Chip four-side detection method and device

Abstract

The application provides a chip four-face detection method. The chip four-face detection method comprises the following steps: obtaining coordinate information of a to-be-detected chip, an input platform module, an input arm module, a chip detection platform, an output arm module and an output platform module by a computer, calculating a motion path of the to-be-detected chip and each module, and controlling each module to move to the corresponding path to realize four-face detection of the to-be-detected chip. By using the method, four faces of the incoming chip are detected by different camera modules, and the four faces of the incoming chip are automatically detected in terms of dirt, scratches, gold layer peeling, edge collapse, damage and size of exposed heads, so that the yield of the chip is improved, and the working strength and difficulty of personnel are reduced.

Description

Technical Field

[0001] This application relates to the field of chip technology. More specifically, it relates to a method and apparatus for four-sided chip inspection. Background Technology

[0002] In electronics, a chip is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer. Mobile phones or camera devices also need chips to take pictures. Chips generally need to be inspected on their surface when they leave the factory to prevent defective products from leaving.

[0003] Existing chip appearance inspection methods fall into two categories. One involves personnel inspecting the chips using a microscope. However, manual inspection is not only inefficient, but also prone to causing visual fatigue due to the small size of the chips, leading to the release of defective products. The other method involves inspection equipment. Such equipment often has visual positioning but does not perform chip height or nozzle height detection. Because the chips are very small, the nozzles and vacuum holes are also very small. Therefore, the nozzle needs to be very close to the chip to pick up the product. However, the nozzle cannot touch the chip, as this would damage it. Therefore, when the carrier is deformed, the product has certain tolerances, or there are height differences after nozzle replacement, it is easy to have difficulty accurately controlling the suction height, resulting in the inability to pick up the chip or damaging it. At the same time, the inspection equipment vibrates during operation, which can cause the visual positioning device on the equipment to shake, resulting in blurry images taken by the camera and affecting the chip inspection. Summary of the Invention

[0004] To address the aforementioned technical problems, the first aspect of this application provides a method for four-sided chip inspection, comprising:

[0005] S1. Place the chip-containing infeed box at the fixed position of the infeed platform module, and move the infeed platform module to below the infeed positioning camera module; place the chip-discharge box at the fixed position of the discharge platform module.

[0006] S2. The feeding positioning camera module acquires the XY coordinate information of the first chip in the feeding placement box and sends the XY coordinate information of the first chip to the computer. The computer controls the feeding platform module to move according to the pre-stored coordinate information of the feeding suction cup in the feeding arm module, so that the first chip moves to directly below the feeding suction cup in the feeding arm module. The discharging positioning camera module acquires the coordinate information of the discharging placement box and sends the coordinate information of the discharging placement box to the computer.

[0007] S3. The feeding ARM module places the chip into the chip detection platform according to the control signal sent by the computer.

[0008] S4. The chip inspection platform moves the chip to be inspected to the area below the chip surface 4 inspection and positioning camera, completes the inspection of the chip surface 4 and obtains the coordinates A of the chip at this time, and sends the coordinates A to the computer.

[0009] S5. The computer calculates the required coordinates B for the chip surface 4 protrusion defect detection microscope group based on coordinates A and controls the chip detection platform to move to coordinates B to complete the detection of chip surface 4 protrusion defects.

[0010] S6. The computer calculates the required coordinates C of the chip surface 1 inspection microscope group based on coordinates B and controls the chip inspection platform to move to coordinates C to complete the inspection of the chip surface 1 to be inspected.

[0011] S7. The computer calculates the coordinates D required for the camera module to be inspected on chip surface 3 based on coordinate C and controls the chip inspection platform to move to coordinate D, thus completing the inspection of chip surface 3 to be inspected.

[0012] S8. The computer calculates the coordinates E required for the camera module to detect chip surface 2 based on coordinate D; the computer calculates the output coordinates F of the chip detection platform and the receiving coordinates G of the output arm module based on coordinate E; the computer controls the chip detection platform and the output arm module to move to coordinates F and G respectively, and the output suction cup in the output arm module picks up the chip to be detected and moves it to coordinate E to realize the detection of chip surface 2.

[0013] S9. The computer controls the discharge suction cup to place the chip under test in different areas of the discharge placement box based on the detection results of the four sides of the chip under test. This completes the four-side detection process of the chip under test.

[0014] S10. The computer calculates the infeed coordinates and infeed platform module coordinates of the next chip to be tested based on the spacing of each chip placement grid in the infeed placement box and the outfeed placement box, and repeats steps S2 to S9 until all chips to be tested are tested.

[0015] By using the above technical means to achieve automatic equipment testing, the dependence on operators is reduced and the accuracy of product testing is improved.

[0016] A second aspect of this application provides a chip four-sided inspection device, comprising: an outer casing module, a display module, an air purification module, a welding frame, a marble base, an infeed platform module, an infeed positioning camera module, an infeed ARM module, a four-sided inspection module, an outfeed ARM module, an outfeed positioning camera module, an outfeed platform module, and a marble crossbeam.

[0017] An air purification module is installed on the top of the outer casing module, and a display module is installed on one side of the outer casing module; a welding frame is set inside the outer casing module; a marble base is built on the welding frame; an infeed platform module, a four-sided detection module, an outfeed platform module, and a marble crossbeam are installed on the marble base; an infeed positioning camera module, an infeed ARM module, an outfeed ARM module, and an outfeed positioning camera module are installed on the marble crossbeam.

[0018] Specifically, the four-sided inspection module is installed on the central axis of the marble base and the marble crossbeam; the four-sided inspection module includes: a substrate, a vacuum unit, a chip surface 1 inspection microscope group, a first mounting column, a chip surface 4 protrusion defect inspection microscope group, a chip surface 4 inspection positioning camera, a chip inspection platform, a light source, a chip surface 3 inspection camera, a chip surface 2 inspection camera, and a second mounting column;

[0019] The substrate is equipped with a vacuum unit, a chip surface 1 inspection microscope group, a first mounting post, a chip surface 4 protrusion defect inspection microscope group, a chip surface 4 inspection positioning camera, a chip inspection platform, a light source, a chip surface 3 inspection camera, a chip surface 2 inspection camera, and a second mounting post.

[0020] With the above technical solution, the four-sided detection module is installed at the central axis of the marble base and the marble beam, so that the distance between the four-sided detection module and the infeed end and the outfeed end is the same, which is conducive to improving the synchronization of infeed and outfeed and the chip detection efficiency.

[0021] Specifically, the vacuum unit includes a vacuum gauge and a vacuum solenoid valve, and the vacuum unit is installed on one side of the substrate; the second mounting post is installed on the other side of the substrate; the first mounting post is installed on the substrate near the vacuum unit; the first mounting post is equipped with a chip surface 1 inspection microscope group, a chip surface 4 protrusion defect inspection microscope group, and a chip surface 4 inspection positioning camera; the chip inspection platform is located between the first and second mounting posts and is close to the first mounting post, and the chip inspection platform can move along the XYZ axes; the chip inspection platform is equipped with a light source and a chip surface 2 inspection camera; the upper end of the second mounting post is equipped with a chip surface 3 inspection camera.

[0022] Specifically, the outer casing module includes: an outer casing body and an alarm light; the alarm light is installed on the top of the outer casing body and viewing windows are opened on multiple sides of the outer casing body; an operation button is set below the viewing window on one side of the outer casing body; the viewing window is used to observe the chip detection process; the outer casing module ensures the environmental quality inside the equipment, prevents the working environment from polluting the internal environment of the equipment, improves the cleanliness inside the equipment, and improves the product yield.

[0023] Specifically, the display module includes: monitor, mouse, and keyboard.

[0024] With the above solution, users can directly observe the chip detection status through a visual window, and can send commands to the computer through the display module to adjust the operation of the chip detection device.

[0025] Specifically, a buffer rubber is installed between the welding frame and the marble base to absorb the vibration of the iron frame and prevent the detection module from malfunctioning due to the vibration of the iron frame.

[0026] Specifically, the feeding positioning camera module includes: a feeding positioning camera module crossbeam support, a feeding positioning camera, a feeding positioning light source, and a feeding positioning camera adjustment unit; one end of the feeding positioning camera module crossbeam support is fixedly connected to a marble crossbeam, and the feeding positioning camera crossbeam is also provided with reinforcing ribs; one end of the feeding positioning camera adjustment unit is fixedly connected to the other end of the marble crossbeam, and the other end of the feeding positioning camera adjustment unit is equipped with a feeding positioning camera, and the feeding positioning camera adjustment unit controls the feeding positioning camera to achieve XYZ three-axis movement; a feeding positioning light source is installed at the lower end of the feeding positioning camera.

[0027] Specifically, the feeding positioning camera includes: a positioning camera, a lens clamping device, and a positioning camera lens; the upper end of the lens clamping device is connected to the positioning camera, and the lower end is connected to the positioning camera lens; the feeding positioning camera adjustment unit includes: a feeding positioning camera adjustment platform, an X-axis adjustment mechanism, an X-axis adjustment bolt, a Y-axis adjustment mechanism, a Y-axis position adjustment handwheel, a Y-axis position fixing handwheel, a Z-axis adjustment mechanism, a Z-axis position adjustment handwheel, and a Z-axis position fixing handwheel; the X-axis adjustment mechanism, Y-axis adjustment mechanism, and Z-axis adjustment mechanism are respectively installed in the XYZ directions of the feeding positioning camera adjustment platform; the X-axis adjustment mechanism is installed on the X-axis adjustment mechanism. The X-axis adjusting bolt passes through the X-axis adjusting mechanism and extends into the feeding positioning camera adjusting platform to adjust the X-axis movement of the feeding positioning camera. The Y-axis adjusting mechanism is equipped with a Y-axis position fixing handwheel and a Y-axis position adjusting handwheel. The Y-axis position adjusting handwheel is used to adjust the Y-axis movement of the feeding positioning camera; the Y-axis position fixing handwheel is used to fix the feeding positioning camera's position in the Y-axis. The Z-axis adjusting mechanism is equipped with a Z-axis position fixing handwheel and a Z-axis position adjusting handwheel. The Z-axis position adjusting handwheel is used to adjust the Z-axis movement of the feeding positioning camera; the Z-axis position fixing handwheel is used to fix the feeding positioning camera's position in the Z-axis.

[0028] Through the above technical solution, the feeding platform module moves with the chip placement box containing the chip. Through the movement of the X and Y axis slides of the feeding platform module, the chip is transported to the area below the feeding camera. By adjusting the position of the feeding camera's three-axis adjustment platform, the camera can clearly capture images of the chip.

[0029] Specifically, the discharge positioning camera module includes: a discharge positioning camera beam support, a discharge positioning camera, a discharge positioning camera light source, and a discharge positioning camera adjustment unit; one end of the discharge positioning camera beam support is fixedly connected to the marble beam and a reinforcing rib is provided on the discharge positioning camera beam; one end of the discharge positioning camera adjustment unit is fixedly connected to the other end of the marble beam, and the other end of the discharge positioning camera adjustment unit is equipped with the discharge positioning camera and the discharge positioning camera adjustment unit controls the discharge positioning camera to achieve XYZ three-axis movement; a discharge positioning camera light source is installed at the lower end of the discharge positioning camera.

[0030] Specifically, the discharge positioning camera includes: a positioning camera, a lens clamping device, and a positioning camera lens; the upper end of the lens clamping device is connected to the positioning camera, and the lower end is connected to the positioning camera lens; the discharge positioning camera adjustment unit includes: a discharge positioning camera adjustment platform, an X-axis adjustment mechanism, an X-axis adjustment bolt, a Y-axis adjustment mechanism, a Y-axis position adjustment handwheel, a Y-axis position fixing handwheel, a Z-axis adjustment mechanism, a Z-axis position adjustment handwheel, and a Z-axis position fixing handwheel; the X-axis adjustment mechanism, Y-axis adjustment mechanism, and Z-axis adjustment mechanism are respectively installed in the XYZ directions of the discharge positioning camera adjustment platform; the X-axis adjustment mechanism is installed on the X-axis adjustment mechanism. The X-axis adjusting bolt passes through the X-axis adjusting mechanism and extends into the discharge positioning camera adjusting platform to adjust the X-axis movement of the discharge positioning camera. The Y-axis adjusting mechanism is equipped with a Y-axis position fixing handwheel and a Y-axis position adjusting handwheel. The Y-axis position adjusting handwheel is used to adjust the Y-axis movement of the discharge positioning camera; the Y-axis position fixing handwheel is used to fix the discharge positioning camera's position in the Y-axis. The Z-axis adjusting mechanism is equipped with a Z-axis position fixing handwheel and a Z-axis position adjusting handwheel. The Z-axis position adjusting handwheel is used to adjust the Z-axis movement of the discharge positioning camera; the Z-axis position fixing handwheel is used to fix the discharge positioning camera's position in the Z-axis.

[0031] Through the above technical solution, the unloading platform module moves with the chip placement box containing the chip. Through the movement of the X and Y axis slides of the unloading platform module, the chip is conveyed to the area below the unloading camera. By adjusting the position of the unloading camera's three-axis adjustment platform, the camera can clearly capture images of the chip.

[0032] Specifically, the feeding ARM module includes: a suction cup, a cable chain sheet metal, a feeding ARM reader, a grating ruler, limit blocks, a Z-axis position sensor, a Z-axis module, an X-axis linear motor, and a feeding ARM X-axis motion unit; the feeding ARM X-axis motion unit is installed on the top of the marble beam; the feeding ARM X-axis motion unit consists of a U-shaped track and an X-axis cable chain arranged within the U-shaped track; the cable chain sheet metal is an irregularly shaped part, one end of which is connected to the X-axis cable chain and moves along the X-axis along the X-axis; the Z-axis module is fixedly connected to the other end of the cable chain sheet metal; the Z-axis position sensor is installed on one side of the Z-axis module; the suction cup is installed at the front end of the Z-axis module via a suction cup mounting bracket; limit blocks are installed on both sides of the rear end of the Z-axis module, and an X-axis linear motor is installed at the rear end of the Z-axis module; a grating ruler is installed above the X-axis motor; the feeding ARM reader is installed in the space formed by the cable chain sheet metal, the grating ruler, and the Z-axis module.

[0033] Specifically, the discharge ARM module includes: a suction cup, a cable chain sheet metal, a discharge ARM reader, a grating ruler, limit blocks, a Z-axis position sensor, a Z-axis module, an X-axis linear motor, and a discharge ARM X-axis motion unit. The discharge ARM X-axis motion unit is installed on the top of the marble beam. The discharge ARM X-axis motion unit consists of a U-shaped track and an X-axis cable chain arranged within the U-shaped track. The cable chain sheet metal is an irregularly shaped part, with one end connected to the X-axis cable chain and moving along the X-axis along the X-axis. The Z-axis module is fixed to the other end of the cable chain sheet metal. The Z-axis position sensor is installed on one side of the Z-axis module. The suction cup is installed at the front end of the Z-axis module via a suction cup mounting bracket. Limit blocks are installed on both sides of the rear end of the Z-axis module, and an X-axis linear motor is installed at the rear end of the Z-axis module. A grating ruler is installed above the X-axis motor. The discharge ARM reader is installed in the space formed by the cable chain sheet metal, the grating ruler, and the Z-axis module.

[0034] Specifically, the feeding platform module includes: a chip placement box, a vacuum platform, an X-axis motion mechanism for the feeding platform, a Y-axis motion mechanism for the feeding platform, an X-axis position sensor for the feeding platform, and a Y-axis position sensor for the feeding platform; the X-axis motion mechanism for the feeding platform is mounted on the Y-axis motion mechanism for the feeding platform, and the Y-axis position sensor for the feeding platform is mounted below the Y-axis motion mechanism for the feeding platform; a vacuum platform is mounted on the X-axis motion mechanism for the feeding platform, and the X-axis position sensor for the feeding platform is mounted on one side of the X-axis motion mechanism for the feeding platform; multiple accommodating spaces for placing the chip placement box are provided on the vacuum platform.

[0035] Specifically, the unloading platform module includes: a chip placement box, a vacuum platform, an X-axis motion mechanism for the unloading platform, a Y-axis motion mechanism for the unloading platform, an X-axis position sensor for the unloading platform, and a Y-axis position sensor for the unloading platform; the X-axis motion mechanism for the unloading platform is mounted on the Y-axis motion mechanism for the unloading platform, and the Y-axis position sensor for the unloading platform is mounted below the Y-axis motion mechanism for the unloading platform; a vacuum platform is mounted on the X-axis motion mechanism for the unloading platform, and the X-axis position sensor for the unloading platform is mounted on one side of the X-axis motion mechanism for the unloading platform; multiple accommodating spaces for placing the chip placement box are provided on the vacuum platform.

[0036] The beneficial effects of this application are as follows:

[0037] 1. It enables automatic inspection of all four sides of the chip, improving product yield, reducing production costs, and increasing company profits;

[0038] 2. It enables automatic equipment testing, reducing reliance on operators and improving the accuracy of product testing;

[0039] 3. It reduces the workload and difficulty for operators. Attached Figure Description

[0040] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of this application. Other embodiments and many anticipated advantages of these embodiments will be readily recognized as they become better understood through reference to the following detailed description. Elements in the drawings are not necessarily to scale. The same reference numerals refer to corresponding similar parts.

[0041] Figure 1 This is a flowchart of a chip four-sided inspection method according to an embodiment of this application;

[0042] Figure 2 This is a schematic diagram of the external structure of a chip four-sided detection device according to an embodiment of this application;

[0043] Figure 3 This is a schematic diagram of the internal main structure of a chip four-sided detection device according to an embodiment of this application;

[0044] Figure 4 This is a partial enlarged view of the welding frame and marble base in a chip four-sided inspection device according to an embodiment of this application;

[0045] Figure 5 This is a schematic diagram of the feeding positioning camera module of a chip four-sided detection device according to an embodiment of this application;

[0046] Figure 6This is a schematic diagram of the feeding positioning camera of a chip four-sided detection device according to an embodiment of this application;

[0047] Figure 7 This is a schematic diagram of the structure of a chip four-sided detection device's discharge positioning camera module according to an embodiment of this application;

[0048] Figure 8 This is a schematic diagram of the feeding ARM module structure of a chip four-sided inspection device according to an embodiment of this application;

[0049] Figure 9 This is a chip four-sided inspection device according to an embodiment of this application. Material platform module Structural diagram;

[0050] Figure 10 This is a schematic diagram of the structure of a four-sided detection module of a chip four-sided detection device according to an embodiment of this application.

[0051] The meaning of each number in the diagram:

[0052] 1. Outer casing module; 2. Air purification module; 3. Display module; 4. Welding frame; 5. Marble base; 6. Feeding platform module; 7. Feeding positioning camera module; 8. Feeding ARM module; 9. Four-sided detection module; 10. Discharge ARM module; 11. Discharge positioning camera module; 12. Marble crossbeam; 13. Discharge platform module; 14. Buffer rubber; 1a. Alarm light; 1b. Viewing window; 1c. Operation button; 6a. Feeding platform X-axis position sensor; 6b. Chip placement box; 6c. Feeding platform X-axis position sensor; Y-axis motion mechanism; 6d, vacuum platform; 6e, Y-axis motion mechanism of feeding platform; 6f, Y-axis position sensor of feeding platform; 7a, crossbeam bracket of feeding positioning camera module; 7b, adjusting unit of feeding positioning camera; 7c, lens of feeding positioning camera; 7d, light source of feeding positioning camera; 7e, lens clamping device; 7f, positioning camera; 7b1, cross roller bearing; 7b2, X-axis adjustment mechanism; 7b3, X-axis adjustment bolt; 7b4, adjusting platform of feeding positioning camera; 7b5, spring; 7b6, cross roller bearing; 7b7, Y-axis position adjustment handwheel; 7b8, Y-axis position fixing handwheel; 7b9, Y-axis adjustment mechanism; 7b10, Z-axis adjustment mechanism; 7b11, Z-axis position fixing handwheel; 7b12, Z-axis position adjustment handwheel; 11a, discharge positioning camera module crossbeam bracket; 11b, discharge positioning camera; 11c, lens clamping device; 11d, discharge positioning camera lens; 11e, discharge positioning camera light source; 11f, discharge positioning camera adjustment unit; 8a, suction cup; 8b, suction cup mounting bracket; 8c, limit block; 8d 8e. Cable chain sheet metal; 8f. Feed ARM reader; 8g. Grating ruler; 8h. X-axis linear motor; 8i. Limit block; 8j. Z-axis position sensor; 8a. Z-axis module; 9b. Chip surface 2 inspection camera; 9c. Vacuum solenoid valve; 9d. Vacuum gauge; 9e. Chip surface 1 inspection microscope group; 9f. First mounting column; 9g. Chip surface 4 protrusion defect inspection microscope group; 9h. Chip surface 4 inspection positioning camera; 9j. Chip inspection platform; 9k. Chip surface 3 inspection camera; 9j. Substrate; 9k. Second mounting column. Detailed Implementation

[0053] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description and illustrate illustrative specific embodiments in which the present application may be practiced. In this regard, directional terms such as “top,” “bottom,” “left,” “right,” “up,” “down,” etc., are used with reference to the orientation of the described figures. Because components of the embodiments can be positioned in several different orientations, directional terms are used for illustrative purposes and are by no means limiting. It should be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the present application is defined by the appended claims.

[0054] Figure 1 This is a flowchart of a chip four-sided inspection method according to an embodiment of this application, such as... Figure 1 The aforementioned chip four-sided inspection method includes:

[0055] S1. Place the chip-containing infeed box at the fixed position of the infeed platform module, and move the infeed platform module to below the infeed positioning camera module; place the chip-discharge box at the fixed position of the discharge platform module.

[0056] S2. The feeding positioning camera module acquires the XY coordinate information of the first chip in the feeding placement box and sends the XY coordinate information of the first chip to the computer. The computer controls the feeding platform module to move according to the pre-stored coordinate information of the feeding suction cup in the feeding arm module, so that the first chip moves to directly below the feeding suction cup in the feeding arm module. The discharging positioning camera module acquires the coordinate information of the discharging placement box and sends the coordinate information of the discharging placement box to the computer.

[0057] S3. The feeding ARM module places the chip into the chip detection platform according to the control signal sent by the computer.

[0058] S4. The chip inspection platform moves the chip to be inspected to the area below the chip surface 4 inspection and positioning camera, completes the inspection of the chip surface 4 and obtains the coordinates A of the chip at this time, and sends the coordinates A to the computer.

[0059] S5. The computer calculates the required coordinates B for the chip surface 4 protrusion defect detection microscope group based on coordinates A and controls the chip detection platform to move to coordinates B to complete the detection of chip surface 4 protrusion defects.

[0060] S6. The computer calculates the required coordinates C of the chip surface 1 inspection microscope group based on coordinates B and controls the chip inspection platform to move to coordinates C to complete the inspection of the chip surface 1 to be inspected.

[0061] S7. The computer calculates the coordinates D required for the camera module to be inspected on chip surface 3 based on coordinate C and controls the chip inspection platform to move to coordinate D, thus completing the inspection of chip surface 3 to be inspected.

[0062] S8. The computer calculates the coordinates E required for the camera module to detect chip surface 2 based on coordinate D; the computer calculates the output coordinates F of the chip detection platform and the receiving coordinates G of the output arm module based on coordinate E; the computer controls the chip detection platform and the output arm module to move to coordinates F and G respectively, and the output suction cup in the output arm module picks up the chip to be detected and moves it to coordinate E to realize the detection of chip surface 2.

[0063] S9. The computer controls the discharge suction cup to place the chip under test in different areas of the discharge placement box based on the detection results of the four sides of the chip under test. This completes the four-side detection process of the chip under test.

[0064] S10. The computer calculates the infeed coordinates and infeed platform module coordinates of the next chip to be tested based on the spacing of each chip placement grid in the infeed placement box and the outfeed placement box, and repeats steps S2 to S9 until all chips to be tested are tested.

[0065] like Figures 2 to 10 As shown, since the infeed and discharge device structures of this invention are symmetrical, the structural schematic diagrams of the discharge positioning camera, discharge arm module, and discharge arm module are omitted in this drawing. Material platform module Structural diagram;

[0066] Specifically, this device includes: outer cover module 1, display module 3, air purification module 2, welding frame 4, marble base 5, feeding platform module 6, feeding positioning camera 7f module 7, feeding arm module 8, four-sided detection module 9, discharging arm module 10, discharging positioning camera 11b7f module 11, discharging platform module 13, and marble crossbeam 12;

[0067] An air purification module 2 is installed on the top of the outer cover module 1, and a display module 3 is installed on one side of the outer cover module 1; a welding frame 4 is set inside the outer cover module 1; a marble base 5 is built on the welding frame 4; an infeed platform module 6, a four-sided detection module 9, an outfeed platform module 13, and a marble crossbeam 12 are installed on the marble base 5; an infeed positioning camera module 7, an infeed arm module 8, an outfeed arm module 10, and an outfeed positioning camera module 11 are installed on the marble crossbeam 12.

[0068] The four-sided inspection module 9 is installed at the central axis of the marble base 5 and the marble beam 12; the four-sided inspection module 9 includes: a substrate 9j, a vacuum unit, a chip surface 1 inspection microscope group 9d, a first mounting column 9e, a chip surface 4 protrusion defect inspection microscope group 9f, a chip surface 4 inspection positioning camera 9g, a chip inspection platform 9h, a light source, a chip surface 3 inspection camera 9i, a chip surface 2 inspection camera 9a, and a second mounting column 9k;

[0069] The substrate 9j is equipped with a vacuum unit, a chip surface 1 inspection microscope group 9d, a first mounting post 9e, a chip surface 4 protrusion defect inspection microscope group 9f, a chip surface 4 inspection positioning camera 9g, a chip inspection platform 9h, a light source, a chip surface 3 inspection camera 9i, a chip surface 2 inspection camera 9a, and a second mounting post 9k.

[0070] The vacuum unit includes a vacuum gauge 9c and a vacuum solenoid valve, and is mounted on one side of the substrate 9j; the second mounting post 9k is mounted on the other side of the substrate 9j; the first mounting post 9e is mounted on the substrate 9j near the vacuum unit; the first mounting post 9e is equipped with a chip surface 1 inspection microscope group 9d, a chip surface 4 protrusion defect inspection microscope group 9f, and a chip surface 4 inspection positioning camera 9g; the chip inspection platform 9h is located between the first mounting post 9e and the second mounting post 9k and is close to the first mounting post 9e, and the chip inspection platform 9h can move along the XYZ axes; the chip inspection platform 9h is equipped with a light source and a chip surface 2 inspection camera 9a; the upper end of the second mounting post 9k is equipped with a chip surface 3 inspection camera 9i.

[0071] The outer casing module 1 includes: an outer casing body and an alarm light 1a; the alarm light 1a is installed on the top of the outer casing body and viewing windows 1b are opened on multiple sides of the outer casing body; an operation button 1c is provided below the viewing window 1b on one side of the outer casing body; the viewing window 1b is used to observe the chip detection process.

[0072] Display module 3 includes: a monitor, a mouse, and a keyboard.

[0073] A buffer rubber 14 is provided between the welding frame 4 and the marble base 5.

[0074] The feeding positioning camera module 7 includes: a crossbeam support for the feeding positioning camera module 7, a feeding positioning camera 7f, a feeding positioning light source, and a feeding positioning camera adjustment unit 7b; one end of the crossbeam support for the feeding positioning camera 7f is fixedly connected to the marble crossbeam 12, and the crossbeam of the feeding positioning camera 7f is also provided with reinforcing ribs; one end of the feeding positioning camera adjustment unit 7b is fixedly connected to the other end of the marble crossbeam 12, and the other end of the feeding positioning camera adjustment unit 7b is equipped with the feeding positioning camera 7f, and the feeding positioning camera adjustment unit 7b controls the feeding positioning camera 7f to achieve XYZ three-axis movement; a feeding positioning light source is installed at the lower end of the feeding positioning camera 7f.

[0075] The feeding positioning camera 7f includes: a positioning camera 7f, a lens clamping device 7e, and a lens of the positioning camera 7f; the upper end of the lens clamping device 7e is connected to the positioning camera 7f, and the lower end is connected to the lens of the positioning camera 7f; the feeding positioning camera 7f adjustment unit 7b includes: a feeding positioning camera 7f adjustment platform, an X-axis adjustment mechanism 7b2, an X-axis adjustment bolt 7b3, a Y-axis adjustment mechanism 7b9, a Y-axis position adjustment handwheel 7b7, a Y-axis position fixing handwheel 7b8, a Z-axis adjustment mechanism 7b10, a Z-axis position adjustment handwheel 7b12, and a Z-axis position fixing handwheel 7b11; the X-axis adjustment mechanism 7b2, the Y-axis adjustment mechanism 7b9, and the Z-axis adjustment mechanism 7b10 are respectively installed in the XYZ directions of the feeding positioning camera 7f adjustment platform; the X-axis adjustment mechanism 7b2 is mounted on the X-axis adjustment mechanism 7b2. An X-axis adjusting bolt 7b3 passes through the X-axis adjusting mechanism 7b2 and extends into the adjusting platform of the feeding positioning camera 7f to adjust the X-axis movement of the feeding positioning camera 7f. A Y-axis adjusting mechanism 7b9 is equipped with a Y-axis position fixing handwheel 7b8 and a Y-axis position adjusting handwheel 7b7. The Y-axis position adjusting handwheel 7b7 is used to adjust the Y-axis movement of the feeding positioning camera 7f; the Y-axis position fixing handwheel 7b8 is used to fix the position of the feeding positioning camera 7f in the Y-axis. A Z-axis adjusting mechanism 7b10 is equipped with a Z-axis position fixing handwheel 7b11 and a Z-axis position adjusting handwheel 7b12. The Z-axis position adjusting handwheel 7b12 is used to adjust the Z-axis movement of the feeding positioning camera 7f; the Z-axis position fixing handwheel 7b11 is used to fix the position of the feeding positioning camera 7f in the Z-axis.

[0076] The discharge positioning camera module 11 includes: a discharge positioning camera module crossbeam support 11a, a discharge positioning camera 11b, a discharge positioning camera light source 11e, and a discharge positioning camera adjustment unit 11f; one end of the discharge positioning camera module crossbeam support 11a is fixedly connected to the marble crossbeam 12, and a reinforcing rib is also provided on the discharge positioning camera module crossbeam support 11a; one end of the discharge positioning camera adjustment unit 11f is fixedly connected to the other end of the marble crossbeam 12, and the discharge positioning camera 11b is installed on the other end of the discharge positioning camera adjustment unit 11f, and the discharge positioning camera adjustment unit 11f controls the discharge positioning camera 11b to achieve XYZ three-axis movement; the lower end of the discharge positioning camera 11b is equipped with the discharge positioning camera light source 11e.

[0077] The discharge positioning camera includes: a positioning camera, a lens clamping device, and a positioning camera lens; the upper end of the lens clamping device is connected to the positioning camera, and the lower end is connected to the positioning camera lens; the discharge positioning camera adjustment unit includes: a discharge positioning camera adjustment platform, an X-axis adjustment mechanism, an X-axis adjustment bolt, a Y-axis adjustment mechanism, a Y-axis position adjustment handwheel, a Y-axis position fixing handwheel, a Z-axis adjustment mechanism, a Z-axis position adjustment handwheel, and a Z-axis position fixing handwheel; the X-axis adjustment mechanism, Y-axis adjustment mechanism, and Z-axis adjustment mechanism are respectively installed in the XYZ directions of the discharge positioning camera adjustment platform; the X-axis adjustment mechanism is installed on the X-axis adjustment mechanism. Bolts are used to adjust the X-axis position. An X-axis adjusting bolt passes through the X-axis adjusting mechanism and extends into the discharge positioning camera adjusting platform to adjust the X-axis movement of the discharge positioning camera. A Y-axis position fixing handwheel and a Y-axis position adjusting handwheel are installed on the Y-axis adjusting mechanism. The Y-axis position adjusting handwheel is used to adjust the Y-axis movement of the discharge positioning camera, and the Y-axis position fixing handwheel is used to fix the discharge positioning camera's position in the Y-axis. Similarly, a Z-axis position fixing handwheel and a Z-axis position adjusting handwheel are installed on the Z-axis adjusting mechanism. The Z-axis position adjusting handwheel is used to adjust the Z-axis movement of the discharge positioning camera, and the Z-axis position fixing handwheel is used to fix the discharge positioning camera's position in the Z-axis.

[0078] The feeding arm module 8 includes: a suction cup 8a, a cable chain sheet metal 8d, a feeding arm reader 8e, a grating ruler 8f, limit blocks (8h, 8c), a Z-axis position sensor 8i, a Z-axis module 8j, an X-axis linear motor 8g, and a feeding arm X-axis motion unit; the feeding arm X-axis motion unit is installed on the top of the marble beam 12; the feeding arm X-axis motion unit consists of a U-shaped track and an X-axis cable chain arranged within the U-shaped track; the cable chain sheet metal 8d is an irregularly shaped part, one end of which is connected to the X-axis cable chain and follows the X-axis cable chain. The chain moves along the X-axis; the Z-axis module 8j is fixedly connected to the other end of the cable chain sheet metal 8d; the Z-axis position sensor 8i is installed on one side of the Z-axis module 8j; the suction cup 8a is installed at the front end of the Z-axis module 8j through the suction cup 8a mounting bracket; limit blocks 8h8c are installed on both sides of the rear end of the Z-axis module 8j, and the X-axis linear motor 8g is installed at the rear end of the Z-axis module 8j; the grating ruler 8f is installed above the X-axis linear motor 8g; the feed arm reader 8e is installed in the space formed by the cable chain sheet metal 8d, the grating ruler 8f and the Z-axis module 8j.

[0079] The discharge ARM module includes: a suction cup, a cable chain sheet metal, a discharge ARM reader, a grating ruler, limit blocks, a Z-axis position sensor, a Z-axis module, an X-axis linear motor, and a discharge ARM X-axis motion unit. The discharge ARM X-axis motion unit is installed on the top of the marble beam. The discharge ARM X-axis motion unit consists of a U-shaped track and an X-axis cable chain arranged within the U-shaped track. The cable chain sheet metal is an irregularly shaped part, with one end connected to the X-axis cable chain and moving along the X-axis along the X-axis. The Z-axis module is fixed to the other end of the cable chain sheet metal. The Z-axis position sensor is installed on one side of the Z-axis module. The suction cup is installed at the front end of the Z-axis module via a suction cup mounting bracket. Limit blocks are installed on both sides of the rear end of the Z-axis module, and an X-axis linear motor is installed at the rear end of the Z-axis module. A grating ruler is installed above the X-axis motor. The discharge ARM reader is installed in the space formed by the cable chain sheet metal, the grating ruler, and the Z-axis module.

[0080] The feeding platform module 6 includes: a chip placement box 6b, a vacuum platform 6d, a feeding platform X-axis motion mechanism 6c, a feeding platform Y-axis motion mechanism 6e, a feeding platform X-axis position sensor 6a, and a feeding platform Y-axis position sensor 6f; the feeding platform X-axis motion mechanism 6c is mounted on the feeding platform Y-axis motion mechanism 6e, and the feeding platform Y-axis position sensor 6f is mounted below the feeding platform Y-axis motion mechanism 6e; the vacuum platform 6d is mounted on the feeding platform X-axis motion mechanism 6c, and the feeding platform X-axis position sensor 6a is mounted on one side of the feeding platform X-axis motion mechanism 6c; the vacuum platform 6d has multiple accommodating spaces for placing the chip placement box 6b.

[0081] The unloading platform module includes: a chip placement box, a vacuum platform, an X-axis motion mechanism for the unloading platform, a Y-axis motion mechanism for the unloading platform, an X-axis position sensor for the unloading platform, and a Y-axis position sensor for the unloading platform. The X-axis motion mechanism for the unloading platform is mounted on the Y-axis motion mechanism for the unloading platform, and the Y-axis position sensor for the unloading platform is mounted below the Y-axis motion mechanism for the unloading platform. The vacuum platform has multiple accommodating spaces for placing the chip placement box.

[0082] It is obvious that those skilled in the art can make various modifications and alterations to the embodiments of this application without departing from the spirit and scope of this application. In this way, this application also aims to cover such modifications and alterations if they fall within the scope of the claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not indicate that a combination of these measures cannot be used for profit. Any reference numerals in the claims should not be considered limiting in scope.

Claims

1. A method for detecting four sides of a chip, characterized in that, include: S1. Place the chip-containing infeed box at the fixed position of the infeed platform module, and move the infeed platform module to below the infeed positioning camera module; place the chip-discharge box at the fixed position of the discharge platform module. S2. The feeding positioning camera module acquires the XY coordinate information of the first chip in the feeding placement box and sends the XY coordinate information of the first chip to the computer. The computer controls the feeding platform module to move according to the pre-stored coordinate information of the feeding suction cup in the feeding arm module, so that the first chip moves to directly below the feeding suction cup in the feeding arm module. The discharging positioning camera module acquires the coordinate information of the discharging placement box and sends the coordinate information of the discharging placement box to the computer. S3. The feeding ARM module places the chip into the chip detection platform according to the control signal sent by the computer. S4. The chip inspection platform moves the chip to be inspected to the area below the chip surface 4 inspection and positioning camera, completes the inspection of the chip surface 4 and obtains the coordinates A of the chip at this time, and sends the coordinates A to the computer. S5. The computer calculates the required coordinates B for the chip surface 4 protrusion defect detection microscope group based on coordinates A and controls the chip detection platform to move to coordinates B to complete the detection of chip surface 4 protrusion defects. S6. The computer calculates the required coordinates C of the chip surface 1 inspection microscope group based on coordinates B and controls the chip inspection platform to move to coordinates C to complete the inspection of the chip surface 1 to be inspected. S7. The computer calculates the coordinates D required for the camera module to be inspected on chip surface 3 based on coordinate C and controls the chip inspection platform to move to coordinate D, thus completing the inspection of chip surface 3 to be inspected. S8. The computer calculates the coordinates E required for the camera module to detect chip surface 2 based on coordinate D; the computer calculates the output coordinates F of the chip detection platform and the receiving coordinates G of the output arm module based on coordinate E; the computer controls the chip detection platform and the output arm module to move to coordinates F and G respectively, and the output suction cup in the output arm module picks up the chip to be detected and moves it to coordinate E to realize the detection of chip surface 2. S9. The computer controls the discharge suction cup to place the chip under test in different areas of the discharge placement box based on the detection results of the four sides of the chip under test. This completes the four-side detection process of the chip under test. S10. The computer calculates the infeed coordinates and infeed platform module coordinates of the next chip to be tested based on the spacing of each chip placement grid in the infeed placement box and the outfeed placement box, and repeats steps S2 to S9 until all chips to be tested are tested.

2. A chip four-sided inspection device, characterized in that, When the device is executed by computer control, it implements the method described in claim 1. A chip four-sided inspection device includes: an outer cover module, a display module, an air purification module, a welding frame, a marble base, an infeed platform module, an infeed positioning camera module, an infeed arm module, a four-sided inspection module, an outfeed arm module, an outfeed positioning camera module, an outfeed platform module, and a marble crossbeam. An air purification module is installed on the top of the outer cover module, and a display module is installed on one side of the outer cover module; the welding frame is located inside the outer cover module; the marble base is built on the welding frame; the feeding platform module, the four-sided detection module, the discharging platform module, and the marble crossbeam are installed on the marble base; the feeding positioning camera module, the feeding arm module, the discharging arm module, and the discharging positioning camera module are installed on the marble crossbeam; The four-sided inspection module is installed at the central axis of the marble base and the marble crossbeam; the four-sided inspection module includes: a substrate, a vacuum unit, a chip surface 1 inspection microscope group, a first mounting column, a chip surface 4 protrusion defect inspection microscope group, a chip surface 4 inspection positioning camera, a chip inspection platform, a light source, a chip surface 3 inspection camera, a chip surface 2 inspection camera, and a second mounting column. The substrate is equipped with a vacuum unit, a chip surface 1 inspection microscope group, a first mounting post, a chip surface 4 protrusion defect inspection microscope group, a chip surface 4 inspection positioning camera, a chip inspection platform, a light source, a chip surface 3 inspection camera, a chip surface 2 inspection camera, and a second mounting post.

3. The chip four-sided inspection device according to claim 2, characterized in that, The vacuum unit includes a vacuum gauge and a vacuum solenoid valve, and the vacuum unit is installed on one side of the substrate; the second mounting post is installed on the other side of the substrate; the first mounting post is installed on the substrate near the vacuum unit; the first mounting post is equipped with the chip surface 1 inspection microscope group, the chip surface 4 protrusion defect inspection microscope group, and the chip surface 4 inspection positioning camera; the chip inspection platform is disposed between the first mounting post and the second mounting post and is close to the first mounting post, and the chip inspection platform is movable along the XYZ axes; the chip inspection platform is equipped with the light source and the chip surface 2 inspection camera; the upper end of the second mounting post is equipped with the chip surface 3 inspection camera.

4. The chip four-sided inspection device according to claim 2, characterized in that, The outer casing module includes: an outer casing body and an alarm light; the alarm light is installed on the top of the outer casing body and viewing windows are opened on multiple sides of the outer casing body; an operation button is provided below the viewing window on one side of the outer casing body; the viewing window is used to observe the chip detection process.

5. A chip four-sided inspection device according to claim 2, characterized in that, The display module includes a monitor, a mouse, and a keyboard.

6. The chip four-sided inspection device according to claim 2, characterized in that, A cushioning rubber is provided between the welding frame and the marble base.

7. A chip four-sided inspection device according to claim 2, characterized in that, The feeding positioning camera module includes: a feeding positioning camera module crossbeam support, a feeding positioning camera, a feeding positioning light source, and a feeding positioning camera adjustment unit; one end of the feeding positioning camera module crossbeam support is fixedly connected to the marble crossbeam, and the feeding positioning camera crossbeam is also provided with reinforcing ribs; one end of the feeding positioning camera adjustment unit is fixedly connected to the other end of the feeding positioning camera module crossbeam support, the other end of the feeding positioning camera adjustment unit is equipped with the feeding positioning camera, and the feeding positioning camera adjustment unit controls the feeding positioning camera to achieve XYZ three-axis movement; the feeding positioning light source is installed at the lower end of the feeding positioning camera.

8. A chip four-sided inspection device according to claim 7, characterized in that, The feeding positioning camera includes: a positioning camera, a lens clamping device, and a positioning camera lens; the upper end of the lens clamping device is connected to the positioning camera, and the lower end is connected to the positioning camera lens; the feeding positioning camera adjustment unit includes: a feeding positioning camera adjustment platform, an X-axis adjustment mechanism, an X-axis adjustment bolt, a Y-axis adjustment mechanism, a Y-axis position adjustment handwheel, a Y-axis position fixing handwheel, a Z-axis adjustment mechanism, a Z-axis position adjustment handwheel, and a Z-axis position fixing handwheel; the X-axis adjustment mechanism, the Y-axis adjustment mechanism, and the Z-axis adjustment mechanism are respectively installed in the XYZ directions of the feeding positioning camera adjustment platform; the X-axis adjustment bolt is installed on the X-axis adjustment mechanism, and the X-axis... An adjusting bolt passes through the X-axis adjusting mechanism and extends into the feed positioning camera adjusting platform to adjust the X-axis movement of the feed positioning camera; a Y-axis position fixing handwheel and a Y-axis position adjusting handwheel are installed on the Y-axis adjusting mechanism; the Y-axis position adjusting handwheel is used to adjust the Y-axis movement of the feed positioning camera; the Y-axis position fixing handwheel is used to fix the position of the feed positioning camera in the Y-axis; a Z-axis adjusting mechanism is installed with a Z-axis position fixing handwheel and a Z-axis position adjusting handwheel; the Z-axis position adjusting handwheel is used to adjust the Z-axis movement of the feed positioning camera; the Z-axis position fixing handwheel is used to fix the position of the feed positioning camera in the Z-axis.

9. A chip four-sided inspection device according to claim 2, characterized in that, The discharge positioning camera module includes: a discharge positioning camera beam support, a discharge positioning camera, a discharge positioning camera light source, and a discharge positioning camera adjustment unit; one end of the discharge positioning camera beam support is fixedly connected to the marble beam and the discharge positioning camera beam is also provided with reinforcing ribs; one end of the discharge positioning camera adjustment unit is fixedly connected to the other end of the discharge positioning camera beam support, the other end of the discharge positioning camera adjustment unit is equipped with the discharge positioning camera, and the discharge positioning camera adjustment unit controls the discharge positioning camera to achieve XYZ three-axis movement; the discharge positioning camera light source is installed at the lower end of the discharge positioning camera.

10. A chip four-sided inspection device according to claim 9, characterized in that, The discharge positioning camera includes: a positioning camera, a lens clamping device, and a positioning camera lens; the upper end of the lens clamping device is connected to the positioning camera, and the lower end is connected to the positioning camera lens; the discharge positioning camera adjustment unit includes: a discharge positioning camera adjustment platform, an X-axis adjustment mechanism, an X-axis adjustment bolt, a Y-axis adjustment mechanism, a Y-axis position adjustment handwheel, a Y-axis position fixing handwheel, a Z-axis adjustment mechanism, a Z-axis position adjustment handwheel, and a Z-axis position fixing handwheel; the X-axis adjustment mechanism, the Y-axis adjustment mechanism, and the Z-axis adjustment mechanism are respectively installed in the XYZ directions of the discharge positioning camera adjustment platform; the X-axis adjustment bolt is installed on the X-axis adjustment mechanism, and the X-axis... An adjusting bolt passes through the X-axis adjusting mechanism and extends into the discharge positioning camera adjusting platform to adjust the X-axis movement of the discharge positioning camera; a Y-axis position fixing handwheel and a Y-axis position adjusting handwheel are installed on the Y-axis adjusting mechanism; the Y-axis position adjusting handwheel is used to adjust the Y-axis movement of the discharge positioning camera; the Y-axis position fixing handwheel is used to fix the position of the discharge positioning camera in the Y-axis; a Z-axis adjusting mechanism is installed with a Z-axis position fixing handwheel and a Z-axis position adjusting handwheel; the Z-axis position adjusting handwheel is used to adjust the Z-axis movement of the discharge positioning camera; the Z-axis position fixing handwheel is used to fix the position of the discharge positioning camera in the Z-axis.

11. A chip four-sided inspection device according to claim 2, characterized in that, The feeding arm module includes: a suction cup, a cable chain sheet metal, a feeding arm reader, a grating ruler, a limit block, a Z-axis position sensor, a Z-axis module, an X-axis linear motor, and a feeding arm X-axis motion unit. The feeding arm X-axis motion unit is installed on the top of the marble beam. The feeding arm X-axis motion unit consists of a U-shaped track and an X-axis cable chain arranged within the U-shaped track. The cable chain sheet metal is an irregularly shaped part, with one end connected to the X-axis cable chain and moving along the X-axis along the X-axis. The Z-axis module is fixedly connected to the other end of the cable chain sheet metal. The Z-axis position sensor is installed on one side of the Z-axis module. The suction cup is installed at the front end of the Z-axis module via a suction cup mounting bracket. The limit blocks are installed on both sides of the rear end of the Z-axis module, and the X-axis linear motor is installed at the rear end of the Z-axis module. The grating ruler is installed above the X-axis motor. The feeding arm reader is installed in the space formed by the cable chain sheet metal, the grating ruler, and the Z-axis module.

12. A chip four-sided inspection device according to claim 2, characterized in that, The discharge arm module includes: a suction cup, a cable chain sheet metal, a discharge arm reading head, a grating ruler, a limit block, a Z-axis position sensor, a Z-axis module, an X-axis linear motor, and a discharge arm X-axis motion unit. The discharge arm X-axis motion unit is installed on the top of the marble beam. The discharge arm X-axis motion unit consists of a U-shaped track and an X-axis cable chain arranged within the U-shaped track. The cable chain sheet metal is an irregularly shaped part, with one end connected to the X-axis cable chain and moving along the X-axis along the X-axis. The Z-axis module is fixedly connected to the other end of the cable chain sheet metal. The Z-axis position sensor is installed on one side of the Z-axis module. The suction cup is installed at the front end of the Z-axis module via a suction cup mounting bracket. The limit blocks are installed on both sides of the rear end of the Z-axis module, and the X-axis linear motor is installed at the rear end of the Z-axis module. The grating ruler is installed above the X-axis motor. The discharge arm reading head is installed in the space formed by the cable chain sheet metal, the grating ruler, and the Z-axis module.

13. A chip four-sided inspection device according to claim 2, characterized in that, The feeding platform module includes: a chip placement box, a vacuum platform, an X-axis motion mechanism for the feeding platform, a Y-axis motion mechanism for the feeding platform, an X-axis position sensor for the feeding platform, and a Y-axis position sensor for the feeding platform. The X-axis motion mechanism for the feeding platform is mounted on the Y-axis motion mechanism for the feeding platform, and the Y-axis position sensor for the feeding platform is mounted below the Y-axis motion mechanism for the feeding platform. The vacuum platform is mounted on the X-axis motion mechanism for the feeding platform, and the X-axis position sensor for the feeding platform is mounted on one side of the X-axis motion mechanism for the feeding platform. The vacuum platform has multiple accommodating spaces for placing the chip placement box.

14. A chip four-sided inspection device according to claim 2, characterized in that, The unloading platform module includes: a chip placement box, a vacuum platform, an X-axis motion mechanism for the unloading platform, a Y-axis motion mechanism for the unloading platform, an X-axis position sensor for the unloading platform, and a Y-axis position sensor for the unloading platform. The X-axis motion mechanism for the unloading platform is mounted on the Y-axis motion mechanism for the unloading platform, and the Y-axis position sensor for the unloading platform is mounted below the Y-axis motion mechanism for the unloading platform. The vacuum platform is mounted on the X-axis motion mechanism for the unloading platform, and the X-axis position sensor for the unloading platform is mounted on one side of the X-axis motion mechanism for the unloading platform. The vacuum platform has multiple accommodating spaces for placing the chip placement box.

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