Baseboard module and electrical junction box

Abstract

The objective is to reduce the distance between substrates and improve heat dissipation when electrically connecting the circuits of the substrates to each other. The substrate module includes: a first substrate having a first circuit and a first connector disposed on the first substrate, the first connector being connected to a second connector, a through hole being formed in the first substrate, the first connector including a connector housing disposed in the through hole and a first terminal, the first terminal including a first substrate side end connected to the first circuit, a first terminal portion held in the connector housing, and a heat dissipation portion disposed between the first substrate side end and the first terminal portion and exposed from the connector housing when viewed from the side opposite to the second connector.

Description

[0001] Technology Area

[0002] This disclosure relates to a baseboard module and an electrical junction box. Background Technology

[0003] Patent Document 1 discloses a structure in which circuits of a first substrate and a second substrate are electrically connected to each other. The structure includes a first female terminal disposed on the first substrate facing a side opposite to the second substrate, a second female terminal disposed on the second substrate facing a side opposite to the first substrate, and a male member having a first male terminal at one end and a second male terminal at the other end. The male member passes through the first substrate and the second substrate and is connected to the first female terminal and the second female terminal.

[0004] Patent document 2 discloses the following structure: a connector for connecting a substrate to an external terminal, comprising a connector terminal portion connected to the substrate and the external terminal, and a housing portion for holding the connector terminal portion, the housing portion being disposed on the substrate in a state in which it penetrates the substrate in its height direction and protrudes from both sides of the substrate.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2009-129858

[0008] Patent Document 2: Japanese Patent Application Publication No. 2019-8872. Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] Here, when connecting other connectors to a connector disposed on a substrate, it is desirable to minimize the size of the structural portion used for connection and improve heat dissipation. No research related to heat dissipation was conducted in Patent Documents 1 and 2.

[0011] Therefore, the purpose of this disclosure is to reduce the size of the structural portion used for connection and improve heat dissipation when connecting other connectors to a connector disposed on a substrate.

[0012] Technical solutions for solving the problem

[0013] The substrate module disclosed herein includes: a first substrate having a first circuit and a first connector disposed on the first substrate, the first connector being connected to a second connector, a through hole being formed in the first substrate, the first connector including a connector housing disposed in the through hole and a first terminal, the first terminal including a first substrate side end electrically and mechanically connected to the first circuit, a first terminal portion held in the connector housing, and a heat dissipation portion disposed between the first substrate side end end and the first terminal portion and exposed from the connector housing when viewed from the side opposite to the second connector.

[0014] Invention Effects

[0015] According to this disclosure, when connecting other connectors to a connector disposed on a substrate, the size of the structural portion used for connection can be miniaturized and heat dissipation improved. Attached Figure Description

[0016] Figure 1 This is a schematic perspective view showing an electrical junction box equipped with the substrate module according to the embodiment.

[0017] Figure 2 yes Figure 1 A sectional view at line II-II.

[0018] Figure 3 It is a cross-sectional view showing the state of the connector during connection.

[0019] Figure 4 This is a perspective view showing the first connector.

[0020] Figure 5 This is a perspective view showing the first terminal.

[0021] Figure 6 This is a three-dimensional view showing the pile components. Detailed Implementation

[0022] [Description of embodiments of this disclosure]

[0023] First, embodiments of this disclosure will be described.

[0024] The substrate module disclosed herein is as follows.

[0025] (1) A substrate module comprising: a first substrate having a first circuit and a first connector disposed on the first substrate, the first connector being connected to the second connector, a through hole being formed in the first substrate, the first connector including a connector housing disposed in the through hole and a first terminal, the first terminal including a first substrate side end electrically and mechanically connected to the first circuit, a first terminal portion held in the connector housing, and a heat dissipation portion disposed between the first substrate side end end and the first terminal portion and exposed from the connector housing when viewed from the side opposite to the second connector.

[0026] According to this substrate module, a connector housing is disposed in a through-hole formed in the first substrate, and a first terminal portion is held in the connector housing. Furthermore, the first terminal portion is connected to the second terminal portion of the second connector by the approach of the first connector and the second connector. Corresponding to the placement of the connector housing holding the first terminal portion in the through-hole, the size of the structural portion used for connecting the first connector and the second connector can be reduced. In addition, the first terminal includes a heat dissipation portion disposed between the first substrate side end and the first terminal portion and exposed when viewed from the side opposite to the second connector, thus improving heat dissipation.

[0027] (2) According to the substrate module of (1), it may also include the second connector disposed on the second substrate, the second substrate being disposed with a gap relative to the first substrate and having a second circuit, the second connector having a second terminal, the second terminal including a second substrate side end that is electrically and mechanically connected to the second circuit and a second terminal portion that is connected to the first terminal portion by the proximity of the first substrate and the second substrate.

[0028] (3) According to the substrate module of (2), the second substrate side end may also be electrically and mechanically connected to the second circuit on the first substrate side relative to the second substrate.

[0029] (4) According to any of the substrate modules in (1) to (3), the heat dissipation part may extend relative to the connector housing to the side opposite to the second connector. As a result, good heat dissipation can be achieved.

[0030] (5) According to any of the substrate modules in (1) to (4), the heat dissipation part and the heat dissipation promotion member may also be in contact in a state that enables heat transfer. As a result, the heat of the first terminal is efficiently released via the heat dissipation promotion member.

[0031] (6) According to any one of (1) to (5) the substrate module may also include a support portion that connects to the heat dissipation portion from the side opposite to the first connector in the connection direction between the first connector and the second connector. Thus, when the connectors are connected, the force acting on the first terminal portion is borne by the support portion.

[0032] (7) According to any one of the substrate modules in (1) to (6), the first terminal may have a stress-absorbing portion that is more easily deformable than the first terminal portion between the first substrate side end and the first terminal portion. Therefore, when connecting connectors, the force acting on the first terminal portion is mitigated by the deformation of the stress-absorbing portion, making it difficult to transmit to the first substrate side end. Thus, the connection between the first substrate side end and the first circuit is maintained.

[0033] (8) According to any of the substrate modules in (1) to (7), the first substrate side end may extend in a direction intersecting the connection direction of the first connector and the second connector, and the first substrate side end is electrically and mechanically connected to the first circuit on the second connector side relative to the first substrate. If the first connector and the second connector are connected, the first terminal is pushed away from the second connector. If the first substrate side end extending in a direction intersecting the connection direction is electrically and mechanically connected to the first circuit on the second connector side relative to the first substrate, the force of pushing the first terminal is borne by the first substrate. Thus, the connection state between the first substrate side end and the first circuit is maintained.

[0034] (9) According to any one of (1) to (8), the substrate module may also include a stud member that is held in the connector housing and connected to the first substrate from the second connector side. Thus, the force when connecting the first connector and the second connector is borne from the first terminal portion through the connector housing and through the stud member.

[0035] The electrical junction box disclosed herein is as follows.

[0036] (10) An electrical junction box comprising any one of (1) to (9) a substrate module and a housing covering the substrate module. Thus, in the electrical junction box, when the circuits of the substrates are electrically connected to each other, the distance between the substrates can be reduced and heat dissipation can be improved. This contributes to the miniaturization of the electrical junction box.

[0037] [Details of the embodiments disclosed herein]

[0038] Specific examples of the substrate module and electrical junction box of this disclosure are described below with reference to the accompanying drawings. Furthermore, this disclosure is not limited to these examples, but is intended to include all modifications within the meaning and scope equivalent to the claims, as indicated by the claims themselves.

[0039] [Implementation Method]

[0040] The following describes the substrate module and electrical junction box involved in the implementation method. Figure 1 This is a schematic perspective view showing an electrical junction box 10 equipped with a baseboard module 20. Figure 2 yes Figure 1 A sectional view at line II-II. Figure 3 This is a cross-sectional view showing the state of the connector connection in progress.

[0041] <About the overall structure>

[0042] An electrical junction box 10 is a component that connects electrical components and makes electrical connections between them. For example, in a vehicle, the electrical junction box 10 is installed to provide a power supply path between a power source such as a battery and a load such as a vehicle electrical installation such as a light or windshield wiper. The electrical junction box 10 can also distribute, connect, and disconnect power in the power supply path.

[0043] The electrical junction box 10 includes a baseboard module 20 and a housing 12.

[0044] The housing 12 is a component that covers the substrate module 20. The housing 12 is formed, for example, from resin, and is box-shaped, covering the top and all four sides of the substrate module. The bottom opening of the housing 12 can also be blocked by a heat dissipation promoting member 90. In this case, the heat dissipation promoting member 90 can be exposed outside the housing 12, allowing heat to be easily released to the outside. The bottom opening of the housing 12 can also be blocked by a base plate different from the heat dissipation promoting member 90.

[0045] The substrate module 20 includes a first substrate 30, a first connector 40, a second substrate 60, and a second connector 70.

[0046] The first substrate 30 has a first circuit 32. The second substrate 60 has a second circuit 62. The second substrate 60 is spaced apart from the first substrate 30 and is disposed parallel to the first substrate 30. A first connector 40 is disposed on the first substrate 30, and a second connector 70 is disposed on the second substrate 60. The first circuit 32 and the second circuit 62 are electrically connected by connecting the first connector 40 and the second connector 70.

[0047] More specifically, circuits for controlling the switching on and off of power circuits are formed on the first substrate 30 and the second substrate 60, for example.

[0048] For example, the first substrate 30 includes a power circuit, a switching element disposed along the path of the power circuit, and a signal circuit for controlling the switching element to be turned on and off. The power circuit is formed, for example, by a busbar formed from a metal plate or the like. The switching element is, for example, a field-effect transistor (FET). The signal circuit is, for example, a circuit pattern formed by etching copper foil. The switching element is mounted on the first substrate 30 by soldering it to the power circuit and the signal circuit, etc.

[0049] Additionally, for example, the second substrate 60 has a semiconductor chip and a signal circuit. The semiconductor chip is, for example, an integrated circuit (IC) with electronic circuitry forming an electronic circuitry for controlling the on / off state of switching elements. The signal circuitry is, for example, a circuit pattern formed by etching copper foil.

[0050] The first circuit 32 on the first substrate 30 and the second circuit 62 on the second substrate 60 are either power circuits or signal circuits. For example, the first circuit 32 is a signal circuit of the first substrate 30, and the second circuit 62 is a signal circuit of the second substrate 60. In this case, the first circuit 32 and the second circuit 62 are connected via the first connector 40 and the second connector 70, thereby enabling the switching element mounted on the first substrate 30 to be switched on and off by a semiconductor chip mounted on the second substrate 60.

[0051] Examples of circuits formed on the first substrate 30 and the second substrate 60 are not limited to the examples described above. For example, power circuits may be formed on both the first substrate 30 and the second substrate 60, with the power circuit on the first substrate 30 being a first circuit 32 and the power circuit on the second substrate 60 being a second circuit 62. In this case, the first connector 40 and the second connector 70 may also connect the power circuit formed on the first substrate 30 to the power circuit formed on the second substrate 60. The first substrate 30 may also be a substrate containing circuits other than the first circuit 32, such as a double-sided circuit board or a multilayer circuit board. Similarly, the second substrate 60 may also be a substrate containing circuits other than the second circuit 62, such as a double-sided circuit board or a multilayer circuit board.

[0052] Hereinafter, the first connector 40 and the second connector 70 will be described in more detail, with the first circuit 32 disposed on the side of the second substrate 60 in the substrate body 31 of the first substrate 30 and the second circuit 62 disposed on the side of the first substrate 30 in the substrate body 61 of the second substrate 60.

[0053] <About Connector 1>

[0054] The first connector 40 is a connector mounted on the first substrate 30. A through hole 31h is formed in the substrate body 31 of the first substrate 30. Here, the through hole 31h is formed in a square shape. A first circuit 32 is formed on the surface of the second substrate 60 in the substrate body 31 and in at least a portion of the periphery of the through hole 31h.

[0055] The first connector 40 includes a connector housing 42 and a first terminal 50.

[0056] The connector housing 42 is formed of an insulating material such as resin. The connector housing 42 is disposed in the through hole 31h while holding the first terminal 50, and is held on the first substrate 30. Thus, the first terminal 50 is held on the first substrate 30 in a constant position and orientation.

[0057] The first terminal 50 is a component formed by stamping or other processes on a metal plate, and includes a first substrate side end 52, a first terminal portion 54, and a middle portion 56.

[0058] The first substrate-side end portion 52 is electrically and mechanically connected to the first circuit 32. Here, "electrically and mechanically connected" means that the first substrate-side end portion 52 and the first circuit 32 are connected in a manner that allows electrical conduction, and that the first substrate-side end portion 52 and the first circuit 32 are maintained in a constant positional relationship. For example, if the first substrate-side end portion 52 is soldered to the first circuit 32, then the first substrate-side end portion 52 is in a state of being electrically and mechanically connected to the first circuit 32. The same applies to the relationship between the second substrate-side connection portion 73 and the second circuit 62, which will be described later.

[0059] The first terminal portion 54 is held in the connector housing 42. The holding posture of the first terminal portion 54 in the connector housing 42 is a posture suitable for connection with the second terminal portion 74 in the second connector 70, which is a posture perpendicular to the first substrate 30.

[0060] A middle portion 56 is disposed between the first substrate-side end portion 52 and the first terminal portion 54. The middle portion 56 is the portion that connects the first substrate-side end portion 52 and the first terminal portion 54. The middle portion 56 includes a heat dissipation portion 57 exposed on the side opposite to the second substrate 60. The heat dissipation portion 57 is the portion exposed from the connector housing 42 when viewed from the side opposite to the second substrate 60. Furthermore, "the heat dissipation portion 57 is exposed from the connector housing 42 when viewed from the side opposite to the second substrate 60" means that at least a portion of the heat dissipation portion 57 is not obstructed by the connector housing 42 and can be observed when viewed from the side opposite to the second substrate 60.

[0061] A more detailed explanation is given regarding connector 40. Figure 4 This is a perspective view showing the first connector 40. Figure 5 This is a perspective view showing the first terminal 50. (As shown) Figures 1 to 5 As shown, the first connector 40 is configured such that the first terminal 50 is held in the connector housing 42.

[0062] The connector housing 42 is, for example, a component molded from resin. The connector housing 42 includes a housing body portion 43 formed as a bottomed cylindrical shape. Here, the housing body portion 43 is formed as a bottomed square cylindrical shape having a square bottom 44 and a peripheral wall portion 45 rising to one side from the periphery of the bottom 44.

[0063] For ease of explanation, the direction of one edge of the bottom 44 is defined as the width direction, and the direction orthogonal to this width direction is defined as the front-back direction (see reference). Figure 4 The width dimension of the outer casing main body 43 is set to be the same as the width dimension in the same direction as the through hole 31h. Therefore, the outer casing main body 43 is positioned within the through hole 31h in the width direction. The front-rear dimension of the outer casing main body 43 is set to be smaller than the dimension in the same direction as the through hole 31h. With the outer casing main body 43 disposed within the through hole 31h, a gap S is formed between the outer casing main body 43 and the through hole 31h on the front-rear side. The middle portion 56 of the first terminal 50, described later, can pass through this gap S.

[0064] In this embodiment, slits are formed on the front and rear sides of the peripheral wall portion 45 of the outer casing body portion 43, extending from the opening of the outer casing body portion 43 toward the bottom 44. Alternatively, these slits may be omitted.

[0065] The connector housing 42 includes a pair of retaining tabs 47. The pair of retaining tabs 47 are formed to protrude outward from a portion near an opening in the peripheral wall portion 45 of the housing body 43. Here, the pair of retaining tabs 47 are formed to protrude outward from both sides of the wall portion on one side in the front-rear direction of the peripheral wall portion 45. A pair of retaining grooves 48 are formed in opposing portions of the pair of retaining tabs 47. The pair of retaining grooves 48 are formed in a groove shape extending from the opening side of the housing body 43 toward the bottom 44 side. The portion of the pair of retaining grooves 48 near the bottom 44 protrudes more than the portion near the opening. Therefore, the distance between the bottoms of the pair of retaining grooves 48 is smaller in the region near the bottom 44 than in the region near the opening.

[0066] The outer facing surface 47f of the bottom 44 side of the pair of retaining pieces 47 is located at the axial middle portion of the peripheral wall portion 45, facing the bottom 44 side. Furthermore, with the outer housing body portion 43 disposed in the through hole 31h, this outer facing surface 47f can contact the first substrate 30 from the second substrate 60 side. Even without retaining the post member 80, the pair of retaining pieces 47 protrude outward from the outer housing body portion 43, contacting the first substrate 30 from the second substrate 60 side, and can withstand the insertion force of the second connector 70 onto the first connector 40.

[0067] The first terminal 50 is formed by stamping or other processes on a strip of metal such as copper, copper alloy, aluminum, or aluminum alloy. One end of the first terminal 50 is the first substrate side end 52, and the other end of the first terminal 50 is the first terminal portion 54. The portion between the first substrate side end 52 and the first terminal portion 54 of the first terminal 50 is the middle portion 56.

[0068] The base of the first terminal portion 54 is supported by the bottom 44 in an upright position. The first terminal portion 54 extends from the bottom 44 through the peripheral wall portion 45 toward the opening of the housing body portion 43. Here, the first terminal portion 54 is formed by folding back the two sides of the sheet-shaped portion before stamping. That is, the first terminal portion 54 is formed to have a thickness twice the thickness of the sheet material used as the base material. As a result, the first terminal portion 54 is difficult to bend. It is not necessary to make the first terminal portion 54 into a double-layer overlapping structure obtained by folding back, etc. The second terminal portion 74 is connected to the first terminal portion 54. The extending direction of the first terminal portion 54 is the same as the connection direction of the first terminal portion 54 and the second terminal portion 74. In addition, the connection direction of the first terminal portion 54 and the second terminal portion 74 is the same as the connection direction of the first connector 40 and the second connector 70.

[0069] Furthermore, the structure for supporting the first terminal portion 54 via the bottom 44 is arbitrary. For example, the first terminal portion 54 can be held in the bottom 44 by pressing it into the through hole 31h formed in the bottom 44. Alternatively, the first terminal portion 54 can be held in the bottom 44 by molding the connector housing 42 as an insert member.

[0070] The intermediate portion 56 extends from the base end of the first terminal portion 54, passes through the outer side of the bottom 44 and the outer side of the peripheral wall portion 45, and reaches the axial middle position of the peripheral wall portion 45. More specifically, the intermediate portion 56 includes a drooping portion 56a, a laterally extending portion 56b, a curved portion 56c, and a hole arrangement portion 56d.

[0071] The drooping portion 56a extends from the base end of the first terminal portion 54 toward the outside of the bottom 44 in a direction intersecting the bottom 44 (orthogonal in this case). The lateral extension portion 56b extends from the end of the drooping portion 56a in a direction intersecting the drooping portion 56a (orthogonal in this case). The lateral extension portion 56b extends in the front-rear direction toward the side opposite to the pair of retaining pieces 47. The curved portion 56c bends toward the opening side of the connector housing 42 while drawing a curve from the end of the lateral extension portion 56b. The hole arrangement portion 56d extends from the end of the curved portion 56c along the axial direction of the connector housing 42 toward the axial middle portion of the connector housing 42. A gap is provided between the middle portion 56 and the outer surface of the connector housing 42. In this embodiment, the heat dissipation portion 57 exposed when viewed from the side opposite to the second substrate in the first terminal 50 includes the drooping portion 56a, the lateral extension portion 56b, and the curved portion 56c. The drooping portion 56a, the lateral extension portion 56b, and the bent portion 56c, which are examples of the heat dissipation portion 57, can also be understood as portions that extend from the connector housing 42 to the side opposite to the second substrate 60.

[0072] Furthermore, the aforementioned bent portion 56c is not held by the connector housing 42 and the first substrate 30. Additionally, the first terminal portion 54 is made into a double-layered structure, while the bent portion 56c is a single-layered plate structure and is thinner than the first terminal portion 54. Moreover, the bent portion 56c is formed in a bent manner, so it can be easily deformed in a way that allows for overall deformation. Therefore, the bent portion 56c is a stress-absorbing portion in the first terminal 50 that is easily deformable. Furthermore, the stress-absorbing portion in the first terminal 50 can be achieved by at least one of thinning the first terminal portion 54 and forming the first terminal portion 54 into an easily bendable shape.

[0073] The first substrate-side end portion 52 extends from the end portion of the middle portion 56 opposite to the first terminal portion 54, in a direction intersecting the extending direction of the first terminal portion 54, and here orthogonal to that extending direction. The orientation of the first substrate-side end portion 52 is opposite to that of the pair of retaining tabs 47. In the axial direction of the connector housing 42, the position where the first substrate-side end portion 52 extends is the same as the end of the foot portion 84 of the post member 80 described later. This first substrate-side end portion 52 is electrically and mechanically connected to the first circuit 32 in the first substrate 30.

[0074] This first connector 40 includes a piling component 80. Figure 6 This is a perspective view showing pile component 80. (For example...) Figures 2 to 4 , Figure 6 As shown, the stud component 80 is a component that is held in the connector housing 42 and connected to the first substrate 30 from the side of the second substrate 60.

[0075] More specifically, the pile component 80, like the first terminal 50, is formed by stamping or other processes on a metal sheet. The pile component 80 may also be formed of resin.

[0076] The pile component 80 includes a base 82 and a foot 84. The base 82 is formed in the shape of a plate. Each side of the base 82 is formed such that its width gradually increases from the end on the bottom 44 side, and its width is the widest in the middle of its extending direction. The maximum dimension in the width direction of the base 82 is less than the spacing between the open sides of the pair of retaining grooves 48, and greater than the spacing between the bottom 44 sides of the pair of retaining grooves 48.

[0077] The foot 84 is formed in such a way that it extends outward from the end of the base 82 on the bottom 44 side, and extends towards the bottom 44 side from the outwardly extending portion, and further extends outward from the bottom 44 side portion in a direction orthogonal to the axial direction of the connector housing 42.

[0078] By pressing the base 82 into a pair of retaining grooves 48, the two sides of the base 82 are recessed into the bottom portion near the bottom 44 in the pair of retaining grooves 48, thereby holding the stud member 80 in the connector housing 42. In this state, the front end of the foot 84 extends axially in the connector housing 42 to the same position as the first substrate side end 52.

[0079] The first connector 40 is mounted on the first substrate 30 in the following manner: the connector housing 42 is disposed within the through hole 31h. In this state, the intermediate portion 56 can pass through the gap S between the outer peripheral surface of the housing body portion 43 and the inner peripheral surface of the through hole 31h from the outside of the bottom 44 of the connector housing 42, reaching the second substrate 60 side of the first substrate 30. The first substrate side end 52, which is connected to the front end of the intermediate portion 56, can be connected to the first circuit 32 on the second substrate 60 side of the first substrate 30. In this state, the front end of the foot portion 84 of the post member 80 can be connected to the surface on the second substrate 60 side of the first substrate 30. In addition, the outer facing surface 47f of the pair of retaining pieces 47 can also be connected to the surface on the second substrate 60 side of the first substrate 30. The outer facing surface 47f can also be separated from the first substrate 30.

[0080] In this state, the first substrate-side end 52 is electrically and mechanically connected to the first circuit 32. For example, the first substrate-side end 52 is soldered to the first circuit 32. Thus, the first connector 40 is mounted and fixed to the first substrate 30. Furthermore, the foot 84 of the stake member 80 can also be soldered to the first substrate 30. In this case, a dummy pattern not connected to other circuits can also be formed on the first substrate 30, and the stake member 80 can be soldered to this dummy pattern.

[0081] <Regarding heat dissipation enhancement components>

[0082] The aforementioned heat dissipation portion 57 can also contact the heat dissipation promoting member 90 in a heat-transferable state. The heat dissipation promoting member 90 is a member used to promote heat dissipation from the first terminal 50. The heat dissipation promoting member 90 is configured, for example, to facilitate the transfer of heat from the first terminal 50 by being formed thicker than the first terminal 50 or by being formed of a material with high thermal conductivity. The heat dissipation promoting member 90 may also be exposed on the outer surface of the housing 12 or have a shape portion suitable for increasing the surface area (e.g., fin structure, comb structure), thus having a structure suitable for releasing heat to the outside.

[0083] On the side opposite to the second substrate 60 and relative to the first substrate 30, the heat dissipation promoting member 90 is provided with a gap relative to the first substrate 30. The heat dissipation promoting member 90, the first substrate 30, and the second substrate 60 are supported side by side with a gap. For example, the first substrate 30 and the second substrate 60 can also be fixed to the heat dissipation promoting member 90 by threaded locking. In this case, a cylindrical boss 98 is sandwiched between the heat dissipation promoting member 90 and the first substrate 30, and the boss 98 is also sandwiched between the first substrate 30 and the second substrate 60.

[0084] The inner surface of the heat dissipation promoting member 90 is located opposite the heat dissipation portion 57. With the first substrate 30 supported in a constant position relative to the heat dissipation promoting member 90, the heat dissipation portion 57 is positioned to contact the heat dissipation promoting member 90 in a heat-transferable manner. Contact between the heat dissipation portion 57 and the heat dissipation promoting member 90 in a heat-transferable manner means that the heat dissipation portion 57 is directly in contact with the heat dissipation promoting member 90, or that the heat dissipation portion 57 contacts the heat dissipation promoting member 90 via a thermally conductive member made of solid or liquid. As a thermally conductive member, a member that improves the seal between the heat dissipation portion 57 and the heat dissipation promoting member 90, and whose thermal conductivity is improved by the thermally conductive filler (such as metal powder) contained therein, is used. Known thermally conductive sheets, thermally conductive pastes, and thermally conductive adhesives can also be used as such thermally conductive members. Here, an example is shown where the lateral extension 56b of the heat dissipation portion 57 contacts the heat dissipation promoting member 90 via a thermally conductive member 96a.

[0085] A protrusion 92 is formed in the portion of the heat dissipation promoting member 90 adjacent to the drooping portion 56a. The drooping portion 56a also contacts the protrusion 92 in a heat-transferable state. In this embodiment, the drooping portion 56a contacts the protrusion 92 via a heat-conducting member 96b.

[0086] By ensuring that the drooping portion 56a is in contact with the protrusion 92 in a heat-transferable state, heat can be easily transferred from the heat dissipation portion 57 to the heat dissipation promoting member 90. Furthermore, the protrusion 92 is not necessary.

[0087] The aforementioned heat dissipation promoting member 90 is an example of a support portion that connects to the heat dissipation portion 57 from the side opposite to the second substrate 60 in the connection direction between the first terminal 50 and the second terminal portion 74. Since the heat dissipation promoting member 90 connects to the heat dissipation portion 57 from the side opposite to the second substrate 60, when the first terminal 50 is connected to the second substrate 60, even if the first terminal 50 is pushed towards the heat dissipation promoting member 90, the force can be borne by the heat dissipation promoting member 90. Considering this function, the heat dissipation portion 57 can also directly contact the heat dissipation promoting member 90, or a non-deformable heat-conducting sheet can be used as a heat-conducting member 96a. Furthermore, considering the need to withstand the force acting on the heat dissipation portion 57, the heat dissipation promoting member 90 does not need to be a component suitable for dissipating heat to the outside.

[0088] <About the second connector>

[0089] The second connector 70 includes a second terminal 72 and a connector housing 78.

[0090] The second terminal 72 is formed in the same way as the first terminal 50 by stamping or other processes on a metal plate, and includes a second substrate side connection portion 73 and a second terminal portion 74.

[0091] The second terminal portion 74 is connected to the first terminal portion 54 by the proximity of the first substrate 30 and the second substrate 60. In this embodiment, the second terminal portion 74 is configured such that a contact piece 76 is formed inside the cylindrical portion 75. The cylindrical portion 75 is formed into a cylindrical shape, in this case, a square cylindrical shape, into which the first terminal portion 54 can be inserted. The contact piece 76 is formed into a shape that can elastically deform within the cylindrical portion 75. When the first terminal portion 54 is inserted into the cylindrical portion 75, the contact piece 76 elastically deforms in a manner that is pushed away by the first terminal portion 54, and the contact piece 76 is pressed against the first terminal portion 54 by the elastic restoring force of the contact piece 76 to return to its original shape.

[0092] The second substrate-side connection portion 73 is electrically and mechanically connected to the second circuit 62. In this embodiment, the second substrate-side connection portion 73 extends from the base end of the cylindrical portion 75 in a direction intersecting (orthogonal in this case) the axial direction of the cylindrical portion 75. The second substrate-side connection portion 73 is electrically connected to the second circuit 62 on the side of the first substrate 30 of the second substrate 60. For example, the second substrate-side connection portion 73 is soldered to the second circuit 62. Thus, it is mounted and fixed to the second substrate 60 with the second terminal portion 74 protruding from the second substrate 60 toward the first substrate 30.

[0093] The connector housing 78 is a cylindrical component formed of resin or the like. The second terminal portion 74 is housed within the connector housing 78. By inserting the second terminal portion 74 into the connector housing 42, the second terminal portion 74 can be guided in such a way that the first terminal portion 54 can be smoothly inserted into the second terminal portion 74. The connector housing 78 may also be omitted.

[0094] <Regarding connection operations>

[0095] An example of the connection operation between the first terminal section 54 and the second terminal section 74 will be described.

[0096] First, the first substrate 30, on which the first connector 40 is mounted, is fixed to the heat dissipation promoting member 90. In this state, the lateral extension 56b in the heat dissipation section 57 is connected to the heat dissipation promoting member 90 via the heat-conducting member 96a. In addition, the outer surface of the drooping portion 56a is connected to the protrusion 92 of the heat dissipation promoting member 90 via the heat-conducting member 96b.

[0097] In the above state, the second substrate 60, which is parallel to the first substrate 30, is brought closer to the first substrate 30. The second connector 70 then approaches the first connector 40, and the connector housing 78 is inserted into the connector housing 42. The first terminal portion 54 is then inserted into the second terminal portion 74. The first terminal portion 54 pushes open the contact piece 76 of the second terminal portion 74 and inserts itself into the second terminal portion 74. Therefore, a force F1 towards the base end also acts on the first terminal portion 54. The force F1 towards the base end on the first terminal portion 54 is transmitted to the connector housing 42. The connector housing 42 is in contact with the surface of the second substrate 60 in the first substrate 30 via the post member 80. Therefore, the force F1 towards the base end on the first terminal portion 54 is borne by the post member 80 in contact with the first substrate 30 (see F2).

[0098] Furthermore, the middle portion 56 of the first terminal 50 is in contact with the heat dissipation promoting member 90, which serves as a support. Therefore, the force on the first substrate 30 toward the base end side is also borne by the heat dissipation promoting member 90, which serves as a support (see F3).

[0099] Even when the force F1 acting on the first terminal portion 54 is transmitted to the intermediate portion 56, the bending portion 56c functions as a stress-absorbing portion that deforms in response to the force F1. Therefore, the force F1 is difficult to be transmitted to the first substrate-side end portion 52 as an unchanged force. As a result, the electrical and mechanical connection between the first substrate-side end portion 52 and the first circuit 32 can be maintained well.

[0100] Furthermore, the first substrate side end 52 is connected to the first circuit 32 of the first substrate 30 from the second substrate 60 side, so even if the force F1 is transmitted to the first substrate side end 52, the first substrate 30 can effectively withstand the force (see F4).

[0101] In addition, since the first substrate side end 52 is pushed in the direction of approaching the first circuit 32, the electrical and mechanical connection between the second terminal 72 and the second circuit 62 can also be well maintained.

[0102] <Effects, etc.>

[0103] In the substrate module 20 or electrical junction box 10 configured in this way, a connector housing 42 is disposed in the through hole 31h formed in the first substrate 30, and the first terminal portion 54 is held in the connector housing 42. Furthermore, the first terminal portion 54 and the second terminal portion 74 are connected by the proximity of the first substrate 30 and the second substrate 60. Here, a certain insertion length is required for the connection between the first terminal portion 54 and the second terminal portion 74 to be established. Therefore, the lengths of the first terminal portion 54 and the second terminal portion 74 are set to be greater than or equal to this insertion length. In this embodiment, corresponding to the fact that at least a portion of the connector housing 42 holding the first terminal portion 54 is disposed within the through hole 31h, a portion of the connection structure portion between the first connector 40 and the second connector 70 can be disposed within the first substrate 30, thereby reducing the size of the connection structure portion. Additionally, the distance between the first substrate 30 and the second substrate 60 can be reduced. Corresponding to the ability to arrange the first substrate 30 and the second substrate 60 close together, the thickness dimension of the substrate module 20 can be miniaturized, thereby miniaturizing the electrical junction box 10. This also enables cost reduction for both the substrate module 20 and the electrical junction box 10.

[0104] In addition, since the first terminal 50 includes a heat dissipation portion 57 disposed between the first substrate side end 52 and the first terminal portion 54 and exposed when viewed from the side opposite to the second substrate 60, the heat generated at the first terminal 50 or the heat transferred to the first terminal 50 can be dissipated efficiently, thereby improving the heat dissipation performance of the substrate module 20.

[0105] Furthermore, improved heat dissipation from the first terminal 50 allows for miniaturization of the first terminal portion 54. Additionally, it increases the freedom of choice in selecting the material for the first terminal 50. For example, the first terminal 50 can be formed from aluminum or an aluminum alloy.

[0106] Furthermore, since the heat dissipation portion 57 extends relative to the connector housing 42 to the side opposite to the second substrate 60, it can achieve good heat dissipation. In addition, the extension of the heat dissipation portion 57 relative to the connector housing 42 to the side opposite to the second substrate 60 can also be understood as at least a portion of the heat dissipation portion 57 bulging out from the connector housing 42 to the side opposite to the second substrate 60 when viewed from a direction orthogonal to the connection direction of the connector 40.

[0107] Furthermore, if the heat dissipation part 57 and the heat dissipation promotion member 90 are in contact in a state that allows heat transfer, the heat of the first terminal 50 can be efficiently dissipated through the heat dissipation promotion member 90.

[0108] Furthermore, if the heat dissipation promoting member 90, which serves as a support, connects to the heat dissipation part 57 from the side opposite to the second substrate 60 in the connection direction between the first terminal part 54 and the second terminal part 74, then when the first terminal part 54 and the second terminal part 74 are connected, the force acting on the first terminal part 54 is borne by the heat dissipation promoting member 90. As a result, unreasonable forces are difficult to be applied to the connection between the first substrate side end 52 and the first circuit 32, and the connection state between the first terminal 50 and the first circuit 32 can be well maintained.

[0109] Furthermore, a bending portion 56c, serving as a stress-absorbing portion, is provided between the first substrate-side end portion 52 and the first terminal portion 54. Therefore, when connecting the first terminal portion 54 and the second terminal portion 74, the force acting on the first terminal portion 54 is mitigated by the deformation of the bending portion 56c, making it difficult to transmit to the first substrate-side end portion 52. As a result, unreasonable forces are difficult to be applied to the connection between the first substrate-side end portion 52 and the first circuit 32, and the connection state between the first terminal 50 and the first circuit 32 can be well maintained. In addition, even if a positional shift occurs between the first substrate-side end portion 52 and the first terminal portion 54 due to expansion and contraction accompanying temperature changes, the bending portion 56c can absorb this shift. As a result, for example, the solder joint between the first substrate-side end portion 52 and the first circuit 32 is difficult to peel off, and the resistance to cold and heat is improved.

[0110] Furthermore, if the first terminal portion 54 is connected to the second terminal portion 74, the first terminal 50 is pushed away from the second substrate 60. The first substrate side end portion 52 is electrically and mechanically connected to the first circuit 32 of the first substrate 30 from the second substrate 60 side, so the first substrate side end portion 52 in contact with the first substrate 30 can effectively withstand the force of pushing the first terminal 50. In addition, the first substrate side end portion 52 is pushed towards the first circuit 32 instead of away from it. As a result, the connection state between the first terminal 50 and the first circuit 32 can be well maintained.

[0111] Furthermore, the stud member 80, which is held in the connector housing 42, is connected to the first substrate 30 from the second substrate 60 side of the first substrate 30. Therefore, the force required to connect the first terminal portion 54 and the second terminal portion 74 is borne by the first substrate 30 from the first terminal portion 54 through the connector housing 42 and the stud member 80. If the stud member 80 is made of metal, the rigidity of the resin-formed connector housing 42 can be strengthened, and the first connector 40 can be securely positioned on the first substrate 30.

[0112] Furthermore, the second substrate-side connection portion 73 is electrically and mechanically connected to the second circuit 62 on the first substrate 30 side of the second substrate 60. Therefore, when the first terminal portion 54 and the second terminal portion 74 are connected, the force acting on the second terminal portion 74 is borne by the second substrate 60. As a result, the connection state between the second substrate-side connection portion 73 and the second circuit 62 can be well maintained.

[0113] [Variation Example]

[0114] In this embodiment, an example is described where a second connector 70 disposed on a second substrate 60 is connected to a first connector 40. However, the second connector connected to the first connector 40 may not be a connector disposed on the substrate. For example, the second connector may also be a connector disposed at the end of a wire harness containing multiple wires.

[0115] Examples of structures where the first substrate-side end portion 52 is connected to the first circuit 32 and the second substrate-side connecting portion 73 is connected to the second circuit 62 are not limited to the examples described above. For example, the first substrate-side end portion 52 may also be formed in the shape of a pin and soldered to the first circuit 32 while penetrating a through hole formed in the first substrate 30. Similarly, the second substrate-side connecting portion 73 may also be formed in the shape of a pin and soldered to the second circuit formed on the surface of the second substrate 60 that serves as the penetration target while penetrating a through hole formed in the second substrate 60.

[0116] In this embodiment, an example of inserting the first terminal portion 54 into and connecting it to the second terminal portion 74 is described. However, it is also possible to have a structure in which the second terminal portion is inserted into and connected to the first terminal portion. For example, the second terminal portion may be formed as a connector-shaped male terminal, and the first terminal portion may be formed as a cylindrical female terminal.

[0117] Furthermore, the structures described in the above embodiments and variations can be appropriately combined as long as they do not contradict each other.

[0118] Label Explanation

[0119] 10 Electrical junction boxes

[0120] 12. Shell

[0121] 20 Baseboard Module

[0122] 30 1st base plate

[0123] 31 substrate main body

[0124] 31h through hole

[0125] 32 Circuit 1

[0126] 40 Connector 1

[0127] 42 Connector Housing

[0128] 43. Main body of the outer shell

[0129] 44 Bottom

[0130] 45 circumferential wall

[0131] 47. Hold tablets

[0132] 47f Outer Facing

[0133] 48 Retaining groove

[0134] 50 Terminal 1

[0135] 52 1st substrate side end

[0136] 54 Terminal 1

[0137] 56. Middle section

[0138] 56a Drooping part

[0139] 56b Lateral extension

[0140] 56c Bending section (stress-absorbing section)

[0141] 56d Hole Configuration Section

[0142] 57 Heat dissipation section

[0143] 60 2nd base plate

[0144] 61 substrate main body

[0145] 62 Circuit 2

[0146] 70 Second Connector

[0147] 72 Terminal 2

[0148] 73 Second substrate side connection portion

[0149] 74 Second terminal section

[0150] 75. Cylindrical section

[0151] 76 contact pads

[0152] 78 Connector Housing

[0153] 80 pile components

[0154] 82 Base

[0155] 84 Feet

[0156] 90 Heat dissipation promotion components

[0157] 92. Protrusion

[0158] 96a and 96b thermal conductive components

[0159] 98. Protruding section.

Claims

1. A substrate module, comprising: A first substrate, having a first circuit; and A first connector is disposed on the first substrate. The first connector is connected to the second connector. A through hole is formed in the first substrate. The first connector includes a connector housing disposed in the through hole and a first terminal. The first terminal includes: The first substrate side end is electrically and mechanically connected to the first circuit. The first terminal portion is retained in the connector housing; as well as A heat dissipation section is disposed between the end portion of the first substrate and the first terminal portion, and protrudes from the connector housing when viewed from the side opposite to the second connector. The substrate module further includes a support portion that connects to the heat dissipation portion from the side opposite to the first connector in the connection direction between the first connector and the second connector. The first terminal has: The drooping portion extends from the base end of the first terminal portion toward the support portion side; A lateral extension extends from the end of the drooping portion in a direction intersecting the drooping portion; as well as The stress-absorbing portion, located between the first substrate-side end and the lateral extension portion, is more easily deformed than the first terminal portion. The lateral extension at the end of the drooping portion is connected to the support portion so as to bear the force of the first terminal portion toward the base end through the support portion.

2. The substrate module according to claim 1, wherein, The substrate module further includes the second connector disposed on the second substrate, the second substrate being disposed with a gap relative to the first substrate and having a second circuit. The second connector has a second terminal, the second terminal comprising: The second substrate side end is electrically and mechanically connected to the second circuit; and The second terminal portion is connected to the first terminal portion by the proximity of the first substrate and the second substrate.

3. The substrate module according to claim 2, wherein, The second substrate side end is electrically and mechanically connected to the second circuit on the first substrate side relative to the second substrate.

4. The substrate module according to any one of claims 1 to 3, wherein, The heat dissipation section extends relative to the connector housing to the side opposite to the second connector.

5. The substrate module according to any one of claims 1 to 4, wherein, The heat dissipation part and the heat dissipation promotion component are in contact in a state that allows heat transfer.

6. The substrate module according to any one of claims 1 to 5, wherein, The first substrate side end extends in a direction that intersects the connection direction of the first connector and the second connector. The first substrate side end is electrically and mechanically connected to the first circuit on the second connector side relative to the first substrate.

7. The substrate module according to any one of claims 1 to 6, wherein, The substrate module includes a stud member that is held in the connector housing and connected to the first substrate from the second connector side relative to the first substrate.

8. An electrical junction box, comprising: The substrate module according to any one of claims 1 to 7; and A housing that covers the substrate module.

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