Hard disk high-speed connector automatic assembling, detecting and packaging machine and method

Abstract

The application discloses a hard disk high-speed connector automatic assembling, detecting and packaging machine and method, and relates to the field of connector packaging machines. The packaging machine comprises a rack, a feeding track and a driving mechanism arranged on the rack, a BL needle inserting mechanism, a conductive glue mounting mechanism, a terminal inserting mechanism, a bending mechanism and a testing and marking mechanism arranged on the rack from left to right, and a glue shell feeding mechanism arranged at the end of the rack. The driving mechanism is used for driving the glue shell to be assembled to move on the feeding track and sequentially pass through the BL needle inserting mechanism, the conductive glue mounting mechanism, the terminal inserting mechanism, the bending mechanism and the testing and marking mechanism. The conductive glue mounting mechanism comprises a conductive glue vibrating feeding assembly, a conductive glue detecting assembly, a conductive glue transferring assembly, a conductive glue pushing assembly and a clamping assembly arranged on the rack. The application can realize the purpose of automatically assembling the conductive glue and further improve the assembling efficiency of the connector.

Description

Technical Field

[0001] This invention relates to the field of connector assembly equipment technology, specifically including an automatic assembly, testing and packaging machine and method for high-speed hard disk connectors. Background Technology

[0002] In the connector industry, to ensure product quality, all products must undergo dimensional checks before packaging and shipping. The industry generally uses semi-automatic assembly / manual wire assembly, which involves a lot of human intervention, resulting in low production efficiency and low inspection and packaging efficiency. If fully automated assembly, inspection, and packaging can be achieved, production efficiency can be greatly improved, and product quality can be significantly enhanced.

[0003] When using semi-automatic assembly equipment, the application of conductive adhesive is generally done manually. Because the conductive adhesive is small and its orientation cannot be easily corrected, manual assembly is necessary, preventing the automation of conductive adhesive application. While semi-automatic assembly equipment can improve assembly efficiency, the manual application of conductive adhesive still limits connector assembly efficiency to some extent. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic assembly, testing and packaging machine and method for high-speed hard disk connectors, which can achieve the purpose of automating the assembly of conductive adhesive and further improve the assembly efficiency of connectors.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0006] An automatic assembly, testing, and packaging machine for high-speed hard disk connectors includes a frame, a feeding track mounted on the frame, and a drive mechanism. From left to right, the following components are mounted on the frame: a BL pin insertion mechanism, a conductive adhesive installation mechanism, a terminal insertion mechanism, a bending mechanism, and a testing and marking mechanism. A housing feeding mechanism is located at the end of the frame. The drive mechanism drives the housing to be assembled to move on the feeding track and pass through the BL pin insertion mechanism, conductive adhesive installation mechanism, terminal insertion mechanism, bending mechanism, and testing and marking mechanism in sequence.

[0007] The conductive adhesive mounting mechanism includes a conductive adhesive vibratory feeding assembly, a conductive adhesive detection assembly, a conductive adhesive transfer assembly, a conductive adhesive pushing assembly, and a clamping assembly, all mounted on a frame. The conductive adhesive vibratory feeding assembly, conductive adhesive detection assembly, conductive adhesive transfer assembly, and conductive adhesive pushing assembly are located on the same side of the feeding track, while the clamping assembly is located on the other side of the feeding track. The conductive adhesive vibratory feeding assembly uses vibration to arrange the conductive adhesive in an orderly manner before feeding it to the conductive adhesive detection assembly, which detects whether the conductive adhesive is in place. The conductive adhesive transfer assembly adsorbs and fixes the conductive adhesive, adjusts its angle, and then feeds it to the conductive adhesive pushing assembly, which pushes the conductive adhesive into the adhesive shell. The clamping assembly clamps and fixes the adhesive shell after the conductive adhesive is pushed into place by the pushing assembly.

[0008] The conductive adhesive detection component includes a first transverse sliding seat, a first driving mechanism, a first bracket, a receiving track mounted on the first bracket for docking with the discharge end of the conductive adhesive vibration feeding component, and a first sliding plate seat vertically and slidably mounted on the first bracket. The first bracket is provided with the first driving mechanism connected to the first sliding plate seat and used to drive the first sliding plate seat to move vertically. The first transverse sliding seat is slidably mounted on the first sliding plate seat, and a conductive adhesive placement groove is provided on the first transverse sliding seat. A first detection optical fiber for detecting conductive adhesive is provided on the first transverse sliding seat. A first baffle plate for blocking the conductive adhesive placement groove is provided on the first sliding plate seat. A linkage mechanism connected to the first transverse sliding seat is provided on the first bracket. When the first sliding plate seat moves laterally, the linkage mechanism enables the first transverse sliding seat to move laterally, allowing the conductive adhesive in the conductive adhesive placement groove to be exposed.

[0009] Further optimization is achieved by including a linkage plate and a first cam bearing follower. The first cam bearing follower is mounted on a first transverse sliding seat, and the linkage plate is fixedly mounted on a first bracket. The linkage plate is provided with an inclined guide groove, and the first cam bearing follower is in movable cooperation with the guide groove.

[0010] Preferably, a through groove is provided on the first transverse sliding seat, through which the conductive adhesive placement groove is provided, and the first detection optical fiber is located in the through groove.

[0011] Preferably, the conductive adhesive transfer assembly includes a second bracket and a conductive adhesive recognition and transfer assembly mounted on the second bracket. The second bracket is mounted on a frame. The conductive adhesive recognition and transfer assembly includes a mounting frame, a first drive motor, a first slide plate, a second slide plate, and a CCD camera. The first drive motor is mounted on the second bracket. The first slide plate is horizontally slidably mounted on the second bracket. The second slide plate is vertically slidably mounted on the first slide plate. The output shaft of the first drive motor is connected to a crank. A first mounting post is provided on the side of the crank near the first slide plate. The first mounting post and the first slide plate are rotatably connected via bearings. The CCD camera is mounted on the second slide plate. The CCD camera is used to acquire image information of the conductive adhesive. The CCD camera is connected to an analysis unit, which is used to analyze and process the acquired image information.

[0012] The conductive adhesive identification and transfer assembly also includes a rotary negative pressure adsorption mechanism mounted on the second slide plate. The rotary negative pressure adsorption mechanism is used to adsorb and fix the conductive adhesive and to adjust the angle of the conductive adhesive.

[0013] Preferably, a ring-shaped light source is provided on the second slide plate.

[0014] The second bracket is provided with a semi-circular guide groove, and a second mounting post is provided on the crank on the other side of the first mounting post. A second cam bearing follower that cooperates with the semi-circular guide groove is provided on the second mounting post.

[0015] Furthermore, the rotary negative pressure adsorption mechanism includes a fixed frame, a second drive motor, a belt drive mechanism, and a negative pressure suction head. The fixed frame is mounted on the second slide plate, the first drive mechanism is mounted on the fixed frame, and the negative pressure suction head is rotatably mounted on the fixed frame. The negative pressure suction head is connected to the negative pressure source through a rotary joint.

[0016] Among them, the negative pressure suction head has several relief grooves on the side that contacts the conductive adhesive, which correspond to the raised ribs on the conductive adhesive.

[0017] In addition, the present invention also discloses an automatic assembly, testing and packaging method for high-speed hard disk connectors, which includes packaging the high-speed hard disk connectors using the above-mentioned automatic assembly, testing and packaging machine for high-speed hard disk connectors.

[0018] The conductive adhesive pushing assembly includes a third bracket, a fixed seat, a first pressure plate, a push plate, and a push cylinder. The third bracket is mounted on the frame, and the fixed seat is fixedly mounted on the third bracket. The fixed seat is provided with a sliding groove, and the bottom of the sliding groove is provided with a guide groove corresponding to the protruding rib on the back of the conductive adhesive. The first pressure plate has an L-shaped structure and is fixedly mounted on the fixed seat and located above the end of the sliding groove.

[0019] The push plate includes a connector and a push plate, which are integrally formed. The push plate is slidably disposed in the slide groove. A push cylinder is disposed on the third bracket. The movable end of the push cylinder is connected to the connector via a connecting plate. The push cylinder is used to drive the push plate to move within the slide groove. A slide plate is slidably disposed above the slide groove. After the slide groove is covered by the slide plate, a passage is formed. A first slide groove is disposed on the slide plate near the slide groove. A protrusion that slides with the first slide groove is disposed on the push plate. A return spring is disposed between the third bracket and the slide plate. When the push plate moves away from the first pressure plate, the slide groove is exposed to facilitate the placement of conductive adhesive.

[0020] The conductive adhesive pushing assembly also includes a second telescopic rod and a guide head. The second telescopic rod is installed on the feeding track, and the guide head is provided with a guide groove. After the second telescopic rod is connected to the guide head, it is used to align the guide groove on the guide head with the slide groove.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention is mainly used to automate the assembly of high-speed hard disk connectors. A housing feeding mechanism is provided for automated housing loading, a feeding track carries the housing, and a drive mechanism allows the housing to move intermittently along the feeding track. A BL pin insertion mechanism is provided for automated BL pin insertion, a conductive adhesive installation mechanism is provided for automated conductive adhesive installation on the housing, a terminal insertion mechanism is provided for terminal insertion on the housing, a bending mechanism is provided for bending the terminals, a testing and marking mechanism is provided for testing and marking the assembled connectors, and finally, qualified connectors are packaged.

[0023] In this invention, the conductive adhesive installation mechanism includes a conductive adhesive vibration feeding assembly, a conductive adhesive detection assembly, a conductive adhesive transfer assembly, a conductive adhesive pushing assembly, and a clamping assembly mounted on a frame. The conductive adhesive vibration feeding assembly uses vibration to arrange the conductive adhesive in an orderly manner before sending it to the conductive adhesive detection assembly, which detects whether the conductive adhesive is in place. The conductive adhesive transfer assembly adsorbs and fixes the conductive adhesive, adjusts its angle, and then sends it to the conductive adhesive pushing assembly, which pushes the conductive adhesive into the adhesive shell. The clamping assembly clamps and fixes the adhesive shell after the conductive adhesive is pushed into place by the pushing assembly. This conductive adhesive installation mechanism enables automated installation of the conductive adhesive, effectively solving the technical problem of low connector assembly efficiency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0026] Figure 2 This is a schematic diagram of the overall structure of the conductive adhesive mounting mechanism of the present invention.

[0027] Figure 3 This is a schematic diagram showing the connection relationship between the conductive adhesive mounting mechanism and the frame of the present invention.

[0028] Figure 4 This is a schematic diagram of the overall structure of the conductive adhesive detection component of the present invention.

[0029] Figure 5 This is a schematic diagram of the overall structure of the conductive adhesive transfer assembly of the present invention.

[0030] Figure 6 This is a schematic diagram of the overall structure of the conductive adhesive delivery component of the present invention.

[0031] Figure 7 This is a schematic diagram showing the state when the guide head of the present invention is aligned with the slide groove.

[0032] Figure 8 This is a schematic diagram showing the alignment of the guide head and the rubber shell of the present invention.

[0033] Figure 9 For the present invention Figure 4 A schematic diagram of the structure after the first baffle plate has been removed.

[0034] Figure 10 For the present invention Figure 5 A magnified view of a portion of point A in the middle.

[0035] Figure 11 This is a schematic diagram illustrating the interaction between the push plate and the slide plate of the present invention.

[0036] Figure label:

[0037] 1-Housing shell, 101-Frame, 102-Feeding track, 103-Drive mechanism, 104-BL pin insertion mechanism, 105-Conductive adhesive mounting mechanism, 106-Terminal insertion mechanism, 107-Bending mechanism, 108-Testing and marking mechanism, 109-Housing shell feeding mechanism;

[0038] 110-Conductive adhesive vibration feeding assembly,

[0039] 111-Conductive adhesive detection component; 112-First transverse sliding seat; 113-First drive mechanism; 114-First baffle plate; 115-Linkage mechanism; 116-Linkage plate; 117-First cam bearing follower; 118-Guide groove; 119-Through groove; 110-Receiving track; 120-Conductive adhesive transfer component; 121-Second bracket; 122-Conductive adhesive identification and transfer component; 123-Mounting bracket; 124-First drive motor; 125-First slide plate; 126-Second slide plate; 127-CCD camera; 128-Crank; 129-Annular light source; 130-Semi-circular guide groove; 131-Rotating negative pressure adsorption mechanism; 132-Fixed bracket; 133-Second drive motor; 134-Belt drive mechanism; 135-Negative pressure suction head.

[0040] 136-Conductive adhesive pusher assembly; 137-Third bracket; 138-Fixing seat; 139-First pressure plate; 140-Push plate; 141-Push cylinder; 142-Slide groove; 143-Connector; 144-Push plate; 145-Slide plate; 146-First slide groove; 147-Second telescopic rod; 148-Guide head; 149-Guide groove.

[0041] 150 - Tightening assembly; 151 - Clearance groove; 152 - Conductive adhesive placement groove; 153 - First bracket; 154 - First slide block seat. Detailed Implementation

[0042] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0043] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0045] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0046] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] The following disclosure provides many different implementations or examples for carrying out different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0048] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0049] Example 1

[0050] See Figures 1-10 This embodiment discloses an automatic assembly, testing and packaging machine for high-speed hard disk connectors, including a frame 101, a feeding track 102 disposed on the frame 101 and a drive mechanism 103. From left to right, the following components are disposed on the frame 101: a BL pin insertion mechanism 104, a conductive adhesive installation mechanism 105, a terminal insertion mechanism 106, a bending mechanism 107, and a test marking mechanism 108. A plastic shell feeding mechanism 109 is disposed at the end of the frame 101. The drive mechanism 103 is used to drive the plastic shell 1 to be assembled to move on the feeding track 102 and pass through the BL pin insertion mechanism 104, the conductive adhesive installation mechanism 105, the terminal insertion mechanism 106, the bending mechanism 107, and the test marking mechanism 108 in sequence.

[0051] The conductive adhesive mounting mechanism 105 includes a conductive adhesive vibratory feeding assembly 110, a conductive adhesive detection assembly 111, a conductive adhesive transfer assembly 120, a conductive adhesive pushing assembly 136, and a clamping assembly 150, all mounted on a frame 101. The conductive adhesive vibratory feeding assembly 110, the conductive adhesive detection assembly 111, the conductive adhesive transfer assembly 120, and the conductive adhesive pushing assembly 136 are located on the same side of the feeding track 102, while the clamping assembly 150 is located on the other side of the feeding track 102. The conductive adhesive vibratory feeding assembly 110 uses vibration to arrange the conductive adhesive in an orderly manner before feeding it to the conductive adhesive detection assembly 111, which detects whether the conductive adhesive is in place. The conductive adhesive transfer assembly 120 adsorbs and fixes the conductive adhesive, adjusts its angle, and then feeds it to the conductive adhesive pushing assembly 136, which pushes the conductive adhesive into the adhesive shell 1. The clamping assembly 150 clamps and fixes the adhesive shell 1 after the conductive adhesive is pushed into place by the conductive adhesive pushing assembly 136.

[0052] This invention is mainly used to automate the assembly of high-speed hard disk connectors. A housing feeding mechanism 109 is used for automated feeding of housing 1. A feeding track 102 carries housing 1 and, under the action of a drive mechanism 103, allows housing 1 to move intermittently on the feeding track 102. A BL pin insertion mechanism 104 is used for automated insertion of BL pins. A conductive adhesive installation mechanism 105 is used for automated installation of conductive adhesive on housing 1. A terminal insertion mechanism 106 is used for inserting terminals into housing 1. A bending mechanism 107 is used for bending the terminals. A testing and marking mechanism 108 is used to test and mark the assembled connectors. Finally, qualified connectors are packaged.

[0053] It should be noted that in this application, the feeding track 102, drive mechanism 103, BL pin insertion mechanism 104, terminal insertion mechanism 106, bending mechanism 107, and testing and marking mechanism 108 can all adopt the existing structures, and their specific structures will not be described in detail here.

[0054] Preferably, the drive mechanism 103 is an intermittent drive mechanism 103, so that the rubber shell 1 on the feeding track 102 moves intermittently through each station.

[0055] The specific structure of the conductive adhesive detection component 111 will be further described below:

[0056] The conductive adhesive detection assembly 111 includes a first transverse sliding seat 112, a first driving mechanism 113, a first bracket 153, a receiving track 1911 mounted on the first bracket 153 for docking with the discharge end of the conductive adhesive vibration feeding assembly 110, and a first sliding plate seat 154 vertically and slidably mounted on the first bracket 153. The first bracket 153 is equipped with the first driving mechanism 113, which is connected to the first sliding plate seat 154 and used to drive the first sliding plate seat 154 to move vertically. The first transverse sliding seat 112 is slidably mounted on the first sliding plate seat 154. A conductive adhesive placement groove 152 is provided on a horizontal sliding seat 112, and a first detection optical fiber for detecting conductive adhesive is provided on the first horizontal sliding seat 112; a first baffle plate 114 for blocking the conductive adhesive placement groove 152 is provided on a first slide plate 154, and a linkage mechanism 115 connected to the first horizontal sliding seat 112 is provided on a first bracket 153. When the first slide plate 154 moves horizontally, the first horizontal sliding seat 112 can move horizontally under the action of the linkage mechanism 115, so that the conductive adhesive in the conductive adhesive placement groove 152 can be exposed.

[0057] In use, the conductive adhesive is placed in the conductive adhesive vibrating feeding assembly 110. The conductive adhesive vibrating feeding assembly 110 is used to transform the disordered conductive adhesive into an ordered one through vibration screening, and to achieve the purpose of automated feeding. The conductive adhesive enters the receiving track 1911 and then enters the conductive adhesive placement groove 152. At this time, the first baffle plate 114 will block the conductive adhesive, so that the conductive adhesive is fixedly placed inside the conductive adhesive placement groove 152, thereby limiting the position of the conductive adhesive. After the conductive adhesive is in place, the first detection optical fiber is used to detect the conductive adhesive.

[0058] At this time, the first drive mechanism 113 will drive the first slide block 154 to move upward. When the first slide block 154 moves upward, under the action of the linkage mechanism 115, the first transverse slide block 112 can move laterally, so that the conductive adhesive in the conductive adhesive placement groove 152 can be exposed, so that the conductive adhesive transfer component 120 can transfer and identify the conductive adhesive. At this time, the receiving track 1911 and the discharge end of the conductive adhesive vibration feeding component 110 are misaligned. After the first slide block 154 is reset under the action of the first drive mechanism 113, the receiving track 1911 and the discharge end of the conductive adhesive vibration feeding component 110 will be aligned again, and the first baffle plate 114 will cover the conductive adhesive placement groove 152 again to limit the conductive adhesive and prevent the conductive adhesive from changing its position due to compression deformation, so as to meet the requirements of conductive adhesive position accuracy.

[0059] The first drive mechanism 113 can be a telescopic rod, which drives the first slide base 154 to move.

[0060] The linkage mechanism 115 includes a linkage plate 116 and a first cam bearing follower 117. The first cam bearing follower 117 is mounted on the first transverse sliding seat 112. The linkage plate 116 is fixedly mounted on the first bracket. The linkage plate 116 is provided with an inclined guide groove 118. The first cam bearing follower 117 is in movable cooperation with the guide groove 118.

[0061] When the first sliding plate seat 154 moves, the first transverse sliding seat 112 can move laterally under the action of the inclined guide groove 118, thereby exposing the conductive adhesive; the first cam bearing follower 117 can change sliding friction into rolling friction to reduce wear.

[0062] The first transverse sliding seat 112 is provided with a through groove 119 that penetrates the conductive adhesive placement groove 152. The first detection optical fiber is located in the through groove 119. The through groove 119 is perpendicular to the conductive adhesive placement groove 152, so that the conductive adhesive can be fixed in the conductive adhesive placement groove 152 to improve the detection accuracy of the first detection optical fiber.

[0063] In this application, the first detection optical fiber is a through-beam optical fiber sensor. When the conductive adhesive blocks the light, the purpose of detecting whether the conductive adhesive is in place can be achieved.

[0064] The conductive adhesive transfer assembly 120 includes a second bracket 121 and a conductive adhesive identification and transfer assembly 122 mounted on the second bracket 121. The second bracket 121 is mounted on a frame 101. The conductive adhesive identification and transfer assembly 122 includes a mounting frame 123, a first drive motor 124, a first slide plate 125, a second slide plate 126, and a CCD camera 127. The first drive motor 124 is mounted on the second bracket 121. The first slide plate 125 is horizontally slidably mounted on the second bracket 121, and the second slide plate 126 is vertically slidably mounted on the first slide plate 125. The output shaft of the first drive motor 124 is connected to a crank 128. A first mounting post is provided on the side of the crank 128 near the first slide plate 125. The first mounting post and the first slide plate 125 are rotatably connected via bearings. The CCD camera 127 is mounted on the second slide plate 126. The CCD camera 127 is used to acquire image information of the conductive adhesive. The CCD camera 127 is connected to an analysis unit, which is used to analyze and process the acquired image information. The analysis unit can use a data processor from the prior art.

[0065] The conductive adhesive identification and transfer assembly 122 also includes a rotary negative pressure adsorption mechanism 131 disposed on the second slide plate 126. The rotary negative pressure adsorption mechanism 131 is used to adsorb and fix the conductive adhesive and to adjust the angle of the conductive adhesive.

[0066] In use, due to the vertically sliding first slide plate 125 and the horizontally sliding second slide plate 126, when the first drive motor 124 drives the crank 128 to rotate, the second slide plate 126 moves horizontally and the first slide plate 125 moves vertically under the action of the first support column. When the CCD camera 127 is above the conductive adhesive placement slot 152, the CCD camera 127 will acquire the image information of the conductive adhesive and send the acquired image information to the analysis unit for analysis and processing, and determine the position information of the conductive adhesive. The rotary negative pressure adsorption mechanism 131 picks up the conductive adhesive according to the position information of the conductive adhesive. After picking up the conductive adhesive, if the position information of the conductive adhesive is correct, the rotary negative pressure adsorption mechanism 131 will not rotate the conductive adhesive. When the position information of the conductive adhesive is opposite to the correct position information, the rotary negative pressure adsorption mechanism 131 will rotate to change the direction of the conductive adhesive and send the conductive adhesive to the conductive adhesive pushing component 136.

[0067] Under the action of crank 128, the second slide plate 126 can move vertically and horizontally at the same time, enabling the rotary negative pressure adsorption mechanism 131 to switch between the conductive adhesive detection component 111 and the conductive adhesive pushing component 136.

[0068] In actual use, when the rotating negative pressure adsorption mechanism 131 places the conductive adhesive on the conductive adhesive pushing component 136, the CCD camera 127 is located just above the conductive adhesive detection component 111, thereby acquiring image information of the conductive adhesive.

[0069] It should be noted that the CCD camera 127 is mainly used to acquire images, and the analysis unit mainly determines the direction of the conductive adhesive by comparing the acquired image information with the pre-stored image information.

[0070] Further optimization involves installing a ring light source 129 on the second slide plate 126, which makes the acquired image information clearer.

[0071] Preferably, the second bracket 121 is provided with a semi-circular guide groove 130, and the crank 128 is provided with a second mounting post on the other side of the first mounting post. The second mounting post is provided with a second cam bearing follower that cooperates with the semi-circular guide groove 130. The semi-circular guide groove 130 makes the first drive motor 124 more stable when driving the crank 128 to rotate.

[0072] It should be noted that, in this application, the rotary negative pressure adsorption mechanism 131 includes a fixed frame 132, a second drive motor 133, a belt drive mechanism 134, and a negative pressure suction head 135. The fixed frame 132 is mounted on the second slide plate 126, the first drive mechanism 113 is mounted on the fixed frame 132, and the negative pressure suction head 135 is rotatably mounted on the fixed frame 132. The negative pressure suction head 135 is connected to the negative pressure source through a rotary joint. The negative pressure suction head 135 is used to absorb and transfer conductive adhesive. The belt drive mechanism 134 includes a driving toothed pulley connected to the second drive motor 133, a driven toothed pulley mounted on the negative pressure suction head 135, and a toothed belt connecting the driving toothed pulley and the driven toothed pulley. In use, only the second drive motor 133 needs to be controlled to adjust the negative pressure suction head 135.

[0073] The negative pressure suction head 135 has several relief grooves 151 on the side that contacts the conductive adhesive, which correspond to the raised ribs on the conductive adhesive. The relief grooves 151 make the negative pressure suction head 135 more stable when it contacts the conductive adhesive, and prevent it from falling off during movement.

[0074] In this embodiment, the conductive adhesive pushing assembly 136 includes a third bracket 137, a fixed seat 138, a first pressure plate 139, a push plate 140, and a push cylinder 141. The third bracket 137 is mounted on the frame 101, and the fixed seat 138 is fixedly mounted on the third bracket 137. The fixed seat 138 is provided with a sliding groove 142, and the bottom of the sliding groove 142 is provided with a guide groove 118 corresponding to the protruding rib on the back of the conductive adhesive. The first pressure plate 139 has an L-shaped structure and is fixedly mounted on the fixed seat 138 and located above the end of the sliding groove 142.

[0075] The push plate 140 includes a connector 143 and a push plate 144, which are integrally formed with the connector 143. The push plate 144 is slidably disposed in the slide groove 142. The third bracket 137 is provided with the push cylinder 141, the movable end of which is connected to the connector 143 via a connecting plate. The push cylinder 141 is used to drive the push plate 144 to move within the slide groove 142. A slide plate 145 is slidably disposed above the slide groove 142. After the slide plate covers the slide groove 142, it forms a passageway. A first slide groove 146 is provided on the slide plate 145 near the slide groove 142. The push plate 144 is provided with a protrusion that slides with the first slide groove 146. A return spring is provided between the third bracket 137 and the slide plate 145. When the push plate 144 moves away from the first pressure plate 139, the slide groove 142 is exposed to facilitate the placement of conductive adhesive.

[0076] The conductive adhesive pushing component 136 can push the conductive adhesive transferred by the conductive adhesive transfer component 120 into the adhesive shell 1 for the fixed installation of the conductive adhesive.

[0077] In use, the negative pressure suction head 135 in the conductive adhesive transfer assembly 120 delivers the conductive adhesive into the slide groove 142. A pusher cylinder 141 drives the pusher plate 144 to move, thereby delivering the conductive adhesive into the adhesive shell 1, achieving the insertion of the conductive adhesive. The guide groove 118 within the slide groove 142 ensures stable movement of the conductive adhesive during the pushing process, guaranteeing stability. Because a sliding plate 145 is provided on the slide groove 142, when the plate 145 covers the slide groove 142, it forms a stable flow path. The sliding plate 144 pushes the conductive adhesive to move. Since the sliding plate 145 is provided with a first groove 146 and the push plate 144 is provided with a protrusion, when the cylinder 141 drives the push plate 144 to reset, the sliding plate 145 moves under the action of the protrusion, thereby exposing the groove 142. At this time, it is convenient for the conductive adhesive transfer assembly 120 to transfer the conductive adhesive into the groove 142. The formed travel channel can serve as a guide and can effectively prevent the conductive adhesive from being deformed and detached from the groove 142 after being pushed and squeezed by the push plate 144.

[0078] In a further optimization, in this embodiment, the conductive adhesive pushing assembly 136 also includes a second telescopic rod 147 and a guide head 148. The second telescopic rod 147 is mounted on the feeding track 102, and the guide head 148 is provided with a guide groove 149. After the second telescopic rod 147 is connected to the guide head 148, it is used to align the guide groove 149 on the guide head 148 with the slide groove 142.

[0079] The guide head 148 serves as a transition point. Under the action of the second telescopic rod 147, the guide head 148 can rise or fall. When the housing 1 is in place, the second telescopic rod 147 drives the guide head 148 to fall, connecting the slide groove 142 and the housing 1 through the guide groove 149, so that the conductive adhesive can be accurately inserted into the housing 1.

[0080] The clamping component 150 is mainly used to clamp and fix the adhesive shell 1 when the conductive adhesive is pushed into the adhesive shell 1, so as to prevent the adhesive shell 1 from shifting.

[0081] In this embodiment, the sliding mechanism is achieved by the cooperation of a slide rail and a slider, and its structure will not be described in detail.

[0082] Example 2

[0083] This embodiment discloses an automatic assembly, testing, and packaging method for high-speed hard disk connectors. It mainly uses the automatic assembly, testing, and packaging machine for high-speed hard disk connectors described in Embodiment 1 to assemble the high-speed hard disk connectors. This invention can effectively improve the installation efficiency of connectors.

[0084] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0085] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic assembly, testing, and packaging machine for high-speed hard disk connectors, comprising a frame, a feeding track and a drive mechanism disposed on the frame, wherein, from left to right, a BL pin insertion mechanism, a conductive adhesive installation mechanism, a terminal insertion mechanism, a bending mechanism, and a testing and marking mechanism are disposed on the frame; a housing feeding mechanism is disposed at the end of the frame; the drive mechanism is used to drive the housing to be assembled to move on the feeding track and pass through the BL pin insertion mechanism, the conductive adhesive installation mechanism, the terminal insertion mechanism, the bending mechanism, and the testing and marking mechanism in sequence; Its features are: The conductive adhesive mounting mechanism includes a conductive adhesive vibratory feeding assembly, a conductive adhesive detection assembly, a conductive adhesive transfer assembly, a conductive adhesive pushing assembly, and a clamping assembly, all mounted on a frame. The conductive adhesive vibratory feeding assembly, conductive adhesive detection assembly, conductive adhesive transfer assembly, and conductive adhesive pushing assembly are located on the same side of the feeding track, while the clamping assembly is located on the other side of the feeding track. The conductive adhesive vibratory feeding assembly uses vibration to arrange the conductive adhesive in an orderly manner before feeding it to the conductive adhesive detection assembly, which detects whether the conductive adhesive is in place. The conductive adhesive transfer assembly adsorbs and fixes the conductive adhesive, adjusts its angle, and then feeds it to the conductive adhesive pushing assembly, which pushes the conductive adhesive into the adhesive shell. The clamping assembly clamps and fixes the adhesive shell after the conductive adhesive is pushed into place by the pushing assembly. The conductive adhesive detection assembly includes a first transverse sliding seat, a first driving mechanism, a first bracket, a receiving track mounted on the first bracket for docking with the discharge end of the conductive adhesive vibration feeding assembly, a first sliding plate seat vertically and slidably mounted on the first bracket, a first driving mechanism mounted on the first bracket for driving the first sliding plate seat to move vertically, a first transverse sliding seat slidably mounted on the first sliding plate seat, a conductive adhesive placement groove mounted on the first transverse sliding seat, and a first detection optical fiber mounted on the first transverse sliding seat for detecting conductive adhesive; a first baffle plate mounted on the first sliding plate seat for blocking the conductive adhesive placement groove, and a linkage mechanism mounted on the first bracket for connecting to the first transverse sliding seat. When the first sliding plate seat moves laterally, the linkage mechanism enables the first transverse sliding seat to move laterally, exposing the conductive adhesive in the conductive adhesive placement groove. The linkage mechanism includes a linkage plate and a first cam bearing follower. The first cam bearing follower is mounted on a first transverse sliding seat. The linkage plate is fixedly mounted on a first bracket. The linkage plate is provided with an inclined guide groove. The first cam bearing follower is in movable cooperation with the guide groove.

2. The automatic assembly, testing, and packaging machine for high-speed hard disk connectors according to claim 1, characterized in that: The first transverse sliding seat is provided with a through groove that passes through the conductive adhesive placement groove, and the first detection optical fiber is located in the through groove.

3. The automatic assembly, testing, and packaging machine for high-speed hard disk connectors according to claim 1, characterized in that: The conductive adhesive transfer assembly includes a second bracket and a conductive adhesive recognition and transfer assembly mounted on the second bracket. The second bracket is mounted on a frame. The conductive adhesive recognition and transfer assembly includes a mounting frame, a first drive motor, a first slide plate, a second slide plate, and a CCD camera. The first drive motor is mounted on the second bracket. The first slide plate is horizontally slidably mounted on the second bracket, and the second slide plate is vertically slidably mounted on the first slide plate. The output shaft of the first drive motor is connected to a crank. A first mounting post is provided on the side of the crank near the first slide plate. The first mounting post and the first slide plate are rotatably connected by a bearing. The CCD camera is mounted on the second slide plate. The CCD camera is used to acquire image information of the conductive adhesive. The CCD camera is connected to an analysis unit, which is used to analyze and process the acquired image information. The conductive adhesive identification and transfer assembly also includes a rotary negative pressure adsorption mechanism mounted on the second slide plate. The rotary negative pressure adsorption mechanism is used to adsorb and fix the conductive adhesive and to adjust the angle of the conductive adhesive.

4. The automatic assembly, testing, and packaging machine for high-speed hard disk connectors according to claim 3, characterized in that: The second skateboard is equipped with a ring-shaped light source.

5. The automatic assembly, testing, and packaging machine for high-speed hard disk connectors according to claim 3, characterized in that: The second bracket is provided with a semi-circular guide groove, and a second mounting post is provided on the crank on the other side of the first mounting post. A second cam bearing follower that cooperates with the semi-circular guide groove is provided on the second mounting post.

6. The automatic assembly, testing, and packaging machine for high-speed hard disk connectors according to claim 3, characterized in that: The rotary negative pressure adsorption mechanism includes a fixed frame, a second drive motor, a belt drive mechanism, and a negative pressure suction head. The fixed frame is mounted on the second slide plate, the first drive mechanism is mounted on the fixed frame, and the negative pressure suction head is rotatably mounted on the fixed frame. The negative pressure suction head is connected to the negative pressure source through a rotary joint.

7. The automatic assembly, testing, and packaging machine for high-speed hard disk connectors according to claim 6, characterized in that: The negative pressure suction head has several clearance grooves on the side that contacts the conductive adhesive, corresponding to the raised ribs on the conductive adhesive.

8. An automated assembly, testing, and packaging method for high-speed hard disk connectors, characterized in that: This includes assembling the hard disk high-speed connector using the automatic assembly, testing, and packaging machine for hard disk high-speed connectors as described in any one of claims 1-7.

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