Endoscope tip rubber injection mold

Abstract

This application relates to an endoscope tip potting mold, including a potting mounting base and a potting sleeve. The potting mounting base has a protruding limiting boss and a limiting post protruding from the limiting boss. The limiting boss can abut against the imaging module to limit the imaging module. The limiting post extends into the instrument channel on the fixing component, which can effectively prevent glue from flowing into the instrument channel and also limit the fixing component. The potting sleeve is sleeved on the limiting boss, and the potting sleeve and the potting mounting base form a receiving space for accommodating the endoscope tip. The potting sleeve has a potting hole, and glue can be poured into the receiving space through the potting hole to fill the gap between the potting sleeve, the potting mounting base and the endoscope tip. After the glue cures, it can form a tip shell on the outside of the imaging module, which can protect the imaging module. The structure is more compact, and the operation is simple, which can improve production efficiency.

Description

Technical Field

[0001] This application relates to the field of endoscope assembly technology, and in particular to an endoscope tip potting mold. Background Technology

[0002] Medical endoscopes are instruments used to examine and treat diseases by passing through the body's natural cavities (digestive tract, respiratory tract, urethra). Therefore, the smaller the size of the insertion part of a medical endoscope, the less trauma it will cause to the patient. At the same time, it is desirable for the forceps channel inside the insertion part to be larger, which will make it easier for doctors to select surgical instruments and perform surgical procedures.

[0003] An endoscope tip typically includes a fixture and an imaging module mounted on the fixture. In related technologies, a transparent plastic part is usually added to the outside of the tip, and then the transparent plastic part is fixed to the imaging module and the fixture by dispensing adhesive. However, this method increases the size of the tip and makes assembly more complex, resulting in lower production efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide an endoscope tip injection mold that eliminates the need for adding a transparent plastic part to the outside of the tip, resulting in a more compact structure, smaller footprint, simple structure and operation, and improved production efficiency.

[0005] An endoscope tip filling mold, the endoscope tip including a fixing member and an imaging module disposed on the fixing member, the endoscope tip filling mold comprising:

[0006] A potting mounting base, wherein a limiting boss and a limiting post protruding from the limiting boss are formed on the potting mounting base, the limiting boss is used to abut against the imaging module, and the limiting post is used to extend into the instrument channel on the fixing member;

[0007] A glue-filling sleeve is fitted onto the limiting protrusion, and a receiving space for accommodating the endoscope tip is formed between the glue-filling sleeve and the glue-filling mounting base. The glue-filling sleeve has a glue-filling hole that communicates with the receiving space. A gap for filling glue can be formed between the glue-filling sleeve, the glue-filling mounting base, and the endoscope tip, so that the cured glue can form a tip shell on the outside of the imaging module.

[0008] In the above solution, by setting a potting mounting base, the limiting boss can abut against the imaging module to limit the imaging module. The limiting post extends into the instrument channel on the fixing component, which can effectively prevent glue from flowing into the instrument channel and also limit the fixing component. By fitting the potting sleeve onto the limiting boss, it is convenient to maintain and replace the potting sleeve and potting mounting base, which can meet the needs of potting different specifications of endoscope tips. The glue can be poured into the receiving space through the potting hole, which can fill the gap between the potting sleeve and potting mounting base and the endoscope tip. After the glue cures, it can form a tip shell on the outside of the imaging module, which can protect the imaging module and effectively ensure the connection strength with the imaging module and fixing component. There is no need to add a transparent plastic part on the outside of the tip, making the structure more compact and the footprint smaller. At the same time, the structure and operation of this application are simple and can improve production efficiency.

[0009] In one embodiment, the potting sleeve has a sealing structure for sealing connection with the fastener.

[0010] When the glue can be poured into the receiving space through the glue filling hole, the glue filling sleeve and the fastener are sealed together, so that the glue in the receiving space will not leak out from the gap between the glue filling sleeve and the fastener.

[0011] In one embodiment, the limiting post has a sealing structure for sealing connection with the instrument channel.

[0012] By sealing the glue-filling sleeve with the fixing component, the glue in the receiving space will not leak out into the instrument channel from the gap between the limiting post and the fixing component.

[0013] In one embodiment, the potting sleeve is sealed to the limiting boss.

[0014] By sealing the glue-filling sleeve with the limiting boss, the glue in the receiving space will not leak out from the gap between the glue-filling sleeve and the limiting boss.

[0015] In one embodiment, the end of the glue-filling sleeve near the limiting boss is provided with a mounting groove for easy insertion into the limiting boss, and the inner diameter of the mounting groove is larger than the outer diameter of the limiting boss.

[0016] When installing the glue-filling sleeve onto the limiting boss, the inner diameter of the mounting groove is larger than the outer diameter of the limiting boss, allowing the glue-filling sleeve to be installed quickly and improving installation efficiency.

[0017] In one embodiment, the outer walls of the glue-potting mounting base and the glue-potting sleeve are configured to withstand negative pressure to expel air bubbles from the glue.

[0018] After the glue dispensing is completed, the glue dispensing mounting base and glue dispensing sleeve can be placed in a vacuum environment. The negative pressure will squeeze the outer wall of the glue dispensing mounting base and glue dispensing sleeve to expel the air bubbles in the containing space to the outside, thus ensuring the glue dispensing effect.

[0019] In one embodiment, the glue-filling hole is formed on the side wall of the glue-filling sleeve.

[0020] In one embodiment, the fastener has a connecting hole that communicates with the glue-filling hole, and the connecting hole is connected to the receiving space.

[0021] In one embodiment, the glue-filling mounting base is further provided with a clearance groove for avoiding the glue-filling sleeve.

[0022] By setting a clearance groove, the upper corner of the glue-filling sleeve can be cleared to ensure the installation effect of the glue-filling sleeve and the glue-filling mounting base, and to avoid interference between the glue-filling sleeve and the glue-filling mounting base during installation, which would prevent the glue-filling sleeve from being installed.

[0023] In one embodiment, both the glue-filling mounting base and the glue-filling sleeve are made of non-adhesive materials.

[0024] The adhesive used is a UV adhesive, which is cured using UV curing. UV curing utilizes the medium and short wavelengths (300 nm-800 nm) of UV light. Under UV radiation, the photoinitiator in the liquid UV adhesive is stimulated to become free radicals or cations, thereby initiating the polymerization of polymer materials (resins) containing active functional groups into an insoluble solid coating film.

[0025] In one embodiment, the glue-filling mounting base and the glue-filling sleeve are made of silicone or Teflon.

[0026] Silica gel possesses high adsorption capacity, good thermal stability, stable chemical properties, and high mechanical strength. Teflon exhibits non-stick properties, heat resistance, sliding properties, moisture resistance, wear resistance, and corrosion resistance. Almost no substances adhere to Teflon coatings. Teflon coatings demonstrate excellent heat and low-temperature resistance. They can withstand short-term high temperatures up to 300℃ and can generally be used continuously between 240℃ and 260℃, exhibiting significant thermal stability. They can operate at freezing temperatures without becoming brittle and do not melt at high temperatures. Teflon coatings have a low coefficient of friction. The coefficient of friction changes under load, but the value remains only between 0.05 and 0.15. The surface of Teflon coatings is non-repellent to water and oil, and is not easily contaminated by solutions during production operations. Small amounts of dirt can be easily wiped away, resulting in short downtime, saving labor time, and improving work efficiency. Under high loads, they exhibit excellent wear resistance. Under certain loads, they possess the dual advantages of wear resistance and non-adhesion. Teflon is virtually unaffected by chemicals and can protect parts from any kind of chemical corrosion. Attached Figure Description

[0027] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a cross-sectional view of the connection structure between the endoscope tip potting mold shown in one embodiment of this application and the endoscope tip in the first embodiment.

[0030] Figure 2 This is a schematic diagram of the connection structure between the endoscope tip potting mold in one embodiment of this application and the endoscope tip in the first embodiment.

[0031] Figure 3 This is a cross-sectional view of the endoscope tip before glue application, as shown in the first embodiment of this application.

[0032] Figure 4 This is a schematic diagram of the endoscope tip after potting and curing, as shown in the first embodiment of this application.

[0033] Figure 5 This is a cross-sectional view of the connection structure between the endoscope tip potting mold in one embodiment of this application and the endoscope tip in the second embodiment.

[0034] Figure 6 This is a cross-sectional view of the endoscope tip before glue application, as shown in the second embodiment of this application.

[0035] Figure 7 This is a cross-sectional view of the connection structure between the endoscope tip potting mold shown in one embodiment of this application and the endoscope tip in the third embodiment.

[0036] Figure 8 This is a cross-sectional view of the endoscope tip before glue application, as shown in the second embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 10. Endoscope tip potting mold; 100. Endoscope tip; 110. Fixture; 111. Instrument channel; 120. Imaging module; 121. Circuit board; 122. Camera assembly; 123. LED light; 124. Fixing bracket; 130. Tip housing; 200. Potting mounting base; 210. Limiting boss; 220. Limiting post; 230. Clearance groove; 300. Potting sleeve; 310. Potting hole; 320. Mounting groove. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] Please see Figure 1 , Figure 4 , Figure 5 and Figure 7One embodiment of this application provides an endoscope tip potting mold 10. The endoscope tip 100 includes a fixing member 110 and an imaging module 120 disposed on the fixing member 110. The endoscope tip potting mold 10 is used to pot the endoscope tip 100 with glue. After the glue cures, it can form a tip shell 130 on the outside of the imaging module 120 and can protect the imaging module 120.

[0046] Please see Figure 1 , Figure 3 and Figure 4 In one embodiment, the imaging module 120 includes a circuit board 121, a camera component 122, an LED light 123, and a fixing bracket 124. The circuit board 121 is disposed on the fixing bracket 124, the camera component 122 is disposed on the circuit board 121, and the LED light 123 is disposed on one side of the camera component 122.

[0047] Please see Figure 1 and Figure 6 In another embodiment, the imaging module 120 includes a circuit board 121, a camera assembly 122, and an LED light 123. The camera assembly 122 is disposed on the circuit board 121, and the LED light 123 is disposed on one side of the camera assembly 122.

[0048] Please see Figure 1 and Figure 8 In another embodiment, the imaging module 120 includes a circuit board 121 and an LED lamp 123, with the LED lamp 123 disposed on one side of the circuit board 121.

[0049] Please see Figure 1 , Figure 4 , Figure 5 and Figure 7 The endoscope tip potting mold 10 includes a potting mounting base 200 and a potting sleeve 300. The potting sleeve 300 is mounted on the potting mounting base 200, and a receiving space is formed between the potting sleeve 300 and the potting mounting base 200 to accommodate the endoscope tip 100. The endoscope tip 100 can be accommodated within the receiving space.

[0050] A limiting boss 210 and a limiting post 220 protruding from the limiting boss 210 are formed on the potting mounting base 200. The limiting boss 210 is used to abut against the imaging module 120. The limiting post 220 is used to extend into the instrument channel 111 on the fixing member 110. The limiting boss 210 can limit the imaging module 120. Specifically, the lower surface of the limiting boss 210 abuts against the upper surface of the imaging module 120. The instrument channel 111 is provided through the fixing member 110. More specifically, the upper surface of the imaging module 120 can be the upper surface of the camera assembly 122 or the upper surface of the circuit board 121.

[0051] The limiting post 220 extends into the instrument channel 111 on the fixing member 110, which can effectively prevent glue from flowing into the instrument channel 111, and at the same time can also limit the fixing member 110.

[0052] Please see Figure 1 , Figure 4 , Figure 5 and Figure 7 The glue-filling sleeve 300 is fitted onto the limiting boss 210. By fitting the glue-filling sleeve 300 onto the limiting boss 210, maintenance and replacement of both the glue-filling sleeve 300 and the glue-filling mounting base 200 are facilitated, allowing for glue filling of endoscope tip 100 of different specifications. It should be understood that when filling endoscope tip 100 of different specifications, the corresponding glue-filling sleeve 300 can be replaced.

[0053] The potting sleeve 300 has a potting hole 310 communicating with the receiving space. Adhesive is filled in the gap between the potting sleeve 300, the potting mounting base 200, and the endoscope tip 100. The cured adhesive forms a tip housing 130 on the outside of the imaging module 120. It should be noted that the tip housing 130 is transparent.

[0054] Adhesive can be poured into the receiving space through the glue-filling hole 310, filling the gap between the glue-filling sleeve 300, the glue-filling mounting base 200, and the endoscope tip 100. After the adhesive cures, it forms a tip shell 130 on the outside of the imaging module 120, protecting the imaging module 120 and effectively ensuring the connection strength with the imaging module 120 and the fixing component 110. There is no need to add a transparent plastic part to the outside of the tip, making the structure more compact and reducing the footprint. Furthermore, the structure and operation of this application are simple, improving production efficiency. It should be noted that the transparent plastic part can be used as the tip shell 130 mentioned in the background art.

[0055] The endoscope tip potting mold 10 of this application is described in detail below with reference to the accompanying drawings.

[0056] Please see Figure 1 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, the glue-filling sleeve 300 is sealed to the fixing member 110. When glue can be poured into the receiving space from the glue-filling hole 310, the glue in the receiving space will not leak out from the gap between the glue-filling sleeve 300 and the fixing member 110 by sealing the glue-filling sleeve 300 to the fixing member 110.

[0057] The limiting post 220 is sealed to the instrument channel 111. Specifically, the limiting post 220 is sealed to the fixing member 110. When glue can be poured into the receiving space from the glue filling hole 310, the glue filling sleeve 300 is sealed to the fixing member 110, so that the glue in the receiving space will not leak out into the instrument channel 111 from the gap between the limiting post 220 and the fixing member 110.

[0058] Please see Figure 1 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, the end of the glue-filling sleeve 300 near the limiting boss 210 is provided with a mounting groove 320 for easy insertion into the limiting boss 210, and the inner diameter of the mounting groove 320 is larger than the outer diameter of the limiting boss 210.

[0059] When the glue-filling sleeve 300 is installed on the limiting boss 210, since the inner diameter of the mounting groove 320 is larger than the outer diameter of the limiting boss 210, the glue-filling sleeve 300 can be installed on the limiting boss 210 quickly, thus improving installation efficiency.

[0060] The glue-filling sleeve 300 is sealed to the limiting boss 210. When glue can be poured into the receiving space from the glue-filling hole 310, the glue-filling sleeve 300 and the limiting boss 210 are sealed to prevent the glue in the receiving space from leaking out from the gap between the glue-filling sleeve 300 and the limiting boss 210.

[0061] Please see Figure 1 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, the outer walls of the glue-potting mounting base 200 and the glue-potting sleeve 300 are configured to withstand negative pressure to expel air bubbles from the glue.

[0062] After the glue dispensing is completed, the glue dispensing mounting base 200 and the glue dispensing sleeve 300 can be placed in a vacuum environment. The negative pressure will squeeze the outer walls of the glue dispensing mounting base 200 and the glue dispensing sleeve 300 to expel the air bubbles of glue in the containing space to the outside, thus ensuring the glue dispensing effect.

[0063] Please see Figure 1 , Figure 2 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, the glue-filling hole 310 is formed on the side wall or bottom of the glue-filling sleeve 300. The fixing member 110 has a communicating hole that communicates with the glue-filling hole 310, and the communicating hole communicates with the receiving space. Glue can be poured from the glue-filling hole 310 into the communicating hole, and the glue in the communicating hole can flow into the receiving space.

[0064] In one embodiment, the glue-filling hole 310 is formed on the side wall of the glue-filling sleeve 300. In another embodiment, the glue-filling hole 310 is formed on the bottom of the glue-filling sleeve 300.

[0065] Please see Figure 1 , Figure 2 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, the glue-filling mounting base 200 is further provided with a clearance groove 230 for avoiding the glue-filling sleeve 300. Specifically, the clearance groove 230 is used for the upper corner of the glue-filling sleeve 300 to ensure the installation effect between the glue-filling sleeve 300 and the glue-filling mounting base 200, and to avoid interference between the glue-filling sleeve 300 and the glue-filling mounting base 200 during installation, so that the glue-filling sleeve 300 cannot be installed.

[0066] Please see Figure 1 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, in one embodiment, the adhesive used is a UV adhesive. The UV adhesive is cured by UV curing. It should be understood that UV curing is a process in which the photoinitiator in the liquid UV adhesive is stimulated to become free radicals or cations under UV radiation, thereby initiating the polymerization of polymer materials (resins) containing active functional groups into an insoluble solid coating film.

[0067] In other embodiments, the adhesive may be a heat-curing adhesive or a naturally curing adhesive.

[0068] Please see Figure 1 , Figure 5 and Figure 7 According to some embodiments of this application, optionally, the materials used for the potting mounting base 200 and the potting sleeve 300 are both non-adhesive materials, which facilitates demolding. Specifically, the materials used for the potting mounting base 200 and the potting sleeve 300 are silicone or Teflon.

[0069] Silica gel has high adsorption capacity, good thermal stability, stable chemical properties, and high mechanical strength. Teflon has non-stick properties, heat resistance, slip resistance, moisture resistance, wear resistance, and corrosion resistance.

[0070] Specifically, almost no substances adhere to the Teflon coating. The Teflon coating exhibits excellent heat and low-temperature resistance. It can withstand temperatures up to 300°C for short periods and can generally be used continuously between 240°C and 260°C, demonstrating significant thermal stability. It can operate at freezing temperatures without becoming brittle and does not melt at high temperatures. The Teflon coating has a low coefficient of friction. While the coefficient of friction changes under load, the value remains only between 0.05 and 0.15. The Teflon coating surface is non-repellent to water and oil, and it is not easily contaminated with solutions during production operations. Small amounts of dirt can be easily wiped away, resulting in short downtime, saving labor time and improving work efficiency. Under high loads, it exhibits excellent wear resistance. Under certain loads, it possesses the dual advantages of wear resistance and non-adhesion. Teflon is virtually unaffected by chemicals, protecting parts from any type of chemical corrosion.

[0071] In this embodiment, the glue-potting mounting base 200 and the glue-potting sleeve 300 are made of silicone, which can serve as a non-stick adhesive and also enable the glue-potting sleeve 300 to form a sealed connection with the fixing member 110, the limiting post 220 to the fixing member 110, and the limiting post 220 to the fixing member 110.

[0072] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An endoscope tip glue filling mold, the endoscope tip comprising a fixing member and an imaging module arranged on the fixing member, characterized in that, The endoscope tip potting mold includes: A potting mounting base, wherein a limiting boss and a limiting post protruding from the limiting boss are formed on the potting mounting base, the limiting boss is used to abut against the imaging module, and the limiting post is used to extend into the instrument channel on the fixing member; A glue-filling sleeve is fitted onto the limiting protrusion, and a receiving space for accommodating the endoscope tip is formed between the glue-filling sleeve and the glue-filling mounting base. The glue-filling sleeve has a glue-filling hole that communicates with the receiving space. A gap for filling glue can be formed between the glue-filling sleeve, the glue-filling mounting base, and the endoscope tip, so that the cured glue can form a tip shell on the outside of the imaging module.

2. The endoscope tip potting mold of claim 1, wherein, The glue-filling sleeve has a sealing structure for sealing connection with the fixing component.

3. The endoscope tip potting mold of claim 1, wherein, The limiting post has a sealing structure for sealing connection with the instrument channel.

4. The endoscope tip potting mold of claim 1, wherein, The glue-filling sleeve is sealed to the limiting boss.

5. The endoscope tip potting mold of claim 1, wherein, The glue-filling sleeve has a mounting groove at one end near the limiting boss, which facilitates insertion into the limiting boss. The inner diameter of the mounting groove is larger than the outer diameter of the limiting boss.

6. The endoscope tip potting mold according to claim 1, characterized in that, The outer walls of the glue-dispensing mounting base and the glue-dispensing sleeve are configured to withstand negative pressure to expel air bubbles from the glue.

7. The endoscope tip potting mold according to claim 1, characterized in that, The glue-filling hole is located on the side wall of the glue-filling sleeve.

8. The endoscope tip potting mold according to claim 1, characterized in that, The glue-filling mounting base is also provided with a clearance groove for avoiding the glue-filling sleeve.

9. The endoscope tip potting mold according to claim 1, characterized in that, The materials used for both the glue-filling mounting base and the glue-filling sleeve are non-adhesive materials.

10. The endoscope tip potting mold according to claim 9, characterized in that, The materials used for the glue-filling mounting base and the glue-filling sleeve are silicone or Teflon.

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