Glass substrate destaticizing apparatus and glass substrate destaticizing method
By etching, cleaning, and drying to form micro-protrusion structures on the glass substrate, the problem of high-voltage electrostatic damage was solved, achieving overall static dispersion and effective protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU KZONE EQUIP TECH
- Filing Date
- 2023-11-23
- Publication Date
- 2026-07-24
Smart Images
Figure CN117602843B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display device technology, and more particularly to a device and method for removing static electricity from glass substrates. Background Technology
[0002] The manufacturing process of the circuit structure within a flat panel display screen involves patterning circuits on a glass substrate. The line width and spacing of the internal circuitry vary. For example, televisions typically have line spacing and width exceeding 5μm, while retina displays, such as those used in mobile phones, generally have line spacing and width within 3μm. Furthermore, some AR (Augmented Reality) and VR (Virtual Reality) screens have line spacing and widths reaching around 1μm. During circuit patterning, product handling and manufacturing processes generate a significant amount of static electricity on the product surface. The smaller the line width and spacing, the greater the impact of static electricity on product yield. When static electricity accumulates to a certain level (generally above 150V), it can cause irreversible electrostatic damage to the completed device structure on the glass substrate.
[0003] The formation of static electricity on glass substrates is generally caused by charge redistribution due to friction or by the attraction of charges. Based on these principles, the main methods for solving static electricity in industrial mass production are: 1. Reducing friction; 2. Eliminating static electricity promptly after friction using static eliminators or static discharge devices; 3. Reducing environmental static charge by controlling conditions such as humidity. Method 3 is generally used as a supplementary condition and not as a core element of static electricity control. Methods 1 and 2 are the key areas of focus for technical personnel in this industry.
[0004] In existing technologies, taking CN111556638A as an example, it uses an antistatic ion bar to act on the surface of the glass substrate to reduce the static electricity value of the glass substrate surface. Taking CN215418222U as an example, it grounds the friction components to achieve the purpose of discharging static electricity after friction. However, during the handling or manufacturing process of the glass substrate, triboelectric static electricity and process static electricity cannot be eliminated at the source. Static voltages of hundreds or even thousands of volts can be reached in a very short time. Although the above two examples can effectively reduce the static electricity value of the product surface, because the process of generating high-voltage static electricity is very rapid, these examples are prone to the phenomenon of instantaneous electrostatic damage to the surface device structure on the glass substrate when the static electricity is not discharged. This is especially true for devices with finer line spacing and linewidth, which are more sensitive to static electricity.
[0005] Therefore, there is an urgent need to invent equipment and methods for removing static electricity from glass substrates to solve the above problems. Summary of the Invention
[0006] The purpose of this invention is to provide a device and method for removing static electricity from glass substrates, so as to reduce the electrostatic discharge voltage on the glass substrate and improve the protection of surface device structures and surface circuits on the glass substrate.
[0007] To achieve this objective, the present invention adopts the following technical solution:
[0008] Static electricity removal equipment for glass substrates includes:
[0009] A conveying device is provided with multiple conveying rollers, each of which has threads on its outer peripheral wall, and the non-process surface of the glass substrate overlaps the conveying roller.
[0010] A roughening device is provided, wherein the transfer roller can transfer the glass substrate from the loading position to the roughening device, the etching agent is contained in the roughening device, the lower end of the transfer roller located above the roughening device is immersed in the etching agent, the etching agent can be transferred from the roughening device to the space between the correspondingly arranged transfer roller and the glass substrate by means of surface tension, the etching agent is used to etch the non-process surface of the glass substrate, and the roughness of the non-process surface of the glass substrate after etching is Rq = 1nm~2nm;
[0011] A cleaning device, located downstream of the roughening device, includes a transfer roller that can transport the roughened glass substrate to the cleaning device, which can clean the etching agent remaining on the glass substrate.
[0012] A drying device is located downstream of the cleaning device. The transfer roller can transfer the cleaned glass substrate to the drying device, which can dry the cleaned glass substrate. The transfer roller can also transfer the dried glass substrate to the unloading position.
[0013] As a preferred embodiment, the cleaning device includes:
[0014] A displacement cleaning assembly, located downstream of the roughening device, is provided. The transfer rollers transport the roughened glass substrate to the displacement cleaning assembly, which cleans any residual etching agent from the non-processed surfaces of the glass substrate.
[0015] A water purification cleaning assembly is located downstream of the displacement cleaning assembly and upstream of the drying device. The transfer roller is capable of transferring the glass substrate that has completed displacement cleaning to the water purification cleaning assembly, which is capable of completely cleaning the glass substrate.
[0016] As a preferred embodiment, the cleaning device further includes:
[0017] A blocking component is disposed between the upstream of the displacement cleaning component and the downstream of the roughening device, the blocking component being able to prevent the cleaning fluid in the displacement cleaning component from splashing into the roughening device.
[0018] As a preferred embodiment, the blocking component includes:
[0019] Air blowing components;
[0020] An air blowing port is connected to the air blowing component, and the opening of the air blowing port faces the displacement cleaning component. Gas can be blown out along the air blowing port and blow the cleaning liquid splashed by the displacement cleaning component toward the displacement cleaning component.
[0021] As a preferred embodiment, the etching agent is a mixture of 40% hydrofluoric acid, ammonium bifluoride, and pure water.
[0022] As a preferred embodiment, the content of the 40% concentration hydrofluoric acid in the etching agent is 60 g / L to 150 g / L, and the content of the ammonium bifluoride is 500 g / L to 600 g / L.
[0023] As a preferred embodiment, the glass substrate moves at a speed of 6 m / min on the transfer roller, and the etching time of the glass substrate is 20 s to 30 s.
[0024] As a preferred embodiment, the thread pitch P on each of the transmission rollers is 0.4 mm to 1.5 mm, the thread height h is 0.5 mm to 1.2 mm, and the thread angle β is 15° to 90°.
[0025] As a preferred embodiment, the drying device is provided with two sets of air blowing components, which are located above and below the correspondingly arranged transmission rollers, respectively. The air blowing component located above the transmission rollers can blow air downwards, and the air blowing component located below the transmission rollers can blow air upwards.
[0026] A method for removing static electricity from glass substrates, applied to the glass substrate static electricity removal equipment described above, includes the following steps:
[0027] The non-processed surface of the glass substrate is overlapped onto the transfer roller at the loading position;
[0028] The glass substrate is transferred from the loading position to the roughening device by the transfer roller. After the glass substrate enters the roughening device, the etching agent in the roughening device is transferred to the non-process surface of the glass substrate for etching.
[0029] The glass substrate that has undergone roughening is transferred by the transfer roller to the cleaning device for cleaning.
[0030] The cleaned glass substrate is transferred to the drying device by the transfer roller for drying.
[0031] The dried glass substrate is transferred to the unloading position by the transfer roller, and the glass substrate is removed from the unloading position by an external picking device.
[0032] The beneficial effects of this invention are:
[0033] The electrostatic discharge equipment for glass substrates provided by this invention, through the setting of a transmission device and a roughening device, a cleaning device, and a drying device arranged sequentially along the production line, places the glass substrate on the transmission rollers within the transmission device. The transmission rollers sequentially transfer the glass substrate from the loading position to the roughening device for roughening treatment, to the cleaning device for cleaning treatment, and to the drying device for drying treatment, and finally to the unloading position. This achieves etching, roughening, cleaning, and drying of the non-processed surfaces of the glass substrate, ensuring that the roughness Rq of the non-processed surfaces of the glass substrate is 1nm to 2nm. It can form micro-protrusion structures that are invisible to the naked eye on the non-processed surfaces of the glass substrate. These micro-protrusion structures not only do not affect the optical properties of the glass substrate, but also can disperse static electricity across the entire surface, avoiding the accumulation of static electricity in localized locations. Since the discharge voltage of the micro-protrusion structure after static electricity dispersion is small, it will not damage the device structure on the surface of the glass substrate, thereby achieving the effect of reducing the electrostatic discharge voltage on the glass substrate, resulting in good electrostatic discharge effect and improving the protection of the surface device structure and surface circuit on the glass substrate.
[0034] This invention also provides a method for removing static electricity from glass substrates. By applying the aforementioned equipment to remove static electricity from glass substrates, the non-processed surfaces of the glass substrate are etched, roughened, cleaned, and dried, ensuring that the roughness Rq of the non-processed surfaces is 1nm to 2nm. This method can form micro-protrusion structures that are invisible to the naked eye on the non-processed surfaces of the glass substrate. These micro-protrusion structures not only do not affect the optical properties of the glass substrate, but also disperse static electricity across the entire surface, preventing static electricity from accumulating in localized areas. Since the discharge voltage of the micro-protrusion structures after static electricity dispersion is small, it will not damage the surface device structures on the glass substrate. This achieves the effect of reducing the electrostatic discharge voltage on the glass substrate, resulting in good static electricity removal and improved protection of the surface device structures and surface circuits on the glass substrate. Attached Figure Description
[0035] Figure 1 This is a schematic diagram of the structure of the glass substrate static electricity removal device provided in Embodiment 1 of the present invention;
[0036] Figure 2 This is a schematic diagram of the structure of the transfer roller provided in Embodiment 1 of the present invention;
[0037] Figure 3 This is a flowchart of the electrostatic removal method for a glass substrate provided in Embodiment 2 of the present invention.
[0038] In the picture:
[0039] 1000. Static electricity removal equipment for glass substrates;
[0040] 100. Conveyor roller; 200. Roughening device; 210. Receptacle tank; 300. Cleaning device; 310. Displacement cleaning assembly; 320. Clean water cleaning assembly; 330. Barrier assembly; 400. Drying device; 410. Air blowing assembly; 500. Loading position; 600. Unloading position;
[0041] 2000, glass substrate;
[0042] 3000, etching agent. Detailed Implementation
[0043] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0044] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0045] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0046] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.
[0047] Example 1
[0048] The formation of static electricity on glass substrates is generally caused by charge redistribution due to friction or by the attraction of charges. Based on these principles, the main methods for solving static electricity in industrial mass production are: 1. Reducing friction; 2. Eliminating static electricity promptly after friction using static eliminators or static discharge devices; 3. Reducing environmental static charge by controlling conditions such as humidity. Method 3 is generally used as a supplementary condition and not as a core element of static electricity control. Methods 1 and 2 are the key areas of focus for technical personnel in this industry.
[0049] In existing technologies, taking CN111556638A as an example, it uses an antistatic ion bar to act on the surface of the glass substrate to reduce the static electricity value of the glass substrate surface. Taking CN215418222U as an example, it grounds the friction components to achieve the purpose of discharging static electricity after friction. However, during the handling or manufacturing process of the glass substrate, triboelectric static electricity and process static electricity cannot be eliminated at the source. Static voltages of hundreds or even thousands of volts can be reached in a very short time. Although the above two examples can effectively reduce the static electricity value of the product surface, because the process of generating high-voltage static electricity is very rapid, these examples are prone to the phenomenon of instantaneous electrostatic damage to the surface device structure on the glass substrate when the static electricity is not discharged. This is especially true for devices with finer line spacing and linewidth, which are more sensitive to static electricity.
[0050] To solve the above problems, such as Figure 1As shown, this embodiment provides a glass substrate antistatic device 1000. The glass substrate antistatic device 1000 includes a conveying device, a roughening device 200, a cleaning device 300, and a drying device 400. The conveying device contains multiple conveying rollers 100, each with threads on its outer peripheral wall. The non-processed surface of the glass substrate 2000 overlaps with the conveying roller 100. The conveying rollers 100 can transfer the glass substrate 2000 from the loading position 500 to the roughening device 200. An etching agent 3000 is contained in the roughening device 200. The lower end of the conveying roller 100 located above the roughening device 200 is immersed in the etching agent 3000. The etching agent 3000 can be transferred from the roughening device 200 to the space between the corresponding conveying roller 100 and the glass substrate 2000 using surface tension. Etching agent 3000 is used to etch the non-process surfaces of glass substrate 2000. After etching, the roughness of the non-process surfaces of glass substrate 2000 is Rq = 1nm~2nm. Cleaning device 300 is located downstream of roughening device 200. Transfer roller 100 can also transfer the roughened glass substrate 2000 to cleaning device 300. Cleaning device 300 can clean the residual etching agent 3000 on glass substrate 2000. Drying device 400 is located downstream of cleaning device 300. Transfer roller 100 can transfer the cleaned glass substrate 2000 to drying device 400. Drying device 400 can dry the cleaned glass substrate 2000. Transfer roller 100 can also transfer the dried glass substrate 2000 to unloading position 600.
[0051] The glass substrate destatic equipment 1000, through the inclusion of a conveying device and a roughening device 200, a cleaning device 300, and a drying device 400 arranged sequentially along the production line, places the glass substrate 2000 onto the conveying roller 100 within the conveying device. The conveying roller 100 sequentially transfers the glass substrate 2000 from the loading position 500 to the roughening device 200 for roughening, to the cleaning device 300 for cleaning, and to the drying device 400 for drying, finally transferring it to the unloading position 600. This process achieves etching roughening, cleaning, and drying of the non-process surfaces of the glass substrate 2000, ensuring the integrity of the non-process surfaces. With a roughness Rq of 1nm to 2nm, micro-protrusion structures invisible to the naked eye can be formed on the non-processed surface of the glass substrate 2000. These micro-protrusion structures not only do not affect the optical properties of the glass substrate 2000, but also disperse static electricity across the entire surface, preventing the accumulation of static electricity in localized areas. Since the discharge voltage of the micro-protrusion structure after static electricity dispersion is small, it will not damage the device structure on the surface of the glass substrate 2000, thereby achieving the effect of reducing the electrostatic discharge voltage on the glass substrate 2000, resulting in good static electricity removal effect and improved protection of the surface device structure and surface circuit on the glass substrate 2000.
[0052] Specifically, such as Figure 2 As shown, the thread pitch P of each transmission roller 100 is 0.4mm to 1.5mm, the thread height h is 0.5mm to 1.2mm, and the thread angle β is 15° to 90°. It should be noted that in this embodiment, the thread pitch P of each transmission roller 100 is 0.9mm, the thread height h is 0.78mm, and the thread angle β is 60°. By limiting the thread pitch P, thread height h, and thread angle β of each transmission roller 100, the transmission effect of the transmission roller 100 on the glass substrate 2000 overlapping it can be guaranteed. In other embodiments, the thread pitch P of each transmission roller 100 can be arbitrarily adjusted within the range of 0.4mm to 1.5mm according to actual needs, the thread angle β can be arbitrarily adjusted within the range of 15° to 90° according to actual needs, and the thread height h can also be arbitrarily adjusted within the range of 0.5mm to 1.2mm according to actual needs; no specific limitation is made in this embodiment.
[0053] It should be noted that, as Figure 1 As shown, the roughening device 200 is provided with a container 210, in which the etching agent 3000 is contained, and the lower end of the transfer roller 100 located above the container 210 is immersed in the etching agent 3000. When the glass substrate 2000 is transferred to the top of the receiving pool 210, as the transfer roller 100 located above the receiving pool 210 rotates, the etching agent 3000 disposed in the receiving pool 210 will adhere to the transfer roller 100 under the action of its surface tension and be transferred to the non-process surface of the glass substrate 2000 located on the transfer roller 100 as the transfer roller 100 rotates. Since the glass substrate 2000 is attached to the transfer roller 100, the glass substrate 2000 will move relative to the transfer roller 100 during the transfer process. However, since the etching agent 3000 has been transferred to the non-process surface of the glass substrate 2000, the etching agent 3000 will etch the non-process surface of the glass substrate 2000.
[0054] Furthermore, the cleaning apparatus 300 includes a displacement cleaning component 310 and a clean water cleaning component 320. The displacement cleaning component 310 is located downstream of the roughening apparatus 200. The transfer roller 100 can transfer the roughened glass substrate 2000 to the displacement cleaning component 310. The displacement cleaning component 310 is used to clean the etching agent 3000 remaining on the non-process surface of the glass substrate 2000. The clean water cleaning component 320 is located downstream of the displacement cleaning component 310 and upstream of the drying apparatus 400. The transfer roller 100 can transfer the displacement-cleaned glass substrate 2000 to the clean water cleaning component 320. The clean water cleaning component 320 can be used to completely clean the glass substrate 2000. By splitting the cleaning device 300 into a replacement cleaning component 310 and a clean water cleaning component 320 arranged sequentially on the production line, the cleaning effect on the glass substrate 2000 can be improved, the etching agent 3000 remaining on the glass substrate 2000 can be thoroughly cleaned, and the roughness Rq of the non-process surface of the glass substrate 2000 can be in the range of 1nm to 2nm.
[0055] Furthermore, the replacement cleaning assembly 310 includes a spray drive, a cleaning agent tank, and two nozzles. The cleaning agent tank contains cleaning agent. The input end of the spray drive is connected to the cleaning agent tank, and the output end of the spray drive is connected to both nozzles. The two nozzles are respectively positioned above and below the corresponding transfer roller 100 at the cleaning position. The nozzle above the corresponding transfer roller 100 at the cleaning position can spray cleaning agent downwards to clean the upper surface of the glass substrate 2000, and the nozzle below the corresponding transfer roller 100 at the cleaning position can spray cleaning agent upwards to clean the lower surface of the glass substrate 2000, thereby achieving replacement cleaning of the glass substrate 2000. It should be noted that in this embodiment, the cleaning agent used for replacement cleaning is pure water. The main purpose of replacement cleaning of the glass substrate 2000 is to use pure water to quickly remove the etching agent 3000 remaining on the non-process surface of the glass substrate 2000. However, after the replacement cleaning, the wastewater containing trace amounts of etching agent 3000 will still remain on the glass substrate 2000. Therefore, the glass substrate 2000 with the residual trace amounts of etching agent 3000 is transferred to the water purification unit 320 for water purification treatment, so as to thoroughly clean the glass substrate 2000 with the residual trace amounts of etching agent 3000 and improve the protection of the glass substrate 2000 after etching.
[0056] It should be noted that the specific structure of the water purification cleaning component 320 is the same as that of the replacement cleaning component 310. To keep the writing concise, the specific structure of the water purification cleaning component 320 will not be described in detail here.
[0057] Furthermore, the cleaning apparatus 300 also includes a blocking component 330, which is disposed between the upstream of the displacement cleaning component 310 and the downstream of the roughening device 200. The blocking component 330 can prevent the cleaning fluid in the displacement cleaning component 310 from splashing into the container 210 in the roughening device 200. By providing the blocking component 330 between the upstream of the displacement cleaning component 310 and the downstream of the roughening device 200 to prevent the cleaning fluid from splashing into the container 210 in the roughening device 200, the protection of the etching agent 3000 in the container 210 can be improved.
[0058] Specifically, the blocking component 330 includes an air blowing element and an air blowing port, wherein the air blowing port and the air blowing element are connected, and the opening of the air blowing port faces the displacement cleaning component 310. Gas can be blown out along the air blowing port and blow the cleaning liquid splashed by the displacement cleaning component 310 toward the displacement cleaning component 310. When the cleaning liquid sprayed from the nozzle in the displacement cleaning component 310 splashes toward the roughening device 200, the gas blown out along the air blowing port will blow the splashed cleaning liquid toward the displacement cleaning component 310, preventing the splashed cleaning liquid from entering the etching agent 3000 in the container 210, thereby improving the protection of the etching agent 3000.
[0059] It should be noted that since the opening of the containment tank 210 is located at the top, the blocking component 330 only needs to be installed above the upstream of the replacement cleaning component 310 and the downstream of the roughening device 200.
[0060] Preferably, the drying apparatus 400 is provided with two sets of air blowing assemblies 410, which are respectively located above and below the correspondingly arranged transfer rollers 100. The air blowing assembly 410 located above the transfer rollers 100 can blow air downwards, and the air blowing assembly 410 located below the transfer rollers 100 can blow air upwards. The opposing air blowing of the two sets of air blowing assemblies 410 achieves omnidirectional air blowing drying of the glass substrate 2000, improving the drying effect and efficiency of the glass substrate 2000. It should be noted that each set of air blowing assemblies 410 includes an air blowing element and an air blowing port, wherein the air blowing port and the air blowing element are connected. The opening of the air blowing port located above the transfer rollers 100 is downward, and the opening of the air blowing port located below the transfer rollers 100 is upward, so as to achieve opposing air blowing of the two sets of air blowing assemblies 410.
[0061] Specifically, each air blowing assembly 410 includes an air blowing element and an air blowing port. The air blowing port and the air blowing element are connected. The opening of the air blowing port located above the transfer roller 100 faces downward, and the opening of the air outlet located below the transfer roller 100 faces upward. Gas can be blown out along the air blowing port and blown towards the transfer roller 100, and then towards the glass substrate 2000 located on the transfer roller 100, thereby increasing the air flow rate on the surface of the glass substrate 2000, thereby increasing the evaporation efficiency of residual water stains on the surface of the glass substrate 2000, and realizing the rapid drying of the glass substrate 2000.
[0062] In other embodiments, the drying apparatus 400 may also be equipped with a heating component, through which the cleaned glass substrate 2000 flows and is dried by heating the glass substrate 2000. This embodiment does not impose any specific limitations.
[0063] In this embodiment, the etching agent 3000 is a mixture of 40% hydrofluoric acid, ammonium bifluoride, and pure water. Specifically, the content of the 40% hydrofluoric acid in the etching agent 3000 is 60 g / L to 150 g / L, and the content of ammonium bifluoride is 500 g / L to 600 g / L. It should be noted that in this embodiment, the preferred content of the 40% hydrofluoric acid in the etching agent 3000 is 115 g / L, and the preferred content of ammonium bifluoride is 550 g / L. In other embodiments, the content of the 40% hydrofluoric acid in the etching agent 3000 can be adjusted arbitrarily within the range of 60 g / L to 150 g / L according to actual needs, and the content of ammonium bifluoride can also be adjusted arbitrarily within the range of 500 g / L to 600 g / L; this embodiment does not impose specific limitations.
[0064] Preferably, the glass substrate 2000 moves at a speed of 6 m / min on the transfer roller 100, and the etching time of the glass substrate 2000 is 20 s to 30 s. By limiting the moving speed of the glass substrate 2000 on the transfer roller 100 and the etching time, a roughness Rq of 1 nm to 2 nm can be ensured at the non-process surface of the glass substrate 2000, thus ensuring the antistatic effect on the glass substrate 2000. In addition, by limiting the moving speed of the glass substrate 2000 on the transfer roller 100 and the etching time, the specific length of the container pool 210 in the roughening device 200 can be determined, facilitating the reasonable arrangement of the installation position of the glass substrate antistatic device 1000 according to the length of the container pool 210.
[0065] Example 2
[0066] like Figure 3 As shown, this embodiment provides a method for removing static electricity from a glass substrate, applied to the aforementioned glass substrate static electricity removal equipment 1000, specifically including the following steps:
[0067] 1) The non-process surface of the glass substrate 2000 is overlapped on the transfer roller 100 at the loading position 500;
[0068] 2) The glass substrate 2000 is transferred from the loading position 500 to the roughening device 200 by the transfer roller 100. After the glass substrate 2000 enters the roughening device 200, the etching agent 3000 in the roughening device 200 is transferred to the non-process surface of the glass substrate 2000 for etching.
[0069] 3) The roughened glass substrate 2000 is transferred to the cleaning device 300 by the transfer roller 100 for cleaning.
[0070] 4) The cleaned glass substrate 2000 is transferred to the drying device 400 by the transfer roller 100 for drying.
[0071] 5) The dried glass substrate 2000 is transferred to the unloading position 600 by the transfer roller 100, and the glass substrate 2000 is taken away from the unloading position 600 by the external picking device.
[0072] This method for removing static electricity from glass substrates, applied to the aforementioned static electricity removal equipment 1000, achieves etching, roughening, cleaning, and drying of the non-processed surfaces of the glass substrate 2000, ensuring a roughness Rq of 1nm to 2nm on the non-processed surfaces. It can form micro-protrusion structures invisible to the naked eye on the non-processed surfaces of the glass substrate 2000. These micro-protrusion structures not only do not affect the optical properties of the glass substrate 2000, but also disperse static electricity across the entire surface, preventing its accumulation in localized areas. Because the discharge voltage of the micro-protrusion structures after static electricity dispersion is low, it will not damage the surface device structures on the glass substrate 2000, thereby achieving the effect of reducing the electrostatic discharge voltage on the glass substrate 2000. This results in good static electricity removal performance and improved protection of the surface device structures and surface circuits on the glass substrate 2000.
[0073] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A device for removing static electricity from glass substrates, characterized in that, include: A conveying device is provided with multiple conveying rollers (100), and each conveying roller (100) has threads on its outer peripheral wall. The non-process surface of the glass substrate (2000) overlaps the conveying roller (100). The roughening device (200) includes a transfer roller (100) that can transfer the glass substrate (2000) from the loading position (500) to the roughening device (200). An etching agent (3000) is contained in the roughening device (200). The lower end of the transfer roller (100) located above the roughening device (200) is immersed in the etching agent (3000). The etching agent (3000) can be transferred from the roughening device (200) to the space between the correspondingly arranged transfer roller (100) and the glass substrate (2000) by means of surface tension. The etching agent (3000) is used to etch the non-process surface of the glass substrate (2000). After etching, the roughness of the non-process surface of the glass substrate (2000) is Rq = 1nm to 2nm. The cleaning device (300) is located downstream of the roughening device (200). The transfer roller (100) can also transfer the roughened glass substrate (2000) to the cleaning device (300). The cleaning device (300) can clean the etching agent remaining on the glass substrate (2000). as well as A drying device (400) is located downstream of the cleaning device (300). The transfer roller (100) can transfer the cleaned glass substrate (2000) to the drying device (400). The drying device (400) can dry the cleaned glass substrate (2000). The transfer roller (100) can also transfer the dried glass substrate (2000) to the unloading position (600). The thread pitch P on each of the transmission rollers (100) is 0.4 mm to 1.5 mm, the thread height h is 0.5 mm to 1.2 mm, and the thread angle β is 15° to 90°.
2. The glass substrate static electricity removal device according to claim 1, characterized in that, The cleaning device (300) includes: A displacement cleaning assembly (310) is located downstream of the roughening device (200). The transfer roller (100) can transfer the roughened glass substrate (2000) to the displacement cleaning assembly (310). The displacement cleaning assembly (310) is used to clean the etching agent (3000) remaining on the non-processed surfaces of the glass substrate (2000). A water purification cleaning assembly (320) is located downstream of the displacement cleaning assembly (310) and upstream of the drying device (400). The transfer roller (100) is capable of transferring the glass substrate (2000) that has completed displacement cleaning to the water purification cleaning assembly (320). The water purification cleaning assembly (320) is capable of completely cleaning the glass substrate (2000).
3. The glass substrate static electricity removal device according to claim 2, characterized in that, The cleaning device (300) further includes: A blocking component (330) is disposed between the upstream of the displacement cleaning component (310) and the downstream of the roughening device (200), the blocking component (330) preventing the cleaning fluid in the displacement cleaning component (310) from splashing into the roughening device (200).
4. The glass substrate static electricity removal device according to claim 3, characterized in that, The blocking assembly (330) includes: Air blowing components; An air blowing port is connected to the air blowing component, and the opening of the air blowing port faces the displacement cleaning assembly (310). Gas can be blown out along the air blowing port and blow the cleaning liquid splashed by the displacement cleaning assembly (310) toward the displacement cleaning assembly (310).
5. The glass substrate static electricity removal device according to any one of claims 1 to 4, characterized in that, The etching agent (3000) is a mixture of 40% hydrofluoric acid, ammonium bifluoride and pure water.
6. The glass substrate static electricity removal device according to claim 5, characterized in that, The etching agent (3000) contains 40% hydrofluoric acid at a concentration of 60 g / L to 150 g / L, and the ammonium bifluoride at a concentration of 500 g / L to 600 g / L.
7. The glass substrate static electricity removal device according to any one of claims 1 to 4, characterized in that, The glass substrate (2000) moves at a speed of 6 m / min on the transfer roller (100), and the etching time of the glass substrate (2000) is 20 s to 30 s.
8. The glass substrate static electricity removal device according to any one of claims 1 to 4, characterized in that, The drying device (400) is provided with two sets of air blowing components (410). The two sets of air blowing components (410) are respectively located above and below the correspondingly arranged transmission rollers (100). The air blowing component (410) located above the transmission rollers (100) can blow air downwards, and the air blowing component (410) located below the transmission rollers (100) can blow air upwards.
9. A method for removing static electricity from a glass substrate, characterized in that, The device for removing static electricity from glass substrates according to any one of claims 1 to 8 comprises the following steps: The non-processed surface of the glass substrate (2000) is overlapped with the transfer roller (100) at the loading position (500); The glass substrate (2000) is transferred from the loading station (500) to the roughening device (200) by the transfer roller (100). After the glass substrate (2000) enters the roughening device (200), the etching agent (3000) in the roughening device (200) is transferred to the non-process surface of the glass substrate (2000) for etching. The glass substrate (2000) that has undergone roughening treatment is transferred by the transfer roller (100) to the cleaning device (300) for cleaning treatment; The cleaned glass substrate (2000) is transferred by the transfer roller (100) to the drying device (400) for drying. The dried glass substrate (2000) is transferred to the unloading station (600) by the transfer roller (100), and the glass substrate (2000) is removed from the unloading station (600) by an external picking device.