, and the second surface 12, and a protective device 20, thereby enhancing the durability of the relatively weak edges during packaging processes such as transport and handling processes and further improving productivity.

[0082] Packaging substrate

[0083] In the example, the packaging substrate according to one or more embodiments may include elements and the substrate 100 described above, the elements being disposed on a surface 11 of the substrate.

[0084] The packaging substrate may also include a lead frame that protects the component from external environmental influences and facilitates heat dissipation on its first surface 11. A thermally conductive filler material may be filled between the component and the lead frame, and the bonding surfaces between the component and the lead frame may be treated by soldering.

[0085] Method for manufacturing substrates

[0086] In one or more examples, a method for manufacturing a substrate according to an example embodiment may include the following operations: preparing a glass substrate including a first surface, a second surface, and an edge region connecting the first surface and the second surface; forming a groove portion extending from a portion of the edge region toward the interior of the glass substrate; and applying a raw material composition to the groove portion for curing thereon.

[0087] The operation of forming the groove portion 14 can form a groove portion 14 that penetrates the first surface and the second surface, and the groove portion can be formed by cutting, laser processing, chemical etching after laser processing, etc.

[0088] The detailed shape of the groove portion 14 formed by the operation of forming the groove portion 14 is the same as the description of the substrate 100 above, and therefore the repeated description is omitted.

[0089] The curing process can be performed by applying the raw material composition to the groove portion to a predetermined thickness and then subjecting it to heat treatment and / or UV irradiation.

[0090] During the curing process, the raw material can have a viscosity of 10,000 cPs or less, or 1,000 cPs or more, and preferably a viscosity of 2,000 cPs to 5,000 cPs. Any viscosity range that allows for easy penetration of the internal area of ​​the package without causing contamination can be used for the raw material.

[0091] The raw materials used in the curing process may include the same materials as described above for the substrate, and therefore, repeated descriptions are omitted.

[0092] The heat treatment for curing can be carried out at a temperature of 20°C to 180°C. The heat treatment can be carried out at a temperature of 150°C to 180°C for 5 to 30 minutes, or at a temperature of 100°C to 150°C for 10 to 50 minutes.

[0093] UV irradiation for curing can be performed using an energy density of 800 mJ / mm². 2 Up to 1400 mJ / mm 2 Or an energy density of 1000 mJ / mm 2 Up to 1200 mJ / mm 2 The UV light with a wavelength range of 320 nm to 380 nm is used for photocuring. When photocuring is performed under these conditions, a protective device with good adhesive strength and performance can be formed.

[0094] The UV irradiation during the curing process can last for 10 seconds or more, or 3 minutes or less, and preferably 20 seconds to 1 minute, but the conditions are not necessarily limited to these. Additionally, further UV irradiation can be performed after heat treatment. Such UV irradiation minimizes the appearance of dust or impurities after curing. Furthermore, when the semiconductor packaging process includes materials with weak UV resistance, UV irradiation can be excluded from the process.

[0095] In the following text, although the examples will be described in more detail with reference to the appended embodiments, it should be noted that the examples are not limited to these examples.

[0096] Example - Substrate

[0097] Prepare a quadrilateral glass substrate 10 with a thickness of 500 μm. For example... Figure 6As shown, a groove portion 14 with a semi-circular cross-section having a diameter of 1.5 mm is formed by laser etching at the first edge and the opposite second edge of a glass substrate. Sylgard 184, available from DOW CHEMICAL, is used as a raw material composition comprising a polydimethylsiloxane prepolymer with a viscosity of 3500 cPs or less. This composition is uniformly applied to the groove portion at a thickness of 270 μm and subjected to heat treatment at 150°C for 10 minutes. Subsequently, a wavelength of 350 nm and an energy density of 1100 mJ / mm² are applied. 2 UV irradiation is applied to the area to be photocured for one minute, forming a protective device 20 including polydimethylsiloxane (PDMS), such as... Figure 9 As shown.

[0098] Comparative Example - Substrate without Protection Device

[0099] Prepare a glass substrate other than the protective device 20 in the example above.

[0100] Experimental Example - Impact Test for Groove Section

[0101] Damage tests were performed by applying a pressure of 1.1 bar for 1 second to the grooved portion of the glass substrate 100 prepared in the example and the glass substrate prepared in the comparative example, wherein the stainless steel pin has the same cross-section as the grooved portion and has a diameter of 1.5 mm to contact the grooved portion.

[0102] In the example where the protective device 20 is provided on the recessed portion 14, it is confirmed that even in cases such as Figure 8 The device showed no damage after fifty damage tests. In a comparative example without protective devices, cracks appeared around the groove after three damage tests. Figure 7 As shown.

[0103] Experimental Example - Testing of Adhesive Strength, Hardness, and Light Transmittance for Protective Devices Used on Substrates

[0104] According to ASTM D3359-97, the adhesive strength of the impact-resistant protective device for the glass substrate 10 prepared in this example was measured using a coating system for measuring adhesive strength, available from KTA-TATOR, as follows: Six wide lines and six long lines, spaced 2 mm apart, were etched on the first surface of the protective device to form a grid. A test strip was attached to this grid, and then the test strip was peeled off at 180° to verify the degree of peeling between the protective device and the test strip. Additionally, the pencil hardness of the impact-resistant protective device for the glass substrate was measured using a pencil hardness tester available from KIPAEE&T and a pressure-resistant high-density pencil available from MITSUBISHI.

[0105] Specifically, the protective device is fixed upwards onto the glass substrate of a pencil hardness tester. A Mitsubishi pencil is mounted at a 45° angle to the surface of the protective device. The surface of the protective device is then scratched five times under an applied force of 1 kgf. The hardness is determined by whether or not scratches are produced. In this embodiment, the total visible light transmittance of the protective device is measured using the pencil hardness value without scratches as the test value.

[0106] The measured results confirmed that the adhesive strength between the protective device and the glass substrate was 5B (without any loss), the pencil hardness of the protective device was HB, and the total transmittance of the protective device was 89%.

[0107] While this disclosure includes specific examples, it will be apparent to those skilled in the art, upon understanding the disclosure of this application, that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered descriptive only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and / or if the components in the described system, architecture, apparatus, or circuit are combined in a different manner, and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific description but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be considered to be included in this disclosure.

Claims

1. A substrate, wherein, The substrate includes: A glass substrate, the glass substrate including a first surface, a second surface and an edge region, the edge region being configured to connect the first surface and the second surface; A recessed portion, the recessed portion being disposed in at least a portion of the edge region, and the recessed portion having a through-type shape extending through the first surface and the second surface toward the interior portion of the glass substrate, and the recessed portion having the same groove in the first surface and the second surface; and The protective device is disposed in the groove portion. Wherein, the groove portion has a maximum recess length of 2.5 mm or less than 2.5 mm, and The protective device has a minimum thickness of 5 μm or greater than 5 μm, and the protective device includes a polymer layer, which is an elastic layer.

2. The substrate according to claim 1, wherein, At least one of the first surface and the second surface of the glass substrate is configured to have a quadrilateral to octagonal shape. The glass substrate includes a through hole that extends from the first surface to the second surface. The glass substrate includes at least one of an electrical conductive line and an electrical conductive layer in at least a portion of the glass substrate.

3. The substrate according to claim 1, wherein: The protection device includes a first protection device and a second protection device, which are different from each other. The first protective device is disposed in the edge region that contacts the first side of the first surface. The second protective device is disposed in the edge region that contacts the second side of the first surface, and The first side and the second side are positioned opposite each other.

4. The substrate according to claim 1, wherein, The groove portion includes a first groove portion and a second groove portion, the first groove portion and the second groove portion being different from each other, and The first groove portion and the second groove portion are configured to face each other, and the first surface is located between the first groove portion and the second groove portion.

5. The substrate according to claim 1, wherein, The total transmittance of the polymer layer is equal to or greater than 87%.

6. The substrate according to claim 5, in, The protective device and the glass substrate are configured to have an adhesive strength of 5B according to ASTM D3359.

7. The substrate according to claim 1, wherein, When the protective device is subjected to three impacts at a pressure of approximately 1.1 bar so that the protective device comes into direct contact with a pin having a cross-section corresponding to the cross-section of the groove portion, the damage to the glass substrate of the substrate is not substantial.

8. The substrate according to claim 1, wherein, When the protective device is subjected to fifty impacts at a pressure of approximately 1.1 bar, causing the protective device to come into direct contact with a pin having a cross-section corresponding to the cross-section of the groove portion, the damage to the glass substrate of the substrate is not substantial.

9. The substrate according to claim 1, wherein, The groove portion has a shape corresponding to either a circle or an ellipse, and The distance from the first point of the groove portion to the edge region is 1 mm to 15 mm.

10. The substrate according to claim 1, wherein, The protective device is configured to have a pencil hardness of HB or higher according to ASTM D3363.

11. The substrate according to claim 5, wherein, The polymer layer comprises a UV-curable resin.

12. The substrate according to claim 1, wherein, The glass substrate includes a cavity unit disposed within a portion of the glass substrate, and The thickness between the first surface and the second surface of the cavity unit is thinner than the thickness between the first surface and the second surface of the glass substrate.

13. The substrate according to claim 1, wherein, The glass substrate includes an upper redistribution layer, the upper redistribution layer being located on the first surface of the glass substrate, and A lower redistribution layer is located below the second surface of the glass substrate.

14. A semiconductor substrate, the semiconductor substrate comprising: The substrate according to claim 1, and A semiconductor element, which is mounted on the substrate.

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