Method, device and equipment for determining three-dimensional seismic secondary acquisition channel density

Abstract

The application provides a method, device and equipment for determining the trace density of three-dimensional seismic secondary acquisition, which comprises the following steps: performing extended bin processing on the seismic data of the target area in previous economic three-dimensional acquisition, significantly improving the fold number and calculating the profile signal-to-noise ratio under different fold numbers, determining the target signal-to-noise ratio required by the three-dimensional seismic secondary acquisition and the fold number corresponding to the target signal-to-noise ratio, further determining the multiple of the fold number and the fold number in the previous economic three-dimensional acquisition, and finally multiplying the trace density in the previous economic three-dimensional acquisition by the obtained multiple to determine the trace density required by the three-dimensional seismic secondary acquisition. The method fully utilizes the existing seismic data of the economic three-dimensional acquisition, does not need to bear additional investment cost, does not need long-time acquisition test, can more economically and quickly determine the trace density of the three-dimensional seismic secondary acquisition observation system, realizes more economic and efficient seismic exploration acquisition, shortens the acquisition cycle and improves the quality of the seismic acquisition data.

Description

Technical Field

[0001] This invention relates to the field of three-dimensional seismic exploration and acquisition technology, specifically to a method, apparatus, and equipment for determining the density of boreholes in three-dimensional seismic secondary acquisition. Background Technology

[0002] Seismic acquisition is the first step in oil and gas exploration and development. The accuracy of seismic acquisition is a crucial factor affecting the accuracy of oil and gas exploration, and shot density is one of the important parameters determining the quality of seismic data. Shot density is the number of offsets per unit area, which can be determined by multiplying the number of coverages per unit area by the number of surface cells. Accurately determining shot density helps improve the quality of seismic data.

[0003] Currently, the common method for determining shot density is as follows: First, a small-area redundant shot density seismic acquisition test is conducted in the target area. Then, the acquired test data is used to perform a degradation analysis of the shot density, ultimately determining the shot density of the observation system. The final determined shot density then guides construction and production. However, small-area acquisition tests typically require an 8-12 month field acquisition and processing period, and conducting these tests requires an investment of up to tens of millions of yuan, resulting in long timeframes and high investment costs. Summary of the Invention

[0004] This invention provides a method, apparatus, and equipment for determining the density of shot channels in three-dimensional seismic secondary acquisition, in order to solve the problems of long time cycles and high investment costs of existing methods.

[0005] In a first aspect, embodiments of the present invention provide a method for determining the density of shot channels in a three-dimensional seismic secondary acquisition, comprising:

[0006] To acquire seismic data for economical 3D seismic acquisition of the target area to be acquired in 3D seismic secondary acquisition;

[0007] The seismic data obtained from economic 3D acquisition is processed by enlarging the surface area to form a stacked profile with a higher coverage number;

[0008] For overlay profiles with higher coverage counts, the coverage count is gradually reduced, and the profile signal-to-noise ratio is calculated under each coverage count condition to obtain the correspondence between the coverage count and the profile signal-to-noise ratio.

[0009] Determine the signal-to-noise ratio of the target profile in the secondary 3D seismic acquisition;

[0010] The number of coverage times for secondary 3D seismic acquisitions is determined based on the target profile signal-to-noise ratio and the correspondence between the number of coverage times and the profile signal-to-noise ratio.

[0011] Determine the ratio of the coverage number of the secondary 3D seismic acquisition to the coverage number of the economic 3D acquisition;

[0012] The product of the shot density obtained from the economic 3D acquisition and the multiplier is determined as the shot density obtained from the 3D seismic secondary acquisition.

[0013] In one embodiment, when enlarging the area of ​​seismic data acquired through economic 3D acquisition, if the area is enlarged by N times, the coverage number is increased by N times.

[0014] In one embodiment, the coverage number is progressively reduced for overlay profiles with higher coverage numbers, including:

[0015] For overlay profiles with higher coverage counts, the coverage count is gradually reduced by sparsely sparse receiving points or excitation points.

[0016] In one embodiment, determining the signal-to-noise ratio of the target profile in a secondary 3D seismic acquisition includes:

[0017] Determine the geological requirements for secondary 3D seismic acquisition;

[0018] Based on the geological task requirements of 3D seismic secondary acquisition and the pre-established correspondence between geological task requirements and profile signal-to-noise ratio, the target profile signal-to-noise ratio of 3D seismic secondary acquisition is determined.

[0019] Secondly, embodiments of the present invention provide a device for determining the density of shot channels in three-dimensional seismic secondary acquisition, comprising:

[0020] The acquisition module is used to acquire seismic data for economical 3D acquisition of the target area to be acquired in 3D seismic secondary acquisition.

[0021] The enlargement module is used to enlarge the surface area of ​​seismic data obtained from economic 3D acquisition, forming a stacked profile with a higher coverage number.

[0022] The reduction module is used to gradually reduce the coverage number of the superimposed profile with a higher coverage number, calculate the profile signal-to-noise ratio under each coverage number condition, and obtain the correspondence between the coverage number and the profile signal-to-noise ratio.

[0023] The first determination module is used to determine the signal-to-noise ratio of the target profile in the secondary 3D seismic acquisition.

[0024] The second determination module is used to determine the number of coverages for the second 3D seismic acquisition based on the target profile signal-to-noise ratio and the correspondence between the number of coverages and the profile signal-to-noise ratio.

[0025] The third determination module is used to determine the multiple of the coverage number of the 3D seismic secondary acquisition to the coverage number of the economic 3D acquisition.

[0026] The fourth determination module is used to determine the product of the shot density of the economic 3D acquisition and the multiplier value as the shot density of the 3D seismic secondary acquisition.

[0027] In one embodiment, when the enlargement module is used to enlarge the surface area of ​​the seismic data obtained from economic 3D acquisition, if the surface area is enlarged by N times, the coverage times are increased by N times.

[0028] In one embodiment, the reduction module is used to progressively reduce the coverage number of a superimposed profile with a higher coverage number, including:

[0029] For overlay profiles with higher coverage counts, the coverage count is gradually reduced by sparsely sparse receiving points or excitation points.

[0030] In one embodiment, the first determining module is used to determine the signal-to-noise ratio of the target profile in a two-dimensional seismic secondary acquisition, including:

[0031] Determine the geological requirements for secondary 3D seismic acquisition;

[0032] Based on the geological task requirements of 3D seismic secondary acquisition and the pre-established correspondence between geological task requirements and profile signal-to-noise ratio, the target profile signal-to-noise ratio of 3D seismic secondary acquisition is determined.

[0033] Thirdly, embodiments of the present invention provide an electronic device, comprising:

[0034] At least one processor and memory;

[0035] The memory stores instructions that the computer executes;

[0036] At least one processor executes computer execution instructions stored in memory, causing the at least one processor to perform the method for determining the density of the three-dimensional seismic secondary acquisition borehole as described in any of the first aspects.

[0037] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method for determining the density of three-dimensional seismic secondary acquisition boreholes as described in any of the first aspects.

[0038] The method, apparatus, and equipment for determining the shot density of 3D seismic secondary acquisition provided in this invention significantly increase the coverage number by enlarging the surface area of ​​previously economically acquired 3D seismic data in the target area and calculating the profile signal-to-noise ratio under different coverage numbers. Then, the target signal-to-noise ratio required for 3D seismic secondary acquisition and the corresponding coverage number are determined. Furthermore, the multiple of this coverage number to the coverage number of previous economically acquired 3D acquisitions is determined. Finally, the shot density of previous economically acquired 3D acquisitions is multiplied by the obtained multiple to determine the shot density required for 3D seismic secondary acquisition. This fully utilizes existing economically acquired 3D seismic data, without incurring additional investment costs or requiring lengthy acquisition experiments. It can determine the shot density of the 3D seismic secondary acquisition observation system more economically and quickly, achieving more economical and efficient seismic exploration acquisition, shortening the acquisition cycle, and improving the quality of seismic acquisition data. Attached Figure Description

[0039] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0040] Figure 1 A flowchart illustrating a method for determining the density of a three-dimensional seismic secondary acquisition borehole according to an embodiment of the present invention;

[0041] Figure 2 A flowchart of a method for determining the density of a three-dimensional seismic secondary acquisition borehole, provided in another embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of the structure of a device for determining the density of a three-dimensional seismic secondary acquisition borehole provided in an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention.

[0044] The accompanying drawings have illustrated specific embodiments of the invention, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the invention in any way, but rather to illustrate the concept of the invention to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0045] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0046] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0047] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0048] Economic 3D seismic acquisition allows for rapid and cost-effective seismic observation of target areas. However, when dealing with complex and concealed oil and gas reservoirs, secondary 3D seismic acquisition is still necessary. The accuracy of the runway density in secondary 3D seismic acquisition determines the quality of the seismic data. Using existing methods for determining runway density through small-area redundant runway density seismic acquisition experiments is not only time-consuming but also costly, severely hindering construction progress. This application fully utilizes seismic data acquired through previous economic 3D seismic acquisition in the target area to determine the runway density for secondary 3D seismic acquisition. This method enables more economical, faster, and more accurate determination of the runway density for secondary 3D seismic acquisition, shortening the acquisition cycle and improving the quality of the acquired seismic data. This results in more economical and efficient seismic exploration acquisition, thereby accelerating construction progress. Specific embodiments will further illustrate this application below.

[0049] Example 1

[0050] Figure 1This is a flowchart illustrating a method for determining the borehole density in a three-dimensional seismic secondary acquisition according to an embodiment of the present invention. Figure 1 As shown in this embodiment, the method for determining the density of shot channels in a three-dimensional seismic secondary acquisition may include:

[0051] S101. Obtain seismic data for economical 3D seismic acquisition of the target area to be subjected to secondary 3D seismic acquisition.

[0052] Typically, the target area for secondary 3D seismic acquisition has already undergone economic 3D seismic acquisition, so acquiring economic 3D seismic data does not incur additional costs. The specific acquisition method depends on how the economic 3D seismic data is stored. For example, if the economic 3D seismic data is stored on a cloud server, it can be downloaded via the internet; if the economic 3D seismic data is stored on hardware storage, such as a hard drive or USB flash drive, it can be accessed by connecting the hardware storage to a host device.

[0053] S102. The seismic data obtained from the economic 3D acquisition is processed to expand the area of ​​the data, forming a stacked profile with a higher coverage.

[0054] To obtain a higher coverage stacked profile, this embodiment can perform enlarged pixel processing on the seismic data acquired through economic 3D acquisition. This embodiment does not limit the specific implementation of the enlarged pixel processing; any existing enlarged pixel processing method can be used. Here, "higher" refers to the coverage number relative to the seismic data acquired through economic 3D acquisition.

[0055] In one optional implementation, when enlarging the area of ​​seismic data obtained from economic 3D acquisition, if the area is enlarged by a factor of N, the coverage count increases by a factor of N, meaning the coverage count increases proportionally to the area. Here, N can be, for example, a non-negative natural number, and the value of N can be determined based on the actual geological task requirements.

[0056] S103. For the superimposed profile with a higher coverage number, gradually reduce the coverage number, calculate the profile signal-to-noise ratio under each coverage number condition, and obtain the correspondence between the coverage number and the profile signal-to-noise ratio.

[0057] In one optional implementation, gradually reducing the coverage number for a superimposed profile with a higher coverage number may specifically include: gradually reducing the coverage number for a superimposed profile with a higher coverage number by sparsely distributing receiver points or excitation points.

[0058] It is understandable that by sparsely processing the receiving or excitation points, stacking profiles with various coverage counts can be obtained. For each coverage count stacking profile, the corresponding profile signal-to-noise ratio (SNR) can be calculated, thus revealing the relationship between the coverage count and the profile SNR.

[0059] S104. Determine the signal-to-noise ratio of the target profile in the secondary 3D seismic acquisition.

[0060] 3D seismic secondary acquisition may be used to perform different geological tasks, and different geological tasks often have different requirements for the profile signal-to-noise ratio (SNR). Different 3D seismic secondary acquisition observation systems may use different frequency bands, and different frequency bands often have different requirements for the profile SNR. Therefore, the target profile SNR of 3D seismic secondary acquisition can be determined based on the geological task and / or different frequency bands.

[0061] S105. Based on the target profile signal-to-noise ratio and the correspondence between the number of coverages and the profile signal-to-noise ratio, determine the number of coverages for the second 3D seismic acquisition.

[0062] After determining the target profile signal-to-noise ratio, the number of coverages corresponding to the target profile signal-to-noise ratio can be determined based on the correspondence between the number of coverages and the profile signal-to-noise ratio obtained in step S103, and this number of coverages can be determined as the number of coverages for the second three-dimensional seismic acquisition.

[0063] S106. Determine the multiple of the coverage number of the secondary 3D seismic acquisition to the coverage number of the economic 3D acquisition.

[0064] It is understandable that the coverage number of 3D seismic secondary acquisition is greater than that of economic 3D acquisition. Therefore, in this embodiment, the coverage number of 3D seismic secondary acquisition can be divided by the coverage number of economic 3D acquisition to obtain the multiple value.

[0065] S107. The product of the shot density obtained from the economic 3D acquisition and the multiplier value is determined as the shot density obtained from the 3D seismic secondary acquisition.

[0066] After obtaining the multiplier value, the multiplier value can be multiplied by the shot density of the economic 3D acquisition to determine the shot density of the 3D seismic secondary acquisition.

[0067] The method for determining the shot density of 3D seismic secondary acquisition provided in this embodiment involves enlarging the area of ​​previously acquired economical 3D seismic data in the target area to significantly increase the coverage number and calculating the profile signal-to-noise ratio under different coverage numbers. Then, the target signal-to-noise ratio required for 3D seismic secondary acquisition and the corresponding coverage number are determined. Furthermore, the multiple of this coverage number to the coverage number of previous economical 3D acquisitions is determined. Finally, the shot density of previous economical 3D acquisitions is multiplied by the obtained multiple to determine the shot density required for 3D seismic secondary acquisition. This method fully utilizes existing economical 3D seismic data, eliminating the need for additional investment costs and lengthy acquisition experiments. It allows for a more economical and faster determination of the shot density of the 3D seismic secondary acquisition observation system, achieving more economical and efficient seismic exploration acquisition, shortening the acquisition cycle, and improving the quality of seismic acquisition data.

[0068] Example 2

[0069] Based on the above embodiments, this embodiment further explains the specific implementation method for determining the signal-to-noise ratio of the target profile in 3D seismic secondary acquisition. Figure 2 This is a flowchart illustrating a method for determining the borehole density in a three-dimensional seismic secondary acquisition, as provided in another embodiment of the present invention. Figure 2 As shown in this embodiment, determining the signal-to-noise ratio of the target profile in the secondary 3D seismic acquisition can specifically include:

[0070] S1041. Determine the geological requirements for secondary 3D seismic acquisition.

[0071] Geological task requirements are determined based on actual exploration needs. In one optional implementation, geological task requirements can be divided into multiple different levels according to their severity, and different geological task requirements can be scored according to their severity. The established correspondence between geological task requirements and profile signal-to-noise ratio (SNR) can be, for example, a correspondence between geological task requirement levels and profile SNR, or a correspondence between geological task requirement scores and profile SNR.

[0072] Optionally, the frequency band used by the three-dimensional seismic secondary acquisition observation system can be further determined, and the correspondence between frequency band, geological task requirements and profile signal-to-noise ratio can be constructed.

[0073] S1042. Based on the geological task requirements of the 3D seismic secondary acquisition and the pre-constructed correspondence between the geological task requirements and the profile signal-to-noise ratio, determine the target profile signal-to-noise ratio for the 3D seismic secondary acquisition.

[0074] The method for determining the shot density in 3D seismic secondary acquisition provided in this embodiment, based on the above embodiment, further determines the geological task requirements of 3D seismic secondary acquisition, and determines the target profile signal-to-noise ratio of 3D seismic secondary acquisition based on the geological task requirements of 3D seismic secondary acquisition and the pre-constructed correspondence between the geological task requirements and the profile signal-to-noise ratio. In the process of determining the shot density of 3D seismic secondary acquisition, the actual geological task requirements are fully considered, which helps to further improve the accuracy of shot density and thus improve the quality of seismic acquisition data.

[0075] Example 3

[0076] This invention also provides a device for determining the density of shot channels in a three-dimensional seismic secondary acquisition. Please refer to [link to relevant documentation]. Figure 3 As shown, the embodiments of the present invention are only used as examples. Figure 3 The examples are provided for illustration only and do not imply that the invention is limited to these examples. Figure 3 This is a schematic diagram of a device for determining the density of a three-dimensional seismic secondary acquisition borehole, provided in an embodiment of the present invention. Figure 3 As shown, the device 30 for determining the density of the three-dimensional seismic secondary acquisition borehole provided in this embodiment may include: an acquisition module 301, an enlargement module 302, a reduction module 303, a first determination module 304, a second determination module 305, a third determination module 306, and a fourth determination module 307.

[0077] The acquisition module 301 is used to acquire seismic data for economical 3D acquisition of the target area to be subjected to secondary 3D seismic acquisition;

[0078] The enlargement module 302 is used to enlarge the surface area of ​​the seismic data obtained from economic 3D acquisition, forming a stacked profile with a higher coverage number.

[0079] The reduction module 303 is used to gradually reduce the coverage number of the superimposed profile with a higher coverage number, calculate the profile signal-to-noise ratio under each coverage number condition, and obtain the correspondence between the coverage number and the profile signal-to-noise ratio.

[0080] The first determining module 304 is used to determine the signal-to-noise ratio of the target profile in the secondary three-dimensional seismic acquisition.

[0081] The second determining module 305 is used to determine the number of coverages for the second three-dimensional seismic acquisition based on the target profile signal-to-noise ratio and the correspondence between the number of coverages and the profile signal-to-noise ratio.

[0082] The third determining module 306 is used to determine the multiple of the coverage number of the 3D seismic secondary acquisition to the coverage number of the economic 3D acquisition.

[0083] The fourth determination module 307 is used to determine the product of the shot density of the economic 3D acquisition and the multiplier value as the shot density of the 3D seismic secondary acquisition.

[0084] The apparatus of this embodiment can be used to perform Figure 1 The technical solutions of the method embodiments shown are similar in principle and in effect, and will not be described again here.

[0085] In one optional implementation, when the enlargement module is used to enlarge the surface area of ​​the seismic data obtained from economic 3D acquisition, if the surface area is enlarged by N times, the coverage times are increased by N times.

[0086] In one optional implementation, the reduction module 303 is used to gradually reduce the coverage number of the superimposed profile with a higher coverage number. Specifically, it may include: gradually reducing the coverage number of the superimposed profile with a higher coverage number by sparse receiving points or excitation points.

[0087] Example 4

[0088] Based on the above embodiments, the first determining module 304 in this embodiment is used to determine the target profile signal-to-noise ratio of the three-dimensional seismic secondary acquisition. Specifically, it may include: determining the geological task requirements of the three-dimensional seismic secondary acquisition; and determining the target profile signal-to-noise ratio of the three-dimensional seismic secondary acquisition based on the geological task requirements of the three-dimensional seismic secondary acquisition and the pre-constructed correspondence between the geological task requirements and the profile signal-to-noise ratio.

[0089] Example 5

[0090] This invention also provides an electronic device, please refer to [link to relevant documentation]. Figure 4 As shown, the embodiments of the present invention are only used as examples. Figure 4 The examples are provided for illustration only and do not imply that the invention is limited to these examples. Figure 4 This is a schematic diagram of the structure of an electronic device provided according to an embodiment of the present invention. Figure 4 As shown, the electronic device 40 provided in this embodiment includes: a memory 401, a processor 402, and a bus 403. The bus 403 is used to connect the various components.

[0091] The memory 401 stores a computer program, which, when executed by the processor 402, can implement the technical solutions of any of the above method embodiments.

[0092] The memory 401 and processor 402 are electrically connected directly or indirectly to enable data transmission or interaction. For example, these components can be electrically connected to each other via one or more communication buses or signal lines, such as bus 403. The memory 401 stores a computer program for determining the density of shot channels in three-dimensional seismic secondary acquisition, including at least one software functional module that can be stored in the memory 401 in the form of software or firmware. The processor 402 executes various functional applications and data processing by running the software program and modules stored in the memory 401.

[0093] The memory 401 may be, but is not limited to, Random Access Memory (RAM), Read Only Memory (ROM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), etc. The memory 401 stores programs, and the processor 402 executes the programs after receiving execution instructions. Furthermore, the software programs and modules within the memory 401 may also include an operating system, which may include various software components and / or drivers for managing system tasks (such as memory management, storage device control, power management, etc.) and can communicate with various hardware or software components to provide an operating environment for other software components.

[0094] Processor 402 can be an integrated circuit chip with signal processing capabilities. The aforementioned processor 402 can be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this invention. The general-purpose processor can be a microprocessor or any conventional processor. It is understood that... Figure 4 The structure shown is for illustrative purposes only and may include more... Figure 4 The more or fewer components shown, or having the same Figure 4 The different configurations shown. Figure 4 The components shown can be implemented in hardware and / or software.

[0095] This invention also provides a computer-readable storage medium storing a computer program thereon, which is executed by a processor to implement the technical solutions of any of the above method embodiments.

[0096] The various embodiments in this disclosure are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0097] The scope of protection of this disclosure is not limited to the embodiments described above. Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its scope and spirit. If such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, then the intent of this disclosure also includes such modifications and variations.

Claims

1. A method for determining the density of shot channels in a three-dimensional seismic secondary acquisition, characterized in that, include: To acquire seismic data for economical 3D seismic acquisition of the target area to be acquired in 3D seismic secondary acquisition; The seismic data obtained from the economic 3D acquisition is subjected to enlarged area processing to form a stacked profile with a higher coverage number; For the superimposed profile with higher coverage counts, the coverage count is gradually reduced, and the profile signal-to-noise ratio is calculated under each coverage count condition to obtain the correspondence between the coverage count and the profile signal-to-noise ratio. Determine the signal-to-noise ratio of the target profile acquired in the secondary 3D seismic acquisition; Based on the target profile signal-to-noise ratio and the correspondence between the number of coverages and the profile signal-to-noise ratio, the number of coverages for the second 3D seismic acquisition is determined. Determine the multiple of the coverage number of the 3D seismic secondary acquisition to the coverage number of the economic 3D acquisition; The product of the shot density obtained from the economic 3D acquisition and the multiplier value is determined as the shot density obtained from the 3D seismic secondary acquisition.

2. The method according to claim 1, characterized in that, When enlarging the area of ​​the seismic data obtained from the economic 3D acquisition, if the area is enlarged by N times, the coverage times will increase by N times.

3. The method according to claim 1, characterized in that, The method of gradually reducing the coverage number for the superimposed profile with the higher coverage number includes: For the superimposed profile with higher coverage times, the coverage times are gradually reduced by sparsely sparse receiving points or excitation points.

4. The method according to any one of claims 1-3, characterized in that, Determining the signal-to-noise ratio of the target profile acquired in the secondary 3D seismic acquisition includes: Determine the geological requirements for the secondary 3D seismic acquisition; Based on the geological task requirements of the 3D seismic secondary acquisition and the pre-established correspondence between the geological task requirements and the profile signal-to-noise ratio, the target profile signal-to-noise ratio of the 3D seismic secondary acquisition is determined.

5. A device for determining the density of shot channels in a three-dimensional seismic secondary acquisition, characterized in that, include: The acquisition module is used to acquire seismic data for economical 3D acquisition of the target area to be acquired in 3D seismic secondary acquisition. The enlargement module is used to enlarge the surface area of ​​the seismic data obtained from the economic 3D acquisition, forming a stacked profile with a higher coverage number. The reduction module is used to gradually reduce the coverage number of the superimposed profile with a higher coverage number, calculate the profile signal-to-noise ratio under each coverage number condition, and obtain the correspondence between the coverage number and the profile signal-to-noise ratio. The first determining module is used to determine the signal-to-noise ratio of the target profile acquired in the secondary 3D seismic acquisition. The second determining module is used to determine the number of coverages for the second three-dimensional seismic acquisition based on the target profile signal-to-noise ratio and the correspondence between the number of coverages and the profile signal-to-noise ratio. The third determining module is used to determine the multiple of the coverage number of the three-dimensional seismic secondary acquisition to the coverage number of the economic three-dimensional acquisition; The fourth determining module is used to determine the product of the shot density of the economic three-dimensional acquisition and the multiplier value as the shot density of the three-dimensional seismic secondary acquisition.

6. The apparatus according to claim 5, characterized in that, When the enlargement module is used to enlarge the seismic data obtained from the economic 3D acquisition, if the number of pixels is enlarged by N times, the number of coverage times will increase by N times.

7. The apparatus according to claim 5, characterized in that, The reduction module is used to progressively reduce the coverage number of the superimposed profile with higher coverage numbers, including: For the superimposed profile with higher coverage times, the coverage times are gradually reduced by sparsely sparse receiving points or excitation points.

8. The apparatus according to any one of claims 5-7, characterized in that, The first determining module is used to determine the signal-to-noise ratio of the target profile acquired in the secondary 3D seismic acquisition, including: Determine the geological requirements for the secondary 3D seismic acquisition; Based on the geological task requirements of the 3D seismic secondary acquisition and the pre-established correspondence between the geological task requirements and the profile signal-to-noise ratio, the target profile signal-to-noise ratio of the 3D seismic secondary acquisition is determined.

9. An electronic device, characterized in that, include: At least one processor and memory; The memory stores computer-executed instructions; The at least one processor executes computer execution instructions stored in the memory, causing the at least one processor to perform the method for determining the density of the three-dimensional seismic secondary acquisition borehole as described in any one of claims 1-4.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method for determining the density of shot channels in three-dimensional seismic secondary acquisition as described in any one of claims 1-4.

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