A clamp for large diameter silicon wafer dicing

Abstract

The present application belongs to the technical field of large-diameter silicon wafer splitting equipment, and provides a clamp for large-diameter silicon wafer splitting, which comprises a base, a cross section of which is trapezoidal and is adapted to a V-shaped groove on a cutting machine, and a first position-avoiding groove is arranged through the top of the base along the X-axis direction; and a pressing assembly is arranged on the base and is used for fixing the silicon wafer on the base. The clamp for large-diameter silicon wafer splitting has simple structure and reasonable design, and can achieve the purpose of splitting the silicon wafer by using the cutting machine which is generally equipped by silicon rod manufacturers, without the need of additionally equipping the splitting and scribing equipment, thereby saving the equipment cost and the maintenance cost.

Description

Technical Field

[0001] This invention relates to the field of large-diameter silicon wafer slicing equipment technology, and more specifically to a clamp for slicing large-diameter silicon wafers. Background Technology

[0002] Generally, silicon single crystals are grown using single crystal growth equipment and the Czochralski method. After cooling, a slitting machine and a grinding machine are used to cut and grind the single crystal ingot before it is used to fabricate wafers or silicon components.

[0003] For single crystals, the internal microscopic defects and electrical performance indicators are the basis for determining whether a single crystal is qualified. Generally, after the single crystal is grown, it is segmented by a cutting machine. A piece is cut from the head, segmented part, and tail part of the whole single crystal for testing of electrical performance and microscopic defects. Only if the parameters are qualified can the subsequent processes be carried out.

[0004] Currently, the photovoltaic and silicon component industries produce relatively large monocrystalline silicon products, typically with diameters ranging from 300 to 700 mm. Such large diameters create space constraints for various testing equipment and methods, hindering practical operation.

[0005] Currently, the common approach is to use dicing or cleaving equipment to dic and cut large silicon wafers into smaller pieces, which facilitates the detection of various electrical properties and micro-defects.

[0006] The drawbacks of the above method are that the required cutting equipment has a high investment cost, and the equipment itself has disadvantages such as consumables and easily damaged parts, resulting in high long-term maintenance costs. Summary of the Invention

[0007] In view of the deficiencies in the prior art, the purpose of this invention is to provide a fixture for dicing large-diameter silicon wafers in order to reduce costs.

[0008] To achieve the above objectives, the present invention provides a fixture for dicing large-diameter silicon wafers, comprising:

[0009] The base, with a trapezoidal cross-section parallel to the XOZ plane and conforming to the V-groove on the cutting machine, has a through-hole first clearance groove at its top along the X-axis; and

[0010] A clamping assembly, which is disposed on the base, is used to fix the silicon wafer on the base.

[0011] Furthermore, the clamping assembly includes two symmetrically arranged first clamping units, which are respectively disposed on both sides of the first clearance groove. Each first clamping unit includes:

[0012] A first clamping plate, disposed on top of the base, is positioned along the X-axis in its length direction and can reciprocate in a direction approaching or moving away from the XOY plane; and

[0013] A first adjustment structure is disposed on the first pressing plate and / or the base, and is used to adjust the distance between the top of the first pressing plate and the base.

[0014] Furthermore, the cross-section of the base parallel to the YOZ plane is trapezoidal and conforms to the V-shaped groove on the cutting machine, and a second clearance groove is provided through the top of the base along the Y-axis direction.

[0015] Furthermore, the clamping assembly includes four second clamping units, each corresponding to one of the four regions on the top of the base divided by the first and second clearance slots. Each second clamping unit includes:

[0016] A second clamping plate, disposed on top of the base, is reciprocating in a direction approaching or moving away from the XOY plane; and

[0017] A second adjustment structure is provided on the second pressing plate and / or the base, and is used to adjust the distance between the top of the second pressing plate and the base.

[0018] Furthermore, the clamping assembly further includes a connecting unit disposed on two adjacent second clamping plates, the connecting unit comprising:

[0019] A connection socket is provided on one of two adjacent second clamping plates;

[0020] A connecting rod that mates with the connecting socket is disposed on another of two adjacent second clamping plates. It has a first working position inserted into the connecting socket and a second working position separated from the connecting socket, and can reciprocate linearly between the first working position and the second working position; and

[0021] A drive structure is provided for driving the connecting rod to reciprocate linear motion between the first working position and the second working position.

[0022] Furthermore, the driving structure includes:

[0023] A screw, which is disposed within the second clamping plate and rotatably connected to the second clamping plate, and whose threaded end extends into the connecting rod and is threadedly connected to the connecting rod; and

[0024] A drive knob is located on top of the second clamping plate and is rotatably connected to the second clamping plate. Its power output end extends into the second clamping plate and is drively connected to the power input end of the screw.

[0025] Furthermore, the bottom of the connecting socket and the connecting rod are provided with mutually cooperating guide slopes.

[0026] Furthermore, there are multiple connecting rods, which are divided into two groups. The two groups of connecting rods are respectively set on two adjacent second pressing plates. The number of connecting holes is equal to the number of connecting rods and corresponds one-to-one.

[0027] Furthermore, the base is a hollow shell structure, and a support assembly for supporting the top of the base is provided inside the base. The support assembly includes four support units, which correspond to four areas on the top of the base that are divided by the first and second clearance grooves. Each support unit includes:

[0028] The first support block is V-shaped with an included angle of 90°, and its bottom is provided with multiple support holes.

[0029] The second support block is V-shaped with an included angle of 90°. Its top has a receiving groove adapted to the first support block, and a threaded hole is provided on it corresponding to the support insertion hole on the first support block. The inner diameter of the threaded hole is larger than the inner diameter of the support insertion hole.

[0030] The number of support bolts is equal to the number of support holes and corresponds one-to-one. The threaded end of the support bolt has a plug-in portion that is adapted to the support hole. The threaded end of the support bolt passes through the bottom of the base and the second support block in sequence and is threadedly connected to the second support block.

[0031] The beneficial effects of this invention are:

[0032] The fixture for cutting large-diameter silicon wafers provided by this invention can achieve the purpose of cutting silicon wafers using the cutting machine that is usually equipped by silicon rod manufacturers, without the need for additional dicing or splitting equipment, which not only saves equipment costs but also maintenance costs. Attached Figure Description

[0033] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0034] Figure 1This is a perspective view of the fixture for dicing large-diameter silicon wafers provided in Embodiment 1 of the present invention;

[0035] Figure 2 This is a perspective view of the fixture for dicing large-diameter silicon wafers provided in Embodiment 2 of the present invention (during dicing along the direction of the first clearance groove).

[0036] Figure 3 for Figure 2 A perspective view of the fixture used for dicing large-diameter silicon wafers; (during dicing along the direction of the second clearance groove).

[0037] Figure 4 for Figure 2 A top view of a fixture used for dicing large-diameter silicon wafers;

[0038] Figure 5 for Figure 4 The cross-sectional view shown in the AA direction;

[0039] Figure 6 for Figure 4 The cross-sectional view shown in the BB direction.

[0040] Figure label:

[0041] Base 100, first clearance groove 110, first clamping plate 211, first clamping bolt 212, second clearance groove 120, second clamping plate 221, second clamping bolt 222, connecting socket 223, connecting rod 224, screw 225, drive knob 226, first bevel gear 227, second bevel gear 228, first support block 310, support socket 311, second support block 320, receiving groove 321, support bolt 330, plug-in part 331. Detailed Implementation

[0042] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0043] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application should have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0044] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0045] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly defined.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0047] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] like Figure 1-6 As shown, the present invention provides a clamp for dicing large-diameter silicon wafers, including a base 100 and a clamping assembly.

[0049] The base 100 has a trapezoidal cross-section parallel to the XOZ plane that adapts to the V-groove on the cutting machine; that is, the angles of the two sides of the trapezoid match the angles of the V-groove. In use, the fixture is placed into the V-groove. Because the base 100 has a trapezoidal cross-section parallel to the XOZ plane that adapts to the V-groove on the cutting machine, and the inclined surface of the V-groove provides support and limitation for the base 100, the base 100 will not shift laterally, only experiencing vertical cutting pressure, thus maintaining stability. A first clearance groove 110 is formed through the top of the base 100 along the X-axis. The first clearance groove 110 is used to avoid obstruction from the cutting blade of the cutting machine. A clamping assembly is mounted on the base 100 to fix the silicon wafer to the base 100.

[0050] In use, the silicon wafer 400 to be divided is first fixed on the base 100 using the clamping assembly; then, the fixture is placed in the V-groove of the cutting machine, thereby dividing the silicon wafer 400 using the cutting machine.

[0051] By setting up the fixture provided by this invention, the purpose of dividing silicon wafers into 400mm wafers can be achieved using the cutting machine that is usually equipped by silicon rod manufacturers, without the need for additional wafer cleaving or dicing equipment, which not only saves equipment costs but also saves maintenance costs.

[0052] In one embodiment, the clamping assembly includes two symmetrically arranged first clamping units, which are respectively disposed on both sides of the first clearance groove 110. The first clamping unit includes a first clamping plate 211 and a first adjustment structure.

[0053] A first pressing plate 211 is disposed on the top of the base 100. The length direction of the first pressing plate 211 is along the X-axis. The first pressing plate 211 can reciprocate in a direction approaching or moving away from the XOY plane, that is, the first pressing plate 211 can reciprocate in a direction approaching or moving away from the top of the base 100, thereby changing the distance between the first pressing plate 211 and the top of the base 100, thus achieving the purpose of pressing and releasing the silicon wafer 400. In this embodiment, the first pressing plate 211 can reciprocate linearly along the Z-axis in a direction approaching or moving away from the base 100.

[0054] A first adjustment structure is disposed on the first clamping plate 211 and / or the base 100. The first adjustment structure is used to adjust the distance between the top of the first clamping plate 211 and the base 100. Preferably, the first adjustment structure includes a first clamping bolt 212, and a plurality of first clamping bolts 212 are provided. In this embodiment, there are two first clamping bolts 212, which are disposed at both ends of the first clamping plate 211. The bottom end of the first clamping bolt 212 passes through the first clamping plate 211, and the first clamping bolt 212 is threadedly connected to one of the first clamping plate 211 or the base 100, and rotatably connected to the other of the first clamping plate 211 or the base 100.

[0055] Specifically, when the first clamping bolt 212 is rotatably connected to the base 100 and threadedly connected to the first clamping plate 211, the first clamping bolt 212 and the first clamping plate 211 form a screw and nut structure, thereby changing the distance between the first clamping plate 211 and the top of the base 100 by rotating the first clamping bolt 212.

[0056] When the first clamping bolt 212 is rotatably connected to the first clamping plate 211 and threadedly connected to the base 100, turning the first clamping bolt 212 causes it to move closer to or further away from the base 100. When the first clamping bolt 212 moves closer to the base 100, it pushes the first clamping plate 211 closer to the base 100, thereby reducing the distance between the first clamping plate 211 and the top of the base 100. When the first clamping bolt 212 moves further away from the base 100, the distance between the large end of the first clamping bolt 212 and the base 100 increases, thus increasing the distance between the first clamping plate 211 and the base 100.

[0057] In use, the silicon wafer 400 is first placed on the top of the base 100, and then the first clamping bolt 212 is rotated to move the first clamping plate 211 toward the base 100 to achieve the purpose of clamping the silicon wafer 400. Then the fixture is placed in the V-groove of the cutting machine to cut the silicon wafer 400.

[0058] The clamping assembly of this structure is simple in structure, reasonable in design, and easy to operate.

[0059] The aforementioned fixture has the following drawback: when a large-diameter silicon wafer 400 needs to be divided into four pieces, after one division, the silicon wafer 400 needs to be repositioned and fixed before it can be divided again, which is complex and inefficient. Therefore, in one embodiment, the cross-section of the base 100 parallel to the YOZ plane is trapezoidal and conforms to the V-groove on the cutting machine. A second clearance groove 120 is provided through the top of the base 100 along the Y-axis direction. The second clearance groove 120 is used to avoid the cutting blade of the cutting machine. In use, the fixture is placed in the V-groove. Since the cross-section of the base 100 parallel to both the YOZ and XOZ planes is trapezoidal and conforms to the V-groove on the cutting machine, after the silicon wafer 400 is divided along the X-axis direction, the fixture is removed, reversed, and placed back into the V-groove of the cutting machine to achieve the purpose of cutting the silicon wafer 400 along the Y-axis direction. No secondary positioning is required, making the operation convenient and efficient.

[0060] In one embodiment, the clamping assembly includes four second clamping units, which correspond to four regions on the top of the base 100 that are divided by the first clearance groove 110 and the second clearance groove 120, respectively. The second clamping unit includes a second clamping plate 221 and a second adjustment structure.

[0061] The second clamping plate 221 is disposed on the top of the base 100, and the second clamping plate 221 can reciprocate in a direction approaching or moving away from the XOY plane. That is, the second clamping plate 221 can reciprocate in a direction approaching or moving away from the top of the base 100, thereby changing the distance between the second clamping plate 221 and the top of the base 100, thereby achieving the purpose of clamping and releasing the silicon wafer 400. In this embodiment, the second clamping plate 221 can reciprocate linearly along the Z-axis in a direction approaching or moving away from the base 100.

[0062] A second adjustment structure is disposed on the second clamping plate 221 and / or the base 100, and is used to adjust the distance between the second clamping plate 221 and the top of the base 100. Preferably, the second adjustment structure includes at least one second clamping bolt 222. In this embodiment, the second adjustment structure includes two second clamping bolts 222. One of the two second clamping bolts 222 is disposed on the side of the second clamping plate 221 away from the first recess 110, and the other is disposed on the side of the second clamping plate 221 away from the second recess 120.

[0063] The bottom end of the second clamping bolt 222 passes through the second clamping plate 221, and the second clamping bolt 222 is threadedly connected to one of the second clamping plate 221 or the base 100, while being rotatably connected to the other of the second clamping plate 221 or the base 100.

[0064] Specifically, when the second clamping bolt 222 is rotatably connected to the base 100 and threadedly connected to the second clamping plate 221, the second clamping bolt 222 and the second clamping plate 221 form a screw and nut structure, thereby changing the distance between the second clamping plate 221 and the top of the base 100 by rotating the second clamping bolt 222.

[0065] When the second clamping bolt 222 is rotatably connected to the second clamping plate 221 and threadedly connected to the base 100, turning the second clamping bolt 222 causes it to move closer to or further away from the base 100. When the second clamping bolt 222 moves closer to the base 100, it pushes the second clamping plate 221 closer to the base 100, thereby reducing the distance between the second clamping plate 221 and the top of the base 100. When the second clamping bolt 222 moves further away from the base 100, the distance between the large end of the second clamping bolt 222 and the base 100 increases, which in turn increases the distance between the first clamping plate 211 and the base 100.

[0066] In use, first place the silicon wafer 400 on top of the base 100, then rotate the second clamping bolt 222 to move the second clamping plate 221 toward the base 100 to achieve the purpose of clamping the silicon wafer 400. Then place the clamp into the V-groove of the cutting machine to cut the silicon wafer 400.

[0067] The clamping assembly of this structure is simple in structure, reasonable in design, and easy to operate.

[0068] In one embodiment, the clamping assembly further includes a connecting unit disposed on two adjacent second clamping plates 221. The connecting unit includes a connecting socket 223, a connecting rod 224, and a drive structure.

[0069] A connecting socket 223 is formed on one of two adjacent second clamping plates 221. A connecting rod 224 mates with the connecting socket 223 and is disposed on the other of the two adjacent second clamping plates 221. The connecting rod 224 has a first working position inserted into the connecting socket 223 and a second working position separated from the connecting socket 223. The connecting rod 224 can reciprocate linearly between the first working position and the second working position. A driving structure is used to drive the connecting rod 224 to reciprocate linearly between the first working position and the second working position.

[0070] In use, when it is necessary to cut the silicon wafer 400 along the direction of the first clearance groove 110, the connecting rod 224 that crosses the first clearance groove 110 is driven to the second working position by the driving structure, so that the connecting rod 224 is located on one side of the first clearance groove 110 without affecting the cutting of the silicon wafer 400. At the same time, the connecting rod 224 that crosses the second clearance groove 120 is driven to the first working position, so that the connecting rod 224 is inserted into the connecting socket 223, thereby connecting the two adjacent second clamping plates 221 into a whole, thereby improving the clamping effect on the silicon wafer 400.

[0071] When the silicon wafer 400 needs to be cut along the direction of the second clearance groove 120, the connecting rod 224 that crosses the second clearance groove 120 is driven to the first working position by the driving structure, so that the connecting rod 224 is located on one side of the second clearance groove 120 without affecting the cutting of the silicon wafer 400. At the same time, the connecting rod 224 that crosses the first clearance groove 110 is driven to the second working position, so that the connecting rod 224 is inserted into the connecting socket 223, thereby connecting the two adjacent second clamping plates 221 into a whole, thereby improving the clamping effect on the silicon wafer 400.

[0072] The clamping assembly of this structure is simple in structure, reasonable in design, and has a good fixing effect on silicon wafer 400.

[0073] In one embodiment, the drive structure includes a screw 225 and a drive knob 226.

[0074] A screw 225 is disposed within and rotatably connected to the second clamping plate 221, and the threaded end of the screw 225 extends into and is threadedly connected to the connecting rod 224. A drive knob 226 is disposed on the top of the second clamping plate 221 and rotatably connected to it, and the power output end of the drive knob 226 extends into the second clamping plate 221 and is drively connected to the power input end of the screw 225. Specifically, the power output end of the drive knob 226 is provided with a first bevel gear 227, and the power input end of the screw 225 is provided with a second bevel gear 228, the first bevel gear 227 and the second bevel gear 228 meshing with each other.

[0075] In use, by rotating the drive knob 226 in the forward direction, the drive knob 226 drives the first bevel gear 227 to rotate, the first bevel gear 227 drives the second bevel gear 228 to rotate, and the second bevel gear 228 drives the screw 225 to rotate, thereby achieving the purpose of driving the connecting rod 224 to move to the first working position.

[0076] Similarly, by rotating the drive knob 226 in the opposite direction, the drive knob 226 drives the first bevel gear 227 to rotate, the first bevel gear 227 drives the second bevel gear 228 to rotate, and the second bevel gear 228 drives the screw 225 to rotate, thereby achieving the purpose of driving the connecting rod 224 to move to the second working position.

[0077] The drive structure of this device is simple, rationally designed, and easy to operate.

[0078] In one embodiment, the bottom of the connecting socket 223 and the connecting rod 224 are provided with mutually cooperating guide slopes. In use, because the bottom of the connecting socket 223 is provided with guide slopes, the opening of the connecting socket 223 is larger, which helps the connecting rod 224 to be inserted into the connecting socket 223. At the same time, under the action of the guide slopes, the connecting rod 224 will press the second clamping plate 221 downward, thereby further improving the fixing effect on the silicon wafer 400.

[0079] Preferably, there are multiple connecting rods 224, which are divided into two groups. The two groups of connecting rods 224 are respectively arranged on two adjacent second pressing plates 221. The number of connecting holes 223 is equal to the number of connecting rods 224 and corresponds one-to-one. In use, the connecting rods 224 can be extended from both adjacent second pressing plates 221 and inserted into the corresponding connecting holes 223, thereby further improving the pressing effect on the silicon wafer 400.

[0080] In one embodiment, the base 100 is a hollow shell structure to reduce the weight of the base 100. Since the top of the base 100 is provided with a first clearance groove 110 and a second clearance groove 120, a support assembly for supporting the top of the base 100 is provided inside the base 100. The support assembly includes four support units, which correspond to the four areas of the top of the base 100 divided by the first clearance groove 110 and the second clearance groove 120. The support unit includes a first support block 310, a second support block 320 and a support bolt 330.

[0081] Since the first clearance groove 110 is along the X-axis and the second clearance groove 120 is along the Y-axis, both the first support block 310 and the second support block 320 are V-shaped with an included angle of 90°. The bottom of the first support block 310 has multiple support insertion holes 311. The top of the second support block 320 has a receiving groove 321 that matches the first support block 310. The second support block 320 has threaded holes corresponding to the support insertion holes 311 on the first support block 310, and the inner diameter of the threaded holes is larger than the inner diameter of the support insertion holes 311. The number of support bolts 330 is equal to the number of support insertion holes 311 and corresponds one-to-one. The threaded end of the support bolt 330 has a plug-in portion 331 that matches the support insertion hole 311. The threaded end of the support bolt 330 passes sequentially through the bottom of the base 100 and the second support block 320 and is threadedly connected to the second support block 320.

[0082] During assembly, the first support block 310 is first placed into the receiving groove 321. Then, the second support block 320, which contains the first support block 310, is placed into the base 100 from the intersection of the first clearance groove 110 and the second clearance groove 120. Then, the support bolt 330 is inserted from the bottom of the support base and aligned with the threaded hole on the second support block 320. The support bolt 330 is rotated so that the insertion part 331 is inserted into the support insertion hole 311, thereby causing the support bolt 330 to push the first support block 310 upward until the first support block 310 abuts against the inner side of the top of the base 100, thereby achieving the purpose of supporting the top of the base 100.

[0083] The support base of this structure is simple in structure, reasonable in design, and easy to assemble.

[0084] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A fixture for dicing large-diameter silicon wafers, characterized in that, include: The base has trapezoidal cross-sections parallel to the XOZ plane and parallel to the YOZ plane, which are adapted to the V-grooves on the cutting machine. The top of the base has a first clearance groove extending along the X-axis and a second clearance groove extending along the Y-axis. A clamping assembly, disposed on the base, is used to fix the silicon wafer on the base; The clamping assembly includes four second clamping units, each corresponding to one of four regions on the top of the base that are divided by the first and second clearance slots. Each second clamping unit includes: A second clamping plate, disposed on top of the base, is reciprocating in a direction approaching or moving away from the XOY plane; and A second adjustment structure is provided on the second pressing plate and / or the base, and is used to adjust the distance between the top of the second pressing plate and the base; The clamping assembly further includes a connecting unit disposed on two adjacent second clamping plates, the connecting unit comprising: A connection socket is provided on one of two adjacent second clamping plates; A connecting rod that mates with the connecting socket is disposed on another of two adjacent second clamping plates. It has a first working position inserted into the connecting socket and a second working position separated from the connecting socket, and can reciprocate linearly between the first working position and the second working position; and A drive structure is provided for driving the connecting rod to reciprocate linear motion between the first working position and the second working position.

2. The fixture for dicing large-diameter silicon wafers according to claim 1, characterized in that, The driving structure includes: A screw, which is disposed within the second clamping plate and rotatably connected to the second clamping plate, and whose threaded end extends into the connecting rod and is threadedly connected to the connecting rod; and A drive knob is located on top of the second clamping plate and is rotatably connected to the second clamping plate. Its power output end extends into the second clamping plate and is drively connected to the power input end of the screw.

3. The fixture for dicing large-diameter silicon wafers according to claim 1 or 2, characterized in that, The bottom of the connecting socket and the connecting rod are provided with mutually cooperating guide slopes.

4. The fixture for dicing large-diameter silicon wafers according to claim 3, characterized in that, The number of connecting rods is multiple, and the multiple connecting rods are divided into two groups. The two groups of connecting rods are respectively set on two adjacent second pressing plates. The number of connecting holes is equal to the number of connecting rods and corresponds one-to-one.

5. The fixture for dicing large-diameter silicon wafers according to claim 1, 2, or 4, characterized in that, The base is a hollow shell structure, and a support assembly for supporting the top of the base is provided inside the base. The support assembly includes four support units, which correspond to four areas on the top of the base that are divided by the first and second clearance grooves. Each support unit includes: The first support block is V-shaped with an included angle of 90°, and its bottom is provided with multiple support holes. The second support block is V-shaped with an included angle of 90°. Its top has a receiving groove adapted to the first support block, and a threaded hole is provided on it corresponding to the support insertion hole on the first support block. The inner diameter of the threaded hole is larger than the inner diameter of the support insertion hole. The number of support bolts is equal to the number of support holes and corresponds one-to-one. The threaded end of the support bolt has a plug-in portion that is adapted to the support hole. The threaded end of the support bolt passes through the bottom of the base and the second support block in sequence and is threadedly connected to the second support block.

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