A pind test fixture and fixing method

By connecting the lightweight PIND test fixture to the vibration equipment, the problem of damage to microelectronic devices caused by adhesive media is solved, and low-cost, easy-to-operate device fixation is achieved, which is suitable for a variety of device sizes.

CN117589407BActive Publication Date: 2026-07-21NO 24 RES INST OF CETC

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NO 24 RES INST OF CETC
Filing Date
2023-12-06
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing technologies using adhesive media such as double-sided tape or water-soluble adhesives can damage the appearance and function of microelectronic devices during PIND testing, and are costly, making it difficult to meet the reliability and safety requirements of military microelectronic devices.

Method used

The lightweight PIND test fixture, consisting of a bracket and a pressure-applying component, is used. It is connected to the vibration equipment via the bracket's fixing arm and fixing bolt. The fixture is fixed and detached using a specially shaped mounting groove, replacing the adhesive medium for device fixation.

Benefits of technology

It greatly reduces the impact on the appearance of the device, is easy to operate, is suitable for devices of different sizes, and is low in cost and has a wide range of applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a PIND test clamp and fixing method, which comprises a support and a pressure applying part. The support comprises an intersection part and a plurality of fixing arms arranged on the periphery of the intersection part. The fixing arms jointly enclose a containing space below the intersection part for placing a device to be tested. The pressure applying part is detachably arranged on the intersection part and can be vertically moved relative to the intersection part to press and fix the device to be tested. The device to be tested is fixed by the clamp which is light in weight and can be fixed on a vibration equipment, thereby replacing the adhesive medium, greatly reducing the influence on the appearance of the device to be tested, and having strong practicability. The pressure applying part for pressure fixing can change the vertical direction to adapt to different sizes of the device to be tested, and has wide application range. It is worth noting that the fixing method is characterized in that the special-shaped mounting groove is arranged, so that the clamp can be integrally fixed and separated from the vibration equipment, and the operation is convenient.
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Description

Technical Field

[0001] This invention relates to the field of microelectronic device testing technology, and in particular to a PIND test fixture and fixing method. Background Technology

[0002] During the production, manufacturing, and packaging of semiconductor devices, external substances, or movable foreign objects, may enter the internal cavity. Under service conditions, these free particles will continuously collide with the chip, bonding wires, and other components within the device cavity. In severe cases, this can lead to circuit malfunction, posing a significant threat to the reliability and safety of equipment systems such as aerospace, satellites, and missiles in my country. To address this, particle collision noise detection (PIND) equipment and technology have emerged. Their advantages include high accuracy, low cost, and speed, making them the primary method for detecting foreign objects.

[0003] Generally, when military microelectronic devices undergo particle collision noise testing according to GJB548C-2021 Method 2020.2, most types of devices are directly mounted on the center or axis of the sensor using an adhesive medium to achieve maximum sensitivity. However, in existing technologies, the use of adhesive media such as double-sided tape or water-soluble adhesives can affect the appearance of the device, and water-soluble adhesives are expensive and difficult to clean; especially for some devices with protective films, the use of adhesive media can damage the protective film, causing damage to the device's appearance and even its function. Summary of the Invention

[0004] To address the shortcomings of the prior art, the technical problem to be solved by the present invention is to provide a PIND test fixture and a fixing method, which uses a lightweight fixture that can be fixed to the vibration device of a PIND device and proposes a fixing method for the fixture, thereby replacing the adhesive medium and greatly reducing the impact on the appearance of the device under test.

[0005] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide a PIND test fixture for fixing a semiconductor device to be tested on a vibration device used for particle collision noise detection testing, including a support and a pressure-applying component. The support includes a junction portion and a plurality of fixed arms disposed on the outer periphery of the junction portion, the plurality of fixed arms together forming a receiving space located below the junction portion for placing the device to be tested; the pressure-applying component is detachably disposed on the junction portion and can move vertically relative to the junction portion to apply pressure and fix the device to be tested. Each of the fixed arms has a fixing bolt at its lower end to form a fixing pair, so that the bracket can be fixed to the vibrating device; the vibrating device has a through-hole with mounting slots corresponding one-to-one with the fixing pairs. Each mounting slot includes a guide slot with a larger inner diameter and a fixing slot with a smaller inner diameter located on one side of the guide slot and communicating with it. The inner diameter of the guide slot is larger than the maximum outer diameter of the fixing bolt so that the fixing bolt can pass through it. The inner diameter of the fixing slot is smaller than the maximum outer diameter of both the fixed arm and the fixing bolt.

[0006] Furthermore, the vibration device includes a main body, a vibration table for placing the device under test thereon, and a connecting plate for connecting the main body and the vibration table. The diameter of the connecting plate is larger than the diameter of the vibration table. Several mounting slots are formed through the connecting plate for fixing the fixing arm and the fixing bolt thereon. The intersection part is coaxially arranged with the vibration table. The pressure applying member is located at the axis of the intersection part to apply pressure and fix the device under test at the center position.

[0007] Furthermore, several of the fixed arms are arranged radially and evenly spaced around the axis of the intersection.

[0008] Furthermore, each of the fixed arms includes a horizontal portion extending radially outward from the intersection portion and a vertical portion located at one end of the horizontal portion away from the intersection portion. A plurality of fixed bolts are correspondingly located at the lower ends of the plurality of vertical portions and can move up and down relative to the vertical portions. Each fixed bolt includes a fixed block and a first screw located at one end of the fixed block that can extend into the vertical portion. The outer diameter of the fixed block is larger than the outer diameter of the first screw and forms a bearing surface with the first screw that can abut against the lower end of the vertical portion.

[0009] Furthermore, the pressure-applying member includes a second screw threaded to the meeting portion, the second screw threaded to the axis of the meeting portion so that the pressure-applying member can move vertically relative to the meeting portion.

[0010] Furthermore, the pressure-applying component also includes a small end piece located at one end of the second screw along its length direction and having a diameter not greater than that of the second screw, and a large end piece located at the other end of the second screw along its length direction and having a diameter greater than that of the second screw.

[0011] Furthermore, a first silicone sleeve is provided around the outer periphery of the small end foot, and a second silicone sleeve is provided around the outer periphery of the large end foot.

[0012] Furthermore, the outer diameter of the first silicone sleeve is larger than the outer diameter of the second screw; A fixing method for fixing a semiconductor device to be tested onto a vibrating device used for particle collision noise detection testing, characterized in that the fixing method includes the following steps: S100: The pressure-applying component is mounted on the bracket; S200: Fix the bracket to the vibration equipment so that the vibration table of the vibration equipment is located within the receiving space; S300: Place the device under test at the center of the vibration table; S400: Adjust the vertical position of the pressure-applying component to apply pressure and fix it at the center position of the device under test.

[0013] Furthermore, the bracket includes a junction portion and a plurality of fixed arms disposed on the outer periphery of the junction portion. Each fixed arm includes a horizontal portion extending radially outward from the junction portion and a vertical portion disposed at one end of the horizontal portion away from the junction portion. The lower ends of the plurality of vertical portions are provided with fixing bolts that can move up and down relative to the vertical portions. Each fixing bolt includes a fixing block and a first screw disposed at one end of the fixing block that can extend into the vertical portion. The outer diameter of the fixing block is larger than the outer diameter of the first screw and forms a bearing surface with the first screw that can abut against the lower end of the vertical portion. The connecting plate of the vibration device has a mounting groove for mounting the bracket. Each mounting groove includes a guide groove with a larger inner diameter and a fixing groove with a smaller inner diameter located on one side of the guide groove and communicating with it. Step S200 includes the following sub-steps: S210. Move the plurality of fixing bolts relative to the corresponding vertical parts so that there is a gap between the abutting surface and the lower end of the vertical part that is greater than the thickness of the connecting plate. S220. Move the bracket so that the fixing bolts extend from top to bottom into the corresponding guide grooves, and make the connecting plate horizontally aligned with the gap. S230. Rotate the bracket as a whole around its own axis, so that the first screws slide into the corresponding fixing grooves at the positions corresponding to the gaps. S240. Move the plurality of fixing bolts upward relative to the corresponding vertical parts, so that the abutting surface and the lower end surface of the vertical part together clamp the connecting plate.

[0014] The PIND test fixture and fixing method of the present invention have at least the following beneficial effects: the device under test is fixed by a lightweight fixture that can be fixed to the vibration equipment, thereby replacing the adhesive medium and greatly reducing the impact on the appearance of the device under test, which has strong practicality; moreover, the pressure-applying component used for pressure fixing can change the vertical direction to adapt to devices under test of different sizes, which has a wide range of applications; it is worth noting that the fixing method, by setting a specially shaped mounting groove, allows the fixture to be fixed and separated from the vibration equipment as a whole, which is convenient to operate. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of a structure used to fix a small device under test in one embodiment of the present invention; Figure 2 This is a schematic diagram of a structure used to fix a large device under test in one embodiment of the present invention; Figure 3 This is a schematic diagram of the structure including the bracket, pressure-applying member, and fixing bolt in one embodiment of the present invention; Figure 4 This is a schematic diagram of the connecting plate, vibration table, and mounting groove in one embodiment of the present invention.

[0016] The meanings of the labels in the attached diagram are as follows: Vibration table 11, connecting plate 12, bracket 2, meeting part 21, fixed arm 22, horizontal part 221, vertical part 222, fixing bolt 23, fixing block 231, first screw 232, threaded hole 233, mounting groove 24, guide groove 241, fixing groove 242, gap 25, pressure applying part 3, second screw 31, small end foot 32, large end foot 33, first silicone sleeve 34, second silicone sleeve 35. Detailed Implementation

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] To more clearly illustrate the PIND test fixture and fixing method of the present invention, the external structure of the vibration device is described first. The vibration device includes a main body (not shown in the figure), a vibration table 11 on which the device under test (DUT) is placed, and a connecting plate 12 for connecting the main body and the vibration table 11. The connecting plate 12 is coaxially arranged with the vibration table 11 and its diameter is larger than that of the vibration table 11. The above-described PIND test vibration device is mature prior art; it is only referred to here.

[0019] Reference Figure 1 and Figure 2 The present invention discloses a PIND test fixture for fixing a semiconductor device under test (hereinafter referred to as "DUT") on a vibration device used for particle collision noise detection testing. It includes a support 2 and a pressure-applying component 3. The support 2 has a receiving space formed in the middle for placing the DUT. The pressure-applying component 3 is detachably connected to the support 2 and can extend into the receiving space to apply pressure and fix the DUT.

[0020] Reference Figure 3 and Figure 4 The support 2 includes a junction portion 21 and a plurality of fixed arms 22 disposed on the outer periphery of the junction portion 21. When the support 2 is mounted on the vibration equipment, the junction portion 21 is coaxial with the vibration table 11. The plurality of fixed arms 22 are arranged radially and evenly spaced about the axis of the junction portion 21. The accommodating space is formed by the junction portion 21 and the plurality of fixed arms 22, and its inner diameter is larger than the outer diameter of the vibration table 11. The lower ends of the plurality of fixed arms 22 are provided with fixing bolts 23 to form a fixing pair, so that the support 2 can be fixed to the connecting plate 12. Each fixed arm 22 includes a horizontal portion 221 extending radially outward from the junction portion 21 and a vertical portion 222 disposed on the lower end face of the horizontal portion 221 away from the junction portion 21. The plurality of fixing bolts 23 are correspondingly disposed at the lower ends of the plurality of vertical portions 222. Each fixing bolt 23 includes a fixing block 231 and a first screw 232. The first screw 232 is coaxially arranged with the fixing block 231 and its diameter is smaller than that of the fixing block 231. The side of the fixing block 231 facing the first screw 232 forms a bearing surface that can abut against the lower end face of the corresponding vertical part 222. The lower end of the vertical part 222 has a threaded hole 233 that matches the thread of the first screw 232. The connecting plate 12 has a corresponding mounting groove 24 through the position of several fixing pairs, that is, several mounting grooves 24 are evenly spaced along the circumference of the connecting plate 12. Each mounting groove 24 includes a guide groove 241 with a larger inner diameter and a fixing groove 242 located on one side of the guide groove 241 and communicating with the guide groove 241. The inner diameter of the guide groove 241 is larger than the outer diameter of the fixing block 231 so that the fixing block 231 and the first screw 232 can pass through it. The inner diameter of the fixing groove 242 is smaller than the outer diameter of the vertical part 222 and the outer diameter of the fixing block 231, and larger than the outer diameter of the first screw 232.

[0021] The pressure-applying component 3 includes a second screw 31, a small end 32 located at one end of the second screw 31 along its length, and a large end 33 located at the other end of the second screw 31 along its length. The second screw 31 is vertically screwed to the center of the junction 21, with both ends extending vertically out of the junction 21. The small end 32 is coaxially arranged with the second screw 31 and has an outer diameter smaller than that of the second screw 31. A first silicone sleeve 34 with an outer diameter larger than that of the second screw 31 is fitted over the small end 32, preventing the pressure-applying component 3 from easily detaching from the bracket 2. The large end 33 is coaxially arranged with the second screw 31 and has an outer diameter larger than that of the second screw 31. A second silicone sleeve 35 is fitted over the large end 33. When fixing the device under test (DUT), the first silicone sleeve 34 / second silicone sleeve 35 directly contact the DUT, protecting the DUT while also providing anti-static protection.

[0022] A fixing method of the present invention, which fixes the device under test to a vibration device for particle collision noise detection test using a PIND test fixture as described above, includes the following steps: S100. Install the pressure-applying member 3 onto the bracket 2; wherein, step S100 includes the following sub-steps: S110. Determine whether the small pin 32 or the large pin 33 is at the bottom based on the size of the device under test; S120. Based on the above judgment, with the small end 32 as the insertion end, the pressure applying member 3 is screwed onto the bracket 2 from top to bottom or from bottom to top.

[0023] S200: Fix the bracket 2 to the vibration equipment so that the vibration table 11 of the vibration equipment is located within the receiving space; wherein, step S200 includes the following sub-steps: S210, Move the plurality of fixing bolts 23 relative to the corresponding vertical parts 222, so that there is a gap 25 between the abutting surface and the lower end of the vertical part 222 that is greater than the thickness of the connecting plate 12; S220. Move the bracket 2 so that a plurality of the fixing bolts 23 extend from top to bottom into the corresponding guide grooves 241, and make the connecting plate 12 horizontally aligned with the gap 25. S230. Rotate the bracket 2 as a whole around its own axis, so that the first screws 232 slide into the corresponding fixing grooves 242 at the positions corresponding to the gaps 25. S240. Move the plurality of fixing bolts 23 upward relative to the corresponding vertical portions 222, so that the abutting surface and the lower end surface of the vertical portion 222 together clamp the connecting plate 12.

[0024] S300: Place the device under test at the center of the vibration table 11; S400: Adjust the vertical position of the pressure-applying component 3 to apply pressure and fix it at the center position of the device under test.

[0025] The working method of one embodiment of the PIND test fixture and test method of the present invention is as follows: the vertical orientation of the pressure member 3 is determined according to the size of the device under test, the first silicone sleeve 34 is removed, if the device under test is a small device, the small end 32 is facing down, and the pressure member 3 is screwed into the junction 21 from top to bottom with the small end 32 as the insertion end; if the device under test is a large device, the large end 33 is facing down, and the pressure member 3 is screwed into the junction 21 from bottom to top with the small end 32 as the insertion end, and then the first silicone sleeve 34 is put on the outside of the small end 32.

[0026] A plurality of fixing bolts 23 are screwed one-to-one to the lower ends of a plurality of vertical portions 222. The position of the fixing bolts 23 relative to the vertical portions 222 is adjusted by rotating the fixing block 231, so that a gap 25 larger than the thickness of the connecting plate 12 is left between the abutting surface and the lower end surface of the vertical portion 222. The bracket 2 is moved so that the plurality of fixing bolts 23 extend from top to bottom into the corresponding guide grooves 241, and the connecting plate 12 is horizontally aligned with the gap 25. The bracket 2 is rotated about its own axis so that a plurality of first screws 232 slide into the corresponding fixing grooves 242 at the positions corresponding to the gaps 25. The fixing bolts 23 are rotated so that the corresponding first screws 232 move into the threaded holes 233, so that the abutting surface and the lower end surface of the vertical portion 222 abut against the lower end surface and upper end surface of the connecting plate 12, respectively, to clamp the connecting plate 12. This fixing method allows the clamp to be fixed and separated from the vibration equipment as a whole. Because the gap between the connecting plate 12 and the main body of the equipment is narrow, if a single fixing slot 242 were used, it would be very inconvenient for the user to position the fixing bolt 23 from below the connecting plate 12 and the threaded hole 233, given that the position of the threaded hole 233 is difficult to observe from below. In this fixing method, the fixing bolt 23 remains connected to the bracket 2, avoiding the problem of difficulty in positioning the fixing bolt 23 and the threaded hole 233.

[0027] After fixing the bracket 2, place the device under test in the middle position of the vibration table 11. Rotate the pressure applying member 3 to move it downward relative to the bracket 2 until the small end foot 32 / large end foot 33 abuts against the center position of the upper end surface of the device under test. After fixing the device under test, start the vibration equipment to test the device under test.

[0028] Compared with the prior art, the PIND test fixture and fixing method of the present invention uses a lightweight fixture that can be fixed to the vibration equipment to fix the device under test, thereby replacing the adhesive medium and greatly reducing the impact on the appearance of the device under test, which has strong practicality; moreover, the pressure-applying component used for pressure fixing can change the vertical direction to adapt to devices under test of different sizes, and has a wide range of applications; it is worth noting that the fixing method, by setting a specially shaped mounting groove, allows the fixture to be fixed and separated from the vibration equipment as a whole, which is convenient to operate.

Claims

1. A PIND test fixture for fixing a semiconductor device to be tested onto a vibration device used for particle collision noise detection testing, characterized in that: The device includes a support and a pressure-applying component. The support includes a junction section and several fixed arms disposed on the outer periphery of the junction section. The several fixed arms together form a receiving space located below the junction section for placing the device under test. The pressure-applying component is detachably disposed on the junction section and can move vertically relative to the junction section to apply pressure and fix the device under test. Each of the fixed arms has a fixing bolt at its lower end to form a fixing pair, so that the bracket can be fixed to the vibrating device; the vibrating device has a through-hole with mounting slots corresponding one-to-one with the fixing pairs. Each mounting slot includes a guide slot with a larger inner diameter and a fixing slot with a smaller inner diameter located on one side of the guide slot and communicating with it. The inner diameter of the guide slot is larger than the maximum outer diameter of the fixing bolt so that the fixing bolt can pass through it. The inner diameter of the fixing slot is smaller than the maximum outer diameter of both the fixed arm and the fixing bolt. The vibration device includes a vibration table on which the device to be tested is placed. The intersection part is coaxially arranged with the vibration table. The pressure applying member is located at the axis of the intersection part to apply pressure and fix the device to be tested at the center position.

2. The PIND test fixture as described in claim 1, characterized in that: The vibration device further includes a device body and a connecting plate for connecting the device body and the vibration table. The diameter of the connecting plate is larger than the diameter of the vibration table. Several mounting slots are formed through the connecting plate for the fixing arm and the fixing bolt to be fixed thereon.

3. The PIND test fixture as described in claim 2, characterized in that: Several fixed arms are arranged radially and evenly spaced around the axis of the intersection.

4. A PIND test fixture as described in claim 3, characterized in that: Each of the fixed arms includes a horizontal portion extending radially outward from the intersection portion and a vertical portion located at one end of the horizontal portion away from the intersection portion. A plurality of fixed bolts are correspondingly located at the lower ends of the plurality of vertical portions and can move up and down relative to the vertical portions. Each fixed bolt includes a fixed block and a first screw located at one end of the fixed block that can extend into the vertical portion. The outer diameter of the fixed block is larger than the outer diameter of the first screw. The side of the fixed block facing the first screw forms a bearing surface that can abut against the lower end face of the corresponding vertical portion.

5. A PIND test fixture as described in claim 2, characterized in that: The pressure-applying component includes a second screw threaded to the meeting portion, the second screw threaded to the axis of the meeting portion so that the pressure-applying component can move vertically relative to the meeting portion.

6. A PIND test fixture as described in claim 5, characterized in that: The pressure-applying component further includes a small end piece located at one end of the second screw along its length and having a diameter not greater than that of the second screw, and a large end piece located at the other end of the second screw along its length and having a diameter greater than that of the second screw.

7. A PIND test fixture as described in claim 6, characterized in that: The outer periphery of the small end is fitted with a first silicone sleeve, and the outer periphery of the large end is fitted with a second silicone sleeve.

8. A PIND test fixture as described in claim 7, characterized in that: The outer diameter of the first silicone sleeve is larger than the outer diameter of the second screw.

9. A fixing method, utilizing a PIND test fixture as described in claim 1, for fixing a semiconductor device to be tested onto a vibration device used for particle collision noise detection testing, characterized in that: The fixation method includes the following steps: S100: The pressure-applying component is mounted on the bracket; S200: Fix the bracket to the vibration equipment so that the vibration table of the vibration equipment is located within the receiving space; S300: Place the device under test at the center of the vibration table; S400: Adjust the vertical position of the pressure-applying component to apply pressure and fix it at the center position of the device under test.

10. The fixing method as described in claim 9, characterized in that: The bracket includes a junction and a plurality of fixed arms disposed on the outer periphery of the junction. Each fixed arm includes a horizontal portion extending radially outward from the junction and a vertical portion disposed at one end of the horizontal portion away from the junction. The lower ends of the plurality of vertical portions are provided with fixing bolts that can move up and down relative to the vertical portions. Each fixing bolt includes a fixing block and a first screw disposed at one end of the fixing block that can extend into the vertical portion. The outer diameter of the fixing block is larger than the outer diameter of the first screw. The side of the fixing block facing the first screw forms a bearing surface that can abut against the lower end face of the corresponding vertical portion. The connecting plate of the vibration device has a mounting groove for mounting the bracket. Each mounting groove includes a guide groove with a larger inner diameter and a fixing groove with a smaller inner diameter located on one side of the guide groove and communicating with it. Step S200 includes the following sub-steps: S210. Move the plurality of fixing bolts relative to the corresponding vertical parts so that there is a gap between the abutting surface and the lower end of the vertical part that is greater than the thickness of the connecting plate. S220. Move the bracket so that the fixing bolts extend from top to bottom into the corresponding guide grooves, and make the connecting plate horizontally aligned with the gap. S230. Rotate the bracket as a whole around its own axis, so that the first screws slide into the corresponding fixing grooves at the positions corresponding to the gaps. S240. Move the plurality of fixing bolts upward relative to the corresponding vertical parts, so that the abutting surface and the lower end surface of the vertical part together clamp the connecting plate.