Ultrasonic probe

Abstract

The present application relates to an ultrasonic probe. A main backing (22) is provided on the rear side of an electronic circuit (37). The main backing (22) has two outer surfaces (high heat conduction surfaces) (22a, 22b) orthogonal to the Y direction and two outer surfaces (low heat conduction surfaces) orthogonal to the X direction. The two outer surfaces (22a, 22b) orthogonal to the Y direction are joined to a housing head (14) as a heat absorbing member. A temperature sensor (200) is provided on a specific outer surface (22b) orthogonal to the Y direction. The housing head (14) has a recess that houses the temperature sensor (200).

Description

Technical Field

[0001] This disclosure relates to ultrasonic probes, and more particularly to heat conduction structures within ultrasonic probes. Background Technology

[0002] Ultrasonic diagnostic devices are used in ultrasound examinations. These devices consist of ultrasonic probes that transmit and receive ultrasonic waves. In recent years, ultrasonic probes with two-dimensional vibrating element arrays have become increasingly common. Such probes are also called three-dimensional probes or 2D array probes. With 2D array probes, volumetric data can be obtained through two-dimensional scanning of the ultrasonic beam, or frame data can be obtained through one-dimensional scanning of the ultrasonic beam using two-dimensional electronic focusing.

[0003] An ultrasonic probe contains an oscillator assembly comprising an array of vibrating elements. The oscillator assembly typically has: a matching layer located on the front side (biological side) of the vibrating element array; and a backing located on the rear side (non-biological side) of the vibrating element array. The backing attenuates unwanted ultrasonic waves emitted from the vibrating element array to its rear side.

[0004] In the aforementioned 2D array probe, the oscillator assembly typically comprises a two-dimensional array of vibrating elements and electronic circuitry. The electronic circuitry generates multiple transmitted signals supplied to the multiple vibrating elements and processes multiple received signals output from the multiple vibrating elements. The electronic circuitry is usually composed of one or more integrated circuits (specifically, one or more ASICs).

[0005] In 2D array probes, a significant amount of heat is generated in the two-dimensional vibrating element array and electronic circuitry. The electronic circuitry, in particular, generates a large amount of heat. From a biological safety perspective, it is necessary to maintain the temperature of the transmitting and receiving wavefronts in the ultrasonic probe below a specified temperature. To effectively dissipate the heat generated in the electronic circuitry and other components to the outside environment, a heat conduction structure is incorporated within the ultrasonic probe.

[0006] Document 1 (JP Patent No. 5972296) discloses an ultrasonic probe having a vertically stacked array of vibrating elements, an ASIC, and a backing. Document 1 does not disclose a heat conduction structure utilizing the thermal anisotropy of the backing. Document 2 (JP Patent Application Publication No. 2017-70449) discloses an ultrasonic probe having a backing with an embedded lead array. Electronic circuitry is located on the rear side of the backing. Document 2 discloses a backing located on the rear side of the electronic circuitry. Summary of the Invention

[0007] The purpose of this disclosure is to provide a suitable method for measuring the temperature of a backing with thermal anisotropy in an ultrasonic probe.

[0008] The ultrasonic probe disclosed herein is characterized by comprising: an array of vibrating elements; an electronic circuit disposed on the rear side of the array of vibrating elements and electrically connected to the array of vibrating elements; and a backing disposed on the rear side of the electronic circuit and attenuating ultrasonic waves from the array of vibrating elements. In a configuration where the arrangement direction of the array of vibrating elements, the electronic circuit, and the backing is defined as the Z-direction, the direction orthogonal to the Z-direction is defined as the X-direction, and the direction orthogonal to both the Z-direction and the X-direction is defined as the Y-direction, the thermal conductivity in the Z-direction and the Y-direction of the backing is both greater than the thermal conductivity in the X-direction. The backing has two outer surfaces intersecting the Y-direction, and a temperature sensor is disposed on at least one of the two outer surfaces intersecting the Y-direction. Attached Figure Description

[0009] Figure 1 This is a cross-sectional view showing the structure of the ultrasonic probe involved in the embodiment.

[0010] Figure 2 This is an exploded 3D view of the oscillator assembly.

[0011] Figure 3 This is a cross-sectional view of a laminated body.

[0012] Figure 4 This is an XZ cross-sectional view showing the front end of the ultrasonic probe involved in the embodiment.

[0013] Figure 5 This is a schematic diagram showing the XY cross-section of the front end of the ultrasonic probe involved in the embodiment.

[0014] Figure 6 It is a three-dimensional drawing representing the shell.

[0015] Figure 7 This is a YZ cross-sectional view of the ultrasonic probe involved in the implementation method.

[0016] Figure 8 This is a YZ cross-sectional view showing the configuration of the temperature sensor.

[0017] Figure 9 This is a diagram representing the first variation.

[0018] Figure 10 This is a diagram representing the second variation. Detailed Implementation

[0019] The following description, based on the accompanying drawings, illustrates the implementation method.

[0020] (1) Overview of the implementation method

[0021] The ultrasonic probe involved in the embodiment is characterized by comprising: an array of vibrating elements; an electronic circuit disposed on the rear side of the vibrating element array and electrically connected to the vibrating element array; and a backing disposed on the rear side of the electronic circuit and attenuating ultrasonic waves from the vibrating element array. When the arrangement direction of the vibrating element array, the electronic circuit, and the backing is defined as the Z direction, the direction orthogonal to the Z direction is defined as the X direction, and the direction orthogonal to both the Z and X directions is defined as the Y direction, the thermal conductivity in the Z direction and the Y direction in the backing is both greater than the thermal conductivity in the X direction. The backing has two outer surfaces intersecting the Y direction, and a temperature sensor is disposed on at least one of the two outer surfaces intersecting the Y direction.

[0022] In the above structure, the two outer surfaces of the backing that intersect the Y direction are both relatively high thermal conductivity surfaces, i.e., heat output surfaces. On the other hand, the two outer surfaces of the backing that intersect the X direction are both relatively low thermal conductivity surfaces. Based on this structure, the temperature of the heat output surfaces can be detected by a temperature sensor.

[0023] The ultrasonic probe described in this embodiment includes a heat-absorbing member having two inner surfaces joined to two outer surfaces orthogonal to the Y direction. A temperature sensor is separated from the heat-absorbing member. According to this structure, since the temperature sensor is separated from the heat-absorbing member, the temperature of the backing (the temperature of the interface between the backing and the heat-absorbing member) can be accurately measured. That is, the influence of the temperature gradient within the heat-absorbing member is less likely to affect the temperature sensor.

[0024] In this embodiment, the heat-absorbing member has a housing space for a temperature sensor. The temperature sensor is separated from the inner surface of the housing space. An air layer exists between the inner surface of the housing space and the outer surface of the temperature sensor. The air layer functions as a thermal insulation layer. Where it is difficult to process the backing (especially to form a recess), a recess is formed in the heat-absorbing member. The interior of this recess functions as the aforementioned housing space. The temperature sensor is disposed in a non-contact state relative to the heat-absorbing member, within a portion of a specific outer surface of the backing that protrudes into the recess.

[0025] In this embodiment, the outer surface on which the temperature sensor is disposed has an upper end near the electronic circuit and a lower end away from the electronic circuit. The temperature sensor is disposed at the lower end. Because the backing has high thermal conductivity in the Z direction, the temperature of the backing can be accurately measured even when the temperature sensor is disposed at the lower end of the outer surface. This configuration shortens the length of the signal line from the temperature sensor.

[0026] In this embodiment, the aforementioned backing is a main backing. A secondary backing is disposed between the electronic circuitry and the main backing. In the secondary backing, the thermal conductivity in both the Z and X directions is greater than that in the Y direction. Heat diffused in the X direction within the secondary backing is transferred to the heat-absorbing member via the main backing. A temperature sensor detects the temperature of the interface between the main backing and the heat-absorbing member. When the main backing has a high thermal conductivity in the Y direction, the specific outer surface on which the temperature sensor is located can be considered as the interface between the main backing and the heat-absorbing member.

[0027] (2) Details of the implementation method

[0028] exist Figure 1 An ultrasound probe 10 according to the embodiment is shown. The ultrasound probe 10 is connected to an ultrasound diagnostic device body (not shown). The ultrasound probe 10 and the ultrasound diagnostic device body constitute an ultrasound diagnostic device. The ultrasound diagnostic device is a medical device used in ultrasound examination of a subject (biological body). The ultrasound probe 10 has cables and connectors (not shown).

[0029] exist Figure 1 In the diagram, the X direction is the first horizontal direction, the Y direction is the second horizontal direction, and the Z direction is the vertical direction. These three directions are orthogonal. The central axis of the ultrasonic probe 10 is parallel to the Z direction. The X direction is the first electronic scanning direction, and the Y direction is the second electronic scanning direction.

[0030] exist Figure 1 The XZ cross-section of the ultrasonic probe 10 is shown. A portion of the structure of the ultrasonic probe 10 is omitted from the diagram. The ultrasonic probe 10 consists of a front end 10A, a middle part 10B, and a rear end 10C. The front end 10A is a bulky portion, and the middle part 10B is a necked portion.

[0031] A shell member 12 is provided inside the resin shell 11. The shell member 12 is a heat-absorbing component. The shell member 12 may contain a metal with good thermal conductivity, specifically aluminum. The shell member 12 is composed of a shell member head (front end) 14, a middle part 15, and a rear end 16. The shell member 12 is a hollow component. The shell member 12 has a shape that surrounds a quadrangular prism-shaped cavity (internal space). At each position in the Z direction, the XY cross section of the cavity is rectangular. The outer surface of the shell member 12 is in close contact with the inner surface of the resin shell 11.

[0032] An oscillator assembly 17 is disposed inside the housing head 14. In addition to having a two-dimensional array of vibrating elements, the oscillator assembly 17 also has a backing member (backing group) 20 for attenuating unwanted ultrasonic waves. In the illustrated structural example, the backing member 20 consists of a sub-backing (first backing) 21 and a main backing (second backing) 22. Both the sub-backing 21 and the main backing 22 are made of backings with thermal anisotropy. The sub-backing 21 has a first thermal anisotropy. The main backing 22 has a second thermal anisotropy, different from the first thermal anisotropy. This will be explained in detail later. The stacking direction in the oscillator assembly 17 is the Z-direction.

[0033] The oscillator assembly 17 has: a laminate containing a two-dimensional array of vibrating elements; and an electronic circuit composed of multiple ICs. The upper surface of the oscillator assembly 17 is covered by a protective layer 18. The surface of the protective layer 18 is a receiving and transmitting surface that abuts against the surface of the subject.

[0034] An FPC (flexible printed circuit board) 24 is provided between the laminate and the electronic circuit. The FPC 24 is a flexible, sheet-like wiring component. In this embodiment, the FPC 24 is a multilayer FPC with multiple wiring layers. Its thickness is, for example, in the range of 0.1 to 0.5 mm. Its width in the Y direction is, for example, in the range of 10 to 20 mm.

[0035] FPC24 has a horizontal portion 26, a first drooping portion 28, and a second drooping portion 30. Multiple connectors 32 and reinforcing plates 34 are provided on the first drooping portion 28 and the second drooping portion 30, respectively. The upper end of the first drooping portion 28 is a first vertical portion. The upper end of the second drooping portion 30 is a second vertical portion.

[0036] exist Figure 2 The structure of the oscillator assembly 17 is shown. As already described, the oscillator assembly 17 has a stack 36 containing a two-dimensional array of vibrating elements. An electronic circuit 37 is provided on the rear side (non-biological side) of the stack 36. The electronic circuit 37 is, for example, composed of two ICs 38 and 40 arranged in the X direction. Each IC 38 and 40 has the function of generating multiple transmitted signals from the two-dimensional vibrating element array and processing multiple received signals from the two-dimensional vibrating element array. The latter function includes a sub-beamforming function. The electronic circuit 37 can be composed of more ICs arranged in the X and Y directions.

[0037] A two-dimensional vibrating element array consists of multiple vibrating elements (transducers) arranged in the first electronic scanning direction (X direction) and the second electronic scanning direction (Y direction). For example, a two-dimensional vibrating element array may consist of tens, hundreds, thousands, tens of thousands, or more vibrating elements. Alternatively, a one-dimensional vibrating element array may be used instead of a two-dimensional vibrating element array. A one-dimensional vibrating element array consists of multiple vibrating elements arranged in the X direction.

[0038] A horizontal portion 26 of the FPC 24 is sandwiched between the laminate 36 and the electronic circuit 37. The horizontal portion 26 performs signal connection functions, wiring pattern transformation functions, etc. One end of the horizontal portion 26 is connected to the first drooping portion 28 via a first bend 24a. The other end of the horizontal portion 26 is connected to the second drooping portion 30 via a second bend 24b. The central axis of the horizontal portion 26 is parallel to the X-direction. In other words, the arrangement direction of the first drooping portion 28, the horizontal portion 26, and the second drooping portion is the X-direction.

[0039] The sub-backer 21 has a plate-like shape. The sub-backer 21 functions to attenuate unwanted ultrasonic waves radiated rearward from the two-dimensional vibrating element array. The sub-backer 21 exhibits a first thermal anisotropy. Specifically, in the sub-backer 21, the thermal conductivity in the Z and X directions is greater than that in the Y direction.

[0040] The sub-backing 21 serves to conduct heat in the Z direction. Furthermore, as indicated by reference numeral 42 in the attached figure, the sub-backing 21 also serves to diffuse heat in the X direction. The upper surface of the sub-backing 21 is bonded to the electronic circuit 37, and the lower surface of the sub-backing 21 is bonded to the upper surface of the main backing 22.

[0041] The main backing 22 has a cuboid shape. The main backing 22 functions to attenuate unwanted ultrasonic waves entering via the sub-backing. The main backing 22 has a second thermal anisotropy, different from the first thermal anisotropy described above. Specifically, in the main backing 22, the thermal conductivity in the Z and Y directions is greater than that in the X direction.

[0042] The main backing 22 conducts heat in the Z direction and, as indicated by reference numeral 44, in the Y direction. Heat is transferred to the housing head from the two outer surfaces (two side surfaces) of the main backing 22 that are orthogonal to the Y direction. More specifically, heat generated in the electronic circuitry 37 (and the two-dimensional vibrating element array) is transferred to the housing via the sub-backing 21 and the main backing 22, and this heat is absorbed by the housing. Furthermore, in this specification, "orthogonal" refers to a cross-shaped arrangement.

[0043] The first thermal anisotropy of the secondary backing 21 is characterized by the low thermal conductivity direction, i.e., the Y direction. The second thermal anisotropy of the primary backing 22 is characterized by the low thermal conductivity direction, i.e., the X direction. The two low thermal conductivity directions are orthogonal to each other.

[0044] The thickness of the secondary backing 21 is less than that of the primary backing. The thickness of the secondary backing 21 is, for example, in the range of 1 to 5 mm. The thickness of the primary backing is, for example, in the range of 10 to 15 mm.

[0045] In the illustrated structural example, the width of the sub-backing 21 in the Y direction is equal to the width of the main backing 22 in the Y direction. Their widths are, for example, in the range of 10 to 20 mm. The width of the sub-backing 21 in the X direction is greater than the width of the main backing 22 in the X direction. Specifically, on both sides in the X direction, the sub-backing 21 extends beyond the lengths corresponding to d1 and d2. A slit-like space is created directly below each extended portion. The width of the sub-backing 21 in the X direction is, for example, in the range of 30 to 45 mm.

[0046] The secondary backing 21 and the primary backing 22 are each composed of multiple graphite blocks containing graphene. In each graphite block, each graphene is a sheet-like material containing a large number of carbon atoms arranged in a planar (i-direction and j-direction) configuration. The multiple graphenes in the graphite block are aligned in the k-direction. Here, the i-direction, j-direction, and k-direction are orthogonal. Alternatively, multiple carbon blocks containing planar graphite aggregates (e.g., refer to WO2018 / 074493) can be used as the backing.

[0047] The graphite block described above exhibits excellent ultrasonic attenuation and thermal conductivity. For example, the thermal conductivity in the i-direction and j-direction is in the range of 700–1000 (W / m / K), and the thermal conductivity in the k-direction is in the range of 10–20 (W / m / K). Materials for adjusting acoustic impedance and ultrasonic attenuation can be added to the graphite block. Materials with thermal conductivity exceeding 1000 (W / m / K) in the i-direction and j-direction, or materials with thermal conductivity below 700 (W / m / K) in the i-direction and j-direction, can be used.

[0048] For example, in electronic circuit 37, when only IC 38 releases a large amount of heat, according to the embodiment, during the transfer of this heat in the sub-backsheet 21, the heat naturally diffuses in the X direction. This prevents heat from stagnating directly below IC 38. The heat diffused within the sub-backsheet 21 enters the main backsheet 22. The entered heat is guided in the Y direction within the main backsheet 22. The guided heat moves towards the housing side via two heat output surfaces. The heat entering the housing is distributed throughout the entire housing. The heat is transferred to the resin housing via the outer surface of the housing, and the entire outer surface of the resin housing releases heat to the outside. Heat is also transferred from the housing to the probe cable, and the heat is released to the outside via the probe cable.

[0049] The secondary backing 21 and the primary backing 22 exhibit extremely high thermal conductivity except in specific directions. Therefore, through the aforementioned thermal conduction mechanism located within the ultrasonic probe, the heat generated in the electronic circuit 37 and the two-dimensional vibration element array is efficiently released to the outside, effectively reducing the temperature of the receiving and transmitting wave surfaces in contact with the biological body.

[0050] exist Figure 3 The stack 36 is shown. The stack 36 is composed of a reflective layer 52, a piezoelectric layer 50, a first matching layer 54, a second matching layer 56, a ground layer 60, and a third matching layer 62 stacked in the Z direction.

[0051] The piezoelectric layer 50 is composed of multiple piezoelectric elements arranged in a two-dimensional pattern. Each piezoelectric element is an electroacoustic conversion element. The reflective layer 52 is composed of multiple reflective elements arranged in a two-dimensional pattern. Each reflective element is conductive. The reflective layer 52 can also be called a hard backing layer. The first matching layer 54 is composed of multiple first matching elements arranged in a two-dimensional pattern. Each first matching element is conductive. The second matching layer 56 is composed of multiple second matching elements arranged in a two-dimensional pattern. Each second matching element is conductive. A ground layer 60 is provided above the second matching layer 56. A third matching layer 62 is provided above the ground layer 60. A protective layer (not shown) is provided above the third matching layer 62. An FPC 24 is provided below the reflective layer 52. Reference numeral 64 indicates a single vibrating element or a portion containing a single vibrating element.

[0052] exist Figure 4 The XZ cross-section of the front end of the ultrasonic probe according to the embodiment is shown. A transducer assembly 17 is disposed within the housing head 14. The transducer assembly 17 includes a laminate 36 arranged in the Z direction, electronic circuitry 37, a sub-backing 21, and a main backing 22. The wiring component, i.e., the FPC 24, is composed of a horizontal portion 26, a first drooping portion 28, and a second drooping portion 30. The horizontal portion 26 is sandwiched between the laminate 36 and the electronic circuitry 37. In the illustrated structural example, the electronic circuitry 37 is composed of two ICs 38 and 40 arranged in the X direction.

[0053] The sub-backing 21 has two outer surfaces (two side surfaces) orthogonal to the Y direction (the direction through which the paper is laid) and two outer surfaces (two side surfaces) orthogonal to the X direction. These four side surfaces are exposed surfaces that do not contribute to heat conduction. The first bend 24a in the FPC 24 bypasses one end of the sub-backing 21 in the X direction. The second bend 24b in the FPC 24 bypasses the other end of the sub-backing 21 in the X direction.

[0054] The graphene in the sub-backer 21 is aligned in the Y direction. One end of the sub-backer 21 in the X direction and the other end are difficult to deform in the X direction. Therefore, even if a force (shear force) is applied from the first bend 24a to one end, that end is not easily deformed. Similarly, even if a force (shear force) is applied from the second bend 24b to the other end, that end is not easily deformed.

[0055] The main backing 22 has two outer surfaces (two side surfaces) 22a and 22b orthogonal to the Y direction (the direction through which the paper meets the surface), and two outer surfaces (two side surfaces) 22c and 22d orthogonal to the X direction. The two outer surfaces 22a and 22b orthogonal to the Y direction are high thermal conductivity surfaces, functioning as heat output surfaces. The two outer surfaces 22c and 22d orthogonal to the X direction are low thermal conductivity surfaces. Surfaces 22c and 22d do not have thermal conductivity. The graphene in the main backing 22 is aligned in the X direction.

[0056] The housing head 14 has a shape that surrounds the oscillator assembly 17 and holds the oscillator assembly 17. The housing head 14 has two inner surfaces orthogonal to the Y direction and two inner surfaces orthogonal to the X direction. The two inner surfaces orthogonal to the Y direction function as heat input surfaces.

[0057] Two outer surfaces 22a and 22b of the main backing 22, orthogonal to the Y direction, join two inner surfaces of the shell head 14, orthogonal to the Y direction. Heat moves from the main backing 22 to the shell head 14 through the two interfaces formed by this joining. Gap G1 and G2 are created between the two outer surfaces 22c and 22d of the main backing 22, orthogonal to the X direction, and the two inner surfaces 14c and 14d of the shell head 14, orthogonal to the X direction. Each gap G1 and G2 has a slit-like shape. Gap G1 includes a space directly below the first protruding portion of the sub-backing 21. Gap G2 includes a space directly below the second protruding portion of the sub-backing 21.

[0058] The first drooping portion 28 has a first vertical portion 28A as its upper end. The first vertical portion 28A passes through the gap G1. A first electrical component group 66 is provided on the inner surface (the surface on the main backing side) of the first vertical portion 28A. The first electrical component group 66 is composed of a plurality of electrical components arranged in the Y direction and the Z direction. Specifically, the first electrical component group 66 includes a plurality of capacitors required for the operation of the electronic circuit 37.

[0059] An electrically insulating plate 74, serving as an electrically insulating member, is provided between the first electrical component group 66 and the outer surface 22c of the main backing 22. This prevents electrical short circuits between the main backing 22 and the first electrical component group 66. The electrically insulating plate 74 is bonded to the first electrical component group 66 or to the main backing 22.

[0060] A reinforcing plate 68, serving as a reinforcing member, is bonded to the outer surface (the surface opposite to the inner surface 14c) of the first vertical portion 28A. The reinforcing plate 68 can be further fixed to the inner surface 14c using double-sided adhesive tape or the like. The reinforcing plate 68 is, for example, composed of an insulating member.

[0061] The second drooping portion 30 has a second vertical portion 30A as its upper end. The second vertical portion 30A passes through the gap G2. A second electrical component group 76 is provided on the inner surface (the surface on the main backing side) of the second vertical portion 30A. The second electrical component group 76 is composed of a plurality of electrical components arranged in the Y direction and the Z direction. Specifically, the second electrical component group 76 includes a plurality of capacitors required for the operation of the electronic circuit 37.

[0062] An electrically insulating plate 77, serving as an electrically insulating member, is provided between the second electrical component group 76 and the outer surface 22d of the main backing 22. This prevents electrical short circuits between the main backing 22 and the second electrical component group 76. The electrically insulating plate 77 is bonded to the second electrical component group 76 or to the main backing 22.

[0063] A reinforcing plate 78, serving as a reinforcing member, is bonded to the outer surface (the surface opposite to the inner surface 14d) of the second vertical portion 30A. Double-sided adhesive tape or similar materials can be used to further secure the reinforcing plate 78 to the inner surface 14d. The reinforcing plate 78 is, for example, composed of an insulating member.

[0064] The upper surface 22e of the main backing 22 is joined to the lower surface of the secondary backing 21. The lower surface 22f of the main backing 22 is exposed. As described later, sound-absorbing or heat-conducting components may also be provided on the lower surface 22f.

[0065] A temperature sensor 200 is provided on the outer surface 22b, which functions as a heat output surface. Specifically, the temperature sensor 200 is located at the center and lower part 22b1 in the X direction of the outer surface 22b. The temperature sensor 200 is, for example, a thermistor. A signal line 202 is led out from the temperature sensor 200. The signal line 202 is connected to the FPC 24, or to a signal line in a probe cable (not shown). Multiple temperature sensors can be provided on the outer surface 22b. Alternatively, temperature sensors can be provided on both the outer surface 22a and the outer surface 22b.

[0066] By configuring the temperature sensor 200, the temperature of the main backing, especially the temperature of the interface between the main backing and the housing head, can be monitored. This allows for the management of the surface temperature of the ultrasonic probe, particularly the surface temperature of the wave-feeding and receiving surfaces.

[0067] In this embodiment, gaps G1 and G2 are ensured on both sides of the main backing in the X direction. The FPC24 passes through gaps G1 and G2. The gaps G1 and G2 are used to arrange the first electrical component group 66 and the second electrical component group 76 near the electronic circuit 37.

[0068] Figure 5 This is a schematic diagram showing the XY cross-section of the front end of the ultrasonic probe. The main backing 22 has two outer surfaces 22a and 22b orthogonal to the Y direction, and two outer surfaces 22c and 22d orthogonal to the X direction. On the other hand, the housing head 14 has two inner surfaces 14a and 14b orthogonal to the Y direction, and two inner surfaces 14c and 14d orthogonal to the X direction.

[0069] The outer surface 22a and the inner surface 14a are joined, and the outer surface 22b and the inner surface 14b are joined. A gap G1 is formed between the outer surface 22c and the inner surface 14c. A gap G2 is formed between the outer surface 22d and the inner surface 14d. The first vertical portion 28A, the first electrical component group 66, the electrical insulation plate 74, and the reinforcing plate 68 are disposed in the gap G1. The second vertical portion 30A, the second electrical component group 76, the electrical insulation plate 77, and the reinforcing plate 78 are disposed in the gap G2.

[0070] A recess 204 is formed in the housing head 14. The opening of the recess 204 forms part of the inner surface 14b. The interior space of the recess 204 functions as a receiving chamber for housing the temperature sensor 200. The wall of the recess 204 is separated from the temperature sensor 200. The temperature sensor 200 is only in contact with the outer surface 22b of the main backing 22.

[0071] Generally, backings with thermal anisotropy are difficult to process; that is, it is difficult to form a recess in the main backing 22. Therefore, in this embodiment, a recess 204 is formed in the housing head 14, and a temperature sensor 200 is disposed therein. Since the housing head 14 is not in direct contact with the temperature sensor 200, the temperature of the heat output surface can be accurately measured by the temperature sensor 200.

[0072] In this embodiment, the outer surfaces 22a, 22b, 22, and 22d are planar. Alternatively, all or part of the outer surfaces 22a, 22b, 22, and 22d may be curved surfaces. Similarly, in this embodiment, the inner surfaces 14a, 14b, 14c, and 14d are planar. Alternatively, all or part of the inner surfaces 14a, 14b, 14c, and 14d may be curved surfaces.

[0073] exist Figure 6 The housing 12 is shown. As already described, the housing 12 consists of a housing head 14, a middle portion 15, and a rear portion 16. The housing head 14 has two inner surfaces orthogonal to the Y direction. Figure 6 Only one inner surface 14a) and two inner surfaces 14c and 14d orthogonal to the X direction are shown. Heat from the main backing flows into the housing head 14 (refer to reference numeral 90) through the two inner surfaces orthogonal to the Y direction. This heat diffuses to the housing head 14 (refer to reference numeral 94) and also to the entire housing 12 (refer to reference numerals 92 and 96). The heat diffused to the housing 12 is released to the outside through the resin housing and also through the probe cable.

[0074] exist Figure 7 The YZ cross-section of the ultrasonic probe is shown. The direction of heat movement generated in the electronic circuit 37 and the two-dimensional vibrating element array is indicated by reference numeral 102. Heat moves from the sub-backsheet 21 to the main backsheet 22. The movement of heat flowing into the main backsheet 22 in the Y direction is indicated by reference numeral 104. This heat flows into the housing 12. Reference numeral 106 indicates the direction of heat movement (diffusion direction) within the housing 12.

[0075] In addition, Figure 7 The diagram shows the probe cable, the signal harness within the probe cable, and multiple connectors connected to the signal harness. These connectors connect to multiple connectors located on the FPC.

[0076] exist Figure 8 The YZ section of the front end of the ultrasonic probe is shown. As already explained, a recess 204 is formed in the housing head 14. The interior space of the recess 204 is the receiving chamber of the temperature sensor 200. The inner surface of the recess 204 is separated from the temperature sensor 200.

[0077] The sensing surface 200a of the temperature sensor 200 is engaged with the outer surface 22b of the main backing. Specifically, the temperature sensor 200 is engaged at the center of the outer surface 22b in the X direction and at the lower end in the Z direction. A signal line 202 is led out from the temperature sensor 200. The lower surface of the main backing is also a high thermal conductivity surface. A temperature sensor can be disposed on this lower surface.

[0078] use Figure 9 as well as Figure 10 To illustrate the variation. In Figure 9 The first modified example is shown. A sound-absorbing plate 108 is provided on the lower side of the main backing 22. Specifically, the sound-absorbing plate 108 is attached to the lower surface of the main backing. If the ultrasonic waves within the main backing 22 are not completely attenuated, the ultrasonic waves may be reflected from the lower surface of the main backing 22, and there is a possibility that the reflected waves generated will return to the two-dimensional vibrating element array. Such reflected waves will degrade the image quality of the ultrasonic wave. By providing the sound-absorbing plate 108 on the lower surface of the main backing 22, the generation of the aforementioned reflected waves can be effectively suppressed.

[0079] exist Figure 10The second modification is shown. A heat-conducting plate 110 is provided on the underside of the main backing 22. Specifically, the heat-conducting plate 110 is joined to the lower surface of the main backing 22. Heat generated in electronic circuits, etc., moves to the main backing 22 via the sub-backing 21 as indicated by arrow 112. Heat flowing to the main backing 22 moves directly from the main backing 22 to the housing 12 as indicated by arrow 114, and also moves from the main backing 22 to the housing 12 via the heat-conducting plate 110 as indicated by arrow 116. The lower surface of the main backing 22 is also a high thermal conductivity surface. Therefore, according to the second modification, the efficiency of heat conduction from the main backing 22 to the housing 12 can be further improved.

[0080] According to the embodiment described above, heat generated in electronic circuits, etc., is guided to the heat-absorbing component via a path with extremely high thermal conductivity within the backing member. This effectively suppresses the temperature of the receiving and transmitting surfaces in contact with the living organism. Furthermore, since two gaps are ensured near the main backing, wiring components can be arranged within these gaps, and electrical component groups can also be arranged within them. The two sides in contact with the two gaps are both low thermal conductivity surfaces, thus providing thermal protection for the electrical component groups. Moreover, since a sub-backing is provided above the main backing with their orientations orthogonal, heat diffuses in the X direction within the sub-backing and is guided in the Y direction within the main backing. Furthermore, since a temperature sensor is arranged on a high thermal conductivity surface within the main backing and is separated from the housing, the temperature of the main backing can be accurately detected, i.e., the heat transfer effect of the main backing can be accurately measured.

[0081] Furthermore, in the above embodiments, the secondary backing may be excluded. In this case, electronic circuitry is provided on the upper surface of the main backing. Additionally, in the above embodiments, the backing member may be composed of three or more backings. When the laminate has a cylindrical shape, the upper surface of the backing member is set to a cylindrical shape. Backings other than those described above may also be used as backings with thermal anisotropy. For example, a backing obtained by alternately stacking multiple thermally conductive layers and multiple spacers may also be used.

Claims

1. An ultrasonic probe, characterized in that, Include: Vibrating element array (36); An electronic circuit (37) is located on the rear side of the vibrating element array (36) and is electrically connected to the vibrating element array (36); and A backing (22), located behind the electronic circuit (37), attenuates ultrasonic waves from the vibrating element array (36). When the arrangement direction of the vibrating element array (36), the electronic circuit (37), and the backing (22) is defined as the Z direction, the direction orthogonal to the Z direction is defined as the X direction, and the direction orthogonal to both the Z and X directions is defined as the Y direction, In the backing (22), the thermal conductivity in the Z direction and the Y direction is greater than the thermal conductivity in the X direction. The backing (22) has two outer surfaces (22c, 22d) that intersect the X direction and two outer surfaces (22a, 22b) that intersect the Y direction. The two outer surfaces (22c, 22d) intersecting the X direction are low thermal conductivity surfaces, having lower thermal conductivity compared to the two outer surfaces (22a, 22b) intersecting the Y direction. The two outer surfaces (22a, 22b) intersecting the Y direction are high thermal conductivity surfaces, which have higher thermal conductivity than the two outer surfaces (22c, 22d) intersecting the X direction. A temperature sensor (200) is disposed on at least one of the two outer surfaces (22a, 22b) that intersect the Y direction. The ultrasonic probe is provided with a heat-absorbing component (12) having two inner surfaces (14a, 14b) that are joined to two outer surfaces (22a, 22b) orthogonal to the Y direction. The heat-absorbing member (12) includes a recess having a receiving space (204) for accommodating the temperature sensor (200). The temperature sensor (200) is separated from the inner surface of the recess.

2. The ultrasonic probe according to claim 1, characterized in that, The outer surface (22b) of the temperature sensor (200) has an upper end near the electronic circuit (37) and a lower end away from the electronic circuit. The temperature sensor (200) is disposed at the lower end.

3. The ultrasonic probe according to claim 1, characterized in that, The backing is the main backing (22). A secondary backing (21) is provided between the electronic circuit (37) and the main backing (22). In the sub-backing (21), the thermal conductivity in the Z direction and the X direction is greater than that in the Y direction. Heat diffused in the X direction within the sub-backing (21) is transferred to the heat-absorbing member (12) via the main backing (22). The temperature sensor (200) detects the temperature of the interface between the main backing (22) and the heat-absorbing member (12).

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