Measurement tool, method and lifetime prediction method for electrostatic chuck protective glue layer

Abstract

The application discloses a kind of electrostatic chuck protective adhesive layer measuring tool, method and life prediction method. Among them, the measuring tool includes: depth gauge, placed in the reaction cavity when measuring, including depth gauge main body, and the telescopic probe of the measuring end surface of depth gauge main body;Limiting device is connected with the depth gauge main body, for limiting the depth gauge makes the probe vertical and contacts annular outer wall to carry out zero setting operation, or make the probe vertical and contact protective adhesive layer outer wall to carry out measurement operation.The application solves the technical problem that the prior art can only measure the thickness of the protective adhesive layer by removing the electrostatic chuck or visually observing and judging by experience, can accurately measure the thickness of the protective adhesive layer, and predict the life of the protective adhesive layer, has good convenience, practicality and economy.

Description

Technical Field

[0001] This invention relates to the fields of plasma processing and measuring instrument technology, specifically to a measuring tool, method, and life prediction method for an electrostatic chuck protective adhesive layer. Background Technology

[0002] Electrostatic chucks (ESCs) are widely used in integrated circuit (IC) manufacturing processes, particularly in plasma etching. Their function is to support the substrate within the reaction chamber, provide DC bias, and control the substrate surface temperature. In some processes, where higher substrate surface temperatures are required, heaters are typically installed inside the ESC. The upper and lower surfaces of the heater are covered with thermally conductive adhesive for bonding and heat conduction. The heater and thermally conductive adhesive are collectively referred to as the internal components of the ESC. Since these internal components cannot be exposed to the reaction environment, a protective adhesive layer is applied to the outer wall of the internal components to isolate them from the reaction environment.

[0003] However, the protective adhesive layer will be gradually consumed by plasma attack during the process. When its thickness is too thin to provide adequate protection for internal components such as thermal conductive adhesive and heaters, it will lead to uneven surface temperature of the electrostatic chuck, affecting the substrate etching rate and yield. In severe cases, it may even cause abnormal discharge and damage to the electrostatic chuck and other related parts, resulting in downtime. Therefore, it is necessary to measure the thickness of the protective adhesive layer regularly to quantify the degree of attack on the protective adhesive layer and replace the electrostatic chuck before it causes negative effects.

[0004] Because current technology makes it impossible to measure the thickness of the protective adhesive layer without removing the electrostatic chuck, and removing the electrostatic chuck is cumbersome and time-consuming, technicians usually make a visual inspection without removing the electrostatic chuck and judge whether the electrostatic chuck needs to be replaced based on experience. However, this is difficult to judge accurately and can easily lead to process risks or equipment waste. Summary of the Invention

[0005] The purpose of this invention is to provide a measuring tool, method, and life prediction method for the protective adhesive layer of an electrostatic chuck, which solves the technical problem that existing technologies can only measure the thickness of the protective adhesive layer after removing the electrostatic chuck or judge it by visual observation and experience. This invention can accurately measure the thickness of the protective adhesive layer and predict its life, and has better convenience, practicality, and economy.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0007] A measuring tool for an electrostatic chuck protective adhesive layer, the electrostatic chuck being located within the reaction chamber of a plasma processing device, comprising an internal cylindrical component, the protective adhesive layer being sleeved on the outside of the internal component; the reaction chamber further includes a first component disposed above or below the internal component, the first component comprising an annular outer wall, both the annular outer wall and the internal component being about a first axis, and a known first design distance between the outer wall of the internal component and the annular outer wall, including:

[0008] A depth gauge, which is placed inside the reaction chamber during measurement, includes a depth gauge body and a retractable probe disposed on one side of the measuring end face of the depth gauge body.

[0009] A limiting device, connected to the main body of the depth gauge, is used to limit the depth gauge so that the probe is perpendicular to the annular outer wall for zeroing operation, or so that the probe is perpendicular to the outer wall of the protective adhesive layer for measurement operation.

[0010] Preferably, the junction of the measuring end face of the depth gauge body and the probe is the depth gauge base point. During the zeroing operation, the limiting device limits the depth gauge base point to the zeroing operation position, and during the measurement operation, the limiting device limits the depth gauge base point to the measurement operation position.

[0011] There is an unobstructed vertical path between the zeroing operation position and the annular outer wall, and between the measurement operation position and the outer wall of the protective adhesive layer. The zeroing operation position and the measurement operation position share a cylindrical surface on the first cylindrical surface, with the first cylindrical surface having the first axis as its axis.

[0012] Preferably, the limiting device includes:

[0013] A limiting plate is placed between the depth gauge body and the annular outer wall, and between the depth gauge body and the outer wall of the protective adhesive layer, during measurement, and abuts against or is fixed to the annular outer wall;

[0014] The limiting plate includes a limiting unit disposed thereon, which limits the depth gauge body to the side of the limiting plate away from the annular outer wall and the outer wall of the protective adhesive layer, so that the probe can penetrate the limiting plate and the depth gauge base point is located in the zeroing operation position or the measurement operation position.

[0015] Preferably, the limiting plate includes a first region whose horizontal projection is located within the height range of the annular outer wall, and a second region whose horizontal projection is located within the height range of the outer wall of the protective adhesive layer;

[0016] The limiting unit includes a first through hole vertically disposed in the first region. The diameter of the first through hole is larger than the outer diameter of the probe and smaller than the outer diameter of the measuring end face. The probe can be inserted into the first through hole and the base point of the limiting depth gauge is located at the opening of the first through hole.

[0017] The limiting unit includes a second through hole vertically disposed in the second region. The diameter of the second through hole is larger than the outer diameter of the probe and smaller than the outer diameter of the measuring end face. The probe can be inserted into the second through hole and the base point of the limiting depth gauge is located at the opening of the second through hole.

[0018] Preferably, the inner diameters of the first and second through holes are matched with the outer diameter of the probe, so that the probe is precisely positioned within the first and second through holes, and the probe can remain perpendicular to the annular outer wall or the outer wall of the protective adhesive layer during zeroing or measurement operations.

[0019] Preferably, a connecting groove is provided between the first through hole and the second through hole to accommodate the probe. The probe can be moved between the first and second through holes through the connecting groove, and the depth gauge base point can be moved between the zeroing operation position and the measurement operation position through the connecting groove.

[0020] Preferably, the measuring tool further includes an electric displacement device connected to the depth gauge, used to electrically drive the depth gauge to move, thereby causing the probe to automatically transfer between the first and second through holes through the connecting groove.

[0021] Preferably, the limiting unit includes a third through hole vertically disposed on the limiting plate. The diameter of the third through hole is larger than the outer diameter of the probe and smaller than the outer diameter of the measuring end face. The probe can be inserted into the third through hole and the base point of the limiting depth gauge is at the opening of the third through hole.

[0022] The limiting device also includes a lifting unit for raising or lowering the limiting plate to a raised or lowered state. In the raised or lowered state, the limiting plate remains in contact with the annular outer wall, and the horizontal projection of the third through hole falls within the height range of either the annular outer wall or the outer wall of the protective adhesive layer, so that the probe inserted into the third through hole can contact the annular outer wall or the outer wall of the protective adhesive layer.

[0023] Preferably, the lifting unit is a shim block, which is raised by placing the shim block below the limiting plate and lowered by removing the shim block.

[0024] Preferably, the inner diameter of the third through hole is adapted to the outer diameter of the probe, so that the probe is precisely positioned within the third through hole, and the probe remains perpendicular to the annular outer wall or the outer wall of the protective adhesive layer.

[0025] Preferably, the limiting plate is a flat plate that abuts against the annular outer wall, and the two abut against the first tangential segment;

[0026] The perpendicular path from the zeroing operation position to the annular outer wall and the perpendicular path from the measurement operation position to the outer wall of the protective adhesive layer are both perpendicular to the limiting plate and intersect with the first tangent segment or its extension.

[0027] Preferably, the limiting plate is an arc-shaped plate with the same curvature as the annular outer wall, and the inner arc surface of the limiting plate abuts against the annular outer wall at multiple points or completely.

[0028] Preferably, there are multiple second or third through holes, which are evenly distributed along the circumference of the limiting plate for performing multi-point measurement operations.

[0029] Preferably, the limiting plate is a ring body sleeved on the outer periphery of the annular outer wall;

[0030] There are multiple second or third through holes, which are evenly distributed along the circumference of the limiting plate, so that all circumferential measurement operations of the protective adhesive layer can be completed without moving the limiting plate.

[0031] Preferably, the limiting unit further includes a depth gauge fixing mechanism that is disposed on the limiting plate and the depth gauge body and cooperates with each other, for fixing the depth gauge and the limiting device.

[0032] Preferably, the limiting device further includes a limiting plate fixing mechanism disposed on the limiting plate for fixing the limiting plate to the reaction chamber.

[0033] Preferably, the first component is a base disposed below the internal component or an electrostatic chuck ceramic layer disposed above the internal component.

[0034] Preferably, the protective adhesive layer is further fitted with a protective ring made of elastic material, and the probe abuts against the outer wall of the protective ring vertically when performing measurement operations.

[0035] Preferably, the reaction chamber further includes a second component;

[0036] The limiting plate abuts against or is fixed to the second component.

[0037] A method for measuring the protective adhesive layer of an electrostatic chuck, based on the aforementioned measuring tool for the protective adhesive layer of an electrostatic chuck, includes the following steps:

[0038] S1. Arrange and fix the limiting device according to the position where the zeroing operation is performed;

[0039] S2. Arrange and fix the depth gauge according to the position where the zeroing operation will be performed;

[0040] S3. The depth gauge performs a zeroing operation and records the zeroing point;

[0041] S4. Arrange and fix the limiting device according to the position where the measurement operation is performed;

[0042] S5. Arrange and fix the depth gauge according to the position where the measurement operation will be performed;

[0043] S6. The depth gauge performs a measurement operation and reads the measurement reading to obtain the first distance between the outer wall of the protective adhesive layer and the zero point.

[0044] S7. Calculate the difference between the first design distance and the first spacing to obtain the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring.

[0045] S8. Repeat steps S5 to S7 to measure other circumferential measurement points on the outer wall of the protective adhesive layer until all measurements are completed.

[0046] A method for predicting the lifespan of the protective adhesive layer of an electrostatic chuck, based on the above-mentioned measurement method for the electrostatic chuck protective adhesive, includes the following steps:

[0047] L1. After the first installation, measure the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring.

[0048] L2. Measure the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring by using the cleaning time or selecting a suitable opening time, and record the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring, as well as the RF time.

[0049] L3. Based on the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring, and the RF hour record, find the relationship between the two and predict the lifespan of the protective adhesive layer.

[0050] Compared with the prior art, the present invention has the following advantages:

[0051] 1. The measuring tool of the present invention can directly measure the thickness of the protective adhesive layer without removing the electrostatic chuck, and the measurement accuracy is high and the operation is convenient;

[0052] 2. With the arc-shaped or annular limiting plate and multiple limiting holes provided in the circumferential direction of the present invention, the limiting plate can be kept stable and the measurement is more convenient.

[0053] 3. The method for predicting the lifespan of the protective adhesive layer of an electrostatic chuck according to the present invention can improve the accuracy of prediction, thereby reducing process risks or equipment waste. Attached Figure Description

[0054] To more clearly illustrate the technical solutions of the embodiments of this invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1This is a structural diagram of a prior art plasma processing device;

[0056] Figure 2 for Figure 1 A magnified view of a portion of region X;

[0057] Figure 3a This is a front view of one embodiment of the limiting device of the present invention;

[0058] Figure 3b This is a front view of one embodiment of the limiting device of the present invention;

[0059] Figure 3c A side view of a measurement tool according to one embodiment of the present invention, showing a zeroing operation.

[0060] Figure 3d A side view of a measurement operation performed according to one embodiment of the measuring tool of the present invention;

[0061] Figure 3e A top view of one embodiment of the measuring tool of the present invention, showing a measurement operation.

[0062] Figure 3f A top view of one embodiment of the measuring tool of the present invention, showing a measurement operation.

[0063] Figure 4a This is a partial front view of one embodiment of the limiting device of the present invention;

[0064] Figure 4b A side view of a measurement tool according to one embodiment of the present invention, showing a zeroing operation.

[0065] Figure 4c A side view of a measurement operation performed according to one embodiment of the measuring tool of the present invention;

[0066] Figure 5 This is a top view of one embodiment of the measuring tool of the present invention, showing a measurement operation. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on the invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0068] In the following description, references to "some embodiments" or "one or more embodiments" describe a subset of all possible embodiments. However, it is understood that "some embodiments" or "one or more embodiments" may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0069] In the following description, the terms "first, second, third" are used only to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of the invention described herein can be implemented in an order other than that shown in the illustrations or description.

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to limit the invention.

[0071] Figure 1 A capacitively coupled plasma (CCP) processing device is shown, comprising a vacuum-ejectable reaction chamber enclosed by a reaction chamber wall 01. A spray head 02 for introducing reactive gas into the reaction chamber is located at the top inside the reaction chamber. Below the spray head 02 are a base 03 (typically made of aluminum) and an electrostatic chuck 04 for fixing a substrate, wherein the electrostatic chuck 04 is located on top of the base 03. The area between the spray head 02 and the base 03 is the processing area, typically with the spray head 02 serving as the upper electrode and the base 03 as the lower electrode. At least one radio frequency power supply is applied to either the upper or lower electrode through a matching network, generating a radio frequency electric field between the upper and lower electrodes. This field dissociates the reactive gas in the processing area into plasma. The plasma reaching the upper surface of the substrate can perform etching and other processes on the substrate. The bottom of the reaction chamber is an exhaust area connected to an external exhaust pump to extract the process waste gas generated after the etching reaction during the processing.

[0072] further, Figure 2 It shows Figure 1 A magnified view of region X, showing the structure of the electrostatic chuck 04 and its positional relationship with the base 03. The electrostatic chuck 04 includes a ceramic layer 041 disposed on top and an internal component 042 located between the ceramic layer 041 and the base 03. Figure 3c , 3d4b, 4c), and a protective adhesive layer 043 fitted onto the outer wall of the internal component 042. The ceramic layer 041 is a ceramic disc structure, with its upper surface used to support the substrate; the internal component 042 is a cylindrical structure, including a heater 042a located in the middle, and thermally conductive adhesive 042b covering the upper and lower surfaces of the heater 042a; since the internal component 042 cannot be exposed to the reaction environment, it needs to be covered with a ring-shaped protective adhesive layer 043 on its outer wall to isolate it from the reaction environment. The protective adhesive layer 043 is typically made of epoxy resin and is generally about 0.4 mm thick.

[0073] Referring to Figures 3-5, this embodiment provides a tool for measuring the thickness of the protective adhesive layer 043, including:

[0074] A depth gauge, placed inside the reaction chamber during measurement, has a measurement accuracy of no less than 0.1 mm. It includes a depth gauge body 1 and a probe 11. The depth gauge body 1 includes a measuring end face M. One end of the probe 11 is fixed inside the depth gauge body 1, while the other end extends from the measuring end face M and can freely extend and retract within a certain range. The probe head of the probe 11 can be round or flat. The depth gauge needs to have zeroing and measurement functions. Zeroing means that the depth gauge can be zeroed when the probe 11 is in any extended or retracted state. During measurement, the depth gauge can display the positive / negative depth (length) of the probe 11 relative to its zeroing position. The depth gauge can be an existing depth measuring instrument, such as a digital dial indicator. To facilitate the accurate description of the depth gauge body 1's position, a specific point needs to be defined on the depth gauge body 1. In this embodiment, the intersection of the measuring end face M of the depth gauge body 1 and the probe 11 is defined as the depth gauge base point.

[0075] The limiting device 2 is also placed in the reaction chamber during measurement and is connected to the depth gauge body 1. It is usually also set on one side of the measuring end face M to limit the depth gauge to measure the thickness of the protective adhesive layer 043.

[0076] The working principle of the measuring tool provided in this embodiment for measuring the thickness of the protective adhesive layer 043 is as follows: First, a first component is selected in the reaction chamber, above or below the internal component 042. This first component has an annular outer wall. The annular outer wall and the internal component 042 are both coaxial with the first axis D. Furthermore, there is a known first design distance d between the outer wall of the internal component 042 (which is in contact with the inner wall of the protective adhesive layer 043, equivalent to the inner wall of the protective adhesive layer 043) and the annular outer wall. Figure 3d , 4c Then, the perpendicular distance from the outer wall of the protective adhesive layer 043 to the annular outer wall is measured using the limiting device 2 in conjunction with a depth gauge – the first gap c. Figure 3d , 4cThen, calculate the difference between d and c to obtain the thickness of the protective adhesive layer 043. Further, to measure c, a zeroing and measurement operation is required: ① Zeroing is performed using the annular outer wall as a reference. This involves using the limiting device 2 to limit the depth gauge body 1 so that the depth gauge base point is at the zeroing operation position Z, and ensuring the probe 11 is perpendicularly against the annular outer wall. Then, press the zeroing button on the depth gauge to perform zeroing. ② The outer wall of the protective adhesive layer 043 is measured. This involves using the limiting device 2 to limit the depth gauge body 1 so that the depth gauge base point is at the measurement operation position L, and ensuring the probe 11 is perpendicularly against the outer wall of the protective adhesive layer 043. Then, read the depth gauge reading. The first spacing c can then be obtained. The zeroing operation position Z and the measurement operation position L need to meet certain conditions: there must be an unobstructed vertical path between the zeroing operation position Z and the annular outer wall, and between the measurement operation position L and the outer wall of the protective adhesive layer 043. Furthermore, the zeroing operation position Z and the measurement operation position L are coplanar on the first cylindrical surface Y with the first axis D as the axis. That is, the vertical segment from the zeroing operation position Z to the first axis D is equidistant from the vertical segment from the measurement operation position L to the first axis D, or in other words, the vertical segment from the zeroing operation position Z to the annular outer wall is equidistant from the vertical segment from the measurement operation position L to the annular outer wall. In some embodiments, the outer wall of the protective adhesive layer 043 is also fitted with a protective ring (not shown) made of elastic material. The protective ring can be removed for measurement, or the vertical distance c' (not shown) from the outer wall of the protective ring to the annular outer wall can be directly measured without removing the protective ring, and the difference between d and c' is calculated to obtain the overall thickness of the protective adhesive layer 043 and the protective ring.

[0077] In some embodiments, the first component may be a base 03; in other embodiments, the first component may also be a ceramic layer 041, or other components in the reaction chamber that meet the above conditions, such as a focusing ring, an isolation ring, etc.

[0078] Furthermore, in some embodiments, the limiting device 2 includes: a limiting plate 21, which is placed between the depth gauge body 1 and the annular outer wall, and between the depth gauge body 1 and the outer wall of the protective adhesive layer 043, and abuts against or is fixed to the annular outer wall; the limiting plate 21 includes a limiting unit disposed thereon, the limiting unit limiting the depth gauge body 1 on the side of the limiting plate 21 away from the annular outer wall and the outer wall of the protective adhesive layer 043, so that the probe 11 can penetrate the limiting plate 21, and the depth gauge base point is located at the zeroing operation position Z or the measurement operation position L.

[0079] In some embodiments, the limiting unit further includes a depth gauge fixing mechanism (not shown) disposed on the limiting plate 21 and the depth gauge body 1, which cooperates with each other for fixing the depth gauge and the limiting device 2, such as a locking bolt or a buckle.

[0080] In some embodiments, the limiting device 2 further includes a limiting plate fixing mechanism (not shown) disposed on the limiting plate 21 for fixing the limiting plate 21 to the reaction chamber, such as fixing bolts.

[0081] In some embodiments, the limiting plate 21 not only abuts against the first component, but also includes a second component (not shown) in the reaction chamber. The limiting plate 21 can be placed on the upper surface of the second component, or abut against or be fixed thereto. The second component can be a focusing ring, an isolation ring, etc.

[0082] Furthermore, the aforementioned limiting device 2 includes at least two different structural implementations, wherein, as shown in the attached... Figures 3a-3f As shown, Embodiment 1 is a structure of a fixed limiting plate:

[0083] The limiting plate 21 does not need to move vertically during zeroing and measurement operations. In other words, the height of the limiting plate 21 is sufficient to meet the requirement of not moving vertically during zeroing and measurement operations. Specifically, the positioned limiting plate 21 includes a first region A with its horizontal projection within the height range of the annular outer wall, and a second region B with its horizontal projection within the height range of the outer wall of the protective adhesive layer 043. Furthermore, the limiting unit includes a first through hole 23 vertically disposed in the first region A. The diameter of the first through hole 23 is larger than the outer diameter of the probe 11 and smaller than the outer diameter of the measuring end face M. The probe 11 can be inserted into the first through hole 23 and the depth gauge base point is limited to the opening of the first through hole 23. When a zeroing operation is performed, the depth gauge base point is limited to the opening of the first through hole 23 facing the depth gauge body 1. The limiting unit also includes a second through hole 24 vertically disposed in the second region. The diameter of the second through hole 24 is larger than the outer diameter of the probe 11 and smaller than the outer diameter of the measuring end face M. The probe 11 can be inserted into the second through hole 24 and the depth gauge base point is limited to the opening of the second through hole 24. When a measurement operation is performed, the depth gauge base point is limited to the opening of the second through hole 24 facing the depth gauge body 1.

[0084] In some embodiments, the inner diameters of the first and second through holes (23, 24) are adapted to the outer diameter of the probe 11, so that the probe 11 is precisely confined within the first and second through holes (23, 24), and the probe 11 can remain perpendicular to the annular outer wall or the outer wall of the protective adhesive layer 043 during zeroing or measurement operations.

[0085] In some embodiments, a connecting groove 25 is provided between the first through hole 23 and the second through hole 24 to accommodate the probe 11. The probe 11 can be moved between the first and second through holes (23, 24) through the connecting groove 25, and the depth gauge base point can be moved between the zeroing operation position Z and the measurement operation position L through the connecting groove 25. Furthermore, in the above embodiments, an electric displacement device (not shown) connected to the depth gauge can be further provided to electrically drive the depth gauge to move, thereby causing the probe 11 to automatically move between the first and second through holes (23, 24) through the connecting groove 25.

[0086] Further details are attached. Figure 3e As shown, in some embodiments, the limiting plate 21 is a flat plate that abuts against the annular outer wall, with both abutting at the first tangent segment T. Furthermore, the perpendicular paths from the zeroing operation position Z to the annular outer wall and from the measurement operation position L to the outer wall of the protective adhesive layer 043 are both perpendicular to the limiting plate 21 and intersect with the first tangent segment T or its extension. That is, the first and second through holes (23, 24) can only be opened at the position of the first tangent segment T. For this embodiment, in order to ensure accurate measurement, the aforementioned limiting plate fixing mechanism (not shown) is also required for fixing the limiting plate 21 to the reaction chamber.

[0087] Preferably, as shown in the appendix Figure 3f As shown, in some embodiments, the limiting plate 21 is an arc-shaped plate with the same curvature as the annular outer wall. The inner arc surface of the limiting plate 21 abuts against the annular outer wall at multiple points or completely. This arc-shaped structure can maintain a stable connection between the limiting plate 21 and the annular outer wall, and the horizontal opening position of the first and second through holes (23, 24) is not restricted. Furthermore, there are multiple second through holes 24 (multiple first through holes 23 are not required because zeroing operations in the same area are generally only performed once), which are evenly distributed along the circumference of the limiting plate 21 for performing multi-point measurement operations, making the measurement more convenient.

[0088] The most preferred option is as shown in the appendix. Figure 5 As shown, the limiting plate 21 is a ring body sleeved on the outer periphery of the annular outer wall; and there are multiple second through holes 24, which are evenly distributed along the circumference of the limiting plate 21, so that all circumferential measurement operations of the protective adhesive layer 043 can be completed without moving the limiting plate 21. The first through hole 23 can be set to one or multiple.

[0089] Additionally, as attached Figures 4a-4c As shown in 3e and 3f, Embodiment 2 is a structure of a movable limiting plate:

[0090] The limiting plate 21 of this structure needs to move vertically during zeroing and measurement operations. Its limiting unit includes a third through hole 26 vertically disposed on the limiting plate 21. The diameter of the third through hole 26 is larger than the outer diameter of the probe 11 and smaller than the outer diameter of the measuring end face M. The probe 11 can be inserted into the third through hole 26, but the depth gauge body 1 cannot be inserted. In addition, the limiting device 2 also includes a lifting unit for lifting the limiting plate 21 to the raised or lowered state. In the raised or lowered state, the limiting plate 21 remains against the annular outer wall, and the horizontal projection of the third through hole 26 falls within the height range of either the annular outer wall or the outer wall of the protective adhesive layer 043, so that the probe 11 inserted into the third through hole 26 can abut against the annular outer wall or the outer wall of the protective adhesive layer 043. When performing zeroing or measurement operations, the depth gauge base point is limited to the opening of the third through hole 26 facing the depth gauge body 1.

[0091] In some embodiments, the lifting unit is a shim block 22, which is raised by placing the shim block 22 below the limiting plate 21, and lowered by removing the shim block 22.

[0092] In some embodiments, the inner diameter of the third through hole 26 is adapted to the outer diameter of the probe 11, so that the third through hole 26 can precisely limit the probe 11 inside it, and keep the probe 11 perpendicular to the annular outer wall or the outer wall of the protective adhesive layer 043.

[0093] Further details are attached. Figure 3e As shown, in some embodiments, the limiting plate 21 is a flat plate that abuts against the annular outer wall, with both abutting at the first tangent segment T. The perpendicular path from the zeroing operation position Z to the annular outer wall and the perpendicular path from the measurement operation position L to the outer wall of the protective adhesive layer 043 are both perpendicular to the limiting plate 21 and intersect the first tangent segment T or its extension. That is, the third through hole 26 can only be opened at the position of the first tangent segment T. For this embodiment, in order to ensure accurate measurement, the aforementioned limiting plate fixing mechanism (not shown) is also required for fixing the limiting plate 21 to the reaction chamber.

[0094] Preferably, as shown in the appendix Figure 3f As shown, in some embodiments, the limiting plate 21 is an arc-shaped plate with the same curvature as the annular outer wall, and the inner arc surface of the limiting plate 21 abuts against the annular outer wall at multiple points or completely. This arc-shaped structure allows the limiting plate 21 to maintain a stable connection with the annular outer wall, and the horizontal opening position of the third through hole 26 is not restricted. Furthermore, there are multiple third through holes 26, evenly distributed along the circumference of the limiting plate 21, for performing multi-point measurement operations, which makes measurement more convenient.

[0095] The most preferred option is as shown in the appendix. Figure 5As shown, the limiting plate 21 is a ring fitted around the outer periphery of the annular outer wall; and there are multiple third through holes 26, evenly distributed along the circumference of the limiting plate 21, allowing for the completion of all circumferential measurement operations of the protective adhesive layer 043 without moving the limiting plate 21. In some embodiments where a shim block 22 is provided, to prevent the limiting plate 21 from tilting and to maintain stability, multiple shims 22 can be evenly arranged circumferentially, or the shim block 22 can also be a ring.

[0096] Meanwhile, this embodiment also provides a method for measuring the protective adhesive layer of an electrostatic chuck, which is based on the above-mentioned measuring tool and includes the following steps:

[0097] S1. Arrange and fix the limit device 2 according to the position for performing the zeroing operation;

[0098] S2. Arrange and fix the depth gauge according to the position where the zeroing operation will be performed;

[0099] S3. The depth gauge performs a zeroing operation and records the zeroing point;

[0100] S4. Arrange and fix the limiting device 2 according to the position where the measurement operation is performed;

[0101] S5. Arrange and fix the depth gauge according to the position where the measurement operation will be performed;

[0102] S6. The depth gauge performs the measurement operation and reads the measurement reading to obtain the first distance c between the outer wall of the protective adhesive layer 043 and the zero point.

[0103] S7. Calculate the difference between the first design distance d and the first spacing c to obtain the thickness of the protective adhesive layer 043 or the overall thickness of the protective adhesive layer 043 and the protective ring.

[0104] S8. Repeat steps S5 to S7 to measure other measurement points on the circumference of the outer wall of the protective adhesive layer 043 until all measurements are completed.

[0105] In addition, this embodiment also provides a method for predicting the lifespan of the protective adhesive layer of an electrostatic chuck, which is based on the above-described measurement method and includes the following steps:

[0106] L1. After the first installation, measure the thickness of the protective adhesive layer 043 or the overall thickness of the protective adhesive layer 043 and the protective ring.

[0107] L2. Measure the thickness of the protective adhesive layer 043 or the overall thickness of the protective adhesive layer 043 and the protective ring by using the cleaning time or selecting a suitable opening time. Record the thickness of the protective adhesive layer 043 or the overall thickness of the protective adhesive layer 043 and the protective ring, as well as the RF (Radio Frequency) count.

[0108] L3. Based on the thickness of the protective adhesive layer 043 or the overall thickness of the protective adhesive layer 043 and the protective ring, and the RF time record, find the relationship between the two and predict the lifespan of the protective adhesive layer 043.

[0109] This invention applies not only to capacitively coupled plasma processing apparatuses (CCP) but also to inductively coupled plasma processing apparatuses (ICP) and other devices having such electrostatic chucks.

[0110] The above description is merely an embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of the present invention are included within the scope of protection of the present invention.

Claims

1. A measuring tool for a protective adhesive layer of an electrostatic chuck, the electrostatic chuck being located within a reaction chamber of a plasma processing apparatus, comprising an internal cylindrical component, the protective adhesive layer being sleeved on the outside of the internal component; the reaction chamber further comprising a first component disposed above or below the internal component, the first component comprising an annular outer wall, both the annular outer wall and the internal component being about a first axis, and a known first design distance between the outer wall of the internal component and the annular outer wall, characterized in that, include: A depth gauge, which is placed inside the reaction chamber during measurement, includes a depth gauge body and a retractable probe disposed on one side of the measuring end face of the depth gauge body. A limiting device, connected to the main body of the depth gauge, is used to limit the depth gauge so that the probe is perpendicular to the annular outer wall for zeroing operation, or so that the probe is perpendicular to the outer wall of the protective adhesive layer for measurement operation.

2. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 1, characterized in that, The junction of the measuring end face of the depth gauge body and the probe is the depth gauge base point. During the zeroing operation, the limiting device limits the depth gauge base point to the zeroing operation position. During the measurement operation, the limiting device limits the depth gauge base point to the measurement operation position. There is an unobstructed vertical path between the zeroing operation position and the annular outer wall, and between the measurement operation position and the outer wall of the protective adhesive layer. The zeroing operation position and the measurement operation position share a cylindrical surface on the first cylindrical surface, with the first cylindrical surface having the first axis as its axis.

3. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 2, characterized in that, The limiting device includes: A limiting plate is placed between the depth gauge body and the annular outer wall, and between the depth gauge body and the outer wall of the protective adhesive layer, during measurement, and abuts against or is fixed to the annular outer wall; The limiting plate includes a limiting unit disposed thereon, which limits the depth gauge body to the side of the limiting plate away from the annular outer wall and the outer wall of the protective adhesive layer, so that the probe can penetrate the limiting plate and the depth gauge base point is located in the zeroing operation position or the measurement operation position.

4. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 3, characterized in that, The limiting plate includes a first region whose horizontal projection is located within the height range of the annular outer wall, and a second region whose horizontal projection is located within the height range of the outer wall of the protective adhesive layer. The limiting unit includes a first through hole vertically disposed in the first region. The diameter of the first through hole is larger than the outer diameter of the probe and smaller than the outer diameter of the measuring end face. The probe can be inserted into the first through hole and the base point of the limiting depth gauge is located at the opening of the first through hole. The limiting unit includes a second through hole vertically disposed in the second region. The diameter of the second through hole is larger than the outer diameter of the probe and smaller than the outer diameter of the measuring end face. The probe can be inserted into the second through hole and the base point of the limiting depth gauge is located at the opening of the second through hole.

5. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 4, characterized in that, The inner diameters of the first and second through holes are adapted to the outer diameter of the probe, so that the probe can be precisely positioned within the first and second through holes, and the probe can remain perpendicular to the outer wall of the annular shape or the outer wall of the protective adhesive layer during zeroing or measurement operations.

6. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 5, characterized in that, A connecting groove is provided between the first through hole and the second through hole to accommodate the probe. The probe can be moved between the first and second through holes through the connecting groove, and the depth gauge base point can be moved between the zeroing operation position and the measurement operation position through the connecting groove.

7. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 6, characterized in that, The measuring tool also includes an electric displacement device connected to the depth gauge, which is used to electrically drive the depth gauge to move and drive the probe to automatically transfer between the first and second through holes through the connecting groove.

8. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 3, characterized in that, The limiting unit includes a third through hole vertically disposed on the limiting plate. The diameter of the third through hole is larger than the outer diameter of the probe and smaller than the outer diameter of the measuring end face. The probe can be inserted into the third through hole and the base point of the limiting depth gauge is at the opening of the third through hole. The limiting device also includes a lifting unit for raising or lowering the limiting plate to a raised or lowered state. In the raised or lowered state, the limiting plate remains in contact with the annular outer wall, and the horizontal projection of the third through hole falls within the height range of either the annular outer wall or the outer wall of the protective adhesive layer, so that the probe inserted into the third through hole can contact the annular outer wall or the outer wall of the protective adhesive layer.

9. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 8, characterized in that, The lifting unit is a shim block. The lifting state is achieved by placing the shim block below the limiting plate, and the lowering state is achieved by removing the shim block.

10. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 8, characterized in that, The inner diameter of the third through hole is adapted to the outer diameter of the probe, so that the probe is precisely positioned within the third through hole, and the probe remains perpendicular to the outer wall of the annular structure or the outer wall of the protective adhesive layer.

11. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 3 or 8, characterized in that, The limiting plate is a flat plate that abuts against the annular outer wall, and the two abut against the first tangential segment; The perpendicular path from the zeroing operation position to the annular outer wall and the perpendicular path from the measurement operation position to the outer wall of the protective adhesive layer are both perpendicular to the limiting plate and intersect with the first tangent segment or its extension.

12. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 3 or 8, characterized in that, The limiting plate is an arc-shaped plate with the same curvature as the annular outer wall, and the inner arc surface of the limiting plate abuts against the annular outer wall at multiple points or completely.

13. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 4 or 8, characterized in that, There are multiple second or third through holes, which are evenly distributed along the circumference of the limiting plate for performing multi-point measurement operations.

14. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 4 or 8, characterized in that, The limiting plate is a ring that is sleeved on the outer periphery of the annular outer wall; There are multiple second or third through holes, which are evenly distributed along the circumference of the limiting plate, so that all circumferential measurement operations of the protective adhesive layer can be completed without moving the limiting plate.

15. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 4, characterized in that, The limiting unit also includes a depth gauge fixing mechanism that is disposed on the limiting plate and the depth gauge body and cooperates with each other, for fixing the depth gauge and the limiting device.

16. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 3, characterized in that, The limiting device also includes a limiting plate fixing mechanism disposed on the limiting plate for fixing the limiting plate to the reaction chamber.

17. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 1, characterized in that, The first component is a base disposed below the internal component or an electrostatic chuck ceramic layer disposed above the internal component.

18. The measuring tool with the electrostatic chuck protective adhesive layer as described in claim 1, characterized in that, The protective adhesive layer is further fitted with a protective ring made of elastic material, and the probe is perpendicular to the outer wall of the protective ring when performing measurement operations.

19. The measuring tool for the electrostatic chuck protective adhesive layer as described in claim 3, characterized in that, The reaction chamber also includes a second component; The limiting plate abuts against or is fixed to the second component.

20. A method for measuring the protective adhesive layer of an electrostatic chuck, characterized in that, The measurement tool based on the electrostatic chuck protective adhesive layer as described in any one of claims 1-19 includes the following steps: S1. Arrange and fix the limiting device according to the position where the zeroing operation is performed; S2. Arrange and fix the depth gauge according to the position where the zeroing operation will be performed; S3. The depth gauge performs a zeroing operation and records the zeroing point; S4. Arrange and fix the limiting device according to the position where the measurement operation is performed; S5. Arrange and fix the depth gauge according to the position where the measurement operation will be performed; S6. The depth gauge performs a measurement operation and reads the measurement reading to obtain the first distance between the outer wall of the protective adhesive layer or the protective ring and the zero point. S7. Calculate the difference between the first design distance and the first spacing to obtain the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring. S8. Repeat steps S5 to S7 to measure other circumferential measurement points on the outer wall of the protective adhesive layer until all measurements are completed.

21. A method for predicting the lifespan of the protective adhesive layer of an electrostatic chuck, characterized in that, The method for measuring the protective adhesive layer of an electrostatic chuck as described in claim 20 includes the following steps: L1. After the first installation, measure the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring. L2. During the cleaning process, measure the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring, and record the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring, as well as the RF time. L3. Based on the thickness of the protective adhesive layer or the overall thickness of the protective adhesive layer and the protective ring, and the RF hour record, find the relationship between the two and predict the lifespan of the protective adhesive layer.

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