A heat dissipation system, electronic equipment and liquid cooling system

CN117616556BActive Publication Date: 2026-08-07HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2021-10-27
Publication Date
2026-08-07

AI Technical Summary

Technical Problem

[0004]若密封件400不能被很好地压缩,就会使得冷却液流出腔体的密封性不好,就会存在液体泄漏的巨大隐患

Benefits of technology

[0030] Secondly, this application provides an electronic device, including: a heat dissipation system and a heat-generating device according to any one of the first aspects described above, wherein the heat dissipation system is used to dissipate heat from the heat-generating device in the electronic device. Using the aforementioned heat dissipation system reduces the possibility of coolant leakage in the electronic device, thereby lowering the maintenance costs of the electronic device.

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Abstract

The application relates to the technical field of heat dissipation, in particular to a heat dissipation system, an electronic device and a liquid cooling system. The heat dissipation system comprises a spraying assembly, the spraying assembly is provided with a cooling liquid inlet and a spraying hole, the spraying hole faces a heating device; a sealing element is used for sealing the part between the end of the spraying assembly and the surface of the heating device; a rigid upper back plate is arranged on one side of a base plate and surrounds the heating device; a rigid lower back plate clamps the base plate together with the rigid upper back plate; a rigid limiting structure is fixedly connected to the base plate through a connecting piece and is connected to the rigid upper back plate and / or the rigid lower back plate; the base plate and the rigid limiting structure are provided with a height limiting space, and at least a part of the spraying assembly is located in the height limiting space. The height limiting space limits the movement of the spraying assembly in the direction away from the heating device, so that the sealing element remains in a sealed state. Therefore, the heat dissipation system disclosed by the application reduces the possibility of leakage of the cooling liquid flowing into the cooling liquid outlet cavity.
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Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system, electronic device and liquid cooling system. Background Technology

[0002] As the power consumption of heat-generating devices such as chips continues to increase, chip heat dissipation will become one of the bottlenecks restricting chip development. Liquid cooling technology, due to its strong heat dissipation capabilities, is gradually being used. Jet cooling is currently one of the ultimate known solutions for heat dissipation in liquid cooling technology.

[0003] like Figure 1 As shown, a heat-generating device 200, such as a chip, is provided on a substrate 100. A spraying assembly 300, having a nozzle 301, is positioned above the chip. The spraying assembly 300 uses the nozzle 301 to spray a cooling medium (e.g., coolant) onto the chip to be cooled, directly dissipating heat. A sealing element 400 (e.g., an O-ring) is provided between the heat-generating device 200 and the spraying assembly 300, thereby forming a sealed coolant outlet cavity. The coolant sprayed onto the surface of the heat-generating device 200 flows into the coolant outlet cavity and then out through it.

[0004] If the seal 400 cannot be properly compressed, the coolant outflow cavity will be poorly sealed, posing a significant risk of leakage. Maintaining a tight seal is crucial, especially during pressure testing at several atmospheres. Therefore, the reliability of the coolant outflow cavity seal is of paramount importance. Summary of the Invention

[0005] The embodiments of this application provide a heat dissipation system with good sealing performance of the coolant outflow cavity, reducing the possibility of coolant leakage.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, this application provides a heat dissipation system for dissipating heat from a heat-generating device on a substrate. The heat dissipation system includes: a spray assembly having a coolant inlet and a spray hole facing the heat-generating device; the heat-generating device being disposed on the side of the substrate facing the spray assembly, with the end of the spray assembly contacting the surface of the heat-generating device; a sealing member for sealing the portion between the end of the spray assembly and the surface of the heat-generating device; a coolant outlet cavity formed by at least the sealing member, the spray assembly, and the heat-generating device, with the spray hole communicating with the coolant outlet cavity; a rigid upper backplate disposed around the heat-generating device on one side of the substrate; a rigid lower backplate disposed opposite to the rigid upper backplate on the other side of the substrate and clamping the substrate together with the rigid upper backplate; a rigid limiting structure fixedly connected to the substrate via a connector; a height limiting space between the substrate and the rigid limiting structure along a first direction perpendicular to the substrate, with at least a portion of the spray assembly located within the height limiting space; along the first direction, one end of the portion of the spray assembly located within the height limiting space contacts the heat-generating device, and the other end contacts the rigid limiting structure.

[0008] In this embodiment, the rigid limiting structure is fixedly connected to both the rigid upper back plate and the rigid lower back plate to the substrate via connectors. In some possible implementations, the rigid limiting structure is fixedly connected to the rigid upper back plate to the substrate via connectors. Alternatively, in some possible implementations, the rigid limiting structure is fixedly connected to the rigid lower back plate to the substrate via connectors.

[0009] According to the embodiments of this application, coolant flows into the coolant inlet of the spray assembly, and the spray assembly sprays the incoming coolant onto the surface of the heat-generating device through the spray hole. After the coolant dissipates heat from the heat-generating device, it flows into the coolant outlet cavity and out of the spray assembly, thus carrying away the heat from the heat-generating device and achieving heat dissipation of the heat-generating device.

[0010] To maintain the airtightness of the coolant outflow cavity and reduce the possibility of coolant leakage, the substrate of this application is provided with a rigid limiting structure, a rigid upper back plate, and a rigid lower back plate. Along the first direction of the heat dissipation system, the rigid upper back plate and the rigid lower back plate are located on opposite sides of the substrate, and together they clamp the substrate. This is similar to a "sandwich" structure, which enhances the rigidity of the substrate. Therefore, after the rigid limiting structure, the rigid upper back plate, and the rigid lower back plate are fixedly connected by connectors, a height-limiting space exists between the substrate and the rigid limiting structure along the first direction.

[0011] At least a portion of the spray assembly is located within the height limiting space. Along the first direction, one end of the portion of the spray assembly located within the height limiting space is in contact with the heating device, and the other end is in contact with the rigid limiting structure.

[0012] Therefore, in the first direction, the height-limiting space restricts the movement of the spray assembly away from the heat-generating device, keeping the seal in a sealed state. Since the seal is located between the spray assembly and the heat-generating device, the effective restriction of the spray assembly's movement in the first direction by the height-limiting space prevents separation between the seal and the spray assembly, resulting in good compression of the seal and ensuring a good seal for the coolant flowing out of the cavity. Thus, the seal of this application effectively isolates the coolant flowing out of the cavity and prevents it from flowing outside the substrate, avoiding short circuits in components and circuits outside the substrate.

[0013] In one possible implementation of the first aspect described above, the rigid limiting structure includes: a receiving portion for receiving a spraying assembly; a connecting portion extending outward from the outer surface of the receiving portion, the connecting portion being fixedly connected to a rigid upper back plate or a rigid lower back plate via a connector on a substrate, and a height limiting space being provided between the substrate and the receiving portion; and the other end of the spraying assembly contacting the receiving portion along a first direction.

[0014] The receiving portion accommodates the spray assembly, and along the first direction, the other end of the spray assembly contacts the receiving portion, thus restricting the movement of the spray assembly in the first direction. In essence, the receiving portion "wraps" the spray assembly, and after the receiving portion is fixed to the base plate by the connecting portion, it can reliably play a limiting role, restricting the movement of the spray assembly in the first direction and improving the sealing of the coolant outflow cavity.

[0015] In one possible implementation of the first aspect described above, the rigid limiting structure further includes: a sleeve, the inner cavity of which serves as a receiving portion, the inner cavity of which is adapted to the shape of the spraying assembly; and a connecting portion, which is a flange extending radially outward from the end of the sleeve facing the substrate, the radial direction being perpendicular to the first direction. Using a sleeve to form the receiving portion facilitates processing. Using a flange as the connecting portion facilitates the connection of the sleeve with the rigid upper back plate and the rigid lower back plate.

[0016] In one possible implementation of the first aspect described above, multiple ribs are also included, each rib having a flange and a sleeve connected to its two ends respectively. The ribs enhance the strength of the rigid limiting structure. When the cooling system is in operation, coolant flows into the spray assembly, generating back pressure. This increased strength of the rigid limiting structure extends its service life, ensuring the seal remains sealed for an extended period. Consequently, it also extends the service life of the cooling system.

[0017] In one possible implementation of the first aspect described above, the connector includes: multiple upper backplate screws disposed on the side of the rigid upper backplate facing away from the substrate, each upper backplate screw being used to pass through the connector; multiple sets of nuts corresponding one-to-one with the upper backplate screws, each set of nuts including two washers and two nuts, each set of nuts clamping the upper and lower sides of the connector through an upper backplate screw, wherein, along the first direction, the two washers are respectively pressed against the upper and lower sides of the connector.

[0018] Thus, the rigid limiting structure and the rigid upper backplate are fixedly connected by double nuts, ensuring good connection stability and preventing loosening. During operation, the cooling system effectively restricts the primary direction movement of the spray assembly, preventing separation between the seal and the spray assembly. The seal is well compressed, allowing the coolant to flow out of the cavity and achieving a good sealing effect.

[0019] In one possible implementation of the first aspect described above, the nuts in the nut assembly are hexagonal nuts. Hexagonal nuts have a relatively large tightening force, can be operated with a hex wrench, and are convenient to install and disassemble.

[0020] In one possible implementation of the first aspect described above, the connector further includes: multiple sets of spring screws, each set of spring screws being located on the upper side of the connector, thereby sequentially fixing the connector, the rigid upper back plate, the base plate, and the rigid lower back plate together.

[0021] In one possible implementation of the first aspect described above, the connector further includes: a plurality of lower back plate screws, disposed on the side of the rigid lower back plate facing the substrate, corresponding one-to-one with the spring screws, each lower back plate screw having an internal thread, the lower back plate screws being used to pass through the substrate, the rigid upper back plate and the connecting part in sequence, so that the spring screws are threadedly connected to the internal thread of the corresponding lower back plate screw.

[0022] Essentially, the connecting part of the rigid limiting structure, the rigid upper back plate, and the rigid lower back plate are fixedly connected to the base plate by spring screws. Using spring screws as connectors allows for control of the installation force between the connecting part, the rigid upper back plate, and the rigid lower back plate, preventing damage to the heating device due to excessive force.

[0023] In addition, the rigid limiting structure, rigid upper back plate and rigid lower back plate of this application are fixedly connected to each other by spring screws and the aforementioned nut group, thus achieving an overall high rigidity design. While reducing the pressure on the contact surface of the heat-generating device, it also limits the overall deformation of the heat dissipation system, especially the deformation of the sealing component, to prevent coolant leakage from flowing out of the cavity and to prevent damage to the heat-generating device.

[0024] In one possible implementation of the first aspect described above, the connector includes eight sets of nuts arranged in a ring on the heat dissipation system. This improves the connection stability between the rigid limiting structure and the rigid upper backplate. Simultaneously, since the rigid limiting structure applies a force to the spray assembly during the connection process with the rigid upper backplate, the spray assembly compresses the seal located between the spray assembly and the heat-generating device. The eight sets of nuts ensure that the seal is subjected to uniform force.

[0025] In one possible implementation of the first aspect described above, the connector includes: a plurality of upper backplate screws disposed on the side of the rigid upper backplate facing away from the substrate, with every two upper backplate screws located on the same side around the rigid upper backplate, each upper backplate screw being used to pass through the connecting portion, and each upper backplate screw having an internal thread; a plurality of fixing springs, each fixing spring corresponding to two upper backplate screws on the same side, each fixing spring having locking holes at both ends, each locking hole for a locking screw to pass through, so that the locking screw is threadedly connected to the internal thread of the corresponding upper backplate screw.

[0026] The rigid lower back plate, rigid upper back plate, and rigid limiting structure are fixedly connected by a single nut, while the rigid upper back plate and rigid limiting structure are not fixedly connected by the aforementioned nut set. This reduces the number of nuts used and saves costs. At the same time, since the fixing spring is connected to both upper back plate screws simultaneously, this prevents loosening at the connection between the rigid limiting structure and the rigid upper back plate.

[0027] In one possible implementation of the first aspect described above, each fixing spring has a nut groove on its surface facing the connecting part; the connecting member further includes: multiple additional lower back plate screws, located on the side of the rigid lower back plate facing the substrate, corresponding one-to-one with the fixing springs, each additional lower back plate screw being used to pass sequentially through the substrate, the rigid upper back plate, and the connecting part; multiple upper nuts, corresponding one-to-one with the additional lower back plate screws, each upper nut being located on the upper side of the connecting part, the upper nuts being threadedly connected to the portions of the additional lower back plate screws extending out of the connecting part, so as to fix the rigid lower back plate, the rigid upper back plate, and the connecting part in a fixed connection, and each upper nut being circumferentially confined within the nut groove of the corresponding fixing spring.

[0028] After the upper nut is threadedly connected to the protruding part of the additional lower back plate screw ("single nut" connection), each upper nut is circumferentially limited within the nut groove of the corresponding fixing spring. This allows the nut groove on the reverse side of the fixing spring to engage with the upper nut, achieving the limiting requirement. Using fixing springs to limit the rotation of the upper nut effectively prevents it from loosening, especially during transportation.

[0029] In one possible implementation of the first aspect described above, the upper nut is a hexagonal nut, the nut groove is a hexagonal nut groove, and the hexagonal nut is confined within the hexagonal nut groove. There is no need to set up a new circumferential limiting structure; the existing hexagonal nut can be directly utilized. The outer circumferential surface of the hexagonal nut is not circular, and after it mates with the hexagonal nut groove, it can achieve the circumferential limiting function.

[0030] Secondly, this application provides an electronic device, including: a heat dissipation system and a heat-generating device according to any one of the first aspects described above, wherein the heat dissipation system is used to dissipate heat from the heat-generating device in the electronic device. Using the aforementioned heat dissipation system reduces the possibility of coolant leakage in the electronic device, thereby lowering the maintenance costs of the electronic device.

[0031] Thirdly, this application provides a liquid cooling system, including: the electronic equipment described in the second aspect; and a cooling device connected to the spray assembly via a pipeline to provide coolant to the spray assembly. Attached Figure Description

[0032] Figure 1 According to some embodiments of this application, a schematic diagram of the heat dissipation system is shown;

[0033] Figure 2 A three-dimensional breakdown of a heat dissipation system is shown according to some embodiments of this application. Figure 1 ;

[0034] Figure 3 According to some embodiments of this application, a cross-sectional view of a heat dissipation system is shown;

[0035] Figure 4 According to some embodiments of this application, a three-dimensional heat dissipation system is shown. Figure 1 ;

[0036] Figure 5 According to some embodiments of this application, a side view of the heat dissipation system is shown. Figure 1 ;

[0037] Figure 6 According to some embodiments of this application, a partially enlarged view of the heat dissipation system is shown;

[0038] Figure 7 A three-dimensional breakdown of a heat dissipation system is shown according to some embodiments of this application. Figure 2 ;

[0039] Figure 8 According to some embodiments of this application, a side view of the heat dissipation system is shown. Figure 2 ;

[0040] Figure 9 According to some embodiments of this application, a three-dimensional heat dissipation system is shown. Figure 2 ;

[0041] Figure 10 According to some embodiments of this application, a perspective view of a fixing spring in a heat dissipation system is shown.

[0042] Explanation of reference numerals in the attached figures:

[0043] Existing technology:

[0044] 100: substrate;

[0045] 200: Heating element;

[0046] 300: Injection assembly; 301: Nozzle;

[0047] 400: Seal;

[0048] This application:

[0049] 1: Heat dissipation system;

[0050] 10: Substrate; 11: Heating element;

[0051] 20: Injection assembly; 21: Coolant outlet cavity; 22: Coolant inlet channel; 221: Inlet; 23: Coolant outlet channel; 231: Outlet; 232: End of coolant outlet channel; 233: Opening of coolant outlet channel;

[0052] 30: Seals

[0053] 40: Rigid upper backplate; 41: Upper backplate screw;

[0054] 50: Rigid lower back plate; 51: Lower back plate screw; 52: Additional lower back plate screw;

[0055] 60: Rigid limiting structure; 61: Sleeve; 611: Receiving part; 6111: Blocking part; 612: Through hole; 62: Connecting part; 621: Upper back plate screw through hole; 622: Lower back plate screw through hole; 63: Rib;

[0056] 70: Connector; 71: Nut assembly; 711: Washer; 712: Nut; 72: Spring screw; 73: Top nut;

[0057] 80: Fixing spring; 81: Locking hole; 83: Nut groove;

[0058] 90: Locking screw. Detailed Implementation

[0059] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0060] This application provides a heat dissipation system that, by restricting the movement of the spray assembly in a first direction, prevents the seal and the spray assembly from separating, thereby maintaining the seal of the coolant outlet cavity and reducing the possibility of coolant leakage. For example, the heat dissipation system provided in this application is used in electronic devices such as servers, including blade servers, rack servers, and the like.

[0061] like Figures 2 to 3 As shown, the heat dissipation system 1 of this application includes a substrate 10, a spray assembly 20, a sealing member 30, a rigid upper back plate 40, a rigid lower back plate 50, and a rigid limiting structure 60. A heat-generating device 11 is provided on the side of the substrate 10 facing the spray assembly 20. The substrate 10 is, for example, a PCB (Printed Circuit Board). The end of the spray assembly 20 (end 232 described later) contacts the heat-generating device 11. The spray assembly 20 has a coolant inlet 221 and spray holes, with the spray holes facing the heat-generating device 11. The coolant inlet 221 allows coolant to flow in... Figure 3 The dashed arrow B indicates the inflow of coolant, which is then sprayed onto the surface of the heat-generating device 11 through the spray nozzle to dissipate heat. For example, the coolant inlet 221 of the spray assembly 20 can be directly connected to the CDU (Coolant Distribution Unit), which supplies coolant to the spray assembly 20.

[0062] like Figure 2 and Figure 3 As shown, the seal 30 is located between the spray assembly 20 and the heating device 11. The seal 30 is used to seal the portion between the end 232 of the spray assembly 20 and the surface of the heating device 11. Exemplarily, the seal 30, the spray assembly 20, and the heating device 11 form a coolant outlet cavity 21, which is used to contain the coolant after it has dissipated heat from the heating device 11. The coolant outlet cavity 21 communicates with the spray hole of the spray assembly 20. That is, the heating device 11, the spray assembly 20, and the seal 30 form a sealed coolant outlet cavity 21, through which the coolant after it has dissipated heat from the heating device 11 flows out of the spray assembly 20. Figure 3 The dashed arrow C indicates coolant outflow.

[0063] like Figure 2As shown, the rigid upper backplate 40 of this application is disposed on one side of the substrate 10, surrounding the heating element 11. Taking the heating element 11 as a chip example, the chip is square, and the rigid upper backplate 40 has a square-shaped hollow structure, which surrounds the chip. The shape of the chip is not limited to this; for example, it can also be circular or rectangular. Accordingly, the shape of the hollow structure of the rigid upper backplate 40 is adapted to the shape of the chip to surround the chip.

[0064] like Figure 3 As shown, the rigid upper back plate 40 and the rigid lower back plate 50 of this application are disposed opposite each other on the other side of the substrate 10. That is, along the first direction of the heat dissipation system 1 ( Figure 2 and Figure 3 (As shown in the Z-direction), the rigid upper back plate 40 and the rigid lower back plate 50 are located on opposite sides of the substrate 10, and the rigid upper back plate 40 and the rigid lower back plate 50 together clamp the substrate 10. This is similar to a "sandwich" structure, which can enhance the rigidity of the substrate 10.

[0065] refer to Figure 3 and Figure 4 The rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected to the base plate 10 via a connector 70 (the specific structure of the connector 70 will be described in detail later). After the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected via the connector 70, a height limiting space exists between the base plate 10 and the rigid limiting structure 60 along the first direction. Figure 3 As shown in Figure M), at least a portion of the injection assembly 20 is located within the height limiting space. For example, the coolant inlet 221 of the injection assembly 20 is located outside the height limiting space.

[0066] Along the first direction, the portion of the spray assembly 20 located within the height-limiting space has one end in contact with the heating device 11 and the other end in contact with the rigid limiting structure 60. Thus, in the first direction, the height-limiting space restricts the spray assembly 20 from traveling in a direction away from the heating device 11. Figure 3 and Figure 4 The movement (as shown in direction A) keeps the seal 30 in a sealed state.

[0067] Since the coolant for the jet assembly 20 comes from the CDU, the jet chamber (the chamber in which the coolant flows) of the jet assembly 20 will always have a back pressure (e.g., 1 to 4 atmospheres). In addition, reliability testing needs to consider instantaneous extreme scenarios, so there is an industry-standard pressure holding test at several times the atmospheric pressure (e.g., 2 to 7 atmospheres).

[0068] When the heat dissipation system 1 of this application is in operation, that is, after coolant is introduced into the spray assembly 20 through the inlet 221 (which generates a back pressure), the height limiting space will restrict the spray assembly 20 to move away from the heat-generating device 11. Figure 3 and Figure 4 The movement (as shown in direction A) is used to keep the seal 30 in a sealed state.

[0069] Since the seal 30 is located between the spray assembly 20 and the heating device 11, after the height limiting space effectively restricts the first-direction movement of the spray assembly 20, it can prevent the seal 30 and the spray assembly 20 from separating. The seal 30 is well compressed so that the coolant flows out of the cavity 21 and achieves a good sealing effect. Furthermore, under the pressure holding test, the height limiting space can also effectively restrict the first-direction movement of the spray assembly 20. Therefore, the seal 30 of this application can effectively isolate the coolant flowing out of the cavity 21 and prevent the coolant from flowing outside the substrate 10, thus avoiding short circuits in components and circuits outside the substrate 10.

[0070] Furthermore, as described above, after the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 of this application are fixedly connected by the connector 70, the movement of the spray assembly 20 in the first direction is restricted by the height limiting space, so that the sealing member 30 remains sealed. With this configuration, the pressure on the contact surface between the spray assembly 20 and the heat-generating device 11 (e.g., a chip) can be reduced, thus avoiding damage to the heat-generating device 11.

[0071] It should be noted that the specific type of the aforementioned heating device 11 is not limited. For example, the heating device 11 can be a low-power device (e.g., memory module, PCIe card, RAID card, hard drive, etc.) or a high-power device (e.g., CPU, GPU, chip, etc.). The connection method between the aforementioned spray assembly 20 and the CDU is also not limited. For example, the spray assembly 20 can be connected to the CDU via a quick connector, etc., and the quick connector can support automatic liquid shut-off when the connector is plugged in or unplugged. Furthermore, this application does not limit the type of sealing element 30; anything that can provide a sealing function falls within the scope of protection of this application. For example, the sealing element 30 is an O-ring.

[0072] Furthermore, the aforementioned rigid upper backplate 40, rigid lower backplate 50, and rigid limiting structure 60 are made of rigid materials. The specific type of rigid material is not limited; for example, it can be stainless steel, copper, etc.

[0073] As mentioned earlier, the spray assembly 20 is used to spray coolant onto the surface of the heat-generating device 11 to achieve liquid cooling of the heat-generating device 11. This liquid cooling method for the heat-generating device 11 is called "jet impingement cooling". Jet impingement refers to the process where liquid or gas is jetted vertically (or at a certain angle) through a circular or narrow slit nozzle under pressure difference onto the surface to be cooled, thereby generating a strong heat transfer effect in the area directly impacted.

[0074] This application does not limit the specific structure of the jet assembly 20; any structural form capable of achieving jet impact cooling of the heat-generating device 11 falls within the protection scope of this application. Figure 2 and Figure 3 The structure of the spray assembly 20 shown is for illustrative purposes.

[0075] refer to Figure 2 and Figure 3 The body of the spray assembly 20 of this application is cylindrical. The spray assembly 20 includes: a coolant inlet channel 22 and two coolant outlet channels 23. The coolant inlet channel 22 has an inlet 221, and the coolant outlet channels 23 have outlets 231. That is, the spray assembly 20 has one inlet 221 and two outlets 231. One end of the coolant inlet channel 22 with the inlet 221 protrudes from the body of the spray assembly 20 and extends along a first direction (…). Figure 2 and Figure 3 (As shown in the Z direction). The coolant outlet channel 23 is provided with outlets 231 at both ends, which also protrude from the body of the spray assembly 20 and extend in a direction perpendicular to the first direction (e.g., radial). Figure 2 (Extended in the X direction as shown in the middle).

[0076] Furthermore, the coolant inflow channel 22 of this application is provided with a spray hole (not shown) facing the heating element 11. The coolant outflow channel 23 is arranged around the coolant inflow channel 22, and the end 232 of the coolant outflow channel 23 contacts the surface of the heating element 11. The coolant outflow channel 23 has an opening 233, and the opening 233 of the coolant outflow channel 23 and the end 232 of the coolant outflow channel 23 are located on the same side of the spray assembly 20. The end 232 of the coolant outflow channel 23 compresses the sealing member 30, and the sealing member 30 seals the end 233 of the coolant outflow channel 23 and the surface of the heating element 11. The opening 233 of the coolant outflow channel 23 is covered by the surface of the heating element 11, thereby forming a sealed coolant outflow cavity 21 by the coolant outflow channel 23, the sealing member 30, and the heating element 11. The inlet 221 of the aforementioned coolant inflow channel 22 is connected to a CDU, for example. The CDU supplies coolant to the inlet 221, and the coolant flows from the inlet 221 into the internal channel cavity of the coolant inflow channel 22. For ease of description, the internal channel cavity of the coolant inflow channel 22 will be referred to as the jet cavity. After the coolant enters the jet cavity, it forms a high-speed jet. The high-speed jet impacts the heating surface of the heating device 11. That is, the coolant in the jet cavity is sprayed onto the surface of the heating device 11 through the spray hole, thereby achieving liquid cooling of the heating surface of the heating device 11. After the cooling device 11 dissipates heat, the coolant flows into the coolant outflow channel 23 and then flows out from the outlet 231 of the coolant outflow channel 23, for example, flowing back to the CDU.

[0077] In order to Figure 2 and Figure 3 The shown jet assembly 20 is restricted to move in the first direction, reference Figure 2 and Figure 4 The rigid limiting structure 60 of this application includes a receiving portion 611 and a connecting portion 62. The receiving portion 611 accommodates the body of the spraying assembly 20. The connecting portion 62 extends outward from the outer surface of the receiving portion 611 and is fixedly connected to the rigid upper back plate 40 and the rigid lower back plate 50 via a connector 70 on the substrate 10. After the connecting portion 62, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected, a height limiting space is formed between the substrate 10 and the receiving portion 611. Along a first direction, one end of the spraying assembly 20 contacts the heating device 11, and the other end contacts the top wall of the receiving portion 611. Thus, the height limiting space restricts the movement of the spraying assembly 20 away from the heating device 11 and keeps the sealing member 30 sealed.

[0078] The specific structure of the rigid limiting structure 60 is not limited; any structure capable of accommodating the spray assembly 20 falls within the protection scope of this application. In some possible implementations, refer to... Figure 2 and Figure 4The aforementioned rigid limiting structure 60 also includes a sleeve 61.

[0079] The inner cavity of the sleeve 61 serves as the aforementioned receiving portion 611. The inner cavity of the sleeve 61 is adapted to the shape of the spray assembly 20, and it accommodates the body of the spray assembly 20. For example, the body of the spray assembly 20 is cylindrical, and correspondingly, the inner cavity of the sleeve 61 is also cylindrical. Furthermore, the sleeve 61 has openings at both ends in the first direction, and the opening at the end of the sleeve 61 facing away from the substrate 10 in the first direction has a stop portion 6111. The outer peripheral surface of the sleeve 61 has through holes 612 for the two coolant outflow channels 23 of the spray assembly 20 to extend out (see reference). Figure 4 ).

[0080] Thus, after the body of the spray assembly 20 is housed in the inner cavity of the sleeve 61, the coolant inflow channel 22 of the spray assembly 20 extends out from the opening at one end of the sleeve 61 facing away from the substrate 10 in the first direction and abuts against the blocking part 6111 on the sleeve 61 in the first direction, and the two coolant outflow channels 23 of the spray assembly 20 extend out from the two through holes 612 on the outer peripheral surface of the sleeve 61.

[0081] The aforementioned connecting part 62 is a flange, which is formed by the end of the sleeve 61 facing the base plate 10 radially ( Figure 2 The flange extends outward from the first direction (as shown in the X direction) and is radially perpendicular to the first direction. The flange contacts and connects to the rigid upper back plate 40, and its shape is adapted to the rigid upper back plate 40. For example, if the rigid upper back plate 40 is square, the flange is correspondingly square.

[0082] In addition, such as Figure 2 and Figure 4 As shown, the rigid limiting structure 60 also includes multiple ribs 63, each rib 63 having a flange and a sleeve 61 connected to its two ends respectively. The ribs 63 enhance the strength of the rigid limiting structure 60. This application does not limit the number of ribs 63. Figure 2 and Figure 4 The diagram shows four ribs 63 distributed at the four corners of the rigid limiting structure 60. In some possible embodiments, other numbers of ribs 63, such as five or six, may be provided as needed.

[0083] The specific structure of the connector 70 in the heat dissipation system 1 will be described in detail below with reference to the accompanying drawings. This application does not limit the specific structure of the connector 70. Any structure that can fix the three components—the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50—is within the scope of protection of this application.

[0084] First, the structure of the connector 70 between the rigid upper backplate 40 and the rigid limiting structure 60 will be introduced. (Reference) Figure 2 , Figures 4 to 7 The connector 70 includes multiple upper backplate screws 41 and multiple sets of nuts 71. The multiple upper backplate screws 41 are located on the side of the rigid upper backplate 40 facing away from the base plate 10. The connecting portion 62 has upper backplate screw through holes 621 corresponding to each upper backplate screw 41, and each upper backplate screw 41 passes through the upper backplate screw through hole 621 on the connecting portion 62.

[0085] Multiple sets of nuts 71 correspond one-to-one with multiple upper back plate screws 41. Each set of nuts 71 includes two washers 711 and two nuts 712. Each set of nuts 71 clamps the upper and lower sides of the connecting part 62 in a first direction through an upper back plate screw 41. Along the first direction, the two washers 711 are respectively pressed against the upper and lower sides of the connecting part 62 (e.g., ...). Figure 6 (As shown). That is, one of the washers 711 and nut 712 is located on the upper side of the connecting part 62, and the other washer 711 and nut 712 is located on the lower side of the connecting part 62.

[0086] When the connecting part 62 of the rigid limiting structure 60 is connected to the rigid upper back plate 40, firstly, a nut 712 and a washer 711 are sequentially fitted onto the upper back plate screw 41. Then, the upper back plate screw 41 is passed through the upper back plate screw through hole 621 on the connecting part 62. The rigid limiting structure 60 and the rigid upper back plate 40 are in contact in the first direction, leaving a gap to accommodate the washer 711 and the nut 712. Then, another washer 711 and a nut 712 are sequentially fitted onto the part of the upper back plate screw 41 that extends out of the connecting part 62. The nuts 712 on the upper and lower sides of the connecting part 62 are tightened respectively, and then the two washers 711 are pressed tightly against the upper and lower sides of the connecting part 62, completing the fixed connection between the connecting part 62 of the rigid limiting structure 60 and the rigid upper back plate 40. That is, the rigid limiting structure 60 and the rigid upper back plate 40 are connected by the connector 70.

[0087] Thus, the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by double nuts, resulting in good connection stability and preventing loosening. In operation, the cooling system 1 effectively restricts the first-direction movement of the spray assembly 20, preventing the seal 30 from separating from the spray assembly 20. The seal 30 is well compressed, allowing the coolant to flow out of the cavity 21 and achieving a good sealing effect.

[0088] For example, nut 712 in the nut group 71 described above is a hexagonal nut. In some possible embodiments, nut 712 in the nut group 71 may also be other types of nuts.

[0089] Furthermore, this application does not limit the number or installation position of the nut assemblies 71. For example, the connector 70 of this application includes eight nut assemblies 71, which are arranged in a ring on the heat dissipation system 1. Figure 7 The rigid upper backplate 40 is shown to have eight upper backplate screws 41, with two upper backplate screws 41 on each side of the rigid upper backplate 40 and located between two ribs 63. Correspondingly, the connecting part 62 has eight upper backplate screw through holes 621. In some possible embodiments, the number of nut sets 71 can be six, ten, or other similar sets. The nut sets 71 can also be located at other positions in the heat dissipation system 1.

[0090] Next, we will introduce the structure of the connector 70 between the three components: the rigid lower back plate 50, the rigid upper back plate 40, and the rigid limiting structure 60.

[0091] refer to Figure 2 , Figures 4 to 7 The connector 70 further includes multiple sets of spring screws 72, each set of spring screws 72 located on the upper side of the connecting part 62, sequentially fixing the connecting part 62, the rigid upper back plate 40, the base plate 10, and the rigid lower back plate 50 together. The rigid lower back plate 50 has multiple lower back plate screws 51 on the side facing the base plate 10, each lower back plate screw 51 corresponding to one of the multiple sets of spring screws 72. The connecting part 62, the base plate 10, and the rigid upper back plate 40 have lower back plate screw through holes 622 corresponding to the lower back plate screws 51. Each lower back plate screw 51 has an internal thread, which passes sequentially through the base plate 10, the rigid upper back plate 40, and the connecting part 62, so that the spring screw 72 is threadedly connected to the internal thread of the corresponding lower back plate screw 51. Thus, the rigid lower back plate 50, the rigid upper back plate 40, and the rigid limiting structure 60 are connected by the connector 70.

[0092] Essentially, the connecting part 62 of the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected to the base plate 10 by spring screws 72. Using spring screws 72 as connecting parts 70 can control the installation force between the connecting part 62, the rigid upper back plate 40, and the rigid lower back plate 50, preventing the heating device 11 from being damaged due to excessive force.

[0093] Before the connecting part 62 of the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by the aforementioned nut group 71, the connecting part 62 of the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are first connected by spring screws 72 according to a preset installation force. Then, the connecting part 62 of the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by the aforementioned nut group 71. The spring force provided by the aforementioned spring screws 72 is designed to be equal to the rebound force after the seal 30 is compressed. This spring force is relatively small, for example, 30 to 50 kg. Moreover, the rigid limiting structure 60 can ensure that the spring force is evenly applied to the seal 30. Such a spring force results in a small pressure on the contact surface of the heating device 11, for example, 0.1 MPa to 0.4 MPa, ensuring that the heating device 11 will not be damaged.

[0094] If the connecting part 62 of the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are only fixedly connected to the base plate 10 by spring screws 72, without the aforementioned nut assembly 71, then in order to ensure that the sealing member 30 remains sealed when the heat dissipation system 1 is in operation, the installation force of the spring screws 72 needs to be increased, for example, to 400 kg to 600 kg. This will increase the pressure on the contact surface of the heat-generating device 11, for example, to 2 MPa to 4 MPa, which may damage the heat-generating device 11.

[0095] Thus, the rigid limiting structure 60, the rigid upper back plate 40 and the rigid lower back plate 50 of this application are fixedly connected to each other by spring screws 72 and the aforementioned nut group 71, achieving an overall high rigidity design. While reducing the pressure on the contact surface of the heat-generating device 12, it also restricts the overall deformation of the heat dissipation system 1, especially the deformation of the sealing member 30, preventing coolant leakage from the cavity 21 and also preventing damage to the heat-generating device 12.

[0096] In the above embodiments, the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected by spring screws 72 and lower back plate screws 51. In some possible embodiments, the lower back plate screw 51 may be omitted, and the connecting part 62, the rigid upper back plate 40, the base plate 10, and the rigid lower back plate 50 may each have internal threaded holes. The spring screws 72 are then threadedly connected to the internal threaded holes on the connecting part 62, the rigid upper back plate 40, the base plate 10, and the rigid lower back plate 50 in sequence. This configuration also achieves the fixed connection of the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50.

[0097] This application does not impose any restrictions on the number or installation location of the spring screws 72. Figure 4Four spring screws 72 are shown, located at the four corners of the connecting portion 62 (the connection between the aforementioned rib 63 and the connecting portion 62). Correspondingly, four lower backplate screws 51 are provided at corresponding positions on the rigid lower backplate 50, and four lower backplate screw through holes 622 are also provided at the four corners of the connecting portion 62, the base plate 10, and the rigid upper backplate 40. In some possible embodiments, the number of spring screws 72 may be six, eight, or other similar quantities. The spring screws 72 may also be provided at other locations in the heat dissipation system 1.

[0098] Continue to refer to Figure 4 , Figure 5 and Figure 7 In some possible embodiments, the connector 70 further includes: multiple additional lower back plate screws 52 and multiple upper nuts 73. The multiple additional lower back plate screws 52 are disposed on the side of the rigid lower back plate 50 facing the substrate 10. The connecting portion 62, the substrate 10, and the rigid upper back plate 40 are provided with additional lower back plate screw through holes corresponding to the additional lower back plate screws 52. The additional lower back plate screws 52 are used to pass sequentially through the substrate 10, the rigid upper back plate 40, and the connecting portion 62.

[0099] Multiple upper nuts 73 correspond one-to-one with the additional lower back plate screw 52. Each upper nut 73 is located on the upper side of the connecting portion 62 of the rigid limiting structure 60. After the additional lower back plate screw 52 passes through the base plate 10, the rigid upper back plate 40, and the connecting portion 62 in sequence, the upper nut 73 and the portion of the additional lower back plate screw 52 extending out of the connecting portion 62 of the rigid limiting structure 60 are threadedly connected, thereby fixing the rigid lower back plate 50, the rigid upper back plate 40, and the connecting portion 62 together. In other words, the rigid lower back plate 50, the rigid upper back plate 40, and the rigid limiting structure 60 are fixedly connected by a single nut, which also allows for the mutual fixing of the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50. For example, the upper nut 73 is a hexagonal nut. In other embodiments, the upper nut 73 can be other types of nuts.

[0100] Since the connecting portion 62 of the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by the aforementioned nut assembly 71, and the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected to each other by the additional lower back plate screw 52, ​​the upper nut 73, and the spring screw 72, in some possible embodiments, after the connecting portion 62 of the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by the aforementioned nut assembly 71, the spring screw 72 can be removed.

[0101] Because the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are connected by spring screws 72, and after the installation force is controlled, the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 are fixedly connected by an additional lower back plate screw 52 and an upper nut 73. In addition, the connecting part 62 of the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by the aforementioned nut set 71. Removing the spring screws 72 has little impact on the connection stability between the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50. When the heat dissipation system 1 is in operation, the stable connection between the rigid limiting structure 60, the rigid upper back plate 40, and the rigid lower back plate 50 can still prevent the spray assembly 20 and the heat-generating device 11 from separating, so that the sealing element 30 remains sealed and prevents coolant leakage from the cavity 21.

[0102] In some possible implementations, the rigid lower back plate 50, the rigid upper back plate 40, and the rigid limiting structure 60 described above are fixedly connected by a single nut.

[0103] Furthermore, this application does not limit the number or installation position of the backplate screws 41. For example, Figure 7 The connector 70 shown in this application includes four additional upper backplate screws 41, each located between two upper backplate screws 41. Correspondingly, there are also four upper nuts 73. In some possible embodiments, the number of additional upper backplate screws 41 can be one, two, six, etc. The additional upper backplate screws 41 can also be located at other positions on the rigid upper backplate 40.

[0104] In the above embodiments, the rigid limiting structure 60 and the rigid upper back plate 40 are fixedly connected by double nuts. However, this application is not limited to this. In some possible embodiments, the rigid lower back plate 50, the rigid upper back plate 40 and the rigid limiting structure 60 are fixedly connected by a "single nut", and the rigid upper back plate 40 and the rigid limiting structure 60 are not fixedly connected by the aforementioned nut group 71.

[0105] For details, please refer to the following: Figures 8 to 10 The connector 70 of this application includes: multiple upper back plate screws 41 and multiple fixing springs 80. The multiple upper back plate screws 41 are disposed on a rigid upper back plate 40, with every two upper back plate screws 41 located on the same side of the rigid upper back plate 40. The connecting part 62 has upper back plate screw through holes 621 corresponding to the upper back plate screws 41, and the upper back plate screws 41 are used to pass through the upper back plate screw through holes 621 on the connecting part 62. Each upper back plate screw 41 has an internal thread.

[0106] Each of the aforementioned fixing spring pieces 80 corresponds to two upper back plate screws 41 on the same side. Each fixing spring piece 80 is located between the two aforementioned ribs 63. Each fixing spring piece 80 has a locking hole 81 at both ends. Each locking hole 81 allows a locking screw 90 to pass through, so that the locking screw 90 can be threadedly connected to the internal thread of the corresponding upper back plate screw 41.

[0107] When the connecting part 62 of the rigid limiting structure 60 is connected to the rigid upper back plate 40, the upper back plate screw 41 is passed through the upper back plate screw through hole 621 on the connecting part 62, and the locking screws 90 are inserted into the locking holes 81 at both ends of the fixing spring 80. The locking screw 90 at each end of the fixing spring 80 is threadedly connected to the internal thread of the corresponding upper back plate screw 41, thereby realizing the connection between the connecting part 62 of the rigid limiting structure 60 and the rigid upper back plate 40. Since the fixing spring 80 is connected to both upper back plate screws 41 at the same time, this can prevent loosening at the connection between the connecting part 62 of the rigid limiting structure 60 and the rigid upper back plate 40.

[0108] This application does not limit the number or installation position of the fixing springs 80. For example, the connector 70 of this application includes four fixing springs 80, each located between two reinforcing ribs 63. In some possible embodiments, the number of fixing springs 80 can be one, two, six, etc. The fixing springs 80 can also be located at other positions on the rigid upper back plate 40. For example, when the reinforcing ribs 63 are not provided, the fixing springs 80 can correspond to two upper back plate screws 41 on different sides.

[0109] Continue to refer to Figure 8 and Figure 10 Each of the aforementioned fixing spring pieces 80 has a nut groove 83 on its surface facing the connecting part 62. In the aforementioned embodiment, multiple additional lower back plate screws 52 correspond one-to-one with the fixing spring pieces 80. After the upper nut 73 is threadedly connected to the portion of the additional lower back plate screw 52 extending out of the connecting part 62 ("single nut" connection method), each upper nut 73 is circumferentially confined within the nut groove 83 of the corresponding fixing spring piece 80. Thus, the nut groove 83 on the reverse side of the fixing spring piece 80 can be fastened onto the upper nut 73 to achieve the limiting requirement. Using fixing spring pieces 80 to limit the rotation of the upper nut 73 can effectively prevent the upper nut 73 from loosening, especially loosening that occurs during transportation.

[0110] For example, the upper nut 73 is a hexagonal nut, the nut groove 83 is a hexagonal nut groove, and the hexagonal nut is confined within the hexagonal nut groove.

[0111] In the above embodiments, the rigid structural limiting member 60, the rigid upper back plate 40, and the rigid lower back plate 50 are simultaneously fixedly connected by the connector 70. In some possible embodiments, the rigid structural limiting member 60 and the rigid upper back plate 40 are fixedly connected separately by the connector 70, and the rigid structural limiting member 60 and the rigid lower back plate 50 are fixedly connected separately by the connector 70. In some possible embodiments, the rigid structural limiting member 60 may not be provided, and the rigid lower back plate 50, the rigid upper back plate 40, and the spray assembly 20 are fixedly connected. For example, the outer peripheral surface of the body of the spray assembly 20 extends radially outward to form an extension portion, which is similar to the structure of the aforementioned connector 62. The extension portion of the spray assembly 20 is fixedly connected to the rigid upper back plate 40 and the rigid lower back plate 50 by the connector, which can also restrict the movement of the spray assembly 20 in the first direction. The structure of the connector between the extension portion of the spray assembly 20 and the rigid upper back plate 40 and the rigid lower back plate 50 can adopt the structure of the connector 70 described in the previous embodiments. Referring to the specific form of connection of the connecting part 62, the rigid lower back plate 50 and the rigid upper back plate 40 through the connecting member 70 in the aforementioned embodiments, for example, it is a connection form of "nut group", "single nut" and "spring screw".

[0112] This application also provides an electronic device, including: a heat dissipation system 1 as described in any of the above embodiments and a heat-generating device 11, wherein the heat dissipation system 1 is used to dissipate heat from the heat-generating device 11 in the electronic device. The aforementioned electronic device is, for example, a blade server, a rack server, or other server. The heat dissipation system 1 uses a jet assembly 20 to apply jet impact cooling to the heat-generating device 11 in the server.

[0113] This application also provides a liquid cooling system, including: the electronic device described in the above embodiment; and a cooling device connected to the spray assembly 20 via a pipeline to provide coolant to the spray assembly 20. Exemplarily, the cooling device described above is a CDU. A CDU is an industry component with temperature-controlled power functions, containing a plate heat exchanger (not shown) that enables heat exchange on both the primary and secondary sides. The primary side is typically a chilled water unit, where the refrigerant provided by the chilled water unit flows under the drive of a cooling pump. The secondary side is the electronic device described in this application embodiment. That is, the CDU enables heat exchange between the refrigerant in the chilled water unit and the coolant in the electronic device. Exemplarily, the chilled water unit described above is a heat exchange device in the environment, typically a cooling tower. This application does not limit the type of chilled water unit; other devices capable of providing refrigerant can also be used.

[0114] In summary, the spray assembly 20 in the heat dissipation system 1 of this application is restricted to move in the first direction, so that the sealing spray assembly 20 and the sealing element 30 of the heat-generating device 11 remain sealed, thereby the heat dissipation system 1 has good sealing performance and reduces the possibility of coolant leakage.

Claims

1. A heat dissipation system for dissipating heat from heat-generating devices on a substrate, characterized in that, The heat dissipation system includes: A spray assembly having a coolant inlet and a spray hole, the spray hole facing the heat-generating device; The heating element is disposed on the side of the substrate facing the spraying assembly, and the end of the spraying assembly is in contact with the surface of the heating element; A seal for sealing the portion between the end of the jet assembly and the surface of the heating element; Coolant flows out of the cavity, which is formed by at least the seal, the spray assembly, and the heating device, and the spray hole communicates with the coolant outflow cavity; A rigid upper backplate is disposed on one side of the substrate, surrounding the heating element; A rigid lower back plate is disposed on the other side of the substrate opposite to the rigid upper back plate, and together with the rigid upper back plate, clamps the substrate. A rigid limiting structure is fixedly connected to the base plate by means of a connector; Along a first direction perpendicular to the substrate, there is a height limiting space between the substrate and the rigid limiting structure, and at least a portion of the spraying assembly is located within the height limiting space; Along the first direction, the portion of the spray assembly located within the height limiting space has one end in contact with the heating device and the other end in contact with the rigid limiting structure.

2. The heat dissipation system as described in claim 1, characterized in that, The rigid limiting structure includes: A receiving section for accommodating the jet assembly; A connecting portion extends outward from the outer surface of the receiving portion and is fixedly connected to the rigid upper back plate and / or the rigid lower back plate via the connecting member on the base plate, and the height limiting space exists between the base plate and the receiving portion; Along the first direction, the other end of the spraying assembly contacts the receiving portion.

3. The heat dissipation system as described in claim 2, characterized in that, The rigid limiting structure also includes: A sleeve, the inner cavity of which is the receiving portion, and the inner cavity of which is adapted to the shape of the spraying assembly; The connecting part is a flange, which is formed by extending radially outward from the end of the sleeve facing the substrate, the radial direction being perpendicular to the first direction.

4. The heat dissipation system as described in claim 3, characterized in that, It also includes multiple reinforcing bars, each of which is connected at both ends to the flange and the sleeve, respectively.

5. The heat dissipation system according to any one of claims 2 to 4, characterized in that, The connector includes: Multiple upper backplate screws are provided on the side of the rigid upper backplate facing away from the base plate, and each upper backplate screw is used to pass through the connecting part; Multiple sets of nuts are provided, each corresponding to a screw on the upper back plate. Each set of nuts includes two washers and two nuts. Each set of nuts is clamped to the upper and lower sides of the connecting part by a screw on the upper back plate. Along the first direction, the two washers are respectively pressed against the upper and lower sides of the connecting part.

6. The heat dissipation system as described in claim 5, characterized in that, The nuts in the nut group are hexagonal nuts.

7. The heat dissipation system as described in claim 5, characterized in that, The connector further includes multiple sets of spring screws, each set of spring screws being located on the upper side of the connector, which sequentially fixes the connector, the rigid upper back plate, the base plate, and the rigid lower back plate together.

8. The heat dissipation system as described in claim 7, characterized in that, The connector further includes: multiple lower back plate screws, located on the side of the rigid lower back plate facing the substrate, corresponding one-to-one with the spring screws, each of the lower back plate screws having an internal thread, the lower back plate screws being used to pass sequentially through the substrate, the rigid upper back plate and the connecting part, so that the spring screws are threadedly connected to the internal thread of the corresponding lower back plate screw.

9. The heat dissipation system as described in claim 5, characterized in that, The connector includes eight sets of nuts, which are arranged in a ring on the heat dissipation system.

10. The heat dissipation system according to any one of claims 2 to 4, characterized in that, The connector includes: Multiple upper backplate screws are provided on the side of the rigid upper backplate facing away from the substrate. Every two upper backplate screws are located on the same side around the rigid upper backplate. Each upper backplate screw is used to pass through the connecting part. Each upper backplate screw has an internal thread. Multiple fixing springs are provided, each of which corresponds to two upper back plate screws on the same side. Each fixing spring has a locking hole at both ends, and each locking hole allows a locking screw to pass through so that the locking screw is threadedly connected to the internal thread of the corresponding upper back plate screw.

11. The heat dissipation system as described in claim 10, characterized in that, Each of the retaining springs has a nut groove on its surface facing the connecting portion; the connector also includes: Multiple additional lower backplate screws are provided on the side of the rigid lower backplate facing the substrate, and correspond one-to-one with the fixing spring. Each additional lower backplate screw is used to pass through the substrate, the rigid upper backplate and the connecting part in sequence. Multiple upper nuts correspond one-to-one with the additional lower back plate screw. Each upper nut is located on the upper side of the connecting part. The upper nut is threadedly connected to the portion of the additional lower back plate screw that extends out of the connecting part, so that the rigid lower back plate, the rigid upper back plate, and the connecting part are fixedly connected. Furthermore, each upper nut is circumferentially limited within the nut groove of the corresponding fixing spring.

12. The heat dissipation system as described in claim 11, characterized in that, The upper nut is a hexagonal nut, the nut groove is a hexagonal nut groove, and the hexagonal nut is confined within the hexagonal nut groove.

13. An electronic device, characterized in that, include: The heat dissipation system and the heat-generating device according to any one of claims 1 to 12, wherein the heat dissipation system is used to dissipate heat from the heat-generating device in the electronic device.

14. A liquid cooling system, characterized in that, include: The electronic device according to claim 13; A cooling device, which is connected to the spray assembly via a pipeline, provides coolant to the spray assembly.

Citation Information

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