Platinum thin film ultra-high speed fluid temperature measuring resistance processing and packaging method thereof

Abstract

The application discloses a platinum thin film super-high-speed fluid temperature measuring resistance processing and packaging method, which comprises the following steps: 1) a bottom plate is made; 2) a mask is made; 3) a sputtering device is made; 4) a thin film platinum thermal resistance is made by using a sputtering method; and 5) packaging is performed to obtain a platinum thin film thermal resistance. The platinum thin film thermal resistance can realize the measurement of transient temperature values of high-precision super-high-speed fluids, has high measurement precision, has small device volume, and can be applied to various super-high-speed fluid devices.

Description

Technical Field

[0001] This invention belongs to the field of fluid temperature sensing resistor fabrication, specifically relating to a platinum thin-film ultra-high-speed fluid temperature sensing resistor processing and packaging method. Background Technology

[0002] my country has developed several typical electronic components for temperature measurement and control: wire-wound platinum resistance thermometers (RTDs), thermistors, and platinum thin-film thermistors. Wire-wound platinum thin-film RTDs are widely used in domestic industries for temperature measurement, resulting in a long and rich accumulation of experience in their research. However, wire-wound platinum thin-film RTDs are not only expensive, but also suffer from low resistance, low sensitivity, and poor resistance to mechanical vibration. Furthermore, the platinum wire coil generates current in the coupled magnetic field, affecting test accuracy, making them unsuitable for the stringent requirements of high resistance and small size in special applications such as spacecraft. Thermistors are widely used as temperature sensors in China, but they have some inherent drawbacks: their measurement temperature range is narrow, unable to adapt to measurements within the range of -180℃ to +650℃. Solving the problem of wide-temperature-range measurement often requires multiple thermistors, thus occupying more measurement channels. Currently, there are few reports on the design and overall manufacturing process of platinum thin-film RTDs in China.

[0003] Generally, for temperature measurement of low-speed fluids, the convective heat transfer coefficient between the measured medium and the sensor is relatively small, making it easy to select a suitable sensor. However, for high-speed fluids, even ultra-high-speed fluids with Mach numbers close to 5, the complex flow field behind the ultra-high-speed fluid makes it difficult to measure the transient temperature of ultra-high-speed fluids using existing temperature-sensing resistors. However, due to the needs of experimental analysis, the transient temperature of ultra-high-speed fluids has always been an important parameter in engineering analysis, and existing technologies measure this parameter indirectly. For example, to measure the temperature of the liquid film behind an ultra-high-speed fluid due to phase transfer, we need to first calculate the thickness of the liquid film and then indirectly calculate the temperature of the liquid film by combining the latent heat of liquefaction of the corresponding liquid film. However, due to the complexity of the ultra-high-speed flow field mentioned above, the indirect method for substituting the transient temperature of ultra-high-speed fluids often fails to achieve the accuracy required by engineering technology. This invention, in order to directly measure the transient temperature of ultra-high-speed fluids and obtain high-precision transient temperature values, fabricates a platinum thin-film ultra-high-speed fluid temperature-sensing resistor. Summary of the Invention

[0004] The purpose of this invention is to address the challenges of measuring the transient temperature of high-speed fluids, even ultra-high-speed fluids with Mach numbers approaching 5, due to the complex flow field behind them. Existing temperature-measuring resistors are difficult to use for this purpose, and indirect methods for obtaining transient temperature values ​​often fall short of the required engineering precision. This invention proposes a platinum thin-film ultra-high-speed fluid temperature-measuring resistor fabrication and packaging method. This platinum thin-film thermocouple enables high-precision measurement of the transient temperature of ultra-high-speed fluids, offering high accuracy and a small device size, making it applicable to various ultra-high-speed fluid devices.

[0005] The technical solution to achieve the objective of this invention is:

[0006] A method for fabricating and packaging a platinum thin-film ultra-high-speed fluid temperature sensing resistor includes the following steps:

[0007] 1) Film preparation:

[0008] Using drawing software, a first mask template and a second mask template are made. The first mask template and the second mask template are printed onto thin paper and placed on a light-emitting plate. Ensure that the cutout parts of the first mask template and the second mask template are fully exposed. Use a single roll of film to photograph the two sheets of paper to capture the desired image. After the photographing is completed, the film is developed. During the development process, the cutout parts of the first mask template and the second mask template will appear transparent, while the other parts will appear black. After development, the first negative and the second negative are obtained.

[0009] 2) Masking creation:

[0010] Two nickel sheets were cleaned with acetone and ethanol respectively, and then resist was applied to both sides of the two nickel sheets using a spin coating instrument. After that, the first film and the second film obtained in step 1) were covered on the two nickel sheets respectively. Both nickel sheets covered with the first film and the second film were exposed to ultraviolet light for 12 seconds. After exposure, they were immersed in NMD-3 developer. After one minute, the exposed part was developed. After the exposed shape was formed, the nickel sheets were washed with distilled water and dried with nitrogen. The dried nickel sheets were immersed in ferrous chloride solution at 60°C. After one hour, the exposed part was dissolved. The nickel sheets were taken out and washed with ethanol solution and dried with nitrogen to obtain the first mask plate and the second mask plate.

[0011] 3) Fabrication of the sputtering apparatus:

[0012] The sputtering apparatus includes a base, a phenolic resin support, and a heat-resistant glass base stacked sequentially from bottom to top. Each of the four corners of the base has an upward-facing support column. The upper section of each support column is threaded, and each column has a stepped support nut that matches the thread. The four corner through-holes of the first or second shielding plate, which are melted, are fitted onto the support columns. The stepped portion of the support nut limits the position of the first or second shielding plate.

[0013] The sputtering apparatus also includes a sputtering device housing. A nozzle base is located in the middle of the top surface of the sputtering device housing. A set of high-energy particle nozzles arranged in a downward-facing, spaced array is located on the nozzle base. A platinum anode connecting column is located in the center and faces downward. A platinum anode is located at the lower end of the platinum anode connecting column. There is a gap between the bottom surface of the platinum anode and the upper end of the column. The sputtering device housing covers the base, phenolic resin support and heat-resistant glass base. The high-energy particle nozzles are connected to an external power supply.

[0014] 4) Fabrication of platinum thin-film resistance thermometers using sputtering:

[0015] 4.1) Place the first shielding plate on the support column, adjust the support column nuts to make the first shielding plate stable, cover the sputtering device housing, turn on the power supply connected to the high-energy particle nozzle in the sputtering device, and spray through the high-energy particle nozzle to form a DC high-voltage electric field. The ion flow formed by the platinum anode under the action of the DC high-voltage electric field transfers the kinetic energy and momentum of the ions to the atoms on the solid surface. Due to the breaking of chemical bonds, the ions are splashed and bombard the first shielding plate, thereby forming a strip-shaped platinum metal film on the heat-resistant glass base.

[0016] 4.2) Turn off the power supply to the high-energy particle nozzle, remove the sputtering device housing, remove the first shielding plate and replace it with the second shielding plate on the support column, adjust the support column nut to make the second shielding plate stable, then cover the sputtering device housing, turn on the power supply to the high-energy particle nozzle in the sputtering device, and spray through the high-energy particle nozzle to form a DC high-voltage electric field. The ion flow formed by the platinum anode under the action of the DC high-voltage electric field causes the kinetic energy and momentum of the ions to be transferred to the atoms on the solid surface. Due to the breaking of chemical bonds, the ions are splashed and bombard the second shielding plate, thereby forming a square platinum metal film on the heat-resistant glass base.

[0017] 5) Packaging:

[0018] A strip of platinum metal film is fixed on the substrate surface of a heat-resistant glass base. The sides of the heat-resistant glass base are square platinum end caps formed by square platinum metal films. Copper thin film wires are led out from the sides of the heat-resistant glass base to connect to an external bridge circuit. A conductive agent is covered between the lead-out wires and the platinum end caps to form a platinum sealing edge, thus obtaining a platinum thin film thermal resistor.

[0019] In step 1), the size of the first masking template and the second masking template is 5 times larger than the size of the first negative and the second negative. The first masking template and the second masking template have holes at the same positions at the four corners. The first masking template has a long strip hole in the middle, and the second masking template has two square holes spaced apart in the middle. The first masking template and the second masking template are printed on two thin sheets of paper at a 1:1 scale. When the two thin sheets of paper are photographed using a single roll of film, the camera focus is adjusted to produce a first negative and a second negative that are 5 times smaller than the two thin sheets of paper.

[0020] Before placing the first shielding plate onto the support pillar in step 4.1), the heat-resistant glass base is cleaned. The cleaning process involves cleaning with acetone for five minutes, then with ethanol for five minutes, then with distilled water and dried. All cleaning processes are carried out in an ultrasonic cleaning device.

[0021] The encapsulation in step 5) can improve the corrosion resistance, mechanical strength, and mechanical vibration resistance of the platinum thin film thermal resistor.

[0022] After obtaining the platinum thin-film resistance thermometer in step 5), in order to enable the platinum thin-film resistance thermometer to undergo the transition from an equilibrium state to a non-equilibrium state for precise temperature measurement, a balanced bridge circuit needs to be installed on the platinum thin-film resistance thermometer. One of the wires of the platinum thin-film resistance thermometer is connected to the In+ terminal of the amplifier and connected to two resistors R2 and R3 in series. The other wire is connected to the adjustable resistor R1. The outputs of both wires are connected to the In- terminal of the amplifier, and finally the signal is amplified by the amplifier.

[0023] After obtaining the platinum thin-film resistance thermometer in step 5), to compensate for the measurement error caused by the resistance of the lead wire during temperature measurement, a three-wire connection method is adopted. A lead wire is added to one end of the platinum thin-film resistance thermometer, forming three lead wires for the thermometer. The three-wire connection method requires that the three lead wires be of identical length, material, and thickness, and be under the same operating conditions, satisfying the following:

[0024] R L1 =R L2 =R L3 =r

[0025] Among them, R L1 Directly connected to the power supply terminal of the bridge, R L2 and R L3 They are connected in series to the other two arms of the bridge, respectively. When the bridge is balanced, R t The following relationship exists:

[0026] R2(R t +R L3 )=R1(R3+R L2 )

[0027]

[0028] When R1 = R2, then The two signals completely cancel each other out, meaning that the bridge is considered to be completely balanced when r = 0.

[0029] At this point, the wire resistance r will no longer cause measurement errors in the platinum thin-film resistance thermometer.

[0030] This technical solution has the following advantages: 1. It can directly obtain the transient temperature value of ultra-high-speed fluids. 2. Due to the unique properties of platinum, the measurement accuracy is high. 3. The device is small in size and can be applied to various ultra-high-speed fluid devices. Attached Figure Description

[0031] Figure 1 This is a flowchart illustrating the fabrication process of the film and mask in this embodiment;

[0032] Figure 2 The above are schematic diagrams of the first masking template and the second masking template in the embodiment, where a is a schematic diagram of the first masking template and b is a schematic diagram of the second masking template;

[0033] Figure 3 This is a structural diagram of the sputtering apparatus in the embodiment;

[0034] Figure 4 This is a schematic diagram of the platinum thin film resistance thermometer encapsulation in the embodiment;

[0035] Figure 5 This is a schematic diagram of the balanced bridge and amplification circuit with a platinum thin-film thermistor mounted in the embodiment.

[0036] Figure 6 The diagram below shows the principle of a three-wire platinum thin-film resistance thermometer in this embodiment.

[0037] In the figure, 1. Sputtering device housing; 2. Platinum anode; 4. First masking template; 41. First masking template hole; 42. Elongated hole; 43. Square hole; 44. Second masking template hole; 5. Support column; 6. Base; 7. Phenolic resin support; 8. Heat-resistant glass base; 81. Strip-shaped platinum film; 83. Conductive agent; 84. Platinum edge sealing; 85. Wire; 9. Support nut; 10. Platinum anode connecting column; 11. High-energy particle nozzle; 12. Nozzle base; Pt. Platinum film thermal resistor. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0039] Example:

[0040] A method for fabricating and packaging a platinum thin-film ultra-high-speed fluid temperature sensing resistor includes the following steps:

[0041] like Figure 1 As shown, 1) Film preparation:

[0042] like Figure 2 As shown, a first mask template 4 and a second mask template are made using drawing software. The first mask template 4 and the second mask template are printed onto thin paper and placed on a light-emitting plate to ensure that the cutout parts of the first mask template 4 and the second mask template are fully exposed. A single roll of film is used to photograph the two sheets of paper to capture the desired image. After the photographing is completed, the film is developed. During the development process, the cutout parts of the first mask template 4 and the second mask template will be transparent, while the other parts will be black. After development, the first negative and the second negative are obtained.

[0043] 2) Masking creation:

[0044] Two nickel sheets were cleaned with acetone and ethanol respectively, and then resist was applied to both sides of the two nickel sheets using a spin coating instrument. The first and second films obtained in step 1) were then covered onto the two nickel sheets respectively. Both nickel sheets covered with the first and second films were exposed to ultraviolet light for 12 seconds. After exposure, they were immersed in NMD-3 developer. After one minute, the exposed portion was developed. The above exposure and development process removed the resist from the exposed portion. After the exposed shape was formed, the nickel sheets were washed with distilled water and dried with nitrogen. The dried nickel sheets were then immersed in a ferrous chloride solution at 60°C, which can dissolve the exposed portion. After one hour, the exposed portion was dissolved. The nickel sheets were removed and washed with ethanol, and then dried with nitrogen to obtain the first and second masking plates. In this example, the nickel sheet size was 42×32mm and the thickness was 0.05mm.

[0045] 3) Fabrication of the sputtering apparatus:

[0046] like Figure 3 As shown, the sputtering apparatus includes a base 6, a phenolic resin support 7, and a heat-resistant glass base 8 stacked sequentially from bottom to top. Each of the four corners of the base 6 has an upward-facing support column 5. The upper section of each support column 5 is threaded, and each support column 5 has a stepped support nut 9 that matches the thread. The four corner through-holes of the first or second shielding plate, which are melted, are fitted onto the support column 5. The stepped portion of the support nut 9 limits the position of the first or second shielding plate.

[0047] The sputtering apparatus also includes a sputtering device housing 1. A nozzle base 12 is provided in the middle of the top surface of the sputtering device housing 1. A set of high-energy particle nozzles 11 arranged in a downward-facing, spaced array is provided on the nozzle base 12. A platinum anode connecting column 10 is provided in the center and facing downward. A platinum anode 2 is provided at the lower end of the platinum anode connecting column 10. There is a gap between the bottom surface of the platinum anode 2 and the upper end of the column 5. The sputtering device housing 1 covers the base 6, the phenolic resin support 7 and the heat-resistant glass base 8. The high-energy particle nozzles 11 are connected to an external power source.

[0048] 4) Fabrication of platinum thin-film resistance thermometers using sputtering:

[0049] 4.1) Place the first shielding plate on the support column 5, adjust the support column nut 9 to make the first shielding plate stable, cover the sputtering device housing 1, turn on the power supply connected to the high-energy particle nozzle 11 in the sputtering device, and spray through the high-energy particle nozzle 11 to form a DC high-voltage electric field. The ion flow formed by the platinum anode 2 under the action of the DC high-voltage electric field transfers the kinetic energy and momentum of the ions to the atoms on the solid surface. Due to the breaking of chemical bonds, the ions are splashed and bombard the first shielding plate, thereby forming a strip-shaped platinum metal film 81 on the heat-resistant glass base 8.

[0050] 4.2) Turn off the power supply to the high-energy particle nozzle 11, remove the sputtering device housing 1, remove the first shielding plate and replace it with the second shielding plate on the support column 5, adjust the support column nut 9 to make the second shielding plate stable, then cover the sputtering device housing 1, turn on the power supply to the high-energy particle nozzle 11 in the sputtering device, and spray through the high-energy particle nozzle 11 to form a DC high-voltage electric field. The ion flow formed by the platinum anode 2 under the action of the DC high-voltage electric field transfers the kinetic energy and momentum of the ions to the atoms on the solid surface. Due to the breaking of chemical bonds, the ions are splashed and bombard the second shielding plate, thereby forming a square platinum metal film on the heat-resistant glass base 8.

[0051] 5) Packaging:

[0052] like Figure 4 As shown, a strip of platinum metal film 81 is fixed on the substrate surface of the heat-resistant glass base 8. The two sides of the heat-resistant glass base 8 are platinum end caps formed by square platinum metal films. Copper thin film wires 85 are led out from the sides of the heat-resistant glass base 8 to connect to an external bridge. After the lead-out wires 85 and the platinum end caps are covered with a conductive agent 83, a platinum edge cap 84 is formed, resulting in a platinum thin film thermal resistor.

[0053] In step 1), the first masking template 4 and the second masking template are 5 times larger than the first and second negatives. The first and second masking templates have pre-drilled holes at the four corners in the same position. The first masking template 4 has a long strip hole 42 in the center, and the second masking template has two spaced square holes 43 in the center. The first and second masking templates are printed onto two sheets of thin paper at a 1:1 scale. When photographing the two sheets of thin paper using a single roll of film, the camera focus is adjusted to produce a first and second negative that are 5 times smaller than the two sheets of thin paper. In this example, the first... The first masking template 4 and the second masking template are both 210×160mm in size, with holes of 15mm in diameter reserved at the four corners. The first masking template 4 has a 30×1.5mm elongated hole 42 reserved in the center, with the long side of the elongated hole 42 parallel to the long side of the first masking template 4. The second masking template has two square holes 43 reserved in the center with a 20mm interval. The square holes 43 are 12.5×9mm in size, with the 12.5mm side of the square hole parallel to the long side of the second masking template. The vertical axis of the center of the left square hole 43 is 88.75mm away from the left edge of the second masking template.

[0054] In step 4.1), the first shielding plate is placed in front of the support column 5, and the heat-resistant glass base 8 is cleaned. The cleaning process is to clean with acetone for five minutes, then with ethanol for five minutes, then with distilled water and dried. The cleaning process is carried out in an ultrasonic cleaning device.

[0055] The encapsulation in step 5) can improve the corrosion resistance, mechanical strength, and mechanical vibration resistance of the platinum thin film thermal resistor.

[0056] After obtaining the platinum thin-film resistor in step 5), in order to ensure that the precise temperature measurement of the platinum thin-film resistor undergoes a transition from an equilibrium state to a non-equilibrium state, a balanced bridge circuit needs to be used to mount the platinum thin-film resistor, such as... Figure 5 As shown, one wire of the platinum thin film resistance thermometer Pt is connected to the In+ terminal of the amplifier and connected in series with two resistors R2 and R3 with a resistance of 620Ω. The other wire is connected to an adjustable resistor R1 with a resistance range of 0 to 2MΩ. The outputs of both wires are connected to the In- terminal of the amplifier, and finally the signal is amplified by the amplifier.

[0057] After obtaining the platinum thin-film resistance thermometer in step 5), to compensate for the measurement error caused by the resistance of the lead wire during temperature measurement, a three-wire connection method is adopted. A lead wire is added to one end of the platinum thin-film resistance thermometer, forming three lead wires for the thermometer. The three-wire connection method requires that the three lead wires be of identical length, material, and thickness, and be under the same operating conditions, satisfying the following:

[0058] R L1 =R L2 =R L3 =r

[0059] The connection of the three leads of the platinum thin-film resistance thermometer is as follows: Figure 6 As shown, R L1 Directly connected to the power supply terminal of the bridge, R L2 and R L3 They are connected in series to the other two arms of the bridge, respectively. When the bridge is balanced, R t The following relationship exists:

[0060] R2(R t +R L3 )=R1(R3+R L2 )

[0061]

[0062] When R1 = R2, then The two signals completely cancel each other out, meaning that the bridge is considered to be completely balanced when r = 0.

[0063] At this point, the wire resistance r will no longer cause measurement errors in the platinum thin-film resistance thermometer.

Claims

1. A method for fabricating and packaging a platinum thin-film ultra-high-speed fluid thermoelectric resistor, characterized in that, Includes the following steps: 1) Film preparation: Using drawing software, a first mask template and a second mask template are made. The first mask template and the second mask template are printed onto thin paper and placed on a light-emitting plate. Ensure that the cutout parts of the first mask template and the second mask template are fully exposed. Use a single roll of film to photograph the two sheets of paper to capture the desired image. After the photographing is completed, the film is developed. During the development process, the cutout parts of the first mask template and the second mask template will appear transparent, while the other parts will appear black. After development, the first negative and the second negative are obtained. 2) Masking creation: Two nickel sheets were cleaned with acetone and ethanol respectively, and then resist was applied to both sides of the two nickel sheets using a spin coating instrument. After that, the first film and the second film obtained in step 1) were covered on the two nickel sheets respectively. Both nickel sheets covered with the first film and the second film were exposed to ultraviolet light for 12 seconds. After exposure, they were immersed in NMD-3 developer. After one minute, the exposed part was developed. After the exposed shape was formed, the nickel sheets were washed with distilled water and then dried with nitrogen. The dried nickel sheets were immersed in ferrous chloride solution at 60°C. After one hour, the exposed part was dissolved. The nickel sheets were taken out and washed with ethanol solution and dried with nitrogen to obtain the first mask plate and the second mask plate. 3) Fabrication of the sputtering apparatus: The sputtering apparatus includes a base, a phenolic resin support, and a heat-resistant glass base stacked sequentially from bottom to top. Each of the four corners of the base has an upward-facing support column. The upper section of each support column is threaded, and each column has a stepped support nut that matches the thread. The four corner through-holes of the first or second shielding plate, which are melted, are fitted onto the support columns. The stepped portion of the support nut limits the position of the first or second shielding plate. The sputtering apparatus also includes a sputtering device housing. A nozzle base is located in the middle of the top surface of the sputtering device housing. A set of high-energy particle nozzles arranged in a downward-facing, spaced array is located on the nozzle base. A platinum anode connecting column is located in the center and faces downward. A platinum anode is located at the lower end of the platinum anode connecting column. There is a gap between the bottom surface of the platinum anode and the upper end of the column. The sputtering device housing covers the base, phenolic resin support and heat-resistant glass base. The high-energy particle nozzles are connected to an external power supply. 4) Fabrication of platinum thin-film resistance thermometers using sputtering: 4.1) Place the first shielding plate on the support column, adjust the support column nuts to make the first shielding plate stable, cover the sputtering device housing, turn on the power supply connected to the high-energy particle nozzle in the sputtering device, and spray through the high-energy particle nozzle to form a DC high-voltage electric field. The ion flow formed by the platinum anode under the action of the DC high-voltage electric field transfers the kinetic energy and momentum of the ions to the atoms on the solid surface. Due to the breaking of chemical bonds, the ions are splashed and bombard the first shielding plate, thereby forming a strip-shaped platinum metal film on the heat-resistant glass base. 4.2) Turn off the power supply to the high-energy particle nozzle, remove the sputtering device housing, remove the first shielding plate and replace it with the second shielding plate on the support column, adjust the support column nut to make the second shielding plate stable, then cover the sputtering device housing, turn on the power supply to the high-energy particle nozzle in the sputtering device, and spray through the high-energy particle nozzle to form a DC high-voltage electric field. The ion flow formed by the platinum anode under the action of the DC high-voltage electric field transfers the kinetic energy and momentum of the ions to the atoms on the solid surface. Due to the breaking of chemical bonds, the ions are splashed and bombard the second shielding plate, thereby forming a square platinum metal film on the heat-resistant glass base. 5) Packaging: A strip of platinum metal film is fixed on the substrate surface of a heat-resistant glass base. The sides of the heat-resistant glass base are square platinum end caps formed by square platinum metal films. Copper thin film wires are led out from the sides of the heat-resistant glass base to connect to an external bridge circuit. A conductive agent is covered between the lead-out wires and the platinum end caps to form a platinum sealing edge, thus obtaining a platinum thin film thermal resistor.

2. The platinum thin-film ultra-high-speed fluid thermoelectric resistor fabrication and packaging method according to claim 1, characterized in that, In step 1), the size of the first masking template and the second masking template is 5 times larger than the size of the first film and the second film. The first masking template and the second masking template have holes at the same positions at the four corners. The first masking template has a long strip hole in the middle, and the second masking template has two square holes spaced apart in the middle. The first masking template and the second masking template are printed on two thin sheets of paper at a 1:1 scale. When the two thin sheets of paper are photographed using a single roll of film, the camera focus is adjusted to produce a first film and a second film that are 5 times smaller than the two thin sheets of paper.

3. The platinum thin-film ultra-high-speed fluid thermoelectric resistive fabrication and packaging method according to claim 1, characterized in that, Before placing the first shielding plate onto the support pillar in step 4.1), the heat-resistant glass base is cleaned. The cleaning process involves cleaning with acetone for five minutes, then with ethanol for five minutes, then with distilled water and dried. All cleaning processes are carried out in an ultrasonic cleaning device.

4. The platinum thin-film ultra-high-speed fluid thermoelectric resistor fabrication and packaging method according to claim 1, characterized in that, After obtaining the platinum thin-film resistance thermometer in step 5), in order to enable the platinum thin-film resistance thermometer to undergo the transition from an equilibrium state to a non-equilibrium state for precise temperature measurement, a balanced bridge circuit needs to be installed on the platinum thin-film resistance thermometer. One of the wires of the platinum thin-film resistance thermometer is connected to the In+ terminal of the amplifier and connected to two resistors R2 and R3 in series. The other wire is connected to the adjustable resistor R1. The outputs of both wires are connected to the In- terminal of the amplifier, and finally the signal is amplified by the amplifier.

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