泛半导体制程喷雾除尘风机及系统
By using a spray dust removal fan for semiconductor manufacturing processes, and combining centrifugal and atomizing devices with a dust-liquid mesh, continuous dust removal is achieved in the front-end processing of semiconductor wafers. This solves the problems of discontinuous dust removal and frequent bag replacement, and improves dust removal efficiency and resource utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI WALKER GENERAL EQUIP
- Filing Date
- 2023-11-21
- Publication Date
- 2026-07-17
AI Technical Summary
In the current semiconductor wafer front-end processing stage, dust removal is discontinuous, bag filters need to be replaced frequently, and it is difficult to meet the requirements for high cleanliness.
The system employs a semiconductor process spray dust removal fan, which achieves continuous dust removal through the combination of centrifugal device, atomizing device and dust-liquid net, avoiding the use of bag filter dust collector. It utilizes the combination of atomized droplets and dust for filtration, and integrates a system for collecting and recovering slurry.
It enables continuous dust removal in the front-end processing of semiconductor wafers, reduces the frequency of bag replacement, improves dust removal efficiency and resource utilization, and reduces production disruptions.
Smart Images
Figure CN117599551B_ABST