Cutting positioning method and device, electronic equipment and storage medium

Abstract

The application provides a cutting positioning method and device, electronic equipment and a storage medium. The method comprises the following steps: obtaining a positioning parameter of a cutting device, and controlling the cutting device to cut a test sample based on the positioning parameter to obtain measurement data of multiple groups of samples after cutting; when any one of the multiple groups of measurement data does not meet a preset standard, calculating a compensation amount of the positioning parameter based on the multiple groups of measurement data; determining a new positioning parameter based on the compensation amount of the positioning parameter and the positioning parameter, determining the new positioning parameter as the positioning parameter of the cutting device, and jumping to the step of controlling the cutting device to cut the test sample based on the positioning parameter for continuous execution until the multiple groups of measurement data all meet the preset standard, so as to obtain a final positioning parameter, so that the cutting device cuts a glass wafer to be cut based on the final positioning parameter. The application can improve the positioning and cutting efficiency of the glass wafer.

Description

Technical Field

[0001] This invention relates to the field of automation control technology, and in particular to a cutting and positioning method, device, electronic device, and storage medium. Background Technology

[0002] The glass wafer consists of three layers of glass. Markings are printed on the top and bottom surfaces of the middle glass layer, serving as cutting markers. During cutting, the glass wafer is placed on the upper surface of a worktable, with industrial cameras positioned on both sides to determine the positional relationship between the cutting line and the markings on the glass wafer. Cutting is performed when the positional relationship between the markings and the cutting line meets a preset standard.

[0003] Because the marking points on the glass wafer are located in the middle glass layer, the industrial camera's positioning of these points is inevitably affected by glass refraction, reducing positioning accuracy and making it impossible to accurately determine the positional relationship between the marking points and the cutting line, thus leading to reduced cutting precision. In existing technologies, when cutting glass wafers, operators typically rely on experience to repeatedly experiment and fine-tune positioning parameters before cutting to ensure accuracy. However, this method of relying on manual experience for repeated experimentation and fine-tuning of positioning parameters suffers from low adjustment efficiency. Summary of the Invention

[0004] This invention provides a cutting and positioning method, apparatus, electronic device, and storage medium to solve the problem of low efficiency in the prior art when positioning and cutting glass wafers.

[0005] In a first aspect, embodiments of the present invention provide a cutting and positioning method, comprising:

[0006] The positioning parameters of the cutting device are obtained, and the cutting device is controlled to cut the test sample based on the positioning parameters to obtain measurement data of multiple sets of cut samples;

[0007] When any one of the multiple sets of measurement data does not meet the preset standard, the compensation amount of the positioning parameters is calculated based on the multiple sets of measurement data.

[0008] Based on the compensation amount of the positioning parameters and the positioning parameters, new positioning parameters are determined and set as the positioning parameters of the cutting device. The process then jumps to the step of controlling the cutting device to cut the test sample based on the positioning parameters and continues until multiple sets of measurement data meet the preset standard, thus obtaining the final positioning parameters. The cutting device then cuts the glass wafer to be cut based on the final positioning parameters.

[0009] In one possible implementation, the compensation amount of the positioning parameters includes: compensation angle and compensation displacement;

[0010] The calculation of the compensation amount for the positioning parameters based on multiple sets of measurement data includes:

[0011] Calculate the average value of the multiple sets of measurement data, and determine the average value as the average measurement data;

[0012] The compensation angle is calculated based on the average measurement data.

[0013] The compensation displacement is calculated based on the compensation angle.

[0014] In one possible implementation, the average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the second marker point and the first cutting line in each sample;

[0015] The calculation of the compensation angle based on the average measurement data includes:

[0016] according to Calculate the compensation angle;

[0017] Where β represents the compensation angle. This represents the average distance between the first marker point and the first cutting line in each sample. This represents the average distance between the second marker point and the first cutting line in each sample, and D represents the center distance between the first marker point and the second marker point.

[0018] In one possible implementation, calculating the compensation displacement based on the compensation angle includes:

[0019] Based on the compensation angle, calculate the displacement corresponding to the compensation angle;

[0020] The compensation displacement is calculated based on the displacement corresponding to the compensation angle and the average measurement data.

[0021] In one possible implementation, calculating the displacement corresponding to the compensation angle based on the compensation angle includes:

[0022] The displacement corresponding to the compensation angle is calculated based on s = (D / 2) * sinβ.

[0023] Where s represents the displacement corresponding to the compensation angle, D represents the center distance between the first and second marker points, and β represents the compensation angle.

[0024] In one possible implementation, the average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the first marker point and the second cutting line in each sample;

[0025] The calculation of the compensation displacement based on the displacement corresponding to the compensation angle and the average measurement data includes:

[0026] according to Calculate the compensation displacement;

[0027] Where x represents the compensation displacement. This represents the average distance between the first marker point and the first cutting line in each sample. The value represents the average distance between the first marker point and the second cutting line in each sample, and s represents the displacement corresponding to the compensation angle.

[0028] In one possible implementation, the positioning parameters include: angle parameters and displacement parameters;

[0029] The step of determining new positioning parameters based on the compensation amount of the positioning parameters and the positioning parameters includes:

[0030] When the compensation angle is greater than 0, the absolute value of the compensation angle is superimposed in a clockwise direction on the angle parameters of the cutting device to obtain new angle parameters.

[0031] When the compensation angle is less than or equal to 0, the absolute value of the compensation angle is superimposed in a counterclockwise direction on the angle parameters of the cutting device to obtain new angle parameters.

[0032] When the compensation displacement is greater than 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the first direction to obtain new displacement parameters; the first direction is the clockwise upward direction.

[0033] When the compensation displacement is less than or equal to 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the second direction to obtain new displacement parameters; the second direction is the clockwise downward direction.

[0034] Secondly, embodiments of the present invention provide a cutting and positioning device, comprising:

[0035] The measurement module is used to acquire the positioning parameters of the cutting device and control the cutting device to cut the test sample based on the positioning parameters, thereby obtaining measurement data of multiple sets of cut samples.

[0036] The calculation module is used to calculate the compensation amount of the positioning parameters based on multiple sets of measurement data when any one set of measurement data does not meet the preset standard.

[0037] The positioning module is used to determine new positioning parameters based on the compensation amount of the positioning parameters and the positioning parameters, and to set the new positioning parameters as the positioning parameters of the cutting device. Then, it jumps to the step of controlling the cutting device to cut the test sample based on the positioning parameters and continues to execute until multiple sets of measurement data meet the preset standard, so as to obtain the final positioning parameters, so that the cutting device can cut the glass wafer to be cut based on the final positioning parameters.

[0038] Thirdly, embodiments of the present invention provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method as described in the first aspect or any possible implementation of the first aspect.

[0039] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the method as described in the first aspect or any possible implementation thereof.

[0040] This invention provides a cutting and positioning method, apparatus, electronic device, and storage medium. By cutting a test sample, if any set of measurement data fails to meet a preset standard, a compensation amount for the positioning parameters is calculated based on the measurement data of multiple sets of cut samples. Then, new positioning parameters are determined based on the compensation amount, and the cutting verification is repeated based on the new positioning parameters until the measurement data of all cut samples meet the preset standard, thus obtaining the final positioning parameters. Finally, the glass wafer to be cut is then cut based on the final positioning parameters. In this invention, the compensation amount for the positioning parameters is calculated based on the measurement data of the test sample, thereby adjusting the positioning parameters and effectively improving the adjustment efficiency of the positioning parameters, thus enhancing the positioning and cutting efficiency. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a flowchart illustrating the implementation of a cutting and positioning method according to an embodiment of the present invention;

[0043] Figure 2 This is a schematic diagram illustrating the positional relationship between the marked points and the cutting line on the test sample before cutting, provided in an embodiment of the present invention.

[0044] Figure 3 This is a schematic diagram showing the positional relationship between the marked points and the cutting line on a cut sample according to an embodiment of the present invention;

[0045] Figure 4(a) is a schematic diagram of the first and second marking points on the cut sample provided in an embodiment of the present invention;

[0046] Figure 4(b) is a schematic diagram of the first and second marking points on the cut sample provided in another embodiment of the present invention;

[0047] Figure 5 This is a schematic diagram illustrating the calculation of the compensation angle according to an embodiment of the present invention;

[0048] Figure 6 This is a schematic diagram illustrating the calculation of displacement corresponding to the compensation angle according to an embodiment of the present invention;

[0049] Figure 7 This is a schematic diagram of the calculation of the compensation displacement provided in an embodiment of the present invention;

[0050] Figure 8 This is a schematic diagram of the cutting and positioning device provided in an embodiment of the present invention;

[0051] Figure 9 This is a schematic diagram of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0052] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0053] To make the objectives, technical solutions, and advantages of the present invention clearer, specific embodiments will be described below in conjunction with the accompanying drawings.

[0054] When cutting glass wafers using a cutting device, the glass wafer is first bonded to the center of the material plate. Then, the material plate is clamped at the center of the cutting device's worktable. The height of the worktable is adjusted until the upper surface of the glass wafer contacts the cutting line on the cutting device. Industrial cameras on both sides of the cutting device detect the positional relationship between the markers on the glass wafer and the cutting line. By adjusting the positioning parameters of the cutting device, the position of the worktable can be adjusted, thereby adjusting the positional relationship between the markers on the glass wafer and the cutting line. Once the positional relationship meets a preset standard, the glass wafer is cut based on the pre-set cutting parameters.

[0055] However, glass wafers consist of three layers of glass, with markers located on the upper and lower surfaces of the middle glass layer. This inevitably leads to the influence of glass refraction when using an industrial camera to position the markers, resulting in reduced positioning accuracy and making it impossible to accurately determine the positional relationship between the markers and the cutting line. In related technologies, when cutting glass wafers, manual adjustments and verifications are usually performed repeatedly based on experience until the positioning parameters that make the positional relationship between the markers and the cutting line conform to preset standards are determined. However, the method of determining positioning parameters by repeatedly adjusting and verifying based on experience is inefficient.

[0056] Based on this, embodiments of the present invention provide a cutting and positioning method, which calculates the compensation amount of positioning parameters based on the measurement data of the test sample, and adjusts the positioning parameters accordingly, thereby effectively improving the adjustment efficiency of positioning parameters and solving the problem of low positioning and cutting efficiency of glass wafers. Figure 1 The implementation flowchart of the cutting and positioning method provided in the embodiments of the present invention is described in detail below:

[0057] Step 101: Obtain the positioning parameters of the cutting device, and control the cutting device to cut the test sample based on the positioning parameters to obtain measurement data of multiple sets of cut samples.

[0058] The test sample can be a glass wafer from the same batch as the glass wafer to be cut. This embodiment uses the test sample for cutting tests to adjust the positioning parameters. Finally, the adjusted positioning parameters are used to cut the glass wafer to be cut.

[0059] Here, the positioning parameters of the cutting device include: angle parameters and displacement parameters. The angle parameters are used to adjust the rotation angle of the test sample. The displacement parameters are used to adjust the horizontal displacement of the test sample. Based on the angle and displacement parameters, this embodiment can adjust the position of the test sample, thereby adjusting the positional relationship between the marker points on the test sample and the cutting line. The positional relationship between the marker points on the test sample and the cutting line is as follows: Figure 2As shown, the test sample is cut by multiple sets of cutting lines, resulting in multiple sets of cut samples. The cutting lines are typically diamond wires.

[0060] In this embodiment, the positional relationship between the marker points and the cutting line on the test sample is adjusted based on positioning parameters before the test sample is cut. This yields multiple cut samples, and the measurement data for each sample is determined accordingly. See also... Figure 3 For each cut sample, the measurement data refers to the distance between the marked point on the sample and the cutting line. This includes: the distance L between the first marked point and the first cutting line. a The distance L between the first marker point and the second cutting line b The distance R between the second marker point and the first cutting line a And the distance R between the second marker point and the second cutting line b .

[0061] Step 102: When any one of the multiple sets of measurement data does not meet the preset standard, calculate the compensation amount of the positioning parameters based on the multiple sets of measurement data.

[0062] The preset standard is: half of the difference between the marker point and the cutting lines on both sides is less than a preset threshold, for example, 0.02. That is, |(L a -L b ) / 2|<0.02 and|(R a -R b ) / 2|<0.02.

[0063] If any set of measurement data from the multiple sets of cut samples fails to meet the preset standard, this embodiment can determine that the current positioning parameters have deviated and need to be adjusted. When adjusting the positioning parameters, this embodiment can calculate the compensation amount of the positioning parameters based on the measurement data from the multiple sets of cut samples, and then compensate and adjust the positioning parameters accordingly.

[0064] When the measurement data of the cut sample does not meet the preset standard, the positional relationship between the marked point on the sample and the cutting line is shown in Figure 4(a) or Figure 4(b). This embodiment of the invention uses Figure 4(a) as an example to specifically introduce the calculation method for the compensation amount of the positioning parameters. It should be noted that the calculation method for the compensation amount of the positioning parameters in this embodiment of the invention is also applicable to Figure 4(b).

[0065] In some embodiments, the compensation amount for the positioning parameters includes: compensation angle and compensation displacement.

[0066] Based on multiple sets of measurement data, the compensation amount for the positioning parameters is calculated, including:

[0067] Calculate the average value of multiple sets of measurement data, and determine the average value as the average measurement data.

[0068] The compensation angle is calculated based on the average measurement data.

[0069] The compensation displacement is calculated based on the compensation angle.

[0070] In this invention, considering that the compensation result for the angle parameter will affect the displacement parameter, the compensation method first calculates the compensation angle and then calculates the compensation displacement based on the compensation angle when calculating the compensation amount for the positioning parameter.

[0071] In this embodiment, the average measurement data can be obtained by calculating the average value of the measurement data corresponding to each sample after cutting. The average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the second marker point and the first cutting line in each sample.

[0072] In some embodiments, calculating the compensation angle based on average measurement data includes:

[0073] according to Calculate the compensation angle;

[0074] Where β represents the compensation angle. This represents the average distance between the first marker point and the first cutting line in each sample. This represents the average distance between the second marker point and the first cutting line in each sample, and D represents the center distance between the first marker point and the second marker point.

[0075] See Figure 5 By calculating the compensation angle, the marking line formed by the first and second marking points can be rotated to a horizontal position. Based on this, the horizontal displacement is further calculated, thereby translating the marking line to the center position between the first and second cutting lines, ensuring that the positional relationship between the marking points and the cutting lines meets a preset standard.

[0076] In some embodiments, calculating the compensation displacement based on the compensation angle includes:

[0077] Based on the compensation angle, calculate the displacement corresponding to the compensation angle.

[0078] The compensation displacement is calculated based on the displacement and average measurement data corresponding to the compensation angle.

[0079] See Figure 6 When a compensation angle is superimposed on the angle parameters, a displacement s will be generated accordingly. Based on the displacement s corresponding to the compensation angle, the compensation displacement is further calculated.

[0080] In some embodiments, the displacement corresponding to the compensation angle is calculated based on the compensation angle, including:

[0081] The displacement corresponding to the compensation angle is calculated based on s = (D / 2) * sinβ.

[0082] Where s represents the displacement corresponding to the compensation angle, D represents the center distance between the first and second marker points, and β represents the compensation angle.

[0083] When compensating for positioning parameters, this embodiment achieves optimal cutting results when the first and second marker points are adjusted to the center position between the first and second cutting lines. See details... Figure 7 Based on the displacement s corresponding to the compensation angle, the distance between the center positions of the marking line formed by the first and second marking points and the first and second cutting lines is further calculated, i.e., the compensation displacement x.

[0084] The average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the first marker point and the second cutting line in each sample.

[0085] In some embodiments, the compensation displacement is calculated based on the displacement corresponding to the compensation angle and the average measurement data, including:

[0086] according to Calculate the compensation displacement;

[0087] Where x represents the compensation displacement. This represents the average distance between the first marker point and the first cutting line in each sample. The distance between the first marker point and the second cutting line in each sample is represented by s, where s represents the displacement corresponding to the compensation angle.

[0088] Step 103: Based on the compensation amount and positioning parameters of the positioning parameters, determine new positioning parameters, set the new positioning parameters as the positioning parameters of the cutting device, and jump to the step of controlling the cutting device to cut the test sample based on the positioning parameters to continue execution until multiple sets of measurement data meet the preset standards, and obtain the final positioning parameters so that the cutting device can cut the glass wafer to be cut based on the final positioning parameters.

[0089] This embodiment obtains new angle parameters by superimposing a compensation angle on the angle parameters. Similarly, it obtains new displacement parameters by superimposing a compensation displacement on the displacement parameters. Based on these new angle and displacement parameters, the test sample is recut, and the measurement data of the recut sample is checked to see if it meets a preset standard. The compensation amount of the positioning parameters is calculated iteratively, and the positioning parameters are adjusted accordingly until the measurement data of the sample cut based on the current positioning parameters meets the preset standard, thus obtaining the final positioning parameters. The glass wafer to be cut is then cut based on these final positioning parameters.

[0090] In some embodiments, new positioning parameters are determined based on the compensation amount of the positioning parameters and the positioning parameters, including:

[0091] When the compensation angle is greater than 0, the absolute value of the compensation angle is superimposed in a clockwise direction on the basis of the angle parameters of the cutting device to obtain new angle parameters.

[0092] When the compensation angle is less than or equal to 0, the absolute value of the compensation angle is superimposed in a counterclockwise direction on the basis of the angle parameters of the cutting device to obtain a new angle parameter.

[0093] When the compensation displacement is greater than 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the first direction to obtain new displacement parameters; the first direction is the clockwise upward direction.

[0094] When the compensation displacement is less than or equal to 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the second direction to obtain new displacement parameters; the second direction is the clockwise downward direction.

[0095] When the compensation angle is greater than 0, the compensation angle is rotated clockwise based on the angle parameters of the cutting device to obtain new angle parameters. When the compensation angle is less than or equal to 0, the absolute value of the compensation angle is rotated counterclockwise based on the angle parameters of the cutting device to obtain new angle parameters.

[0096] See Figure 7 When the compensation displacement is greater than 0, this embodiment can translate the compensation displacement clockwise downwards based on the displacement parameters of the cutting device to obtain new displacement parameters. When the compensation displacement is less than or equal to 0, the absolute value of the compensation displacement is translated clockwise upwards based on the displacement parameters of the cutting device to obtain new displacement parameters.

[0097] By defining the rotation direction and translation direction, the above calculation method is applicable not only to Figure 4(a) but also to Figure 4(b).

[0098] Compared to existing technologies, this invention involves cutting the test sample, calculating the compensation amount of the positioning parameters based on the measurement data of multiple sets of cut samples, determining new positioning parameters based on the compensation amount, and then re-cutting and verifying based on the new positioning parameters until the measurement data of all cut samples meet the preset standards, thus obtaining the final positioning parameters. The glass wafer to be cut is then cut based on the final positioning parameters. The calculation of the compensation amount based on the measurement data of the test sample, and the subsequent adjustment of the positioning parameters, effectively improves the adjustment efficiency of the positioning parameters, thereby enhancing the positioning and cutting efficiency.

[0099] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0100] The following are device embodiments of the present invention. For details not described in detail, please refer to the corresponding method embodiments described above.

[0101] Figure 8 A schematic diagram of the cutting and positioning device provided in an embodiment of the present invention is shown. For ease of explanation, only the parts related to the embodiment of the present invention are shown, and are described in detail below:

[0102] like Figure 8 As shown, the cutting positioning device 8 includes: a measurement module 81, a calculation module 82, and a positioning module 83.

[0103] The measurement module 81 is used to acquire the positioning parameters of the cutting device and control the cutting device to cut the test sample based on the positioning parameters, so as to obtain the measurement data of multiple sets of samples after cutting.

[0104] The calculation module 82 is used to calculate the compensation amount of the positioning parameters based on the multiple sets of measurement data when any one set of measurement data in the multiple sets of measurement data does not meet the preset standard.

[0105] The positioning module 83 is used to determine new positioning parameters based on the compensation amount and positioning parameters of the positioning parameters, and to set the new positioning parameters as the positioning parameters of the cutting device. Then, it jumps to the step of controlling the cutting device to cut the test sample based on the positioning parameters and continues to execute until multiple sets of measurement data meet the preset standards, so as to obtain the final positioning parameters, so that the cutting device can cut the glass wafer to be cut based on the final positioning parameters.

[0106] In one possible implementation, the compensation amounts for the positioning parameters include: compensation angle and compensation displacement;

[0107] Calculation module 82 is specifically used for:

[0108] Calculate the average value of multiple sets of measurement data, and determine the average value as the average measurement data;

[0109] Calculate the compensation angle based on average measurement data;

[0110] The compensation displacement is calculated based on the compensation angle.

[0111] In one possible implementation, the average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the second marker point and the first cutting line in each sample;

[0112] Calculation module 82, used for calculating based on Calculate the compensation angle;

[0113] Where β represents the compensation angle. This represents the average distance between the first marker point and the first cutting line in each sample. This represents the average distance between the second marker point and the first cutting line in each sample, and D represents the center distance between the first marker point and the second marker point.

[0114] In one possible implementation, the computation module 82 is specifically used for:

[0115] Calculate the displacement corresponding to the compensation angle based on the compensation angle.

[0116] The compensation displacement is calculated based on the displacement and average measurement data corresponding to the compensation angle.

[0117] In one possible implementation, the calculation module 82 is used to calculate the displacement corresponding to the compensation angle according to s = (D / 2)*sinβ;

[0118] Where s represents the displacement corresponding to the compensation angle, D represents the center distance between the first and second marker points, and β represents the compensation angle.

[0119] In one possible implementation, the average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the first marker point and the second cutting line in each sample;

[0120] Calculation module 82, used for calculating based on Calculate the compensation displacement;

[0121] Where x represents the compensation displacement. This represents the average distance between the first marker point and the first cutting line in each sample. The value represents the average distance between the first marker point and the second cutting line in each sample, and s represents the displacement corresponding to the compensation angle.

[0122] In one possible implementation, the positioning parameters include: angle parameters and displacement parameters;

[0123] Positioning module 83 is specifically used for:

[0124] When the compensation angle is greater than 0, the absolute value of the compensation angle is superimposed in a clockwise direction on the basis of the angle parameters of the cutting device to obtain new angle parameters.

[0125] When the compensation angle is less than or equal to 0, the absolute value of the compensation angle is superimposed in the counterclockwise direction on the basis of the angle parameters of the cutting device to obtain a new angle parameter.

[0126] When the compensation displacement is greater than 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the first direction to obtain new displacement parameters; the first direction is the clockwise upward direction.

[0127] When the compensation displacement is less than or equal to 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the second direction to obtain new displacement parameters; the second direction is the clockwise downward direction.

[0128] In this embodiment of the invention, the measurement module 81 cuts the test sample, the calculation module 82 calculates the compensation amount of the positioning parameters based on the measurement data of multiple sets of cut samples, and the positioning module 83 determines the new positioning parameters based on the compensation amount of the positioning parameters. The cutting is then repeated based on the new positioning parameters until the measurement data of the cut samples all meet the preset standards, thus obtaining the final positioning parameters. The glass wafer to be cut is then cut based on the final positioning parameters. The calculation module 82 calculates the compensation amount of the positioning parameters based on the measurement data of the test sample, thereby adjusting the positioning parameters and effectively improving the adjustment efficiency of the positioning parameters, thus enhancing the positioning and cutting efficiency.

[0129] Figure 9 This is a schematic diagram of an electronic device provided in an embodiment of the present invention. Figure 9 As shown, the electronic device 9 of this embodiment includes: a processor 90, a memory 91, and a computer program 92 stored in the memory 91 and executable on the processor 90. When the processor 90 executes the computer program 92, it implements the steps in the various cutting and positioning method embodiments described above, for example... Figure 1 Steps 101 to 103 are shown. Alternatively, when the processor 90 executes the computer program 92, it implements the functions of each module / unit in the above-described device embodiments, for example... Figure 8 The functions of modules 81 to 83 are shown.

[0130] For example, the computer program 92 can be divided into one or more modules / units, which are stored in the memory 91 and executed by the processor 90 to complete the present invention. The one or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program 92 in the electronic device 9. For example, the computer program 92 can be divided into... Figure 8 Modules 81 to 83 are shown.

[0131] The electronic device 9 can be a desktop computer, laptop, handheld computer, or cloud server, etc. The electronic device 9 may include, but is not limited to, a processor 90 and a memory 91. Those skilled in the art will understand that... Figure 9 This is merely an example of electronic device 9 and does not constitute a limitation on electronic device 9. It may include more or fewer components than shown, or combine certain components, or different components. For example, the electronic device may also include input / output devices, network access devices, buses, etc.

[0132] The processor 90 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0133] The memory 91 can be an internal storage unit of the electronic device 9, such as a hard disk or memory. The memory 91 can also be an external storage device of the electronic device 9, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, the memory 91 can include both internal and external storage units of the electronic device 9. The memory 91 is used to store the computer program and other programs and data required by the electronic device. The memory 91 can also be used to temporarily store data that has been output or will be output.

[0134] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0135] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0136] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0137] In the embodiments provided by this invention, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0138] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0139] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0140] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the above embodiments of the present invention can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various cutting and positioning method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, etc. The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A cutting and positioning method, characterized in that, include: The positioning parameters of the cutting device are obtained, and the cutting device is controlled to cut the test sample based on the positioning parameters to obtain measurement data of multiple sets of cut samples; When any one of the multiple sets of measurement data does not meet the preset standard, the compensation amount of the positioning parameters is calculated based on the multiple sets of measurement data. Based on the compensation amount of the positioning parameters and the positioning parameters, new positioning parameters are determined and set as the positioning parameters of the cutting device. The process then jumps to the step of controlling the cutting device to cut the test sample based on the positioning parameters and continues until multiple sets of measurement data meet the preset standard, thus obtaining the final positioning parameters. The cutting device then cuts the glass wafer to be cut based on the final positioning parameters. The compensation amounts for the positioning parameters include: compensation angle and compensation displacement; The calculation of the compensation amount for the positioning parameters based on multiple sets of measurement data includes: Calculate the average value of the multiple sets of measurement data, and determine the average value as the average measurement data; The compensation angle is calculated based on the average measurement data. Calculate the compensation displacement based on the compensation angle; The average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the second marker point and the first cutting line in each sample; The calculation of the compensation angle based on the average measurement data includes: according to Calculate the compensation angle; in, Indicates the angle of compensation. This represents the average distance between the first marker point and the first cutting line in each sample. This represents the average distance between the second marker point and the first cutting line in each sample. This represents the center distance between the first and second marker points.

2. The cutting and positioning method according to claim 1, characterized in that, The calculation of the compensation displacement based on the compensation angle includes: Based on the compensation angle, calculate the displacement corresponding to the compensation angle; The compensation displacement is calculated based on the displacement corresponding to the compensation angle and the average measurement data.

3. The cutting and positioning method according to claim 2, characterized in that, The step of calculating the displacement corresponding to the compensation angle based on the compensation angle includes: according to Calculate the displacement corresponding to the compensation angle; in, This represents the displacement corresponding to the compensation angle. This represents the center distance between the first and second marker points. This indicates the compensation angle.

4. The cutting and positioning method according to claim 2, characterized in that, The average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the first marker point and the second cutting line in each sample; The calculation of the compensation displacement based on the displacement corresponding to the compensation angle and the average measurement data includes: according to Calculate the compensation displacement; in, This indicates the compensation displacement. This represents the average distance between the first marker point and the first cutting line in each sample. This represents the average distance between the first marker point and the second cutting line in each sample. This indicates the displacement corresponding to the compensation angle.

5. The cutting and positioning method according to any one of claims 1-4, characterized in that, The positioning parameters include: angle parameters and displacement parameters; The step of determining new positioning parameters based on the compensation amount of the positioning parameters and the positioning parameters includes: When the compensation angle is greater than 0, the absolute value of the compensation angle is superimposed in a clockwise direction on the angle parameters of the cutting device to obtain new angle parameters. When the compensation angle is less than or equal to 0, the absolute value of the compensation angle is superimposed in a counterclockwise direction on the angle parameters of the cutting device to obtain new angle parameters. When the compensation displacement is greater than 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the first direction to obtain new displacement parameters; the first direction is the clockwise upward direction. When the compensation displacement is less than or equal to 0, based on the displacement parameters of the cutting device, the absolute value of the compensation displacement is moved in the second direction to obtain new displacement parameters; the second direction is the clockwise downward direction.

6. A cutting and positioning device, characterized in that, include: The measurement module is used to acquire the positioning parameters of the cutting device and control the cutting device to cut the test sample based on the positioning parameters, thereby obtaining measurement data of multiple sets of cut samples. The calculation module is used to calculate the compensation amount of the positioning parameters based on multiple sets of measurement data when any one set of measurement data does not meet the preset standard. The positioning module is used to determine new positioning parameters based on the compensation amount of the positioning parameters and the positioning parameters, and to determine the new positioning parameters as the positioning parameters of the cutting device. Then, it jumps to the step of controlling the cutting device to cut the test sample based on the positioning parameters and continues to execute until multiple sets of measurement data meet the preset standard, and obtains the final positioning parameters so that the cutting device can cut the glass wafer to be cut based on the final positioning parameters. The compensation amounts for the positioning parameters include: compensation angle and compensation displacement; The calculation of the compensation amount for the positioning parameters based on multiple sets of measurement data includes: Calculate the average value of the multiple sets of measurement data, and determine the average value as the average measurement data; The compensation angle is calculated based on the average measurement data. Calculate the compensation displacement based on the compensation angle; The average measurement data includes: the average distance between the first marker point and the first cutting line in each sample, and the average distance between the second marker point and the first cutting line in each sample; The calculation of the compensation angle based on the average measurement data includes: according to Calculate the compensation angle; in, Indicates the angle of compensation. This represents the average distance between the first marker point and the first cutting line in each sample. This represents the average distance between the second marker point and the first cutting line in each sample. This represents the center distance between the first and second marker points.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the cutting and positioning method as described in any one of claims 1 to 5.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the cutting and positioning method as described in any one of claims 1 to 5.

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