一种物镜硬限位标定方法和装置
By acquiring wafer shadow images through parallel light illumination and detectors, and combining this with the objective lens driving system, hard-limit calibration of high-magnification objectives is achieved, solving the problem of objective lens collision with wafers and improving the efficiency and safety of the inspection system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- RAINTREE SCI INSTR SHANGHAI
- Filing Date
- 2023-12-06
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, high-magnification, high-numerical-aperture objectives have short working distances, making them prone to collisions with the wafer under test. This results in complex operation, slow speed, low safety factor, and difficulty in adapting to wafers of different thicknesses, affecting the efficiency and safety of the defect detection system.
The wafer stage is illuminated by parallel light, and shadow images are acquired using a detector. The width of the bright slit is calculated, and the objective lens is determined by the descent and ascent process. This ensures that the objective lens and the wafer are vertically offset to avoid collisions, and precise positioning is achieved through a stepper motor and drive system.
It improves the efficiency and safety of the defect detection system, adapts to wafers of different thicknesses, ensures the accuracy and reliability of detection, avoids collisions between the objective lens and the wafer, and improves the safety factor of production.
Smart Images
Figure CN117606353B_ABST