Component pickup device, component mounting device

Abstract

An element pickup device (13) positions a support ring (23) having a through-hole (22) that penetrates vertically, and picks up an element (C) from an element mounting sheet (S) that is stretched on the upper surface side of the support ring (23) in a manner of covering the through-hole (22). The element pickup device (13) includes an ejector (41) that moves within the through-hole (22) of the support ring (23) and lifts the element (C) from below the element mounting sheet (S), a suction head (51) that sucks and picks up the element (C) lifted by the ejector (41), an acquisition unit (53) that acquires information or an image of the ejector (41), and a control unit (80). The control unit (80) acquires the size of the ejector (41) based on the information or the image of the ejector (41) acquired by the acquisition unit (53), and restricts the movement of the ejector (41) within the through-hole (22) based on the acquired size of the ejector (41) and the size of the through-hole (22) to avoid contact of the ejector (41) with the support ring (23).

Description

Technical Field

[0001] This invention relates to a component pickup device and a component mounting device. Background Technology

[0002] Patent Document 1 discloses an apparatus (die supply apparatus) for picking up dies diced from semiconductor wafers and supplying them to a component mounting machine. In the die supply apparatus of Patent Document 1, an information recording unit 35 is provided on the wafer tray 22, which records wafer information related to the size of the wafer and / or the range of the picking operation.

[0003] By reading the information recorded in the information recording unit 35 by the information reading unit, the movable range of the lifting cylinder 51 can be automatically set so that the lifting cylinder 51 does not interfere (contact) with the circular opening edge of the wafer tray 22. As a result, the operation does not require the operator to input the movable range, thus improving productivity.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2012-099680 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Chips (devices) obtained by wafer dicing are placed on dicing pieces (device assembly pieces) attached to a circular opening (through hole of the support ring) on ​​a wafer tray. An ejector (ejector cylinder) moves inside the through hole and lifts the device from below. The size of the ejector sometimes varies depending on the size of the device being picked up.

[0009] In the structure of Patent Document 1, although wafer information is obtained from the wafer tray, the dimensions of the ejector actually used are not obtained. Therefore, if the ejector is changed, it may come into contact with the support ring when it moves inside the through-hole. Furthermore, the device is not limited to chips obtained by wafer dicing; other small devices also face the same problem.

[0010] This invention was made to solve such a problem. This specification discloses a technique for limiting the movement of the ejector member based on the dimensions of the ejector member and the through hole to avoid contact between the ejector member and the support ring.

[0011] Technical solutions for solving the problem

[0012] The component pickup device disclosed in this specification is a component pickup device that positions a support ring having a through hole extending vertically and picks up a component assembly piece that is stretched onto the upper surface of the support ring in a manner covering the through hole. This component pickup device includes: an ejector that moves within the through hole of the support ring to eject the component from below the component assembly piece; an adsorption head that adsorbs and picks up the component ejected by the ejector; an acquisition unit that acquires information or an image of the ejector; and a control unit.

[0013] The control unit obtains the size of the ejector based on the information or image of the ejector obtained by the acquisition unit, and restricts the movement of the ejector within the through hole based on the obtained size of the ejector and the size of the through hole, so as to avoid the ejector contacting the support ring.

[0014] Invention Effects

[0015] According to the present invention, the movement of the ejector can be restricted based on the actual size of the ejector and the size of the through hole, thereby preventing the ejector from contacting the support ring. Attached Figure Description

[0016] Figure 1 This is a top view of a component mounting device that utilizes a component pickup mechanism.

[0017] Figure 2 This is an exploded perspective view showing the mechanism of the component pickup device.

[0018] Figure 3 This is a schematic diagram showing the state when picking up a chip from a component assembly in the structure of Embodiment 1.

[0019] Figure 4 It is a block diagram representing the control system of the component mounting device.

[0020] Figure 5 This is a schematic diagram showing the positional relationship between the support ring, the ejector, and the chip.

[0021] Figure 6 This is a diagram showing the information stored in the top-out component of the storage unit.

[0022] Figure 7 This is a flowchart illustrating the operation of the component mounting device.

[0023] Figure 8 It is a diagram showing the relationship between the chip, which is the object to be picked up, and the support ring.

[0024] Figure 9 This is a schematic diagram showing the state when picking up a chip from a component assembly sheet in the structure of Embodiment 2.

[0025] Figure 10 This is a diagram representing the information recorded on an RFID tag.

[0026] Figure 11 This is a top view of the ejector with an identifier on its upper surface.

[0027] Figure 12 It is a diagram showing the identifier and the type of ejector corresponding to the identifier, as well as the outer diameter R2.

[0028] Figure 13 It is a top view showing the entire protruding part entering the camera's field of view.

[0029] Figure 14 This is a top view showing the situation where the ejected part is not entirely within the camera's field of view. Detailed Implementation

[0030] <Implementation Method 1>

[0031] <Overview of Component Mounting Device>

[0032] Below, based on Figures 1 to 8 Embodiment 1 of the present invention will be described in detail. The component pick-up device 13 according to the present invention can be applied to various devices such as die bonders, tape and reel devices for housing diced chips in tape, or component mounting devices for mounting components on a substrate. Embodiment 1 is an example of applying the component pick-up device 13 to a component mounting device 10.

[0033] Figure 1 This is a top view showing the overall structure of the component mounting device 10. Figure 2 This is an exploded perspective view showing the mechanism of the component pick-up device 13 in the component mounting apparatus 10. The component mounting apparatus 10 is a device that picks up a chip (an example of a "component") C from a diced wafer W and mounts it onto a mounting object M. In this specification, chip C is given as an example of a component, but a component can also be a component other than a chip, such as a passive component like a ceramic capacitor, a molded lead frame, etc.

[0034] The component mounting device 10 includes a base 11, a conveyor 12, a tray storage section 70, and a component picking device 13.

[0035] Conveyor 12 moves the object M to a designated installation position and removes it from the installation position after installation. Conveyor 12 includes: a conveyor body extending in the X direction for conveying the object M; and a positioning mechanism (not shown) that lifts and positions the object M on the conveyor body. Conveyor 12 moves the object M from... Figure 1The right side of the container is conveyed to the left in a roughly horizontal position and positioned and fixed in the designated installation location.

[0036] The tray storage section 70 is a device for accommodating multiple trays 20, and is configured in... Figure 1 The component mounting device 10 is located near the center of its front side. The tray storage unit 70 includes: a multi-layered shelf (not shown) for housing the tray 20; and a drive unit (not shown) for lifting and lowering the shelf. The tray storage unit 70 positions the desired tray 20 at a height that allows it to move in and out of the tray holding table 30 by lifting and lowering the shelf. Then, the tray 20, positioned at the height that allows it to move in and out of the tray holding table 30, is placed on the tray holding table 30.

[0037] <Tray Instructions>

[0038] Reference Figure 2 and Figure 3 The basic structure of the pallet 20 will be described. The pallet 20 has a rectangular plate-shaped pallet body 26, a support ring 23, and an expansion ring 24. A through hole is provided in the pallet body 26, extending vertically. An example of a circular through hole in the pallet body 26 will be described. However, the shape of the through hole in the pallet body 26 is arbitrary and can be appropriately set.

[0039] The support ring 23 is an annular member with a through hole 22 in the center. In this disclosure, an example of a circular support ring 23 is described. However, the shape of the support ring 23 is not limited to a circular shape; for example, it can also be an annular member with a circular outer surface and a rectangular through hole 22. Furthermore, the support ring 23 can be an annular member with a through hole 22 in a plate-like member, or it can be an annular member with a through hole 22 in a cylinder having a predetermined thickness. In addition, the size and shape of the through hole 22 are appropriately set according to the through hole of the tray body 26. The size and shape of the through hole 22 are approximately the same as the through hole of the tray body 26.

[0040] The support ring 23 is assembled relative to the tray body 26 in a manner that allows it to move vertically with the through hole 22 overlapping with the through hole of the tray body 26. The component pickup device 13 has a mechanism for moving the support ring 23 relative to the tray body 26 in the vertical direction. The inner side (interior) of the through hole 22 is the moving area for the ejector 41, as described later.

[0041] Four locking portions 21 are provided on the upper surface of the tray body 26. The four locking portions 21 are arranged at equal intervals around the support ring 23. The locking portions 21 are reversible relative to the upper surface of the tray body 26, locking the end edge of the expansion ring 24 from above, thus fixing the expansion ring 24 to the vicinity of the upper surface of the tray body 26. A component assembly piece S (hereinafter referred to as "piece S") is mounted on the expansion ring 24.

[0042] like Figure 3 As shown, when the expansion ring 24 is engaged with the tray body 26, the sheet S is stretched to cover the opening on the upper surface of the support ring 23. When the support ring 23 is raised relative to the tray body 26, the sheet S is pulled diagonally downward from the opening edge on the upper surface of the support ring 23. At this time, since the expansion ring 24 is engaged with the tray body 26, the sheet S is stretched as a whole as it moves upward through the support ring 23.

[0043] Sheet S is, for example, a flexible sheet made of a light-transmitting resin. On the upper surface of sheet S, in view from above, a portion located inside the support ring 23, is a wafer W divided into multiple chips C. When sheet S is stretched, the spacing between the chips C increases (expansion process).

[0044] The tray 20 is stored in the tray storage section 70 with the chips C attached to the wafer S spaced further apart. Furthermore, the trays 20 stored in the tray storage section 70 sometimes include various types of trays 20 with different through-hole sizes (inner diameter R1 of the support ring 23) depending on the size of the wafer W, etc. To identify these various types of trays 20, identifiers 25 corresponding to the different types of trays 20 are provided on the surface of the tray body 26.

[0045] Reference Figure 1 The elements constituting the component mounting device 10 will be described again. Although repeated, the component mounting device 10 includes a component pickup device 13. The component pickup device 13 includes a tray holding platform 30 for holding the tray 20 and a lifting portion 40 (see reference). Figure 2 ), adsorption section 50 and control section 80.

[0046] The pallet holding platform 30 holds the pallet 20, which is pulled out from the pallet storage section 70, in a central position. Thus, the support ring 23 constituting the pallet 20 is positioned relative to the pallet holding platform 30. An opening is provided in the pallet holding platform 30, overlapping the through hole 22 of the held support ring 23 when viewed from above. The pallet 20, housed in the pallet storage section 70, is mounted on the pallet holding platform 30 by a pallet mounting mechanism (not shown).

[0047] The tray mounting mechanism is an element of the component mounting device 10, which pulls the tray 20 out of the tray storage section 70 and mounts it on the tray holding platform 30. Additionally, the component mounting device 10 may also include a return mechanism (not shown) that returns the tray 20 held by the tray holding platform 30 back to the tray storage section 70. These mounting and return mechanisms can be configured independently or integrally.

[0048] The pallet holding table 30 is movable along the Y direction on the base 11 between the component removal operation position and the pallet receiving position via the table drive motor 33. Specifically, the pallet holding table 30 is movably supported on a pair of fixed rails 31 extending along the Y direction on the base 11, and moves along the fixed rails 31 via a predetermined drive unit.

[0049] The drive unit for moving the tray holding table 30 includes: a ball screw shaft 32 extending parallel to the fixed track 31 and screwed into the nut portion of the tray holding table 30; and a table drive motor 33 for rotating and driving the ball screw shaft 32.

[0050] The pallet holding table 30 can pass under the conveyor 12. Such a pallet holding table 30 is located at a designated component removal position. Figure 1 The pallet holding platform 30 can move freely between its position and the pallet receiving position near the pallet storage section 70. The pallet holding platform 30 can move in the Y direction along the fixed track 31.

[0051] <Explanation of the top section>

[0052] The lifting part 40, at the component removal position, lifts the chip C selected from the multiple chips C attached to the substrate S, along with the substrate S, from bottom to top. The lifted chip C is detached from the substrate S as it is raised. For example... Figure 2 As shown, the lifting part 40 includes an ejector 41, a Z-axis moving part 42, an X-axis moving part 43, a fixed track 44, and a lifting part drive motor 45 (see reference). Figure 4 ).

[0053] like Figure 3As shown, the ejector 41 is cylindrical with an outer diameter R2 oriented vertically, and its lower surface is connected to the Z-axis moving part 42. The outer diameter R2 is an example of the "size of the ejector." The ejector 41 contains a plurality of pins 41a that can protrude upwards. The ejector 41 uses these pins 41a to lift the chip C of the chip S. Specifically, the ejector 41 causes the pin 41a that overlaps with the chip C to be picked up when viewed from above to protrude, while keeping the other pins 41a contained within the ejector 41, thereby lifting only the chip C to be picked up among the plurality of chips C upwards. The ejector 41 can arbitrarily change the protruding pins 41a according to the size of the chip C to be picked up.

[0054] The ejector 41 can be mounted and detached relative to the Z-axis moving part 42. The ejector 41 comes in several different sizes, and an appropriate size is used depending on the size of the chip C to be picked up. For example, when the chip C to be picked up is small, an ejector 41 with a small outer diameter R2 is mounted on the Z-axis moving part 42. On the other hand, when the chip C to be picked up is large, an ejector 41 with a large outer diameter R2 is mounted on the Z-axis moving part 42.

[0055] The Z-axis moving part 42 is disposed between the X-axis moving part 43 and the ejector 41, and its lower end is fixed to the X-axis moving part 43. The Z-axis moving part 42 can move in the Z direction (vertical direction), causing the ejector 41 mounted on its upper end to move in the Z direction. When the ejector 41 is raised, it can approach the sheet S stretched on the upper surface of the support ring 23 from below. In addition, when the tray holding table 30 moves between the component removal operation position and the tray receiving position, by lowering the ejector 41 in advance, the ejector 41 can be retracted so that the support ring 23 does not contact the ejector 41.

[0056] Fixed track 44 is a track extending in the X direction and fixed to base 11. For example... Figure 2 As shown, the fixed track 44 supports the X-axis moving part 43 in a manner that allows it to move in the X direction.

[0057] An ejector 41 is mounted on the X-axis moving part 43. Therefore, the ejector 41 can move in the X direction via the X-axis moving part 43. Here, the tray holding table 30 can move in the Y direction along the fixed track 31. Therefore, the ejector 41 can move freely in the XY direction (horizontal direction) relative to the tray 20 held on the tray holding table 30. Thus, the ejector 41 can move directly below any chip C and lift the chip C. The movement of the ejector 41 and the protrusion of the pin 41a are controlled by the control unit 80, which drives the motor 33 and the lifting part drive motor 45.

[0058] <Explanation of the Adsorption Section>

[0059] like Figure 1 As shown, the adsorption unit 50 has a head unit 50A and a head unit drive mechanism 50B.

[0060] The head unit 50A is a device that picks up the chip C attached to the chip S and mounts it onto the mounting surface M1. The head unit 50A is driven by the head unit drive mechanism 50B disposed on the base 11 and moves along the XY direction (horizontal direction) within the movable area on the base 11.

[0061] Specifically, the head unit drive mechanism 50B includes a pair of fixed rails 57, a unit support member 55, a pair of Y-axis ball screws 58, and a pair of Y-axis motors 59.

[0062] A pair of fixed rails 57 are fixed to the base 11, spaced apart at predetermined intervals in the X direction, and extend parallel to the Y direction. The unit support member 55 is elongated in the X direction, supporting the head unit 50A in a manner that allows it to slide in the X direction.

[0063] The unit support member 55 is movably supported on a pair of fixed rails 57 and is able to slide in the Y direction.

[0064] The Y-axis ball screw 58 is a relatively long shaft in the Y direction and is arranged side by side with the fixed track 57. A Y-axis motor 59 is connected to the Y-axis ball screw 58 via a coupling. The Y-axis ball screw 58 rotates under the driving force of the Y-axis motor 59.

[0065] The Y-axis ball screw 58 constitutes a ball screw mechanism that converts the rotational force of the Y-axis motor 59 into a thrust force in the Y direction. The Y-axis ball screw 58 applies a thrust force in the Y direction to the unit support member 55 and the head unit 50A. As a result, the unit support member 55 and the head unit 50A move in the Y direction (Y-axis servo mechanism).

[0066] Additionally, the head unit drive mechanism 50B includes an X-axis ball screw and an X-axis motor 56 that rotates the X-axis ball screw. The X-axis ball screw is built into the unit support member 55.

[0067] The X-axis ball screw constitutes a ball screw mechanism that converts the rotational force of the X-axis motor 56 into a thrust force in the X direction. The head unit 50A moves in the X direction by receiving a thrust force in the X direction from the X-axis ball screw (X-axis servo mechanism).

[0068] As described above, the head unit 50A moves in the Y direction by being driven by the Y-axis servo mechanism and moves in the X direction by being driven by the X-axis servo mechanism.

[0069] like Figure 2As shown, the head unit 50A includes a head unit body 61, an adsorption head 51, a Z-axis motor 52, and a camera 53. The adsorption head 51 is connected to the motor shaft of the Z-axis motor 52. The Z-axis motor 52 is fixed to the head unit body 61. Driven by the Z-axis motor 52, the adsorption head 51 can move vertically relative to the head unit body 61.

[0070] The adsorption head 51 has a shape that is longer in the vertical direction, and an air supply path is provided in the center along the vertical direction. By supplying negative pressure to the air supply path via a vacuum pump (not shown), negative pressure is applied to the front end (lower end) of the adsorption head 51.

[0071] By applying negative pressure, an attractive force is generated at the lower end of the adsorption head 51. This holds the chip C in place. Alternatively, the applied pressure can be switched to positive pressure. By applying positive pressure, the adsorption head 51 releases the chip C from its grip.

[0072] <Camera Instructions>

[0073] Camera 53 and Z-axis motor 52 are fixed side-by-side to the head unit body 61. Camera 53 has its imaging surface facing downwards, enabling it to capture images of chip C attached to the upper surface of the substrate S. The captured images are sent to control unit 80, where they are processed by image processing unit 84, allowing control unit 80 to identify the presence of chip C as the target for pickup. Furthermore, control unit 80 can detect the position of chip C within support ring 23 based on the position of camera 53 when photographing chip C and the position of tray 20 at that time.

[0074] Furthermore, camera 53 takes pictures of the ejector 41 and tray 20. For example... Figure 2 As shown, the ejector 41 is located below the camera 53. The camera 53 captures an image of the ejector 41 as the tray 20 moves together with the tray holder 30 to the tray receiving position.

[0075] Additionally, after receiving the tray 20 at the tray receiving position, the tray holding platform 30 carries the tray 20 and moves it to the component removal position. At this time, since the tray 20 is located below the camera 53, the camera 53 takes a picture of the tray 20.

[0076] As will be described later, the purpose of photographing the ejector 41 and the tray 20 is to perform image recognition on the ejector 41 and the tray 20 to determine their types.

[0077] <Control Department Description>

[0078] Figure 4 This is a block diagram showing the control system of the component mounting device 10. The control unit 80 is a controller that uniformly controls the component mounting device 10.

[0079] The control unit 80 is electrically connected to a drive motor 33, a lifting drive motor 45, an X-axis motor 56, a Y-axis motor 59, a camera 53, an input unit 81, and an output unit (an example of a "display unit") 82. The operator of the component mounting device 10 inputs various information and commands to the control unit 80 via the input unit 81.

[0080] Furthermore, position detection units such as encoders (not shown) built into each drive motor input output signals to the control unit 80. In addition, when an abnormality occurs, such as the component mounting device 10 stopping due to the proximity or contact between the ejector 41 and the support ring 23, the control unit 80 displays information such as the occurrence and type of the abnormality on the output unit 82 and informs the operator of the status of the component mounting device 10.

[0081] The control unit 80 includes an axis control unit 83, an image processing unit 84, a storage unit 85, and an arithmetic unit 86. The axis control unit 83 is a driver that drives each drive motor, and operates each drive motor according to instructions from the arithmetic unit 86. The image processing unit 84 performs image processing on image data input from the camera 53.

[0082] The storage unit 85 stores various programs and data, such as installation programs. In addition, the storage unit 85 stores the inner diameter R1 of the support ring 23, which varies according to each type of tray 20, and the registration image of the ejector 41, which varies according to each type of ejector 41, and the outer diameter R2 corresponding to the registration image.

[0083] The control unit 80 controls each drive motor, etc., based on a predetermined program, to operate the conveyor 12, the tray holding platform 30, the lifting part 40, and the suction part 50. This adjusts the suction position of the suction part 50 on the chip C. Furthermore, the control unit 80 controls a series of actions, including the movement of the tray 20 relative to the tray storage part 70, the picking up of the chip C from the chip S, and the installation of the chip C using the suction head 51.

[0084] <Avoid contact between the ejector component and the pallet>

[0085] Figure 5 This is a top view showing the positional relationship between the support ring 23 and the ejector 41. "R1" is the inner diameter of the support ring 23, and "R2" is the outer diameter of the ejector 41. "A1" is the center of the support ring 23 and the through hole 22, and "A2" is the center of the ejector 41. Additionally, "A3" is the center of the chip C, which is the object being picked up. Figure 5 In this configuration, the ejector 41 is located directly below the chip C, and the center A2 of the ejector 41 overlaps with the center A3 of the chip C. The ejector 41 moves inside the support ring 23. Therefore, the center A2 is displaced relative to the support ring 23 due to the movement of the ejector 41.

[0086] Here, if the distance D is defined as the distance from the center A1 of the support ring 23 to the center A2 of the ejector 41, the ejector 41 will contact the inner wall 23a of the support ring 23 when D > (R1-R2) / 2. On the other hand, when D < (R1-R2) / 2, it is possible to avoid the ejector 41 contacting the inner wall 23a of the support ring 23.

[0087] (R1-R2) / 2 is the value obtained by converting the difference (R1-R2) between the inner diameter R1 of the support ring 23 and the outer diameter R2 of the ejector 41 into a radius. This (R1-R2) becomes the judgment value (threshold) used when determining whether the ejector 41 is in contact with the support ring 23.

[0088] In this embodiment, the control unit 80 sets the movement of the ejector 41, with the center A1 of the support ring 23 as the reference point, within the range that D < (R1-R2) / 2. This prevents the ejector 41 from contacting the support ring 23.

[0089] There are several types of ejector 41 with different sizes. In this embodiment, the type of ejector 41 is determined, and the outer diameter R2 of the ejector 41 is obtained for each type.

[0090] Furthermore, the control unit 80 restricts the movement of the ejector 41 based on the obtained outer diameter R2, provided that D < (R1 - R2) / 2. Alternatively, the control unit 80 can set the movable range of the ejector 41 to satisfy D < (R1 - R2) / 2. Therefore, regardless of the type of ejector 41 used, contact between the ejector 41 and the support ring 23 can be avoided.

[0091] <Example of obtaining outer diameter R2>

[0092] The storage unit 85 of the control unit 80 pre-stores information corresponding to the ejector 41. Figure 6 This shows an example of the stored information.

[0093] In this embodiment, for the three ejector components (TYPE_001, 002, 003), the information of "registered image", "ejector type" and "outer diameter R2" is stored in the storage unit 85.

[0094] The arithmetic unit 86 acquires image data GD2 of the ejector 41 captured by the camera 53. Then, the arithmetic unit 86 compares the registered image stored in the storage unit 85 with the image data GD2. Afterward, the arithmetic unit 86 determines the ejector 41 corresponding to the registered image that matches the image data GD2, and reads the type and outer diameter R2 of the ejector 41 from the storage unit 85. Thus, the arithmetic unit 86 is able to obtain the "type" and "outer diameter R2" of the ejector 41 used in production.

[0095] In this embodiment, the arithmetic unit 86 determines the type of support ring 23 and obtains its inner diameter R1. Then, based on the obtained inner diameter R1, the movement of the ejector 41 is restricted. Thus, regardless of the type of support ring 23 used, contact between the ejector 41 and the support ring 23 can be avoided. The inner diameter R1 of the support ring 23 can be obtained by the camera 53 photographing the identifier 25 attached to the upper surface of the tray body 26 to determine the type of the tray 20.

[0096] Furthermore, the description in the ejector 41 can also be used as a reference for determining the type of tray 20 and the method for obtaining the inner diameter R1 of the support ring 23.

[0097] <Description of Action Flow>

[0098] Next, refer to Figure 7 The flowchart illustrates the operation of the component mounting device 10 picking up the chip C from the chip S. It is assumed that at the initial time point, the tray holding stage 30 holding the tray 20 is in the tray receiving position.

[0099] The input unit 81 gives a production start instruction to the control unit 80 based on a signal input from an external source. When the production start instruction is given to the control unit 80, the control unit 80 determines whether the outer diameter R2 of the ejector 41 mounted on the component mounting device 10 has been obtained (S10). If the outer diameter R2 has been obtained (S10: Yes), S20 and S30 are omitted, and the process proceeds to S40 (details will be described later). If the outer diameter R2 has not been obtained, the camera 53 takes a picture of the upper surface of the ejector 41 and sends the image data GD2 to the control unit 80. The control unit 80 obtains the image data GD2 sent from the camera 53 (S20).

[0100] The control unit 80 compares the image data GD2 with the multiple registered images stored in the storage unit 85 (see reference). Figure 6 The control unit 80 compares the data with the registered image that matches the image data GD2 and determines the type of ejector 41. Then, the control unit 80 reads from the storage unit 85 and obtains the outer diameter R2 corresponding to the determined type of ejector 41 (S30).

[0101] Next, the control unit 80 moves the tray holding platform 30, which holds the tray 20, to the component removal operation position (S40). At this time, the tray 20 is located below the camera 53. The camera 53 captures an image of the identifier 25 formed on the surface of the tray body 26 and sends the image data GD1 to the control unit 80. The control unit 80 reads the identifier 25 mapped into the image data GD1, reads it from the storage unit 85, and retrieves the inner diameter R1 corresponding to the identifier 25 (S50).

[0102] The following is for reference Figure 8 This explains the processing after S60 (the pickup processing of chip C). Additionally, Figure 8 This is a top view used to illustrate the relationship between the wafer S with the wafer W attached to its surface and the support ring 23. Figure 8 The hollow straight lines shown are dicing lines. These dicing lines form a grid, dividing the wafer W into multiple chips C (rectangles). In the following example, we will explain the sequential chip C picking process starting from rectangular region 1, focusing on rectangular regions 1-5 near the support ring 23 in the rectangular region of wafer S. In rectangular regions 1-5, chips C are present in regions 1, 2, and 5, but not in regions 3 and 4.

[0103] The control unit 80 moves the head unit 50A above the chip S and uses the camera 53 to take a picture of the rectangular area 1. Then, the control unit 80 determines whether the chip C can be identified in the rectangular area 1 based on the image from the camera 53 (S60).

[0104] If chip C is detected (S60: Yes), the control unit 80 calculates the position of the center A3 of chip C in rectangular region 1, and calculates the distance D based on the position of center A3 (S70). Distance D is assumed to be the distance from the center A1 of support ring 23 to the center A2 of ejector 41 when ejector 41 moves below rectangular region 1 to lift chip C (see reference). Figure 5 ).

[0105] Next, the control unit 80 determines whether the distance D is less than (R1-R2) / 2 (S80). The "R1" and "R2" mentioned above use the data obtained in S30 and S50.

[0106] When the distance D is less than (R1-R2) / 2, the control unit 80 determines that even if the ejector 41 is moved below the rectangular area 1, it will not contact the support ring 23.

[0107] If the control unit 80 determines that the ejector 41 will not contact the support ring 23 (S80: No), it moves the ejector 41 below the rectangular region 1. Specifically, the control unit 80 moves the ejector 41 below the rectangular region 1 such that, in top view, the center A2 of the ejector 41 overlaps with the center A3 of the chip C (see reference). Figure 5 ).

[0108] After the ejector 41 moves below the rectangular area 1, it causes the pin 41a to protrude, lifting the chip C from below the rectangular area 1. Then, the chip C is picked up from the chip S by adsorbing the lifted chip C with the adsorption head 51 (S90).

[0109] Then, the adsorption head 51 installs the picked-up chip C at the specified position on the mounting surface M1.

[0110] After chip C is installed, the control unit 80 refers to the installation program to determine whether there are other chips C that should be picked up on chip S.

[0111] If a chip C to be picked up is present (S100: Yes), the control unit 80 counts up to the rectangular area 2 which is the next adsorption position (S110).

[0112] Then, the control unit 80 moves the head unit 50A and uses the camera 53 to take a picture of the rectangular area 2. Based on the image from the camera 53, the control unit 80 determines whether the chip C can be identified in the rectangular area 2 (S60).

[0113] In this example, since chip C is present in rectangular region 2, control unit 80 determines that chip C can be identified (S60: Yes). Control unit 80 calculates distance D based on the position of the center A3 of chip C in rectangular region 2 (S70). Then, it determines whether distance D is less than (R1-R2) / 2 (S80). Hereinafter, the cases of D < (R1-R2) / 2 and D > (R1-R2) / 2 will be explained.

[0114] [Case where D < (R1 - R2) / 2]

[0115] When the distance D is less than (R1-R2) / 2, the control unit 80 moves the ejector 41 to the bottom of the rectangular area 2 and uses the ejector 41 to lift the chip C of the rectangular area 2 from below.

[0116] Then, the adsorption head 51 picks up the chip C that has been lifted and installs it at a predetermined position on the mounting surface M1. After installation, the control unit 80 counts up to the rectangular area 3 (S90 to S110) that will be the next adsorption position.

[0117] Then, the process moves to S60, where the control unit 80 determines whether the chip C can be identified in the rectangular area 3 based on the image from the camera 53 (S60).

[0118] In this example, such as Figure 8 As shown, chip C is not present in rectangular region 3 and cannot be identified, therefore it is determined as no in S60. The control unit 80 does not perform the transfer process to S70 for rectangular region 3, but instead moves to S110 to count up to rectangular region 4, which is the next adsorption position.

[0119] Thus, the processing of S70 to S100 is only performed on the rectangular area where the chip C can be identified based on the image of the camera 53. If there is no chip C to be picked up (S100: No), the process ends.

[0120] [Case where D > (R1 - R2) / 2]

[0121] When the distance D is greater than (R1-R2) / 2, the control unit 80 determines that when the ejector 41 is moved below the rectangular area 2, the ejector 41 will contact the support ring 23 (S80: Yes).

[0122] In this case, the control unit 80 does not perform the processing of S90 to S100, but moves to S110 and counts up to the rectangular region 3, which is the next adsorption position.

[0123] That is, even if chip C is present in rectangular area 2, if it is determined that if the ejector 41 moves to the bottom of rectangular area 2, it will come into contact with support ring 23, the control unit 80 will not move the ejector 41 to the bottom of rectangular area 2 (and of course, will not pick up chip C), but will count up to the next adsorption position (rectangular area 3).

[0124] In this way, the control unit 80 moves the ejector 41 below the rectangular area where the chip C is located only when it determines that the ejector 41 will not contact the support ring 23, thus avoiding contact and suppressing the breakage of the ejector 41.

[0125] Furthermore, if it is determined that the ejector 41 will contact the support ring 23, the control unit 80 can also stop the movement of the ejector 41 towards the rectangular area where the chip C is located, thus stopping the ejector 41. Additionally, the control unit 80 can also display on the output unit 82 whether the ejector 41 is stopped and whether chip C can be picked up, thus informing the operator. Moreover, if D = (R1-R2) / 2, it can also be determined that the ejector 41 will contact the support ring 23. This situation can be explained by referring to the case where D > (R1-R2) / 2.

[0126] <Effect Description>

[0127] In this structure, since the movement of the ejector 41 is restricted based on the inner diameter R1 of the support ring 23 and the outer diameter R2 of the ejector 41, contact between the ejector 41 and the support ring 23 can be avoided. Furthermore, the ejector 41 can be used to lift the chip C as long as it remains within a range where it will not contact the support ring 23. Therefore, it is possible to suppress the unnecessarily reduced number of chips picked up from the chip S.

[0128] Furthermore, when the ejector 41 is replaced, the control unit 80 moves the camera 53 above the replaced ejector 41 and takes an image of the ejector 41 using the camera 53. This allows the type of the replaced ejector 41 to be determined based on the image data GD2 captured by the camera 53. Therefore, the data for the outer diameter R2 of the ejector 41 can be updated to the replaced data (S20, S30). Thus, even if the value of the outer diameter R2 changes before and after the replacement of the ejector 41, the data for the replaced outer diameter R2 can be used to limit the movement of the ejector 41 to prevent the ejector 41 from contacting the support ring 23.

[0129] In this structure, the storage unit 85 of the control unit 80 pre-stores registered images and outer diameters R2 corresponding one-to-one with the types of ejector components 41. Then, the control unit 80 determines the type of ejector component 41 by comparing the image data GD2 with the registered images and obtains the outer diameter R2 corresponding to the type of ejector component 41. Thus, even if the outer diameter R2 is not directly measured during the execution of the process, it can be obtained, thereby improving the cycle time of the component pick-up device 13.

[0130] Furthermore, in this structure, the component pickup device 13 includes a camera 53. The camera 53 is used not only to identify the types of the tray 20 and the ejector 41, but also to confirm the position of the chip C, which is the object to be picked up (S60, S70). By using one camera 53 for multiple purposes, it is possible to suppress the increase in cost.

[0131] <Implementation Method 2>

[0132] Reference Figure 9 , Figure 10 The structure of the component pickup device 113 in Embodiment 2 will be described. The structure of Embodiment 2 differs from Embodiment 1 in the following aspects: the ejector 141 has an RFID tag (an example of an "information recording unit") 47, and the head unit 150A has an RFID reader (an example of an "information reading unit") 60. Furthermore, reference numerals are used for parts common to Embodiment 1, and detailed descriptions are omitted.

[0133] RFID tag 47 is a small piece molded from resin using an IC chip that records the inherent identification information of the ejector component 141. For example... Figure 9 As shown, the RFID tag 47 is mounted on the side of the ejector 141. The RFID reader 60 emits RF band radio waves toward the RFID tag 47 and receives the radio waves emitted by the RFID tag 47 in response. At this time, the RFID reader 60 can read the identification information recorded in the RFID tag 47 in a non-contact manner.

[0134] The identification information of the ejector 141 recorded in the RFID tag 47 is the ejector type and outer diameter R2. An example of the correspondence between the A-signals (A-C-signals) sent by the RFID tag 47 installed on the ejector 141 and the ejector type and outer diameter is shown below. Figure 10 For example, when the RFID reader 60 receives the C signal, the RFID reader 60 reads the ejector type "TYPE_003" and the outer diameter R2 value "25mm" as identification information. The RFID reader 60 sends the read identification information to the control unit 80, and the control unit 80 obtains the ejector type (TYPE_003) and outer diameter R2 (25mm).

[0135] In this structure, the RFID reader 60 can read the identification information of the ejector 141 in a non-contact manner. Furthermore, even if the ejector 141 or the RFID tag 47 is present in a location where it cannot be photographed by the camera 53, the control unit 80 can still obtain the identification information of the ejector 141. For example, as... Figure 9 As shown, when there is a chip S or a chip C between the ejector 141 and the RFID reader 60, the camera 53 cannot take a picture of the ejector 141. However, if the RFID reader 60 is used, the identification information of the ejector 141 can be obtained from the RFID tag 47 and sent to the control unit 80.

[0136] <Other Implementation Methods>

[0137] (1) In Embodiment 1 described above, the type of ejector 41 is determined by comparing the image data GD2 of the ejector 41 with the registered image. However, the method for determining the type of ejector 41 based on the image data GD2 is not limited to this. For example, such as Figure 11 As shown, the ejector 41 may also have an identifier 46 in a position that does not overlap with the pin 41a. Additionally, Figure 12 It is the correspondence between the type of ejector 41 stored in the storage section 85 and its outer diameter R2 and the identifier 46.

[0138] Identifier 46 records the type of top-out component 41. Figure 11 In the example, a QR code is used as identifier 46, but identifier 46 can be any identifier that can be read by the camera 53, such as a barcode or a specified symbol. The arithmetic unit 86 determines the type of ejector 41 based on identifier 46 written into the image data GD2, and obtains the outer diameter R2 corresponding to the type of ejector 41 from the storage unit 85.

[0139] In this case, such as Figure 12As shown, the information pre-stored in the storage unit 85 is the type of the ejector 41 and the value of its outer diameter R2 (both are character information), and a registration image (image information) of the ejector 41 as in Embodiment 1 is not required. Character information generally has less information content compared to image information. Therefore, even if the storage capacity of the storage unit 85 is small, the information of the ejector 41 can be stored as character information.

[0140] (2) In addition to or in lieu of the type of ejector 41, the information recorded in the identifier 46 may also be the outer diameter R2. The arithmetic unit 86 obtains the outer diameter R2 by reading the identifier 46. In this case, the storage unit 85 may not store the type of ejector 41 or the value of the outer diameter R2.

[0141] (3) The outer diameter R2 can also be calculated directly from the image data GD2. Figure 13 The diagram schematically shows the case where the entire upper surface of the ejector 41 is contained within the field of view 53a of the camera 53. In this case, the outer diameter R2 can be calculated by identifying the outer edge 41b of the ejector 41 in the image data GD2 captured inside the field of view 53a by the image processing unit 84.

[0142] In addition, such as Figure 14 As shown, in an ejector 41 with a large outer diameter R2, sometimes the upper surface of the ejector 41 cannot completely enter the inner side of the field of view 53a. In this case, based on the image data GD2 of the 0° position and the 180° position on the outer edge 41b of the circle, points B1 and B2 on the outer edge 41b are identified, and the distance between the two points is calculated, thereby enabling the calculation of the outer diameter R2.

[0143] When the outer diameter R2 is calculated directly based on the image data GD2, the outer diameter R2 of the ejector 41 can be obtained without comparing the image data GD2 with the registered image or reading the identifier 46. Therefore, even if there is no registered image in the storage unit 85 that corresponds one-to-one with the ejector 41, or if reading the identifier 46 fails, the outer diameter R2 can still be obtained based on the image data GD2.

[0144] (4) The component mounting device 10 may also have a mounting head in addition to the adsorption head 51 for mounting the chip C on the mounting surface M1. In this case, after the adsorption head 51 picks up the chip C from the tray 20, it hands the chip C over to the mounting head.

[0145] (5) In Embodiment 1 described above, the arithmetic unit 86 obtains the inner diameter R1 based on the identifier 25 of the tray 20 captured by the camera 53. However, it is not limited to this; the inner diameter R1 can also be obtained by other methods. For example, the tray 20 may have an RFID tag, and the arithmetic unit 86 obtains the inner diameter R1 by reading the RFID tag using an RFID reader.

[0146] (6) In Embodiment 1 described above, the image data GD1 of the identifier 25 and the image data GD2 of the ejector 41 are acquired by the camera 53. However, the camera that captures the identifier 25 and the camera that captures the ejector 41 may be different cameras.

[0147] (7) In the above embodiment 2, the case where the RFID tag 47 is installed on the side of the ejector 41 is illustrated, but it can also be installed on the upper or lower surface of the ejector 41. Alternatively, it can be embedded inside the ejector 41.

[0148] (8) In Embodiment 2 described above, the identification information recorded in the RFID tag 47 may only be the "ejector type" of the ejector 141. In this case, the storage unit 85 stores... Figure 10 The calculation unit 86 reads the outer diameter R2 value corresponding to the type of ejector 141 from the storage unit 85, which is shown as "ejector type" and "outer diameter R2".

[0149] (9) In embodiments 1 and 2 described above, the control unit 80 performs image recognition on the image data GD1 of the identifier 25 to identify the type of tray 20. If there is only one type of tray 20, the image recognition process on the image data GD1 can be omitted. In this case, it is advisable to pre-store the inner diameter R1 of the support ring 23 relative to the storage unit 85 and use this data to limit the movement range of the ejector 41.

[0150] Furthermore, when multiple types of trays 20 are used, as described in embodiments 1 and 2, it is advisable to acquire identification information or images of the trays 20 using an acquisition unit such as a camera 53, and to determine the type based on the acquired identification information or images, thereby obtaining the inner diameter R1 of the support ring 23. Moreover, it is advisable to use the obtained inner diameter R1 to limit the movement range of the ejector 41.

[0151] (10) In the above embodiments 1 and 2, the method of holding the tray 20 on which the chip S is stretched and picking up the chip C from the chip S by the component picking devices 13 and 113 has been described. The tray 20 has a structure in which a support ring 23 is assembled relative to the tray body 26.

[0152] The component pickup device in this disclosure is not limited to the method of holding the tray 20. For example, the component pickup device may also be configured to directly hold the support ring 23 on which the chip S is attached and pick up the chip C from the chip S. In other words, the tray 20 (tray body 26) may be discarded and the support ring 23 may be directly assembled to the component pickup device. The component pickup device of this type has a mechanism for directly holding the support ring 23. For the mechanism for directly holding the support ring 23, known mechanisms can be referenced.

[0153] Furthermore, in the pallet 20 described above, an example of a structure in which a support ring 23 is assembled relative to the pallet body 26 has been explained. However, the support ring 23 may also be assembled to the pallet body 26 via a connecting member. In this case, the pallet 20 has a structure in which the pallet body 26, the connecting member, and the support ring 23 are connected sequentially from bottom to top.

[0154] The connecting member may also be provided with a locking part 21. Furthermore, similar to the description of the tray in Embodiment 1, multiple locking parts 21 are provided to surround the support ring 23, and the expansion ring 24 is fixed to these multiple locking parts 21. Thus, the expansion ring 24 is fixed to the vicinity of the upper surface of the tray body 26 via the connecting member (locking part 21). Furthermore, the chips C attached to the sheet S are spaced further apart via the connecting member (locking part 21).

[0155] Furthermore, the support ring 23 described above is one of the constituent elements of the tray 20. However, the support ring 23 can also be a constituent element of the component pickup device. In this case, the component pickup device may, for example, have: a conveying mechanism for conveying the expansion ring 24 toward the support ring 23; a holding mechanism for holding the expansion ring 24 conveyed by the conveying mechanism; and a stretching mechanism utilizing the stretching piece S of the expansion ring 24 held by the holding mechanism. From another perspective, it can be said that the component pickup device may also have an automatic expansion mechanism.

[0156] (11) In the above embodiments, the camera 53 and the RFID reader 60 are exemplified as acquisition units. As an acquisition unit, a laser displacement meter that uses a laser to acquire the shape and size of the object (ejector 41, tray 20, etc.) may also be used, for example.

[0157] (12) In the above embodiment, the outer diameter R2 (the diameter of the ejector 41 in a top view) is used as the information of the ejector 41 stored in the storage unit 85. The information of the ejector 41 may also include data on the dimension in the height direction (Z direction) in addition to the outer diameter R2.

[0158] (13) In the above embodiment, the support ring 23 is assembled relative to the pallet body 26 in a manner that allows it to move in the vertical direction. The support ring 23 may also be fixed relative to the pallet body 26. For example, the support ring 23 may also be fixed relative to the pallet body 26 by threading or fitting. The support ring 23 is fixed by any method in a state that protrudes upward from the upper surface of the pallet body.

[0159] The component pickup device 13 may also have a mechanism for moving the expansion ring 24 relative to the tray body 26 in the vertical direction. In this case, the expansion process is performed as follows: First, the expansion ring 24, on which the piece S is mounted, is positioned above the support ring 23 and lowered toward the tray body 26. After the piece S contacts the opening on the upper surface of the support ring 23, the expansion ring 24 is further lowered to approach the tray body 26 and locked by the reversible locking part 21. At this time, the piece S is stretched by being pulled obliquely downward from the opening edge on the upper surface of the support ring 23, and is thus expanded.

[0160] Label Explanation

[0161] 10: Component mounting device

[0162] 13, 113: Component pickup device

[0163] 22: Through hole

[0164] 23: Support ring

[0165] 41, 141: Top-out components

[0166] 51: Adsorption head

[0167] 53: Camera (an example of "acquisition unit")

[0168] 80: Control Department

[0169] C: Chip (an example of a "component")

[0170] S: Slab (component assembly slab)

[0171] R1: Inner diameter (an example of "the size of a through hole")

[0172] R2: Outer diameter (an example of "ejector dimensions")

Claims

1. A component pickup device for positioning a support ring having a through hole extending vertically, and for picking up a component from a component assembly piece stretched onto the upper surface of the support ring such that it covers the through hole, wherein, The component pickup device includes: The ejector moves within the through hole of the support ring to lift the component from below the component assembly piece; The adsorption head adsorbs and picks up the element lifted by the ejector. The acquiring unit acquires information or images of the ejector component; and Control Department The control unit obtains the size of the ejector based on the information or image of the ejector obtained by the acquisition unit, and Based on the obtained dimensions of the ejector and the through hole, the control unit restricts the movement of the ejector within the through hole to prevent the ejector from contacting the support ring. The acquiring unit is a camera. The control unit determines the type of the ejector based on the image of the ejector captured by the camera, and obtains the size of the ejector based on the determined type.

2. The component pickup device according to claim 1, wherein, The control unit pre-stores data on the size of the ejector corresponding to the type or identification information of the ejector, and obtains the size of the ejector by comparing the type or identification information with the stored data.

3. A component pickup device for positioning a support ring having a through hole extending vertically, and for picking up a component from a component assembly piece stretched onto the upper surface of the support ring such that it covers the through hole, wherein... The component pickup device includes: The ejector moves within the through hole of the support ring to lift the component from below the component assembly piece; The adsorption head adsorbs and picks up the element lifted by the ejector. The acquiring unit acquires information or images of the ejector component; and Control Department The control unit obtains the size of the ejector based on the information or image of the ejector obtained by the acquisition unit, and Based on the obtained dimensions of the ejector and the through hole, the control unit restricts the movement of the ejector within the through hole to prevent the ejector from contacting the support ring. The acquisition unit is a camera that takes pictures of the ejector component. The control unit directly calculates the size of the ejector based on the image of the ejector captured by the camera.

4. The component pickup device according to any one of claims 1 to 3, wherein, The control unit sets the movable range of the ejector based on the dimensions of the support ring and the ejector.

5. The component pickup device according to any one of claims 1 to 3, wherein, Both the through hole of the support ring and the ejector are circular when viewed from above. If the distance from the center of the through hole to the center of the ejector is less than the dimension obtained by subtracting half the outer diameter of the ejector from half the inner diameter of the through hole, the control unit determines that the ejector will not contact the support ring, and If the distance from the center of the through hole to the center of the ejector is greater than the size obtained by subtracting half the outer diameter of the ejector from half the inner diameter of the through hole, the control unit determines that the ejector will contact the support ring.

6. The component pickup device according to any one of claims 1 to 3, wherein, When the control unit determines that the support ring will come into contact with the ejector, it stops the movement of the ejector.

7. The component pickup device according to claim 6, wherein, The control unit includes a display unit. The display unit shows information related to whether the ejector is stopped and whether the element can be picked up.

8. A component mounting apparatus, comprising the component pickup device according to any one of claims 1 to 7.

Images