Integrated circuit chip module multi-station testing and sorting device and method

Abstract

The application provides a multi-station test and sorting device for an integrated circuit chip module, which comprises a sorting machine main body, a test module is installed on the sorting machine main body, the test module comprises at least one chip conveying protection mechanism which is movably installed along a chip conveying direction, a test mechanism is arranged on the side of the chip conveying protection mechanism, and the chip conveying protection mechanism and the test mechanism are arranged in a staggered mode. The application solves the problem that when the test pins in the existing chip sorting machine touch the chip pins, the impact force is too large, the chip pins are excessively bent and damaged, the falling speed of the chip is reduced, the defective product rate is reduced, and the professional chip sorting is facilitated.

Description

Technical Field

[0001] This invention relates to a multi-station testing and sorting device for integrated circuit chip modules. Background Technology

[0002] Currently, when testing chips with multiple rows of L-shaped pins, chip sorting machines typically use test pins driven by electric or pneumatic cylinders on both sides of the track. These cylinders drive the test pins to contact the chip pins. However, in practice, excessive impact can cause the chip pins to bend and become damaged. Furthermore, in most existing gravity-type chip sorting machines, the test chips descend vertically by gravity, so the sorting machine's conveyor track is vertically positioned. However, because the chips descend directly by gravity, the rapid descent can cause excessive impact when the chips contact the limiting blocks at the bottom, leading to breakage. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to overcome the shortcomings of the prior art and provide a multi-station testing and sorting device for integrated circuit chip modules, which solves the problem that when the test pins in the existing chip sorting machine touch the chip pins, the chip pins are excessively bent and damaged due to the excessive impact force. At the same time, it reduces the falling speed of the chips, reduces the defect rate, and facilitates professional chip sorting.

[0004] This invention is implemented using the following scheme: a multi-station testing and sorting device for integrated circuit chip modules: including a sorting machine body, a testing module installed on the sorting machine body, the testing module including at least one chip conveying protection mechanism movably installed along the chip conveying direction, a testing mechanism being provided on the side of the chip conveying protection mechanism, and the chip conveying protection mechanism and the testing mechanism being staggered.

[0005] Furthermore, the chip conveying protection mechanism includes a vertically arranged misaligned track, a pin protection mechanism movably connected to the middle of the misaligned track, a baffle mechanism movably connected to the misaligned track below the pin protection mechanism, a driving mechanism for driving the misaligned track to slide back and forth on the side of the misaligned track, and a clearance opening in the middle of the misaligned track for the pin protection mechanism and the baffle mechanism to extend into the misaligned track and fix the chip. The driving mechanism is mounted on the sorting machine body, and the movable end of the driving mechanism is connected to the misaligned track. The pin protection mechanism includes a pressure block, and pin protection plates corresponding to the chip pins are respectively installed on the left and right sides of the pressure block. The outer wall of the pin protection plate near the chip pin has a slot corresponding to the chip pin, and the slot of one pin protection plate has several rows of pin abutment blocks arranged from top to bottom.

[0006] Furthermore, the pin protection mechanism also includes a pin protection slide rail, which is mounted on the outer wall of the upper part of the misalignment track. The pin protection slide rail is perpendicular to the misalignment track. A first slider, which is L-shaped, is slidably connected to the pin protection slide rail, with its horizontal portion on top and its vertical portion on the bottom. The horizontal portion of the first slider is slidably connected to the slide rail. A pressure block is mounted on the vertical portion of the first slider. A first fixing block is mounted on the outer wall of the upper part of the misalignment track. The pin protection slide rail is mounted below the first fixing block. A first pushing mechanism for driving the first slider to slide is mounted below the first fixing block. The structure includes a first cylinder, a first limiting block mounted on the end of the first fixed block away from the misalignment track of the pin protection slide rail, the first cylinder mounted on the first limiting block, the movable end of the first cylinder facing the end of the first slider away from the misalignment track, a first buffer shaft fixedly connected to the movable end of the first cylinder, a first push plate slidably connected to the first buffer shaft, a first end block fixedly connected to the end of the first buffer shaft, a first spring mounted on the shaft section between the first end block and the first push plate on the first buffer shaft, the first push plate being L-shaped, the vertical part of the first push plate slidably connected to the first buffer shaft, and the horizontal part of the first push plate connected to the horizontal part of the first slider.

[0007] Furthermore, the material blocking mechanism includes a second fixed block arranged parallel to the first fixed block. The second fixed block is installed on the outer wall of the lower part of the misaligned track. A material blocking slide rail parallel to the pin protection slide rail is installed on the second fixed block. A material blocking insert plate corresponding to the clearance opening is slidably connected on the material blocking slide rail. A second pushing mechanism for driving the material blocking insert plate to slide is installed on the second fixed block. The second pushing mechanism includes a second limiting block, which is fixed to the second fixed block and located at the end of the material blocking slide rail away from the misaligned track. A second cylinder is installed on the second limiting block, with the movable end of the second cylinder facing the material blocking insert plate away from the misaligned track. At one end, a second buffer shaft is fixedly connected to the movable end of the second cylinder, a second push plate is slidably connected to the second buffer shaft, a second end block is fixedly connected to the end of the second buffer shaft, a second spring is installed on the shaft section between the second end block and the second push plate on the second buffer shaft, a second slider is slidably connected to the material stop slide rail, the second slider is L-shaped, the vertical part of the second slider is on top and the horizontal part is on the bottom, the vertical part of the second slider is fixedly connected to the material stop plate, the horizontal part of the second slider is slidably connected to the material stop slide rail, the second push plate is L-shaped, the vertical part of the second push plate is slidably connected to the second buffer shaft, and the horizontal part of the second push plate is connected to the horizontal part of the second slider.

[0008] Furthermore, the pressure block includes a connecting block, one end of which is provided with a pressure plate corresponding to the chip, and the other end is connected to the vertical part of the first slider. Pins are respectively provided at the upper and lower ends of the pressure plate corresponding to the end notches of the chip. A baffle clearance groove is provided in the middle of the upper plate of the baffle plate corresponding to the lower end of the pressure plate. The pin protection plate is located on the left and right sides of the connecting block. The slotted ends of the pin protection plate are respectively located on the left and right sides of the pressure plate, and the non-slotted ends of the pin protection plate are respectively located on the left and right sides of the vertical part of the first slider. The non-slotted ends of the pin protection plate are fixed to the side of the vertical part of the first slider. The misaligned track includes a vertical guide rail plate. A chip guide groove is formed on the surface of the guide rail plate. Pins are respectively provided on the guide rail plate. The chip conveying slot has track cover plates at its input and output ends. The middle of the chip conveying slot is not closed, and a clearance opening is formed between the two track cover plates. A slot is provided on the middle of the chip conveying slot corresponding to the pin. The driving mechanism includes a sliding plate, which is vertically mounted on the main body of the sorting machine. The sliding plate is perpendicular to the guide rail plate. An extension plate is symmetrically arranged on one side of the guide rail plate. A main slider is mounted on the extension plate. A sliding guide rail is provided on the sliding plate corresponding to the main slider. A third cylinder is provided on the sliding plate to drive the guide rail plate to slide along the sliding guide rail. The testing mechanism includes test grippers symmetrically arranged on both sides of the chip conveying and protection mechanism. A test cylinder is provided on the main body of the sorting machine to drive the test grippers.

[0009] Furthermore, a feeding structure is installed on the input end of the test module on the main body of the sorting machine. The feeding structure includes a vertically arranged sorting track. At least one buffer port is opened on the outer wall of the sorting track along the length of the sorting track. The buffer port is connected to the inside of the sorting track. A buffer mechanism is installed on the buffer port. The buffer mechanism includes a buffer block. The upper end of the buffer block is rotatably connected to the outer wall of the sorting track, and the lower end of the buffer block extends into the sorting track through the buffer port.

[0010] Furthermore, the buffer block is a triangular plate, with its surface perpendicular to the sorting track surface. The upper corner of the buffer block is rotatably connected to the outer wall of the sorting track, and one corner of the lower part of the buffer block extends into the sorting track through a buffer opening. A counterweight is installed on the lower corner of the buffer block that does not extend into the sorting track. The buffer mechanism also includes a buffer block rotating seat, which includes an L-shaped support block with its vertical part on top and its horizontal part on the bottom. The vertical part of the L-shaped support block is fixed to the outer wall of the sorting track and located above the corresponding buffer opening. A rotating seat is installed on the horizontal part of the L-shaped support block, and the upper corner of the buffer block is rotatably connected to the rotating seat. The rotating seat includes a fixing block installed below the horizontal part of the L-shaped support block. Connecting blocks are symmetrically arranged on the left and right sides of the lower part of the fixing block, and the upper corner of the buffer block is rotatably connected between the two connecting blocks via a rotating shaft.

[0011] Furthermore, the test module includes at least two chip delivery protection mechanisms, and two adjacent test modules are connected by a transition delivery track. The transition delivery track is provided with a transition buffer port, and the transition buffer port is provided with a buffer mechanism.

[0012] Furthermore, the sorting machine body is connected to a microscopic inspection track at the output end of the testing module. A chip flipping mechanism is provided on the microscopic inspection track, and an inclined output track is provided at the output end of the microscopic inspection track. A track-changing mechanism is provided between the input end of the inclined output track and the output end of the microscopic inspection track. The chip flipping mechanism includes a flipping track driven by a motor. Vertical anti-detachment arc plates are symmetrically arranged on the outer periphery of the flipping track. One end of the flipping track is closed, and the other end is gap-fitted with the ends of the two anti-detachment arc plates. The track-changing mechanism includes a track-changing track driven by a motor. A vertical arc-shaped limiting plate is provided at the input end of the inclined output track corresponding to the lower rotation trajectory of the track-changing track. The lower middle part of the track-changing track slides on the arc surface of the arc-shaped limiting plate, and the lower end of the track-changing track is guided to the input end of the inclined output track through the arc-shaped limiting plate.

[0013] A method for using a multi-station testing and sorting device for integrated circuit chip modules: Step 1) The chip falls from the input end of the sorting track, and after passing through at least one buffer mechanism to reduce its speed, it is output to the test module; Step 2) When the chip enters the first chip conveying and protection mechanism, the misalignment track is initially in its position. At this time, the output and input ends of the misalignment track are exactly aligned with the sorting track. When the operation starts, the blocking mechanism blocks the misalignment track. The chip falls from the conveying track into the misalignment track and is blocked by the blocking mechanism. Then, the pin protection mechanism holds the chip and simultaneously blocks the multiple rows of pins on the chip. Then, the entire misalignment track is misaligned with the sorting track under the action of the driving mechanism and moves to the middle of the originally misaligned test mechanism for testing. After the test is completed, the chip falls to the second chip conveying and protection mechanism via the transition conveying track with a buffer mechanism. Step 3) After the second chip delivery and protection mechanism repeats the action of step 2), the test chip falls onto the microscopic inspection track; Step 4) The test chip in the microscopic inspection track needs to be inspected twice. The two inspections are to inspect the front and back sides of the test chip. A chip flipping mechanism is set between the two inspections to flip the test chip. After inspection, the test chip is transported to the inclined output track by the track switching mechanism for sorting.

[0014] Compared with the prior art, the present invention has the following advantages: it solves the problem that when the test pins in the existing chip sorting machine touch the chip pins, the chip pins are excessively bent and damaged due to the excessive impact force. At the same time, it reduces the falling speed of the chips, reduces the defect rate, and facilitates professional chip sorting. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of an embodiment of the present invention (with the sorting machine body removed). Figure 3 This is a schematic diagram of the test module structure according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the chip delivery and protection mechanism according to an embodiment of the present invention; Figure 5 for Figure 4 Enlarged view of point A in the middle; Figure 6 This is a three-dimensional cross-sectional view of the chip delivery and protection mechanism according to an embodiment of the present invention; Figure 7 for Figure 6 Schematic diagram of the structure of the mid-section; Figure 8 This is a top view of the chip delivery and protection mechanism according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the chip delivery protection mechanism according to an embodiment of the present invention (with pin protection mechanism removed). Figure 10This is a schematic diagram of the test chip structure according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the feeding structure according to an embodiment of the present invention; Figure 12 This is a cross-sectional view of the material feeding structure according to an embodiment of the present invention; Figure 13 This is a schematic diagram of the buffer mechanism according to an embodiment of the present invention; Figure 14 This is a schematic diagram of the chip flipping mechanism and track-changing structure according to an embodiment of the present invention; Figure 15 This is a schematic diagram of the chip flipping mechanism and the lane-changing side structure according to an embodiment of the present invention.

[0016] In the diagram: 0 - Sorting machine body; A0 - Chip conveying and protection mechanism; A1 - Misalignment track; A2 - Pin protection mechanism; A3 - Material blocking mechanism; A4 - Drive mechanism; A5 - Clearance port; A6 - Pressure block; A7 - Pin protection insert plate; A8 - Slot; A9 - Second row of pin contact blocks; A10 - Pin protection slide rail; A11 - First slider; A12 - First fixing block; A13 - First cylinder; A14 - First limit block; A15 - First buffer shaft; A1 6-First push plate; A17-First end block; A18-First spring; A19-Second fixing block; A20-Blocking slide rail; A21-Blocking insert plate; A22-Second limiting block; A23-Second cylinder; A24-Second buffer shaft; A25-Second push plate; A26-Second end block; A27-Second spring; A28-Second slider; A29-Connecting block; A30-Pressure plate; A31-Pin; A33-Blocking relief groove; A34-Guide rail plate body A35 - Chip conveying groove; A36 - Track cover plate; A37 - Slot; A38 - Sliding plate; A39 - Extension plate; A40 - Main slider; A41 - Sliding guide rail; A42 - Third cylinder; A43 - Test chip; B0 - Unloading structure; B1 - Sorting track; B2 - Buffer port; B3 - Buffer mechanism; B4 - Buffer block; B5 - Counterweight block; B6 - L-shaped support block; B7 - Rotary seat; B8 - Connecting block; B9 - Mounting slot; B10 - Guide plate; B11-Cover plate; B12-Chip through slot; B13-Chip channel; B14-Fixing block; C0-Testing mechanism; C1-Test gripper; C2-Test cylinder; C3-Transition conveying track; C4-Transition buffer port; D1-Microscopic inspection track; D2-Microscopic inspection mechanism; D3-Chip flipping mechanism; D4-Tilted output track; D5-Channel changing mechanism; D6-Flipping track; D7-Anti-detachment arc plate; D8-Channel changing track; D9-Arc-shaped limit plate. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0019] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0020] like Figure 1-15 As shown, an integrated circuit chip module multi-station testing and sorting device includes a sorting machine body 0, a testing module installed on the sorting machine body, and the testing module includes at least one chip conveying protection mechanism A0 movably installed along the chip conveying direction. A testing mechanism C0 is provided on the side of the chip conveying protection mechanism, and the chip conveying protection mechanism and the testing mechanism are staggered.

[0021] In this embodiment, the chip conveying protection mechanism includes a vertically arranged misaligned track A1. A pin protection mechanism A2 is movably connected to the middle of the misaligned track. A retaining mechanism is movably connected to the misaligned track below the pin protection mechanism. Initially, the misaligned track is in its initial position, at which point both its output and input ends are perfectly aligned with the sorting track. At the start of operation, the retaining mechanism blocks the misaligned track, and the chip falls from the sorting track into the misaligned track, where it is blocked by the retaining mechanism. Then, the pin protection mechanism holds the chip in place, simultaneously abutting against multiple rows of pins on the chip. Then, under the action of the driving mechanism, the entire misaligned track is misaligned with the sorting track and moves to the middle of the originally misaligned testing mechanism for testing. Due to the protection of the pin protection mechanism, the chip pins will not be excessively bent or damaged under impact. The middle of the misaligned track is provided for the pin protection mechanism and the retaining mechanism. The drive mechanism extends into the misalignment track and fixes the chip's clearance opening A5. The drive mechanism is mounted on the sorting machine body, and its movable end is connected to the misalignment track. The pin protection mechanism includes a pressure block A6. Pin protection inserts A7, corresponding to the chip pins, are screwed onto the left and right sides of the pressure block. The pressure block is used to hold the chip body. When the pressure block holds the chip body, the pin protection inserts are inserted between the pressure block and the chip pins on both sides. The outer wall of the pin protection insert near the chip pin has a slot A8 corresponding to the chip pin. The slot of one pin protection insert has several rows of pin abutment blocks A9 arranged from top to bottom. For multiple rows of pins on the same side, two rows of pin abutment blocks of different heights can be set. The innermost pin just fits into the slot, and the outermost pins hold the corresponding two rows of pin abutment blocks, thus fixing the inner side of the pins and avoiding excessive bending or damage to the chip pins when impacted by the outer testing mechanism.

[0022] In this embodiment, in order to achieve the separation and pressing of the pressure block and the chip, the pin protection mechanism further includes a pin protection slide rail A10. The pin protection slide rail is installed on the outer wall of the upper part of the misalignment track and is perpendicular to the misalignment track. A first slider A11 is slidably connected to the pin protection slide rail. The first slider is L-shaped, with the horizontal part of the first slider on top and the vertical part on the bottom. The horizontal part of the first slider is slidably connected to the slide rail. The pressure block is installed on the vertical part of the first slider. The separation and pressing of the pressure block and the chip are achieved by the movement of the first slider causing the movement of the pressure block.

[0023] In this embodiment, to further realize the movement of the first slider, a first fixing block A12 is installed on the outer wall of the upper part of the misaligned track. The pin protection slide rail is installed under the first fixing block. A first pushing mechanism for driving the first slider to slide is installed under the first fixing block. The first pushing mechanism includes a first cylinder A13. A first limiting block A14 is installed on the end of the pin protection slide rail away from the misaligned track below the first fixing block. The first cylinder is installed on the first limiting block. The movable end of the first cylinder faces the end of the first slider away from the misaligned track. A first buffer shaft A15 is fixedly connected to the movable end of the first cylinder. A first push plate A16 is slidably connected to the first buffer shaft. A first buffer plate A16 is fixedly connected to the end of the first buffer shaft. A first spring A18 is installed on the shaft section between the first end block and the first push plate on the first buffer shaft. The first push plate is L-shaped, with its vertical part sliding on the first buffer shaft and its horizontal part connected to the horizontal part of the first slider. The diameter of the movable end shaft of the first cylinder is larger than the diameter of the first buffer shaft, and the outer diameter of the first end block is larger than the diameter of the first buffer shaft. This allows the first push plate to abut against the movable end shaft of the first cylinder under the action of the first spring. In use, the first cylinder drives the first push plate to slide, thereby moving the pressure block. At the same time, the first limiting block prevents the first slider from excessively dislodging. Furthermore, under the action of the first spring, the pressure plate and the chip are not completely rigidly pressed together, further preventing damage to the chip.

[0024] In this embodiment, in order to achieve material blocking, the material blocking mechanism includes a second fixing block A19 arranged parallel to the first fixing block. The second fixing block is installed on the outer wall of the lower part of the misalignment track. A material blocking slide rail A20 parallel to the pin protection slide rail is installed on the second fixing block. A material blocking insert plate A21 corresponding to the clearance opening is slidably connected on the material blocking slide rail. A second pushing mechanism for driving the material blocking insert plate to slide is installed on the second fixing block.

[0025] In this embodiment, the second pushing mechanism includes a second limiting block A22, which is fixed to a second fixed block and located on the end of the material blocking slide rail away from the misalignment track. A second cylinder A23 is mounted on the second limiting block, with its movable end facing the end of the material blocking plate away from the misalignment track. A second buffer shaft A24 is fixedly connected to the movable end of the second cylinder, and a second push plate A25 is slidably connected to the second buffer shaft. A second end block A26 is fixedly connected to the end of the second buffer shaft, and a second spring A27 is mounted on the shaft section of the second buffer shaft between the second end block and the second push plate. The material blocking slide rail is slidably connected to the second... The second slider A28 is L-shaped, with its vertical part on top and its horizontal part on the bottom. The vertical part of the second slider is fixedly connected to the stop plate, and the horizontal part of the second slider slides on the stop rail. The second push plate is L-shaped, with its vertical part sliding on the second buffer shaft and its horizontal part connected to the horizontal part of the second slider. The diameter of the movable end shaft of the second cylinder is larger than the diameter of the second buffer shaft, and the outer diameter of the second end block is larger than the diameter of the second buffer shaft. This allows the second push plate to abut against the movable end shaft of the second cylinder under the action of the second spring. The specific working principle is similar to that of the first pushing mechanism, so it will not be described in detail here.

[0026] In this embodiment, to ensure a reasonable design and to achieve the effect of pressing the chip onto the misaligned track, the specific structure of the pressing block is as follows: The pressing block includes a connecting block A29. One end of the connecting block is provided with a pressure plate A30 corresponding to the chip, and the other end is connected to the vertical part of the first slider. The upper and lower ends of the pressure plate are respectively provided with pins A31 corresponding to the end notches of the chip. Specifically, notches are provided on both the upper and lower ends of the chip, and pins are provided on the pressure plate corresponding to the two notches. The middle of the upper plate of the baffle plate is provided with a baffle clearance groove A33 corresponding to the lower end of the pressure plate. The pin protection plate is located on the left and right sides of the connecting block. The slotted ends of the pin protection plate are respectively located on the left and right sides of the pressure plate, and the non-slotted ends of the pin protection plate are respectively located on the left and right sides of the vertical part of the first slider. The non-slotted ends of the pin protection plate are fixed to the side of the vertical part of the first slider.

[0027] In this embodiment, for the sake of reasonable design, the misaligned track includes a vertical guide rail plate A34, a chip delivery groove A35 is provided on the surface of the guide rail plate, and a track cover plate A36 is provided on the guide rail plate at the input end and the output end of the chip delivery groove, respectively. A clearance opening is formed between the two track cover plates, and a slot A37 is provided on the middle part of the chip delivery groove corresponding to the pin.

[0028] In this embodiment, for rational design, the driving mechanism includes a sliding plate A38, which is vertically mounted on the main body of the sorting machine. The sliding plate is perpendicular to the guide rail plate. An extension plate A39 is symmetrically arranged on one side of the guide rail plate. A main slider A40 is mounted on the extension plate. A sliding guide rail A41 is provided on the sliding plate corresponding to the main slider. A third cylinder A42 is provided on the sliding plate for driving the guide rail plate to slide along the sliding guide rail. A mounting block is connected between the two main sliders. The mounting block is movably connected to the third cylinder. At the same time, a test port for the test pin to enter and exit is formed between the two extension plates. The test port is connected to the clearance port. The clearance port is an open opening on the side of the guide rail plate where no extension plate is provided, which can directly allow the test mechanism to enter and exit.

[0029] In this embodiment, the testing mechanism includes test grippers C1 symmetrically arranged on both sides of the chip conveying and protection mechanism. The main body of the sorting machine is provided with a test cylinder C2 for driving the test grippers. The test grippers are horizontally slidable to the main body of the sorting machine via a slide rail. Driven by the test cylinder, the test grippers can clamp the chip pins.

[0030] In this embodiment, a feeding structure B0 is installed on the input end of the test module on the main body of the sorting machine. The feeding structure includes a vertically arranged sorting track B1. At least one buffer port B2 is opened on the outer wall of the sorting track along the length of the sorting track. The buffer port communicates with the inside of the sorting track. A buffer mechanism B3 is installed on the buffer port. The buffer mechanism includes a buffer block B4. The upper end of the buffer block is rotatably connected to the outer wall of the sorting track, and the lower end of the buffer block extends into the sorting track through the buffer port. The buffer block is a swing block that is smaller at the top and larger at the bottom.

[0031] In this embodiment, to buffer the chips, the buffer block is a triangular plate with its surface perpendicular to the sorting track surface. The upper corner of the buffer block is rotatably connected to the outer wall of the sorting track, and one corner of the lower part of the buffer block extends into the sorting track through a buffer opening. The buffer block can also be other types of plates that are smaller at the top and larger at the bottom. In use, when no chips are passing through, since most of the buffer block is at the bottom, under the action of gravity, the buffer block moves towards the corner of the sorting track and enters the sorting track through the buffer opening, blocking the chip channel within the sorting track. The transition surface between the smaller and larger parts of the buffer block forms an angle with the inner wall of the sorting track. When a chip falls, it needs to push the buffer block away along the angle, thus its speed decreases due to the action of the buffer block, achieving deceleration. After the chip passes through, the buffer block resets.

[0032] In this embodiment, in order to further realize that the buffer block can quickly reset after the chip descends and causes the buffer block to swing, a counterweight B5 is installed on the corner end of the lower part of the buffer block that does not extend into the sorting track. The counterweight enables the buffer block to swing back quickly. The weight of the counterweight is set according to the actual chip.

[0033] In this embodiment, for reasonable design, the specific installation method of the buffer block is as follows: the buffer mechanism further includes a buffer block rotating seat, the buffer block rotating seat includes an L-shaped support block B6, the vertical part of the L-shaped support block is on top and the horizontal part is on the bottom, the vertical part of the L-shaped support block is fixed to the outer wall of the sorting track and located above the corresponding buffer opening, a rotating seat B7 is installed on the horizontal part of the L-shaped support block, the upper corner end of the buffer block is rotatably connected to the rotating seat, the rotating seat includes a fixing block B14, the fixing block is installed below the horizontal part of the L-shaped support block, the lower part of the fixing block is symmetrically provided with connecting blocks B8, and the upper corner end of the buffer block is rotatably connected between the two connecting blocks through a rotating shaft.

[0034] In this embodiment, to facilitate installation, the rotating seat can be quickly fixed under the L-shaped support block. The upper surface of the fixing block has a mounting groove B9 in the middle that mates with the horizontal part of the L-shaped support block. The horizontal part of the L-shaped support block is screwed into the mounting groove. The quick engagement between the mounting groove and the horizontal part of the L-shaped support block achieves rapid fixing.

[0035] In this embodiment, for rational design, the sorting track includes a guide plate B10 and a cover plate B11. A chip through slot B12 is formed along the length direction in the middle of one side of the guide plate. The two ends of the chip through slot penetrate the guide plate. The cover plate is installed on the side of the guide plate where the chip through slot is formed. The cover plate closes the slot opening of the chip through slot, forming a chip channel B13 for chip passage. A buffer port is formed in the middle of the side of the guide plate away from the cover plate. The vertical part of the L-shaped support block is fixed to the side of the guide plate away from the cover plate. The lower corner of the buffer block extends into the chip channel through the buffer port and abuts against the inner surface of the cover plate.

[0036] In this embodiment, in order to make the design reasonable and facilitate the testing of various data, the test module includes at least two chip delivery protection mechanisms. Two adjacent test modules are connected by a transition delivery track C3. A transition buffer port C4 is provided on the transition delivery track, and a buffer mechanism is provided on the transition buffer port, which is the same as the buffer mechanism described above.

[0037] In this embodiment, the sorting machine body is connected to a microscopic inspection track D1 at the output end of the testing module. Two existing microscopic inspection mechanisms D2 are installed on the inspection track to inspect the front and back of the chip respectively. Therefore, a chip flipping mechanism needs to be installed between the two inspection mechanisms. A chip flipping mechanism D3 is installed on the inspection track. A tilted output track D4 is installed at the output end of the inspection track. A track-changing mechanism D5 is installed between the input end of the tilted output track and the output end of the inspection track. The chip flipping mechanism includes a flipping track D6 driven by a motor. Vertical anti-detachment arc plates D7 are symmetrically arranged on the outer periphery of the flipping track. One end of the flipping track is closed, and the other end is gap-fitted with the ends of the two anti-detachment arc plates. In use, the chip flipping mechanism divides the inspection track into an upper and lower section. The upper section of the inspection track feeds the chip into the flipping track, and the flipping track flips to flip the chip back-side outwards. The chip is fed into the lower section of the microscopic examination track with its face facing upwards. Simultaneously, during the flipping process, the end of the flipping track moves along the inner surface of the anti-detachment arc plate and remains in contact with it, preventing the chip inside the flipping track from detaching under centrifugal force. The anti-detachment arc plate is securely fixed to the worktable. The track-changing mechanism includes a track-changing track D8 driven by a motor. A vertical arc-shaped limiting plate D9 is provided on the input end of the inclined output track corresponding to the lower rotation trajectory of the track-changing track. The lower middle part of the track-changing track slides onto the arc surface of the arc-shaped limiting plate. The lower end of the track-changing track is guided to the input end of the inclined output track via the arc-shaped limiting plate. In use, the upper input end of the track-changing track aligns with the microscopic examination track, and the arc-shaped limiting plate abuts against the lower end of the track-changing track. After the chip falls into the track-changing track, the motor drives the track-changing track to rotate, and the lower end of the track-changing track is guided to the input end of the inclined output track via the arc-shaped limiting plate, thus ejecting the chip.

[0038] A method for using a multi-station testing and sorting device for integrated circuit chip modules: Step 1) The chip falls from the input end of the sorting track, and after passing through at least one buffer mechanism to reduce its speed, it is output to the test module; Step 2) When the chip enters the first chip conveying and protection mechanism, the misalignment track is initially in its position. At this time, the output and input ends of the misalignment track are exactly aligned with the sorting track. When the operation starts, the blocking mechanism blocks the misalignment track. The chip falls from the conveying track into the misalignment track and is blocked by the blocking mechanism. Then, the pin protection mechanism holds the chip and simultaneously blocks the multiple rows of pins on the chip. Then, the entire misalignment track is misaligned with the sorting track under the action of the driving mechanism and moves to the middle of the originally misaligned test mechanism for testing. After the test is completed, the chip falls to the second chip conveying and protection mechanism via the transition conveying track with a buffer mechanism. Step 3) After the second chip delivery and protection mechanism repeats the action of step 2), the test chip falls onto the microscopic inspection track; Step 4) The test chip in the microscopic inspection track needs to be inspected twice. The two inspections are to inspect the front and back sides of the test chip. A chip flipping mechanism is set between the two inspections to flip the test chip. After inspection, the test chip is transported to the inclined output track by the track switching mechanism for sorting.

[0039] Unless otherwise stated, if any of the technical solutions disclosed in this invention specify a numerical range, then the disclosed numerical range is a preferred numerical range. Anyone skilled in the art should understand that the preferred numerical range is merely one among many feasible numerical values ​​that has a more obvious or representative technical effect. Because there are many numerical values, it is impossible to list them all. Therefore, this invention discloses only some numerical values ​​to illustrate the technical solutions of this invention. Furthermore, the numerical values ​​listed above should not constitute a limitation on the scope of protection of this invention.

[0040] If the terms "first" or "second" are used in this document to specify components, those skilled in the art should know that the use of "first" or "second" is merely for the purpose of distinguishing components in description, and unless otherwise stated, the above terms have no special meaning.

[0041] If this invention discloses or relates to mutually fixedly connected components or structural parts, then, unless otherwise stated, a fixed connection can be understood as: a detachable fixed connection (e.g., using bolts or screws), or a non-detachable fixed connection (e.g., riveting, welding). Of course, mutually fixed connections can also be replaced by an integral structure (e.g., manufactured in one piece using a casting process) (except where it is obviously impossible to use an integral molding process).

[0042] Furthermore, the orientations or positional relationships used in any of the technical solutions disclosed in this invention above to indicate positional relationships, such as "longitudinal," "lateral," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this patent. They are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this patent. In addition, unless otherwise stated, the terms used to indicate shape in any of the technical solutions disclosed in this invention above include shapes that are similar to, close to, or approximate with it.

[0043] Any component provided by this invention can be assembled from multiple individual components or can be a single component manufactured by a one-piece molding process.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of the present invention or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solutions of the present invention, and all such modifications and substitutions should be covered within the scope of the technical solutions claimed in the present invention.

Claims

1. A multi-station testing and sorting device for integrated circuit chip modules, characterized in that: The system includes a sorting machine body, on which a testing module is mounted. The testing module includes at least one chip conveying protection mechanism that is movably mounted along the chip conveying direction. A testing mechanism is provided on the side of the chip conveying protection mechanism, and the chip conveying protection mechanism and the testing mechanism are staggered. The chip conveying protection mechanism includes a vertically arranged misaligned track, with a pin protection mechanism movably connected to the middle of the misaligned track; the pin protection mechanism includes a pressure block; a driving mechanism for driving the misaligned track to slide back and forth is provided on the side of the misaligned track, and pin protection plates corresponding to the chip pins are respectively installed on the left and right sides of the pressure block; the driving mechanism is installed on the main body of the sorting machine, and the movable end of the driving mechanism is connected to the misaligned track. The pin protection mechanism further includes a pin protection slide rail; a first slider is slidably connected on the pin protection slide rail. A baffle mechanism is movably connected to the misaligned track below the pin protection mechanism. A first fixing block is installed on the outer wall of the upper part of the misaligned track. The baffle mechanism includes a second fixing block arranged parallel to the first fixing block. A baffle slide rail parallel to the pin protection slide rail is installed on the second fixing block. A baffle insert plate corresponding to the clearance opening is slidably connected on the baffle slide rail. The pressure block includes a connecting block. One end of the connecting block is provided with a pressure plate corresponding to the chip, and the other end is connected to the vertical part of the first slider. Pins are respectively provided at the upper and lower ends of the pressure plate corresponding to the end notches of the chip. A baffle groove is provided in the middle of the upper plate of the baffle plate corresponding to the lower end of the pressure plate. The pin protection plate is located on the left and right sides of the connecting block. The slotted ends of the pin protection plate are respectively located on the left and right sides of the pressure plate, and the non-slotted ends of the pin protection plate are respectively located on the left and right sides of the vertical part of the first slider. The non-slotted ends of the pin protection plate are fixed to the side of the vertical part of the first slider. The misalignment track includes a vertical guide rail plate. A chip guide groove is formed on the surface of the guide rail plate. Chip guide grooves are respectively formed on the guide rail plate. The input and output ends of the chip conveying slot are covered with track covers. The middle of the chip conveying slot is not closed, and a clearance opening is formed between the two track covers. A slot is provided on the middle of the chip conveying slot corresponding to the pin. The driving mechanism includes a sliding plate, which is vertically mounted on the main body of the sorting machine. The sliding plate is perpendicular to the guide rail plate. An extension plate is symmetrically arranged on one side of the guide rail plate. A main slider is mounted on the extension plate. A sliding guide rail is provided on the sliding plate corresponding to the main slider. A third cylinder is provided on the sliding plate for driving the guide rail plate to slide along the sliding guide rail. The testing mechanism includes test grippers symmetrically arranged on both sides of the chip conveying protection mechanism. A test cylinder is provided on the main body of the sorting machine for driving the test grippers.

2. The multi-station testing and sorting device according to claim 1, characterized in that: The middle part of the misaligned track is provided with a clearance opening for the pin protection mechanism and the baffle mechanism to extend into the misaligned track and fix the chip. The outer wall of the pin protection plate near the chip pin is provided with a slot corresponding to the chip pin. The slot of the pin protection plate is provided with several rows of pin abutment blocks from top to bottom.

3. The multi-station testing and sorting device according to claim 2, characterized in that: The pin protection slide rail is mounted on the outer wall of the upper part of the misalignment track, and is perpendicular to the misalignment track. The first slider is L-shaped, with its horizontal part on top and its vertical part on the bottom. The horizontal part of the first slider slides on the slide rail. The pressure block is mounted on the vertical part of the first slider. The pin protection slide rail is mounted under the first fixing block. A first pushing mechanism for driving the first slider to slide is mounted under the first fixing block. The first pushing mechanism includes a first cylinder. The first fixing block is located below the pin protection slide rail away from the misalignment track. A first limiting block is installed on the end, and a first cylinder is installed on the first limiting block. The movable end of the first cylinder faces the end of the first slider away from the misaligned track. A first buffer shaft is fixedly connected to the movable end of the first cylinder. A first push plate is slidably connected to the first buffer shaft. A first end block is fixedly connected to the end of the first buffer shaft. A first spring is installed on the shaft section of the first buffer shaft between the first end block and the first push plate. The first push plate is L-shaped. The vertical part of the first push plate is slidably connected to the first buffer shaft. The horizontal part of the first push plate is connected to the horizontal part of the first slider.

4. The multi-station testing and sorting device according to claim 3, characterized in that: The second fixing block is installed on the outer wall of the lower part of the misaligned track. A second pushing mechanism for driving the material stop plate to slide is installed on the second fixing block. The second pushing mechanism includes a second limiting block, which is fixed on the second fixing block and on the end of the material stop rail away from the misaligned track. A second cylinder is installed on the second limiting block. The movable end of the second cylinder faces the end of the material stop plate away from the misaligned track. A second buffer shaft is fixedly connected to the movable end of the second cylinder. A second push plate is slidably connected to the second buffer shaft. A second end block is fixedly connected to the end of the second buffer shaft. A second spring is installed on the shaft section of the second buffer shaft between the second end block and the second push plate. A second slider is slidably connected to the material stop rail. The second slider is L-shaped, with its vertical part on top and its horizontal part on the bottom. The vertical part of the second slider is fixedly connected to the material stop plate. The horizontal part of the second slider is slidably connected to the material stop rail. The second push plate is L-shaped. The vertical part of the second push plate is slidably connected to the second buffer shaft. The horizontal part of the second push plate is connected to the horizontal part of the second slider.

5. The multi-station testing and sorting device according to claim 4, characterized in that: The sorting machine body is equipped with a feeding structure on the input end of the test module. The feeding structure includes a vertically arranged sorting track. At least one buffer port is opened on the outer wall of the sorting track along the length of the sorting track. The buffer port is connected to the inside of the sorting track. A buffer mechanism is installed on the buffer port. The buffer mechanism includes a buffer block. The upper end of the buffer block is rotatably connected to the outer wall of the sorting track, and the lower end of the buffer block extends into the sorting track through the buffer port.

6. The multi-station testing and sorting device according to claim 5, characterized in that: The buffer block is a triangular plate with its surface perpendicular to the sorting track surface. The upper corner of the buffer block is rotatably connected to the outer wall of the sorting track, and one lower corner of the buffer block extends into the sorting track through a buffer opening. A counterweight is installed on the lower corner of the buffer block that does not extend into the sorting track. The buffer mechanism also includes a buffer block rotating seat, which includes an L-shaped support block with its vertical portion on top and its horizontal portion on the bottom. The vertical portion of the L-shaped support block is fixed to the outer wall of the sorting track and located above the corresponding buffer opening. A rotating seat is installed on the horizontal portion of the L-shaped support block, and the upper corner of the buffer block is rotatably connected to the rotating seat. The rotating seat includes a fixing block installed below the horizontal portion of the L-shaped support block. Connecting blocks are symmetrically arranged on the left and right sides of the lower portion of the fixing block, and the upper corner of the buffer block is rotatably connected between the two connecting blocks via a rotating shaft.

7. The multi-station testing and sorting device according to claim 6, characterized in that: The test module includes at least two chip delivery protection mechanisms. Two adjacent test modules are connected by a transition delivery track. The transition delivery track has a transition buffer port, and the transition buffer port is equipped with a buffer mechanism.

8. The multi-station testing and sorting device according to claim 7, characterized in that: The sorting machine body is connected to a microscopic inspection track at the output end of the testing module. A chip flipping mechanism is provided on the microscopic inspection track. An inclined output track is provided at the output end of the microscopic inspection track. A track-changing mechanism is provided between the input end of the inclined output track and the output end of the microscopic inspection track. The chip flipping mechanism includes a flipping track driven by a motor. Vertical anti-detachment arc plates are symmetrically arranged on the outer periphery of the flipping track. One end of the flipping track is closed, and the other end is gap-fitted with the ends of the two anti-detachment arc plates. The track-changing mechanism includes a track-changing track driven by a motor. A vertical arc-shaped limiting plate is provided at the input end of the inclined output track corresponding to the lower rotation trajectory of the track-changing track. The lower middle part of the track-changing track slides on the arc surface of the arc-shaped limiting plate. The lower end of the track-changing track is guided to the input end of the inclined output track through the arc-shaped limiting plate.

9. A method of using a multi-station testing and sorting device for integrated circuit chip modules, employing the multi-station testing and sorting device as described in claim 8, characterized in that: Step 1) The chip falls from the input end of the sorting track, and after passing through at least one buffer mechanism to reduce its speed, it is output to the test module; Step 2) When the chip enters the first chip conveying protection mechanism, the misalignment track is initially in its position. At this time, the output and input ends of the misalignment track are exactly aligned with the sorting track. When the operation starts, the blocking mechanism blocks the misalignment track. The chip falls from the sorting track into the misalignment track and is blocked by the blocking mechanism. Then, the pin protection mechanism holds the chip and simultaneously blocks the multiple rows of pins on the chip. Then, the entire misalignment track is misaligned with the sorting track under the action of the driving mechanism and moves to the middle of the originally misaligned test mechanism for testing. After the test is completed, the chip falls to the second chip conveying protection mechanism via the transition conveying track with a buffer mechanism. Step 3) After the second chip delivery and protection mechanism repeats the action of step 2), the test chip falls onto the microscopic inspection track; Step 4) The test chip in the microscopic inspection track needs to be inspected twice. The two inspections are to inspect the front and back sides of the test chip. A chip flipping mechanism is set between the two inspections to flip the test chip. After inspection, the test chip is transported to the inclined output track by the track switching mechanism for sorting.

Images