Automatic material withdrawal method for a plasma processing apparatus

Abstract

The application discloses an automatic material discharging method of a plasma processing device and belongs to the technical field of plasma. The application solves the problem of complicated operation of moving in and out of a wafer by a manipulator, and also solves the problem of low work efficiency caused by the increase of stacking waiting time because the wafer can be stacked only after being cooled. The method comprises the following steps: moving a wafer on which a plasma reaction is completed to a discharging port by a bearing opening and closing mechanism; after the bearing opening and closing mechanism is in contact with a material receiving box, the bearing opening and closing mechanism is opened to push the wafer into the material receiving box; and the bearing opening and closing mechanism returns to a feeding port to continue the next conveying operation. The application realizes that the wafer on which the plasma reaction is completed does not need to be cooled, and can be conveyed by the bearing opening and closing mechanism and pushed into the material receiving box for storage. Because cooling is not needed, the time for conveying and storing the wafer at a time is greatly shortened, and the next plasma processing will not be delayed, and the work efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of plasma technology, and in particular to an automatic material unloading method for plasma processing equipment. Background Technology

[0002] Plasma treatment typically involves introducing process gases into a plasma treatment device, ionizing the process gases to become plasma, and then using an electric field to accelerate the plasma and treat the wafer surface.

[0003] Existing plasma processing equipment uses a robotic arm to place the wafer into the reaction zone of the reaction chamber. After the reaction is complete, the robotic arm is used to remove the wafer from the reaction chamber. This process requires the robotic arm to move in and out of the reaction chamber, which is cumbersome.

[0004] Because the temperature of the wafers rises after the plasma reaction, they need to be cooled before they can be stacked. This cooling time results in long wafer stacking times and low work efficiency. Summary of the Invention

[0005] Based on the above analysis, the present invention aims to provide an automatic unloading method for plasma processing equipment, which solves the problem of cumbersome operation of moving wafers in and out using robotic arms, and also solves the problem of low work efficiency caused by increasing the stacking waiting time due to the wafers needing to be cooled before stacking.

[0006] The objective of this invention is mainly achieved through the following technical solutions:

[0007] This invention provides an automatic unloading method for a plasma processing device, the plasma processing device including a support opening and closing mechanism, a feed inlet, a discharge outlet, and a receiving box;

[0008] Automatic material return methods include:

[0009] S1, the bearing opening and closing mechanism carries the wafer that has completed the plasma reaction to the discharge port;

[0010] S2, after the bearing opening and closing mechanism comes into contact with the receiving box, it performs an opening operation to push the wafer into the receiving box;

[0011] S3, the carrying opening and closing mechanism returns to the feed inlet to continue the next conveying operation.

[0012] Furthermore, S1 also includes:

[0013] S0 carries the opening and closing mechanism to transport the wafer to be plasma reacted to the plasma generator for plasma reaction.

[0014] Furthermore, the receiving box has multiple wafer pedestals;

[0015] Before S2, it also includes:

[0016] S2', the receiving box moves so that the inlet of the wafer holder without wafers on the receiving box is opposite to the outlet.

[0017] Further, S2' specifically involves: releasing the limit on the receiving box, moving the wafer holder containing the wafer down until the inlet of the wafer holder without the wafer is opposite to the outlet, and restoring the limit on the receiving box.

[0018] Furthermore, the plasma processing equipment also includes a stacking bin located below the receiving box and a trolley located inside the stacking bin;

[0019] Between S2 and S3, there is also:

[0020] a. After the receiving box is filled with wafers, they fall into the trolley.

[0021] Furthermore, following 'a' is also included:

[0022] b. The trolley is moved out of the storage warehouse.

[0023] Furthermore, the stacking warehouse also includes triggers and protective doors;

[0024] Specifically, b means that when the trolley's load capacity reaches the preset load capacity, the trigger releases the limit on the protective door, and the trolley moves out.

[0025] Furthermore, in S2, after the wafer is pushed into the receiving box, the opening and closing end of the holding mechanism performs a closing operation.

[0026] Furthermore, the plasma processing equipment also includes the equipment body;

[0027] The receiving box slides on the outer wall of the equipment body.

[0028] Furthermore, the plasma treatment equipment also includes a limiting component, which is driven by the load-bearing opening and closing mechanism and connected to the receiving box for limiting.

[0029] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0030] 1. In this invention, a carrier opening and closing mechanism is used to carry the wafer that has completed the plasma reaction to the discharge port; then, the carrier opening and closing mechanism is used to push the wafer into the receiving box. During this process, the wafer that has completed the plasma reaction does not need to be cooled and can be transferred and pushed into the receiving box for storage through the carrier opening and closing mechanism. Since there is no need to wait, the time for single transfer and wafer storage is greatly shortened, and the next plasma treatment will not be delayed due to the wafer cooling in the reaction chamber, thus improving work efficiency.

[0031] 2. In this invention, a carrier-operated opening and closing mechanism is used to carry the wafer for plasma reaction. That is, during the plasma treatment of the wafer surface, the carrier-operated opening and closing mechanism supports the wafer to carry out the reaction. Because the plasma reaction can be completed without moving the wafer, the carrier-operated opening and closing mechanism first transports the wafer to the plasma generator, then supports the plasma to carry out the plasma reaction on the wafer surface, and immediately transfers the wafer to the receiving box after the reaction is completed. The process is continuous, shortening the time for moving the wafer using a robotic arm and improving efficiency.

[0032] 3. This invention uses a limiting component to limit the receiving box. After the limiting component releases the limiting component, the receiving box moves downwards based on its own gravity. The wafer holder containing the wafer moves away from the outlet, and the inlet of the wafer holder without the wafer is opposite to the outlet. The limiting component is then used to limit the receiving box again, thus achieving automation and process control.

[0033] 4. This invention sets up a trolley below the receiving box. After the receiving box is filled with wafers and the constraint is lifted, it can fall into the trolley. Multiple receiving boxes fall into the trolley in sequence, completing the automatic loading of the receiving boxes without manual intervention. This is highly efficient and conducive to continuous production.

[0034] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained through the embodiments described and the accompanying drawings, which are particularly pointed out. Attached Figure Description

[0035] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0036] Figure 1 This is a schematic flowchart of an automatic material unloading method for a plasma processing device according to the present invention;

[0037] Figure 2 for Figure 1 A schematic diagram of the plasma processing equipment used in the experiment;

[0038] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle;

[0039] Figure 4 for Figure 2 A side view diagram;

[0040] Figure 5 for Figure 4 Enlarged structural diagram at point B;

[0041] Figure 6 for Figure 4 Enlarged structural diagram at point D;

[0042] Figure 7 A schematic diagram illustrating the process of a trolley being moved out of the storage warehouse;

[0043] Figure 8 for Figure 4 Enlarged structural diagram at point C;

[0044] Figure label:

[0045] 1-Equipment body, 2-Unloading mechanism, 3-Discharging mechanism, 4-Hydraulic rod, 5-Air jet sleeve;

[0046] 21-Moving cavity, 22-Screw slide, 23-Guide, 24-Bearing opening and closing mechanism, 25-Unloading bin, 26-Receiving box, 27-Limiting component, 28-Wafer base;

[0047] 241-Guide block, 242-Connecting plate, 243-Rubber pad;

[0048] 271-Limiting and blocking component, 272-First connecting rod, 273-Second connecting rod, 274-Base, 275-Rotating rod, 276-Limiting protrusion;

[0049] 31-Stacking warehouse, 32-Trigger, 33-Trolley, 34-Safety door;

[0050] 321-Bottom post, 322-Top rod, 323-Tooth block, 324-Support seat, 325-Unlocking plate, 326-Restriction groove. Detailed Implementation

[0051] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0052] Example 1

[0053] This embodiment discloses an automatic material unloading method for a plasma processing device, which includes a support opening and closing mechanism 24, a material inlet, a material outlet, and a material receiving box 26.

[0054] like Figure 1 As shown, the automatic material unloading method includes:

[0055] S1: The bearing opening and closing mechanism 24 carries the wafer that has completed the plasma reaction to the discharge port;

[0056] S2: After the bearing opening and closing mechanism 24 comes into contact with the receiving box 26, it performs an opening operation to push the wafer into the receiving box 26;

[0057] S3: The load-bearing opening and closing mechanism 24 returns to the feed inlet to continue the next conveying operation.

[0058] Specifically, such as Figure 2 and Figure 4 As shown, the load-bearing opening and closing mechanism 24 is installed inside the equipment body 1 of the plasma processing equipment. The receiving box 26 is slidably connected to the outer wall of the equipment body 1, and the receiving inlet and outlet of the receiving box 26 are opposite each other. The load-bearing opening and closing mechanism 24 reciprocates between the receiving inlet and the outlet of the equipment body 1. The load-bearing opening and closing mechanism 24 includes two connecting members 242. One end of the connecting member 242 is movably connected, and the other end is an opening and closing end. After the opening and closing end contacts the receiving box 26, it opens. During the process of the load-bearing opening and closing mechanism 24 returning to the receiving inlet, the opening and closing end closes. Figure 3 As shown, the load-bearing opening and closing mechanism 24 also includes a rubber pad 243, which is disposed on the inner sidewall of the connector 242. The upper surface of the rubber pad 243 and the inner sidewalls of the two connectors 242 enclose a wafer limiting area, thereby preventing displacement of the wafer during the movement of the load-bearing opening and closing mechanism 24. The load-bearing opening and closing mechanism 24 also includes a torsion spring. The two connectors 242 are rotatably connected by a rotating shaft, and a torsion spring is disposed between the two connectors 242 and the rotating shaft. The torsion spring enables the opening and closing of the two connectors 242.

[0059] Specifically, such as Figure 3 As shown, the load-bearing opening and closing mechanism 24 also includes a drive mechanism 22 and a guide member 23. The drive mechanism 22 is connected to the inner wall of the equipment body 1. One end of the guide member 23 is connected to the drive mechanism 22, and the other end is slidably connected to the connecting member 242. A through groove is formed on the guide member 23, and a guide block 241 matching the through groove is provided on the connecting member 242. The drive mechanism 22 includes a first track and a second track that are parallel to each other. The first track is a lead screw, and the second track is a guide rail or a lead screw, so as to realize the reciprocating motion of the load-bearing opening and closing mechanism 24 between the feed inlet and the discharge outlet.

[0060] Specifically, a guide roller is provided at the contact end between the connector 242 and the receiving box 26. When the connector 242 moves on the receiving box 26 via the guide roller, it prevents the connector 242 from deviating and ensures that the position of the wafer relative to the receiving inlet moves stably, so as to smoothly push the wafer into the receiving box 26.

[0061] In this invention, the wafer to be plasma-treated is carried to the plasma reaction zone by the carrier opening and closing mechanism 24 for plasma reaction. After the plasma reaction is completed, the carrier opening and closing mechanism 24 continues to move towards the discharge port. After contacting the receiving box 26, the two connecting parts 242 of the carrier opening and closing mechanism 24 open on the outer wall of the receiving box 26, releasing the two connecting parts 242 from limiting the wafer. At this time, the carrier opening and closing mechanism 24 continues to move towards the discharge port, and the inner wall of the two connecting parts 242 pushes the wafer into the receiving box 26, completing the wafer transfer and return. In this process, the carrier opening and closing mechanism 24 completes the wafer transfer and carries the wafer for plasma reaction, eliminating the need for a robotic arm to move in and out of the reaction chamber, simplifying the operation. After the plasma reaction is completed, the wafer is immediately transferred to the receiving box without waiting for the wafer to cool, saving the time of receiving and placing it in the box. At the same time, because no manual intervention is required in this process, work efficiency is improved. After the carrier opening and closing mechanism returns to the feed port, the next plasma treatment can be performed, which is beneficial for continuous production.

[0062] Furthermore, before S1, there is also S0, which carries the opening and closing mechanism to transport the wafer to be plasma reacted to the plasma generator for plasma reaction.

[0063] Specifically: the wafer is placed in the wafer limiting area and conveyed to the plasma generator by the carrier opening and closing mechanism 24. The jet sleeve 5 is moved downward by the hydraulic rod 4, as follows: Figure 4 As shown, the jet sleeve 5 covers the wafer, and the jet nozzle inside the jet sleeve 5 starts to jet high-speed plasma. The plasma undergoes a plasma reaction on the wafer surface, completing the plasma treatment of the wafer surface.

[0064] In this invention, during the plasma reaction on the wafer surface, the bearing opening and closing mechanism 24 is not separated from the wafer. This not only simplifies the structure of the plasma equipment, but also reduces the wafer movement steps, shortens the wafer transfer time, and increases the total duration of a single plasma processing cycle.

[0065] Furthermore, the receiving box in this invention has multiple wafer mounts; before S2, it also includes: S2', moving the receiving box so that the receiving inlet of the wafer mount without wafers on the receiving box is opposite to the discharge outlet.

[0066] Specifically, S2' is as follows: the movable limiting member 27 releases its limit on the receiving box 26, and the wafer holder containing the wafer moves down until the receiving inlet and the discharge outlet of the wafer holder without the wafer are opposite each other. Then the limiting member resets and restores its limit on the receiving box.

[0067] Specifically, such as Figure 4 , Figure 5 and Figure 6As shown, the limiting component includes a limiting shield 271, a first connecting rod 272, a second connecting rod 273, a base 274, a rotating rod 275, and a limiting protrusion 276. The limiting protrusion 276, the first connecting rod 272, the second connecting rod 273, and the rotating rod 275 are connected in sequence. The rotating rod 275 is positioned on the reciprocating motion path of the opening and closing mechanism 24. The rotating rod 275 is connected to the bottom surface of the equipment body 1 via the base 274, and the rotating rod 275 is rotatably connected to the base 274. A torsion spring is provided on the rotating rod 275 at the connection point between the rotating rod 275 and the base 274. The second connecting rod 273 penetrates the side wall of the equipment body 1 and is connected to the first connecting rod 272. A limiting protrusion is provided on the side of the first connecting rod 272 facing the receiving box 26, and the limiting protrusion is connected to the slot of the receiving box 26 for insertion and removal limiting. The limiting shield 271 is fixedly connected to the outer wall of the equipment body 1. The first connecting rod 272 is slidably connected to the limiting shield 271, allowing the first connecting rod 272 to slide back and forth between the limiting shield 271 and the outer wall of the equipment body 1. This limits the direction of movement of the first connecting rod 272, ensuring the precise insertion and removal connection between the limiting protrusion 276 and the receiving box 26. During the reset process of the bearing opening and closing mechanism 24, the bearing opening and closing mechanism 24 drives the rotating rod 275 to move. The rotating rod 275, through the second connecting rod 273, drives the first connecting rod 272 to move horizontally towards the outer wall of the equipment body 1, releasing the limiting protrusion's insertion and removal limiting connection with the receiving box 26. Since a torsion spring is provided on the rotating rod 275 to reset the rotating rod 275, the rotating rod 275 drives the second connecting rod 273, the first connecting rod 272, and the limiting protrusion 276 to move towards the receiving box 26, restoring the limiting connection between the limiting protrusion 276 and the receiving box 26.

[0068] In this invention, the receiving box 26 has multiple vertically arranged wafer holders 28, each wafer holder 28 having a receiving inlet. Wafers enter through the receiving inlet and are stored on the wafer holder 28. After a wafer is stored in a circular storage holder 28, the receiving box 26 is unlocked by the limiting member 27. The receiving box 26 moves downwards under its own gravity, and after the receiving inlet of the wafer holder 28 without a wafer is aligned with the discharge outlet, the receiving box 26 is then locked by the limiting member 27, realizing automatic wafer stacking. This process requires no manual intervention, achieving automation and streamlining.

[0069] Furthermore, the plasma processing equipment also includes a stacking bin located below the receiving box and a trolley located inside the stacking bin;

[0070] like Figure 7 As shown, the interval between S2 and S3 also includes:

[0071] a. After the receiving box is filled with wafers, the receiving box falls into the trolley;

[0072] b. The trolley is moved out of the storage warehouse.

[0073] In this invention, the receiving box 26 is slidably connected to the outer wall of the equipment body 1, and the receiving inlet and the discharge outlet on the receiving box 26 are opposite each other. After all the wafer holders 28 on the receiving box 26 have been loaded with wafers, the limiting member 27 releases the limiting member from the receiving box 26, and the receiving box 26 slides down the outer wall of the equipment body 1 onto the trolley based on its own gravity. Multiple receiving boxes fall into the trolley in sequence, completing the automatic loading and stacking of the receiving boxes. No manual intervention is required, which is highly efficient and conducive to continuous production.

[0074] Furthermore, the stacking warehouse also includes a trigger 32 and a protective door 34;

[0075] Specifically, b means that when the trolley's load capacity reaches the preset load capacity, the trigger releases the limit on the protective door, and the trolley moves out.

[0076] Specifically, the trigger 32 is located on the bottom surface of the stacking compartment 31, with its upper end in close contact with the trolley 33. The trigger 32 enables the automatic opening of the protective door 34. Figure 4 and Figure 8 As shown, the trigger 32 includes a first spring, a second spring member, a push rod 322, a toothed block 323, an unlocking block 325, and a limiting groove 326; a first wedge block is provided on the side wall of the push rod 322, and a second wedge block matching the first wedge block is provided on the unlocking block 325; the top end of the push rod 322 contacts the bottom end of the trolley 33, and the bottom end of the push rod 322 is connected to the bottom of the stacking compartment 31 through the first spring; the unlocking block 325 moves horizontally along the direction from the push rod 322 to the protective door 34 through the second spring member; the toothed block 323 is provided on the outer wall of the rotating shaft of the protective door 34 and matches the limiting groove 326 provided on the unlocking block 325. When the limiting protrusion releases the constraint on the receiving box 26, the receiving box 26 slides onto the trolley 33. As the number of receiving boxes 26 on the trolley 33 increases, the load capacity of the trolley 33 increases, the first spring under the push rod 322 is compressed, and the push rod 322 drives the first wedge block to move down. When the first wedge block contacts the second wedge block and continues to press against the second wedge block, the second spring is compressed, thereby driving the unlocking block 325 to move, and finally releasing the limiting connection between the limiting groove 326 and the toothed block 323. The protective door 34 rotates along the protective door pivot and opens, facilitating the movement of the trolley 33 in and out.

[0077] In this embodiment, the trigger 32 also includes a bottom post 321. Considering that the first spring and the top rod 322 may deviate from the bottom post 321 during the rising and falling process, the first spring is set inside the bottom post 321, and the top end of the top rod 322 protrudes from the bottom post. A through groove matching the first wedge block is provided on the side wall of the bottom post 321.

[0078] In this embodiment, the trigger 32 also includes a support base 324, which is fixedly connected to the bottom surface of the stacking bin, and the upper surface of the support base 324 is slidably connected to the lower surface of the unlocking block 325.

[0079] In this embodiment, the number of limiting slots 326 is the same as the number of toothed blocks 323. Multiple toothed blocks 323 are provided and distributed in a circular array with equal spacing. A torsion spring is provided on the protective door pivot. When the limiting connection between the limiting slots 326 and the toothed blocks 323 is released, the torsion spring drives the protective door pivot to rotate, and the protective door pivot drives the protective door 34 to open.

[0080] In this embodiment, the second spring element is preferably a telescopic spring rod.

[0081] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. An automatic material unloading method for a plasma processing device, characterized in that, The plasma processing equipment includes a support opening and closing mechanism, a feed inlet, a discharge outlet, and a receiving box; the plasma processing equipment also includes a device body; the receiving box slides on the outer wall of the device body; the plasma processing equipment also includes a limiting member, which is driven by the support opening and closing mechanism and limitedly connected to the receiving box; the receiving box has multiple wafer mounts; The limiting component includes a limiting shield, a first connecting rod, a second connecting rod, a base, a rotating rod, and a limiting protrusion. The limiting protrusion, the first connecting rod, the second connecting rod, and the rotating rod are connected sequentially. The rotating rod is disposed on the reciprocating motion path of the bearing opening and closing mechanism. The rotating rod is connected to the bottom surface of the equipment body through the base, and the rotating rod is rotatably connected to the base. A torsion spring is disposed on the rotating rod at the connection between the rotating rod and the base. The second connecting rod passes through the side wall of the equipment body and is connected to the first connecting rod. A limiting protrusion is disposed on the side of the first connecting rod facing the receiving box. The limiting protrusion is connected to the slot of the receiving box for insertion and removal limiting. The limiting shield is fixedly connected to the outer wall of the equipment body. The first connecting rod is slidably connected to the limiting shield, allowing the first connecting rod to reciprocate between the limiting shield and the outer wall of the equipment body. The automatic material unloading method includes: S0, the carrier opening and closing mechanism transports the wafer to be plasma reacted to the plasma generator for plasma reaction; during the plasma reaction on the wafer surface, the carrier opening and closing mechanism does not separate from the wafer; S1, the bearing opening and closing mechanism carries the wafer that has completed the plasma reaction to the discharge port; S2, the bearing opening and closing mechanism opens after contacting the receiving box, pushing the wafer into the receiving box; S3, the load-bearing opening and closing mechanism returns to the feed port and continues the next conveying operation; Before S2, it also includes: S2', the receiving box moves so that the inlet of the wafer holder without wafers on the receiving box is opposite to the outlet; Specifically, S2' involves: the limiting component releasing the limiting of the receiving box, the wafer holder containing the wafer moving down until the inlet of the wafer holder without the wafer is opposite to the outlet, and then restoring the limiting of the receiving box.

2. The automatic material unloading method according to claim 1, characterized in that, The plasma processing equipment also includes a stacking bin located below the receiving box and a trolley located inside the stacking bin; Between S2 and S3, the following is also included: a. After the receiving box is filled with wafers, it falls into the trolley.

3. The automatic material unloading method according to claim 2, characterized in that, Following the a, it also includes: b. The trolley is removed from the stacking warehouse.

4. The automatic material unloading method according to claim 3, characterized in that, The stacking compartment also includes a trigger and a protective door; Specifically, b means that when the load capacity of the trolley reaches the preset load capacity, the trigger releases the limit on the protective door, the protective door opens, and the trolley moves out.

5. The automatic material unloading method according to claim 1, characterized in that, In step S2, after the wafer is pushed into the receiving box, the opening and closing end of the bearing opening and closing mechanism performs a closing operation.

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