Test equipment for DFN semiconductor devices

Abstract

The application discloses a kind of test equipment for DFN semiconductor device, which detects shell both sides each is provided with a cooling fin, the circumferential inner wall is provided with several heating rods, and the wind cover is installed in the rear end surface of detection shell, a connecting pipe is respectively arranged in the both sides of detection shell, the both ends of the connecting pipe are respectively communicated with detection shell and wind cover, one end of the rotating shaft is fixedly connected with a gear rod located outside the wind cover, the connecting shell is located on the side of support plate opposite to detection shell, the inside is provided with first piston and second piston, the first piston and second piston are distributed on the upper and lower sides and form a gas cavity between them, a spring is arranged between the second piston and the inner wall of the bottom of connecting shell, the upper end of a second support rod is connected with the second piston, and the lower end with probe is located inside detection shell.The application improves the uniformity of the internal environment temperature of detection shell, and can also realize soft contact of probe and device, reducing the probability of damage caused by probe to device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device testing technology, specifically to a testing device for DFN semiconductor devices. Background Technology

[0002] The DFN / QFN package is a leadless package, square or rectangular in shape, with a large exposed pad at the center of the bottom for heat dissipation. Electrically connected pads surround the large pad. Because the QFN package does not have gull-wing leads like traditional packages, the conductive path between the internal leads and pads is short, resulting in low self-inductance and low wiring resistance within the package, thus providing excellent electrical performance.

[0003] As people's living standards continue to improve, the application scenarios for electronic products are becoming increasingly diverse, such as in harsh environments like rainforests, deserts, and polar regions. This places higher demands on electronic products and their internal semiconductor chips, making it necessary to conduct performance testing on semiconductor chips.

[0004] However, the existing testing equipment simulates an environment with uneven heat distribution, leading to inaccurate test results and seriously affecting the reliability of the test. Summary of the Invention

[0005] The purpose of this invention is to provide a testing device for DFN semiconductor devices. This testing device improves the uniformity of the internal temperature of the test housing, ensuring the accuracy of the test results. It also enables soft contact between the probe and the device, improves the positional accuracy of the probe, reduces misjudgments caused by non-contact between the probe and the device, and improves the reliability of the device operation, thereby ensuring the reliability of the test.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a test device for DFN semiconductor devices, comprising: a base, and further comprising: a connecting housing, a detection housing located on the top of the base, and an air circulation device installed on one side of the detection housing, wherein a hydraulic rod is installed on each side of the base, and a support plate located above the detection housing is installed on the top of the two hydraulic rods; Inside the detection housing, there is a base plate with a fixing groove in the center of the top, which is used to place the device under test. A cooling chip is provided on each side of the detection housing. The air circulation device includes a connecting pipe, a fan shroud, and a rotating shaft with fan blades. The fan shroud, which has several heating rods arranged on its circumferential inner wall, is installed on the rear end face of the detection housing. A connecting pipe is respectively arranged on both sides of the detection housing, and each end of the connecting pipe is connected to the detection housing and the fan shroud, thereby forming a "U"-shaped airflow channel between the detection housing and the fan shroud. The rotating shaft is located inside the fan shroud, and one end of the rotating shaft is fixedly connected to a gear rod located outside the fan shroud. A drive rod is installed on the side wall of the support plate, and the end of the drive rod has a toothed groove that meshes with the gear rod. The connecting housing is located on the side of the support plate opposite to the detection housing. It is equipped with a first piston and a second piston. The first piston and the second piston are distributed on the top and bottom and form an air chamber between them. A spring is provided between the second piston and the inner wall of the bottom of the connecting housing. A top plate is set above the connecting housing. A first support rod installed at the bottom of the top plate can pass through the top wall of the connecting housing and be fixedly connected to the first piston. The upper end of a second support rod is connected to the second piston, and the lower end of the rod with the probe is located inside the detection housing. Each end of the support plate has a through hole. The top plate has a first connecting rod for embedding in the through hole. A fixing plate is provided on the lower surface of the support plate. A motor is installed on one side of the fixing plate. A second connecting rod located below the first connecting rod is fixedly connected to the output shaft of the motor. The third connecting rod is rotatably connected to the lower end of the first connecting rod and the upper end of the second connecting rod. When the motor starts, the rotating second connecting rod can drive the first connecting rod to move along the through hole.

[0007] The following are further improvements to the above technical solution: 1. In the above scheme, a PLC controller is provided on one side of the base.

[0008] 2. In the above scheme, the PLC controller is electrically connected to the hydraulic rod, probe, cooling element, heating rod, and motor.

[0009] 3. In the above scheme, a plurality of heat sinks are provided on the opposite side of the cooling chip.

[0010] 4. In the above scheme, the heat sinks are arranged at equal intervals.

[0011] 5. In the above scheme, the heating rods are equidistantly spaced on the circumferential inner wall of the fan shroud.

[0012] 6. In the above scheme, the cross-section of the drive rod is an inverted "L" shape.

[0013] 7. In the above scheme, a fixing block is provided on each side of the base, and the bottom of the hydraulic rod is fixedly installed on the top surface of the fixing block.

[0014] 8. In the above scheme, a door panel is provided on the front end face of the detection housing.

[0015] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The present invention provides a testing device for DFN semiconductor devices, wherein a cooling chip is disposed on each side of the testing housing, and a fan shroud with several heating rods disposed on the circumferential inner wall is installed on the rear end face of the testing housing. A connecting pipe is disposed on both sides of the testing housing, and the two ends of the connecting pipe are respectively connected to the testing housing and the fan shroud, thereby forming a "U"-shaped airflow channel between the testing housing and the fan shroud. A rotating shaft is located inside the fan shroud, and one end of the rotating shaft is fixedly connected to a gear rod located outside the fan shroud. A drive rod is installed on the side wall of the support plate, and the end of the drive rod has a toothed groove that meshes with the gear rod. The cooling chip and the heating rod can change the temperature environment inside the housing, enabling the device to be tested under high temperature and low temperature environments. The connecting pipe connects the housing and the fan shroud, and the drive rod's toothed groove engages with the gear rod to drive the rotating shaft to rotate, causing air to circulate between the testing housing and the fan shroud, thereby improving the uniformity of the internal temperature environment of the testing housing, ensuring the accuracy of the test results, and effectively avoiding damage to components due to local overheating.

[0016] 2. The testing device for DFN semiconductor devices of the present invention comprises a first piston and a second piston located above and below each other inside a connecting housing, forming an air cavity between them. A spring is disposed between the second piston and the inner wall of the bottom of the connecting housing. A second support rod installed at the bottom of the top plate can pass through the top wall of the connecting housing and be fixedly connected to the first piston. The upper end of the second support rod is connected to the second piston, and the lower end of the probe is located inside the detection housing. Through the cooperation of the first piston, the second piston, and the spring, soft contact between the probe and the device can be achieved, reducing the probability of the probe damaging the device. The air cavity and the spring can also maintain a stable connection between the probe and the device, improving the positional accuracy of the probe, reducing the occurrence of misjudgments due to non-contact between the probe and the device, and improving the reliability of the equipment operation. This design ensures the reliability of the test. Furthermore, each end of the support plate has a through hole, and the top plate has a first connecting rod for embedding in the through hole. A fixing plate is provided on the lower surface of the support plate, and a motor is installed on one side of this fixing plate. A second connecting rod located directly below the first connecting rod is fixedly connected to the output shaft of the motor. A third connecting rod is rotatably connected to the lower end of the first connecting rod and the upper end of the second connecting rod, respectively. When the motor rotates, the second connecting rod can drive the first connecting rod to move along the through hole. By driving the first connecting rod to move along the through hole, the distance between the top plate and the connecting housing can be changed, and the positions of the first piston, the air chamber, and the second piston in the connecting housing can be adjusted to achieve the adjustment of the probe position. This allows it to adapt to devices of different thicknesses and improves the applicability of the device. Attached Figure Description

[0017] Appendix Figure 1 This is a first-view overall structural diagram of the testing equipment of the present invention; Appendix Figure 2 This is a schematic diagram of the overall structure of the testing device of the present invention from a second perspective; Appendix Figure 3 Appendix to this invention Figure 2 Enlarged view of point A; Appendix Figure 4 This is a partial three-dimensional structure of the testing equipment for DFN semiconductor devices according to the present invention. Figure 1 ; Appendix Figure 5 This is a partial three-dimensional structure of the testing equipment for DFN semiconductor devices according to the present invention. Figure 2 ; Appendix Figure 6 This is a cross-sectional view of the testing housing of the testing equipment for DFN semiconductor devices according to the present invention; Appendix Figure 7 This is a partial structural cross-sectional view of the test equipment for DFN semiconductor devices of the present invention; Appendix Figure 8 This is a partial electrical control schematic diagram of the test equipment for DFN semiconductor devices according to the present invention.

[0018] In the attached diagrams: 1. Base; 2. Detection housing; 201. Base plate; 3. Connecting housing; 4. Air circulation device; 5. Hydraulic rod; 6. Support plate; 7. Fixing groove; 8. Cooling element; 9. Connecting pipe; 10. Fan cover; 11. Rotating shaft; 12. Fan blade; 13. Gear rod; 14. Heating rod; 15. Drive rod; 151. Gear groove; 161. First piston; 162. Second piston; 17. Air chamber; 18. Spring; 19. Through hole; 20. Top plate; 21. First connecting rod; 23. Fixing plate; 24. Motor; 25. Second connecting rod; 26. Third connecting rod; 27. First support rod; 28. Second support rod; 29. ​​Probe; 30. Heat sink; 31. Fixing block; 32. PLC controller; 33. Door panel. Detailed Implementation

[0019] In the description of this patent, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this patent based on the specific circumstances.

[0020] Example 1: A test device for DFN semiconductor devices includes: a base 1, and further includes: a connecting housing 3, a detection housing 2 located on the top of the base 1, and an air circulation device 4 installed on one side of the detection housing 2. A hydraulic rod 5 is installed on each side of the base 1, and a support plate 6 located above the detection housing 2 is installed on the top of the two hydraulic rods 5. Inside the detection housing 2, there is a base plate 201 with a fixing groove 7 at the top center, which is used to place the device under test. A cooling chip 8 is provided on each side of the detection housing 2. The air circulation device 4 includes a connecting pipe 9, a fan shroud 10, and a rotating shaft 11 with fan blades 12. The fan shroud 10, which has several heating rods 14 on its circumferential inner wall, is installed on the rear end face of the detection housing 2. A connecting pipe 9 is respectively arranged on both sides of the detection housing 2. The two ends of the connecting pipe 9 are connected to the detection housing 2 and the fan shroud 10, thereby forming a "U"-shaped airflow channel between the detection housing 2 and the fan shroud 10. The rotating shaft 11 is located inside the wind cover 10. One end of the rotating shaft 11 is fixedly connected to a gear rod 13 located outside the wind cover 10. A drive rod 15 is installed on the side wall of the support plate 6. The end of the drive rod 15 has a toothed groove 151 that meshes with the gear rod 13. The hydraulic rod 5 is activated, causing the support plate 6 to descend. The drive rod 15 is connected to the gear rod 13 through the tooth groove 151. As the support plate 6 moves downward, it drives the drive rod 15 to move downward, thereby driving the gear rod 13 to rotate. This drives the rotating shaft 11 to rotate, and the rotating shaft 11 drives the fan blade 12 to rotate inside the fan cover 10. Air from the detection housing 2 is introduced into the fan cover 10 through the connecting pipe 9 on one side, and air from the fan cover 10 is discharged into the detection housing 2 through the connecting pipe 9 on the other side. This creates an air circulation channel between the fan cover 10 and the detection housing 2, greatly improving the temperature uniformity inside the detection housing 2.

[0021] The connecting housing 3 is located on the side of the support plate 6 opposite to the detection housing 2. It is equipped with a first piston 161 and a second piston 162. The first piston 161 and the second piston 162 are distributed on the upper and lower sides and form an air chamber 17 between them. A spring 18 is provided between the second piston 162 and the bottom inner wall of the connecting housing 3. A top plate 20 is disposed above the connecting housing 3. A first support rod 27 installed at the bottom of the top plate 20 can pass through the top wall of the connecting housing 3 and be fixedly connected to the first piston 161. The upper end of a second support rod 28 is connected to the second piston 162, and the lower end of the probe 29 is located inside the detection housing 2. Each end of the support plate 3 has a through hole 19. The top plate 20 has a first connecting rod 21 for embedding in the through hole 19. A fixing plate 23 is provided on the lower surface of the support plate 6. A motor 24 is installed on one side of the fixing plate 23. A second connecting rod 25 located below the first connecting rod 21 is fixedly connected to the output shaft of the motor 24. A third connecting rod 26 is rotatably connected to the lower end of the first connecting rod 21 and the upper end of the second connecting rod 25 respectively. When the motor 24 is started, the rotating second connecting rod 25 can drive the first connecting rod 21 to move along the through hole 19.

[0022] When the thickness of the detection chip changes, the position of probe 29 needs to be adjusted. Motor 24 can be turned on to drive the second connecting rod 25 to rotate. The third connecting rod 26 is rotatably connected to the first connecting rod 21 and the second connecting rod 25. As the second connecting rod 25 rotates, it will drive the first connecting rod 21 to descend along the through hole 19, which will drive the first piston 161 below the top plate 20 to descend, compressing the air in the air chamber 17, thereby pushing the second piston 162 to descend, which will drive the second support rod 28 to move down, so as to realize the downward movement of the probe 29 in the detection housing 2. A PLC controller 32 is provided on one side of the base 1; the PLC controller 32 is electrically connected to the hydraulic rod 5, probe 29, cooling chip 8, heating rod 14, and motor 24.

[0023] A plurality of heat sinks 30 are provided on the opposite side of the aforementioned cooling chip 8; the heat sinks 30 are arranged at equal intervals, thereby improving the heat dissipation efficiency of the cooling chip 8.

[0024] The heating rods 14 are equidistantly spaced on the circumferential inner wall of the fan cover 10, which further improves the uniformity of temperature.

[0025] The front end face of the aforementioned detection housing 2 is provided with a door panel 33.

[0026] The aforementioned detection housing 2 is arranged at equal intervals.

[0027] Example 2: A test device for DFN semiconductor devices includes: a base 1, and further includes: a connecting housing 3, a detection housing 2 located on the top of the base 1, and an air circulation device 4 installed on one side of the detection housing 2. A hydraulic rod 5 is installed on each side of the base 1, and a support plate 6 located above the detection housing 2 is installed on the top of the two hydraulic rods 5. Inside the detection housing 2, there is a base plate 201 with a fixing groove 7 at the top center, which is used to place the device under test. A cooling chip 8 is provided on each side of the detection housing 2. The air circulation device 4 includes a connecting pipe 9, a fan shroud 10, and a rotating shaft 11 with fan blades 12. The fan shroud 10, which has several heating rods 14 on its circumferential inner wall, is installed on the rear end face of the detection housing 2. A connecting pipe 9 is respectively arranged on both sides of the detection housing 2. The two ends of the connecting pipe 9 are connected to the detection housing 2 and the fan shroud 10, thereby forming a "U"-shaped airflow channel between the detection housing 2 and the fan shroud 10. The temperature environment inside the detection housing 2 can be changed by the cooling element 8 and the heating rod 14, enabling the device to be tested in high and low temperature environments. The detection housing 2 is connected to the fan shroud 10 by the connecting pipe 9. With the gear 151 of the drive rod 15 cooperating with the gear rod 13, the rotating shaft 11 is driven to rotate, so that the air circulates between the detection housing 2 and the fan shroud 10. This improves the uniformity of the internal temperature of the detection housing, ensures the reliability of the test results, and effectively avoids the situation of local overheating causing damage to parts, thereby improving the overall reliability of the device.

[0028] The rotating shaft 11 is located inside the wind cover 10. One end of the rotating shaft 11 is fixedly connected to a gear rod 13 located outside the wind cover 10. A drive rod 15 is installed on the side wall of the support plate 6. The end of the drive rod 15 has a toothed groove 151 that meshes with the gear rod 13. The connecting housing 3 is located on the side of the support plate 6 opposite to the detection housing 2. It is equipped with a first piston 161 and a second piston 162. The first piston 161 and the second piston 162 are distributed on the upper and lower sides and form an air chamber 17 between them. A spring 18 is provided between the second piston 162 and the bottom inner wall of the connecting housing 3. A top plate 20 is disposed above the connecting housing 3. A first support rod 27 installed at the bottom of the top plate 20 can pass through the top wall of the connecting housing 3 and be fixedly connected to the first piston 161. The upper end of a second support rod 28 is connected to the second piston 162, and the lower end of the probe 29 is located inside the detection housing 2. The cooperation of the first piston 161, the second piston 162 and the spring 18 can achieve soft contact between the probe 29 and the device. The air chamber 17 and the spring 18 can also maintain a stable connection between the probe and the device, which improves the positional accuracy of the probe, reduces the situation of false judgment caused by the probe not contacting the device, and improves the accuracy of detection. Each end of the support plate 3 has a through hole 19. The top plate 20 has a first connecting rod 21 for embedding in the through hole 19. A fixing plate 23 is provided on the lower surface of the support plate 6. A motor 24 is installed on one side of the fixing plate 23. A second connecting rod 25 located below the first connecting rod 21 is fixedly connected to the output shaft of the motor 24. A third connecting rod 26 is rotatably connected to the lower end of the first connecting rod 21 and the upper end of the second connecting rod 25 respectively. When the motor 24 is started, the rotating second connecting rod 25 can drive the first connecting rod 21 to move along the through hole 19.

[0029] By moving the first connecting rod 21 along the through hole 19, the distance between the top plate 20 and the connecting housing 3 can be adjusted, thereby adjusting the positions of the first piston 161, the air chamber 17, and the second piston 162 within the connecting housing 3. This allows for adjustment of the probe 29's position, enabling the detection of devices of varying thicknesses and improving the device's applicability. A PLC controller 32 is provided on one side of the base 1. The PLC controller 32 is electrically connected to the hydraulic rod 5, probe 29, cooling chip 8, heating rod 14, and motor 24.

[0030] The aforementioned heating rods 14 are equidistantly spaced on the circumferential inner wall of the fan cover 10.

[0031] The cross-section of the aforementioned drive rod 15 is an inverted "L" shape.

[0032] A fixing block 31 is provided on each side of the base 1, and the bottom of the hydraulic rod 5 is fixedly installed on the top surface of the fixing block 31.

[0033] The front end face of the aforementioned detection housing 2 is provided with a door panel 33.

[0034] Working principle: First, the DFN device to be tested is fixed in the fixing groove 7 of the substrate 201. Then, the PLC controller selects a low temperature environment or a high temperature environment. The cooling chip 8 lowers the internal temperature of the detection housing 2, and the heating rod 14 raises the internal temperature of the fan shroud 10. Next, the hydraulic rod 5 is activated to drive the support plate 6 to descend. In the first stage of the descent of the hydraulic rod 5, the probe 29 does not contact the DFN device. The drive rod 15 is connected to the gear rod 13 through the tooth groove 151. During the downward movement of the support plate 6, the drive rod 15 is driven to move downward, thereby driving the gear rod 13 to rotate, which in turn drives the rotating shaft 11 to rotate. The rotating shaft 11 drives the fan blade 12 to rotate inside the wind cover 10. Air from the detection housing 2 is introduced into the wind cover 10 through the connecting pipe 9 on one side, and air from the wind cover 10 is discharged into the detection housing 2 through the connecting pipe 9 on the other side. This forms an air circulation channel between the wind cover 10 and the detection housing 2, which greatly improves the uniformity of air temperature distribution and ensures the reliability of the test. The support plate 6 continues to move downward, causing the second support rod 28 to move downward until the probe 29 contacts the DFN device, so that the probe 29 below the second support rod 28 contacts the conductive pad on the DFN device body; In the second stage of descent, after the probe 29 contacts the DFN device, the hydraulic rod 5 continues to contract, and the support plate 6 continues to descend. Due to the obstruction of the DFN device, the probe 29 cannot move down, causing the second support rod 28 to move relative to the support plate 6. The second piston 162 moves upward to compress the air in the air chamber 17. With the cooperation of the second piston 162 and the spring 18, the spring 18 is in a stretched state and exerts a pulling force on the second piston 162. This can buffer the movement of the second support rod 28, increase the resistance to the upward movement of the second support rod 28, and at the same time maintain the close contact between the probe 29 and the device for product identification. When the thickness of the detection chip changes, the position of probe 29 needs to be adjusted. Motor 24 can be turned on to drive the second connecting rod 25 to rotate. The third connecting rod 26 is rotatably connected to the first connecting rod 21 and the second connecting rod 25. As the second connecting rod 25 rotates, it will drive the first connecting rod 21 to descend along the through hole 19, which will drive the first piston 161 below the top plate 20 to descend, compressing the air in the air chamber 17, thereby pushing the second piston 162 to descend, which will drive the second support rod 28 to move down, so as to realize the downward movement of the probe 29 in the detection housing 2. By controlling the extension of the hydraulic rod 5, the support plate 6 is moved upward, causing the probe 29 to detach from the device.

[0035] When using the above-mentioned testing equipment for DFN semiconductor devices, a cooling chip is provided on each side of the testing housing. A fan shroud with several heating rods on its circumferential inner wall is installed on the rear end face of the testing housing. A connecting pipe is provided on both sides of the testing housing, and each end of the connecting pipe is connected to the testing housing and the fan shroud, thereby forming a "U"-shaped airflow channel between the testing housing and the fan shroud. The rotating shaft is located inside the fan shroud, and one end of the rotating shaft is fixedly connected to a gear rod located outside the fan shroud. A drive rod is installed on the side wall of the support plate. The end of the drive rod has a toothed groove that meshes with the gear rod. The cooling chip and the heating rod can change the temperature environment inside the housing, enabling the device to be tested in high and low temperature environments. The connecting pipe connects the housing and the fan shroud. With the toothed groove of the drive rod cooperating with the gear rod, the rotating shaft is driven to rotate, causing air to circulate between the testing housing and the fan shroud. This improves the uniformity of the internal temperature environment of the testing housing, ensures the accuracy of the test results, and effectively avoids damage to parts caused by local overheating. Furthermore, the first piston and the second piston are located inside the connecting housing and are distributed on the top and bottom, forming an air chamber between them. A spring is provided between the second piston and the bottom inner wall of the connecting housing. A second support rod installed at the bottom of the top plate can pass through the top wall of the connecting housing and be fixedly connected to the first piston. The upper end of the second support rod is connected to the second piston, and the lower end of the probe is located inside the detection housing. Through the cooperation of the first piston, the second piston and the spring, soft contact between the probe and the device can be achieved, reducing the probability of the probe damaging the device. The air chamber and the spring can also maintain a stable connection between the probe and the device, improving the positional accuracy of the probe, reducing the situation of misjudgment caused by the probe not contacting the device, improving the reliability of the equipment, and thus ensuring the reliability of the test. Furthermore, each end of the support plate has a through hole, and the top plate has a first connecting rod for embedding in the through hole. A fixing plate is provided on the lower surface of the support plate, and a motor is installed on one side of the fixing plate. A second connecting rod located directly below the first connecting rod is fixedly connected to the output shaft of the motor. A third connecting rod is rotatably connected to the lower end of the first connecting rod and the upper end of the second connecting rod, respectively. When the motor rotates, the second connecting rod can drive the first connecting rod to move along the through hole. By driving the first connecting rod to move along the through hole, the distance between the top plate and the connecting housing can be changed, and the positions of the first piston, the air chamber, and the second piston in the connecting housing can be adjusted to achieve the adjustment of the probe position. This allows it to adapt to devices of different thicknesses and improves the applicability of the device.

[0036] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A test apparatus for a DFN semiconductor device, comprising: A base (1), characterized in that it further comprises: a connecting housing (3), a detection housing (2) located at the top of the base (1), and an air circulation device (4) mounted on one side of the detection housing (2), wherein a hydraulic rod (5) is respectively mounted on both sides of the base (1), and a support plate (6) located above the detection housing (2) is mounted on the tops of the two hydraulic rods (5); A substrate (201) with a fixing groove (7) opened at the center of the top is arranged inside the detection housing (2), the fixing groove (7) is used for placing a device to be tested, and a refrigeration sheet (8) is respectively arranged on both sides of the detection housing (2); the air circulation device (4) comprises a connecting pipe (9), an air hood (10), and a rotating shaft (11) with fan blades (12), the air hood (10) with a plurality of heating rods (14) arranged on the circumferential inner wall thereof is mounted on the rear end surface of the detection housing (2), one connecting pipe (9) is respectively arranged on both sides of the detection housing (2), and both ends of the connecting pipe (9) are respectively communicated with the detection housing (2) and the air hood (10), so that a "hui"-shaped air flow channel is formed between the detection housing (2) and the air hood (10), the rotating shaft (11) is located inside the air hood (10), one end of the rotating shaft (11) is fixedly connected with a gear rod (13) located outside the air hood (10), a driving rod (15) is mounted on the side wall of the support plate (6), and an end of the driving rod (15) is provided with a tooth groove (151) engaged and connected with the gear rod (13); The connecting housing (3) is located on a side of the support plate (6) opposite to the detection housing (2), a first piston (161) and a second piston (162) are arranged inside the connecting housing (3), the first piston (161) and the second piston (162) are distributed up and down, and an air cavity (17) is formed therebetween, a spring (18) is arranged between the second piston (162) and the inner wall of the bottom of the connecting housing (3); a top plate (20) is arranged above the connecting housing (3), a first support rod (27) mounted at the bottom of the top plate (20) can pass through the top wall of the connecting housing (3) and be fixedly connected with the first piston (161), the upper end of a second support rod (28) is connected with the second piston (162), and the lower end thereof with a probe (29) is located inside the detection housing (2); Two ends of the support plate (6) are each provided with a through hole (19), the top plate (20) is provided with a first connecting rod (21) for being embedded into the through hole (19), a fixing plate (23) is arranged on the lower surface of the support plate (6), a motor (24) is mounted on one side of the fixing plate (23), a second connecting rod (25) located below the first connecting rod (21) is fixedly connected with the output shaft of the motor (24), a third connecting rod (26) is respectively rotatably connected with the lower end of the first connecting rod (21) and the upper end of the second connecting rod (25), when the motor (24) is started, the rotating second connecting rod (25) can drive the first connecting rod (21) to move along the through hole (19).

2. The testing equipment for DFN semiconductor devices according to claim 1, characterized in that: A PLC controller (32) is arranged on one side of the base (1).

3. The testing equipment for DFN semiconductor devices according to claim 2, characterized in that: The PLC controller (32) is electrically connected to the hydraulic rod (5), probe (29), cooling plate (8), heating rod (14), and motor (24).

4. The testing equipment for DFN semiconductor devices according to claim 1, characterized in that: The heating rods (14) are equidistantly spaced on the circumferential inner wall of the hood (10).

5. The testing equipment for DFN semiconductor devices according to claim 1, characterized in that: The cross-section of the drive rod (15) is an inverted "L" shape.

6. The testing equipment for DFN semiconductor devices according to claim 1, characterized in that: A fixing block (31) is provided on each side of the base (1), and the bottom of the hydraulic rod (5) is fixedly installed on the top surface of the fixing block (31).

7. The testing equipment for DFN semiconductor devices according to claim 1, characterized in that: The front end face of the detection housing (2) is provided with a door panel (33).

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