Substrate cleaning apparatus and substrate transfer method for substrate cleaning apparatus
By introducing a cross-station transfer device and a temporary cassette station into the substrate cleaning equipment, efficient transfer of cassettes between different cleaning stations is achieved, solving the problem of long transfer time, increasing production speed and reducing equipment downtime risk.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SCIENTECH CORPORATION
- Filing Date
- 2022-08-09
- Publication Date
- 2026-07-14
AI Technical Summary
Existing substrate cleaning equipment suffers from long transfer times and slow production speeds during the cartridge transfer process.
A substrate cleaning device is adopted, which includes a first cleaning station, a second cleaning station, a temporary cassette station and an inter-station transfer device. A third robot arm realizes the direct transfer of cassettes between different cleaning stations, and when one station malfunctions, the temporary cassette station is used to temporarily store and transfer the cassettes.
It reduces cartridge transfer time, increases production speed, and reduces the risk of equipment downtime when the cleaning station malfunctions, thus increasing equipment efficiency.
Smart Images
Figure CN117619792B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus comprising two cleaning stations and a substrate transfer method for the substrate cleaning apparatus. Background Technology
[0002] In semiconductor manufacturing, the wafers used as substrates need to undergo multiple cleaning processes to ensure that the substrates meet cleanliness standards without affecting the process yield.
[0003] Existing substrate cleaning equipment typically consists of a single workstation, used only for one cleaning process. For example, a pre-wash substrate cleaning unit is used only for pre-washing substrates, an intermediate cleaning unit is used only for cleaning substrates in the intermediate cleaning process, and a final cleaning unit is used only for cleaning substrates in the final cleaning process. When transferring cartridges between two substrate cleaning units, such as transferring a cartridge from the pre-wash substrate cleaning unit to the intermediate cleaning unit, the existing method involves two robotic arms transferring the cartridge outside the two substrate cleaning units. For instance, previously, a robotic arm would transfer the cartridge from the pre-wash substrate cleaning unit to a subsequent robotic arm, which would then transfer the cartridge to the intermediate cleaning unit.
[0004] However, there is still room for improvement in how to shorten the cartridge transfer time and increase production speed. Summary of the Invention
[0005] One objective of this invention is to provide a substrate cleaning device that can improve production speed.
[0006] In some embodiments, the substrate cleaning apparatus of the present invention includes a first cleaning station, a second cleaning station, a temporary cassette station, and an inter-station transfer device. The first cleaning station includes a first cleaning tank and a cassette transfer module. The cassette transfer module has a first robotic arm for transferring cassettes and a first drive mechanism for driving the first robotic arm. The second cleaning station includes a second cleaning tank and a wafer transfer module. The wafer transfer module has a second robotic arm for transferring wafers and a second drive mechanism for driving the second robotic arm. The temporary cassette station is connected between the first and second cleaning stations and includes a temporary storage slot for placing cassettes. The inter-station transfer device includes a third robotic arm for transferring cassettes and a third drive mechanism for driving the third robotic arm. The transfer path controlling the third robotic arm includes a first transfer path for transferring cassettes from the first cleaning tank to the second cleaning tank, a second transfer path for transferring cassettes from the first cleaning tank to the temporary storage slot, and a third transfer path for transferring cassettes from the temporary storage slot to the second cleaning tank.
[0007] In some embodiments, the first drive mechanism and the second drive mechanism are located on the same side of the substrate cleaning equipment, and the third drive mechanism is located on a different side of the substrate cleaning equipment from the first drive mechanism and the second drive mechanism.
[0008] In some embodiments, the third robotic arm can be controlled to move between the first cleaning tank and the second cleaning tank, between the first cleaning tank and the temporary storage tank, and between the temporary storage tank and the second cleaning tank.
[0009] Another object of the present invention is to provide a substrate transfer method for a substrate cleaning apparatus that can improve production speed.
[0010] In some embodiments, the substrate transfer method of the substrate cleaning apparatus of the present invention is applicable to execution in a substrate cleaning apparatus, which includes a first cleaning station, a second cleaning station, a temporary cassette station between the first cleaning station and the second cleaning station, and an inter-station transfer device. The inter-station transfer device is used to transfer cassettes between the first cleaning station, the second cleaning station, and the temporary cassette station. The steps include: when the first cleaning station and the second cleaning station are operating normally, inputting a wafer-loaded cassette from the first cleaning station, and then transferring the cassette from the first cleaning station to the second cleaning station by the inter-station transfer device; when the first cleaning station is operating abnormally, inputting a wafer-loaded cassette from the temporary cassette station, and then transferring the cassette from the temporary cassette station to the second cleaning station by the inter-station transfer device; and when the second cleaning station is operating abnormally, transferring the wafer-loaded cassette from the first cleaning station to the temporary cassette station by the inter-station transfer device to temporarily store the cassette at the temporary cassette station.
[0011] In some embodiments, the first cleaning station includes a first cleaning tank and a first robotic arm for transferring cassettes; the second cleaning station includes a second cleaning tank, a wafer holder disposed in the second cleaning tank for holding wafers, and a second robotic arm for transferring wafers; the inter-station transfer device includes a third robotic arm for transferring cassettes; the step of transferring cassettes in the first cleaning station includes: first, positioning the third robotic arm in the first cleaning tank; then, having the first robotic arm transfer the wafer-loaded cassette to the first cleaning tank and then withdrawing from the first cleaning tank; and finally, having the third robotic arm carry the cassette out of the first cleaning tank; the step of transferring cassettes and wafers in the second cleaning station includes: first, having the third robotic arm place the wafer-loaded cassette into the second cleaning tank and transfer the wafer to the wafer holder; then, having the second robotic arm remove the wafer from the second cleaning tank; and finally, having the third robotic arm carry the empty cassette out of the second cleaning tank.
[0012] The present invention has the following advantages: by directly transferring cartridges from the first cleaning station to the second cleaning station through the cross-station transfer device, the transfer time of cartridges can be reduced, thereby increasing production speed. Furthermore, the cross-station transfer device can also transfer cartridges between the first cleaning station, the temporary cartridge storage station, and the second cleaning station. This allows the other cleaning station to continue operating even if one of the first or second cleaning stations experiences an operational malfunction and shutdown, reducing the risk of simultaneous shutdown of both stations and increasing equipment efficiency. Attached Figure Description
[0013] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:
[0014] Figure 1 This is a top view schematic diagram of an embodiment of the substrate cleaning equipment of the present invention;
[0015] Figures 2 to 7 This describes the step flow of the substrate transfer method in this embodiment, which involves transferring the cartridge at the first cleaning station. Figure 2 , Figure 4 , Figure 6 This is a top-down view. Figure 3 , Figure 5 , Figure 7 They correspond to each other. Figure 2 , Figure 4 , Figure 6 Front view diagram; and
[0016] Figures 8 to 11 This describes the steps of the substrate transfer method in this embodiment, which involve transferring the cassette and wafer at the second cleaning station. Figure 8 , Figure 10 This is a top-down view. Figure 9 , Figure 11 They correspond to each other. Figure 8 , Figure 10 A front view diagram. Detailed Implementation
[0017] See Figures 1 to 3 An embodiment of the substrate cleaning equipment 100 of the present invention includes a first cleaning station 1, a second cleaning station 2, a temporary storage cassette station 3, and a cross-station conveying device 4.
[0018] The first cleaning station 1 includes a first cleaning tank 11 and a cartridge transfer module 12. The cartridge transfer module 12 has a first robotic arm 121 for transferring cartridges 5 and a first drive mechanism 122 for driving the first robotic arm 121.
[0019] The second cleaning station 2 includes a second cleaning tank 21, which is disposed in the second cleaning tank 21 to hold the wafer 6 (see...). Figure 9The wafer transfer module 23 includes a holder 22 and a wafer transfer module 23. The wafer transfer module 23 has a second robotic arm 231 for transferring the wafer 6 and a second drive mechanism 232 for driving the second robotic arm 231.
[0020] The temporary cartridge station 3 is connected between the first cleaning station 1 and the second cleaning station 2, and includes a temporary storage tank 31 for placing the cartridge 5. The temporary storage tank 31 contains liquid, which can prevent damage to the wafer 6 when the cartridge 5 loaded with the wafer 6 is placed in the temporary storage tank 31.
[0021] The inter-station transfer device 4 includes a third robotic arm 41 for transferring the cartridge 5 and a third drive mechanism 42 for driving the third robotic arm 41. The transfer paths controlling the third robotic arm 41 include a first transfer path R1 for transferring the cartridge 5 from the first cleaning tank 11 to the second cleaning tank 21, a second transfer path R2 for transferring the cartridge 5 from the first cleaning tank 11 to the temporary storage tank 31, and a third transfer path R3 for transferring the cartridge 5 from the temporary storage tank 31 to the second cleaning tank 21. In this embodiment, the third robotic arm 41 can be controlled to move between the first cleaning tank 11 and the second cleaning tank 21, between the first cleaning tank 11 and the temporary storage tank 31, and between the temporary storage tank 31 and the second cleaning tank 21.
[0022] The first transfer path R1 is used when the first cleaning station 1 and the second cleaning station 2 are operating normally. The second transfer path R2 is used when the second cleaning station 2 is operating abnormally, in which the third robotic arm 41 transfers the cassette 5 containing the wafer 6 from the first cleaning tank 11 to the temporary storage tank 31 for temporary storage to maintain the moisture state of the wafer 6. The cassette 5 temporarily stored in the temporary storage tank 31 can be manually removed and transferred to other machines for subsequent processing. If the second cleaning station 2 can be quickly repaired, the cassette 5 can be transferred from the temporary storage tank 31 to the second cleaning tank 21 via the third transfer path R3 after the second cleaning station 2 is repaired. The third transfer path R3 is mainly used when the first cleaning station 1 is operating abnormally. When the first cleaning station 1 malfunctions, the cassette 5 containing the wafers 6 can be manually placed into the temporary storage tank 31, and then the third robotic arm 41 can transfer the cassette 5 from the temporary storage tank 31 to the second cleaning tank 21 to continue the subsequent cleaning process. In this way, when one of the first cleaning station 1 and the second cleaning station 2 malfunctions, the other can still continue to operate, avoiding simultaneous shutdown of the first cleaning station 1 and the second cleaning station 2, and increasing the efficiency of the equipment.
[0023] The first drive mechanism 122 and the second drive mechanism 232 are located on the same side of the substrate cleaning equipment 100, and the third drive mechanism 42 is located on a different side of the substrate cleaning equipment 100 from the first drive mechanism 122 and the second drive mechanism 232. Therefore, the third robot 41 and the first robot 121 can enter the first cleaning tank 11 from opposite sides without interfering with each other. Similarly, the third robot 41 and the second robot 231 can enter the second cleaning tank 21 from opposite sides without interfering with each other.
[0024] The following describes the specific steps for transferring the cassette 5 containing the wafer 6 from the first cleaning station 1 to the second cleaning station 2 when the first cleaning station 1 and the second cleaning station 2 are operating normally.
[0025] Figures 2 to 7 This describes the process of transferring the cartridge 5 at the first cleaning station 1. For simplicity, the accompanying drawings are provided. Figure 2 and Figure 3 The cartridge transfer module 12 and the wafer transfer module 23 are not shown in the diagram. Figure 4 and Figure 5 The wafer transfer module 23 is not shown in the image. Figure 6 and Figure 7 The cartridge transfer module 12 and the wafer transfer module 23 are not shown in the diagram. Figure 2 and Figure 3 As shown, first position the third robotic arm 41 in the first cleaning tank 11; as Figure 4 and Figure 5 As shown, the first robotic arm 121 then transfers the cassette 5 containing the wafer 6 to the first cleaning tank 11. At this time, the first robotic arm 121 hands the cassette 5 containing the wafer 6 to the third robotic arm 41; as shown... Figure 6 and Figure 7 As shown, the first robotic arm 121 then exits the first cleaning tank 11, and only the third robotic arm 41 holds the cassette 5 containing the wafer 6.
[0026] Figures 8 to 11 This describes the process flow for transferring the cartridge 5 and the wafer 6 at the second cleaning station 2. To simplify the accompanying drawings, [the following is omitted]. Figure 8 and Figure 9 The cartridge transfer module 12 and the wafer transfer module 23 are not shown in the diagram. Figure 10 and Figure 11 The cartridge delivery module 12 is not shown in the diagram. Figure 8 and Figure 9 As shown, the third robotic arm 41 first places the cassette 5 containing the wafer 6 into the second cleaning tank 21 and then transfers the wafer 6 to the holding base 22; as Figure 10 and Figure 11As shown, the second robotic arm 231 then removes the wafer 6 from the second cleaning tank 21. In this embodiment, the second robotic arm 231 can remove all the wafers 6 from the holder 22 in batches. At this time, the third robotic arm 41 is still holding the cassette 5 in the second cleaning tank 21. Then, the third robotic arm 41 takes the empty cassette 5 out of the second cleaning tank 21 and returns it to the first cleaning tank 11 (not shown).
[0027] When the first cleaning station 1 and the second cleaning station 2 are operating normally, the third robot arm 41 only moves between the first cleaning tank 11 and the second cleaning tank 21. The third robot arm 41 of the cross-station transfer device 4 directly transfers the cartridge 5 from the first cleaning tank 11 of the first cleaning station 1 to the second cleaning tank 21 of the second cleaning station 2, which can reduce the time for transferring the cartridge 5 and improve the production speed.
[0028] When the first cleaning station 1 malfunctions, the temporary cassette station 3 receives the cassette 5 loaded with wafers 6, and then the third robot arm 41 of the inter-station transfer device 4 transfers the cassette 5 from the temporary storage slot 31 of the temporary cassette station 3 to the second cleaning station 2. The procedure for transferring the cassette 5 and wafers 6 at the second cleaning station 2 is described above and will not be repeated. Similarly, the third robot arm 41 returns the empty cassette 5 from the second cleaning tank 21 to the temporary storage slot 31. The action of the third robot arm 41 removing the cassette 5 from the temporary storage slot 31 is self-explanatory and will not be illustrated. In this state, the third robot arm 41 moves between the temporary storage slot 31 and the second cleaning tank 21.
[0029] When the second cleaning station 2 malfunctions, the third robotic arm 41 of the inter-station transfer device 4 transfers the cassette 5 containing the wafer 6 from the first cleaning station 1 to the temporary cassette station 3, so as to temporarily store the cassette 5 in the temporary cassette station 3. This step can be referred to... Figure 6 and Figure 7 As shown, the third robotic arm 41 removes the cassette 5 containing the wafer 6 from the first cleaning tank 11 and then transfers it to the temporary storage tank 31. In this state, the third robotic arm 41 moves between the first cleaning tank 11 and the temporary storage tank 31.
[0030] In summary, by directly transferring the cartridge 5 from the first cleaning station 1 to the second cleaning station 2 using the inter-station transfer device 4, the transfer time of the cartridge 5 can be reduced, thereby increasing production speed. Furthermore, the inter-station transfer device 4 can also transfer the cartridge 5 between the first cleaning station 1, the temporary cartridge storage station 3, and the second cleaning station 2. This allows the other station to continue operating even if one of the first cleaning station 1 or the second cleaning station 2 experiences a malfunction and stops, reducing the risk of simultaneous shutdown of both stations and increasing equipment efficiency.
[0031] The above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the present invention shall still fall within the scope of the present invention.
Claims
1. A substrate cleaning device, characterized in that: Include: The first cleaning station includes a first cleaning tank and a cartridge conveying module. The cartridge conveying module has a first robotic arm for conveying cartridges and a first drive mechanism for driving the first robotic arm. The second cleaning station includes a second cleaning tank and a wafer transfer module. The wafer transfer module has a second robotic arm for transferring wafers and a second drive mechanism for driving the second robotic arm. A temporary card storage station is connected between the first cleaning station and the second cleaning station, and includes a temporary storage slot for placing card cartridges. and The cross-station transfer device includes a third robotic arm for transferring cartridges and a third drive mechanism for driving the third robotic arm. The transfer path controlling the third robotic arm includes a first transfer path for transferring cartridges from the first cleaning tank to the second cleaning tank, a second transfer path for transferring cartridges from the first cleaning tank to the temporary storage tank, and a third transfer path for transferring cartridges from the temporary storage tank to the second cleaning tank. The first transfer path is used when the first cleaning station and the second cleaning station are operating normally, the second transfer path is used when the second cleaning station is operating abnormally, and the third transfer path is used when the first cleaning station is operating abnormally.
2. The substrate cleaning equipment according to claim 1, characterized in that: The first drive mechanism and the second drive mechanism are located on the same side of the substrate cleaning equipment, and the third drive mechanism is located on a different side of the substrate cleaning equipment from the first drive mechanism and the second drive mechanism.
3. The substrate cleaning equipment according to claim 1, characterized in that: The third robotic arm can be controlled to move between the first cleaning tank and the second cleaning tank, between the first cleaning tank and the temporary storage tank, and between the temporary storage tank and the second cleaning tank.
4. A substrate conveying method for a substrate cleaning apparatus, characterized in that: This method is suitable for use in a substrate cleaning equipment, which includes a first cleaning station, a second cleaning station, a temporary cassette station between the first and second cleaning stations, and a cross-station transfer device. The cross-station transfer device is used to transfer cassettes between the first cleaning station, the second cleaning station, and the temporary cassette station. The steps include: When the first cleaning station and the second cleaning station are operating normally, the wafer-loaded cassette is input from the first cleaning station, and then the cross-station transfer device transfers the cassette from the first cleaning station to the second cleaning station. When the first cleaning station is malfunctioning, the temporary storage cassette station is used to input cassettes for loading wafers, and then the cross-station transfer device transfers the cassette from the temporary storage cassette station to the second cleaning station. and When the second cleaning station malfunctions, the cross-station transfer device will transfer the wafer-loaded cartridge from the first cleaning station to the temporary cartridge station to temporarily store the cartridge.
5. The substrate transfer method of the substrate cleaning equipment according to claim 4, characterized in that: The first cleaning station includes a first cleaning tank and a first robotic arm for transferring cassettes; the second cleaning station includes a second cleaning tank, a holding base disposed in the second cleaning tank for holding wafers, and a second robotic arm for transferring wafers; the cross-station transfer device includes a third robotic arm for transferring cassettes. The steps of transferring the cartridge at the first cleaning station include: first positioning the third robotic arm in the first cleaning tank, then having the first robotic arm transfer the cartridge loaded with wafers to the first cleaning tank and then exit the first cleaning tank, and finally having the third robotic arm take the cartridge out of the first cleaning tank. The steps for transferring the cartridge and wafer at the second cleaning station include: first, having the third robotic arm place the cartridge containing the wafer into the second cleaning tank and transfer the wafer to the holding seat; then, having the second robotic arm remove the wafer from the second cleaning tank; and finally, having the third robotic arm take the empty cartridge out of the second cleaning tank.