Reliability index calculation system for space electronic product based on digital model

Abstract

The application discloses a kind of reliability index calculation systems of spaceflight electronic product based on digital model, comprising: product digitalization module, for obtaining the same kind of spaceflight electronic product's failure information by based on the big data platform of Internet of Things, and based on the corresponding relationship between failure mode and product component constructs the failure digital model of spaceflight electronic product;Probability analysis module is used to analyze failure digital model, determine the failure probability of each electronic component respectively and generate component failure probability sequence;Calculation analysis module is used to calculate the reliability index of spaceflight electronic product according to component failure probability sequence.The application fully considers the cross existence of component in different function or packaging circuit, while through the membership of component, the order of magnitude of calculation is simplified as far as possible, and a reliability index relative to function level, packaging circuit level can be obtained quickly for different function level, packaging circuit level.

Description

Technical Field

[0001] This invention belongs to the field of electronic product testing technology, specifically relating to a reliability index calculation system for aerospace electronic products based on a digital model. Background Technology

[0002] Reliability refers to a product's ability to perform its intended function under specified conditions and within a specified time. Reliability can generally be divided into two levels. The first is component reliability, which involves disassembling the product into several different parts or components and studying the reliability of these components first. Then, the overall reliability of the entire system and the entire product is discussed, which is system reliability. Component reliability analysis is essentially statistical analysis. System reliability analysis is more complex and has more applicable methods.

[0003] Traditional medium- and long-term reliability assessments describe component reliability based on statistical averages, neglecting the impact of system operating conditions such as line power flow on component reliability levels. They also ignore the impact of real-time load changes on system reliability, limiting their guiding value for system operation and risk control. Operational reliability assessments, on the other hand, focus on the reliability level during system operation, sensing and quantifying the impact of internal and external environmental changes on component reliability, assessing system operational reliability in real time, and guiding the implementation of risk prevention and control strategies. However, aerospace electronic products contain a wide variety of electronic components with complex coupling relationships. Reliability assessment involves multi-structure coupling and correlation optimization problems, significantly increasing computational complexity. Furthermore, the time-varying characteristics of component reliability parameters and the uncertainties brought about by various types of loads further increase the computational burden. Therefore, how to effectively accelerate the operational reliability assessment of aerospace electronic products and design operational reliability assessment methods that meet timeliness and functional reliability requirements has become an urgent problem to be solved. Summary of the Invention

[0004] In view of this, the purpose of this invention is to propose a method for initial synchronization of satellite 5G terminals. This method fully considers the situation where components coexist in different functions or packaged circuits, simplifies the order of magnitude of calculations by considering the membership of components, and can quickly derive a reliability index relative to the functional level and the packaged circuit level for different functional levels and packaged circuit levels.

[0005] To achieve the above objectives, the present invention provides the following technical solution: The present invention provides a reliability index calculation system for aerospace electronic products based on a digital model, comprising: The product digitization module is used to obtain fault information of the same type of aerospace electronic products through an IoT-based big data platform, and to build a fault digitization model of aerospace electronic products based on the correspondence between fault modes and product components. The probability analysis module is used to analyze the fault digitization model, determine the fault probability of each electronic component, and generate a component fault probability sequence. The calculation and analysis module is used to calculate the reliability indicators of aerospace electronic products based on the component failure probability sequence.

[0006] Preferably, the product digitization module includes: The data acquisition unit is used to determine the model information of aerospace electronic products that need to be calculated for reliability indicators, and to obtain the corresponding fault information of all aerospace electronic products of the same model on the big data platform based on the model information. The hierarchical unit is used to pre-classify aerospace electronic products into three levels based on their functions: functional structure level, packaged component level, and electronic component level. The data processing unit is used to analyze the fault information corresponding to any aerospace electronic product according to the classification results and construct a fault information membership matrix based on the electronic component level of the component that caused the fault. It uses multiple fault information membership matrices to construct a multi-level cross-correlated secondary fault digital model. The data aggregation unit is used to aggregate all secondary fault digital models corresponding to the same type of aerospace electronic product to obtain the fault digital model of that type of aerospace electronic product.

[0007] Preferably, the data processing unit performs the following: Determine the set of functional structure levels with faults based on the fault information corresponding to any aerospace electronic product. and a set of functional architecture levels that do not have faults Where K represents the total number of functional structure levels of the aerospace electronic product, and n represents the total number of functional structure levels with faults. This represents the i-th functional structure level that has a fault. This represents the j-th functional structure level that does not have a fault. For the j-th functional structure level that does not have faults Determine the corresponding package component level set. ; Determine the set of packaged component levels corresponding to all functional architecture levels that do not have faults. : For the i-th faulty functional structure level Determine the corresponding package component level set. ; For packaged component level collections All packaged components within the scope are included in the first set. and the second set ,in: During the process of including all faulty functional structure levels within the encapsulation component levels, any encapsulation component level is determined to be included in the second set. The total number of occurrences is used as the weighting factor for that package component level; Determine the membership status of the corresponding electronic component level under the package component level, and construct the fault information membership matrix of the electronic component level based on the package component level to which the electronic component level belongs; By utilizing multiple fault information membership matrices and the weighting coefficients of the corresponding electronic component level and its associated packaging component level, a multi-level cross-correlation digital model of secondary faults for this aerospace electronic product is constructed.

[0008] Preferably, a digital model of secondary faults with multi-level cross-associations for the aerospace electronic product is constructed by utilizing multiple fault information membership matrices and the weighting coefficients of the corresponding electronic component level and its associated packaging component level, including: The membership of the corresponding electronic component level to all packaged component levels is determined based on the fault information membership matrix; When the electronic component level belongs to the package component level set When any packaged component level is considered, the failure probability of that electronic component level is determined to be zero. Based on the membership of electronic components to all packaged component levels and the weighting factor of each packaged component level, the failure probability coefficient of the electronic component level is determined: In the formula, This represents the failure probability coefficient at the electronic component level. This indicates the total number of package component levels to which this electronic component level belongs. This represents the weighting factor of the x-th package component level to which this electronic component level belongs. Let x be the conditional probability that the electronic component level will fail when the x-th package component level fails. This represents the probability of a failure occurring at the x-th package component level. This represents the probability that the x-th package component level and the corresponding electronic component level will fail simultaneously. Let x be the total number of electronic component levels within the x-th package component level. Indicates the correction factor at the electronic component level; A secondary fault digitization model is constructed based on the fault information membership matrix of each electronic component level within the aerospace electronic product and the fault probability coefficients corresponding to each electronic component level.

[0009] Preferably, the probability analysis module performs the following: Based on the fault digitization model of aerospace electronic products, determine the fault information membership matrix corresponding to each electronic component in the aerospace electronic products; Based on the classification and statistics of the failed functions of aerospace electronic products, the fault information of each electronic component corresponding to the failure of any function of the aerospace electronic product is obtained through the fault information membership matrix, and the failure probability of each electronic component when the function fails is calculated. Generate a sequence of electronic components in descending order of their failure probability when the function fails, and use this sequence as the component failure probability sequence.

[0010] Preferably, the calculation and analysis module performs the following: Obtain the preset function weight table for aerospace electronic products, and determine the impact weight of the reliability index calculation results of the aerospace electronic products when any function fails based on the function weight table; Determine the failure probability of each electronic component for any function based on the component failure probability sequence. The reliability index of aerospace electronic products is calculated based on the following formula: in, This indicates the reliability index of the aerospace electronic product. This represents the weight of the impact of the failure of the e-th function on the calculated reliability index of the aerospace electronic product. This indicates the total number of designed functions calculated based on reliability metrics. This represents the total number of statistics for the corresponding e-th function. This represents the number of times the e-th function in the statistics fails within its design life. This indicates the correction factor for electronic components. Let f represent the failure probability of the f-th electronic component corresponding to the e-th function. This represents the failure probability coefficient of the f-th electronic component corresponding to the e-th function. This represents the total number of electronic components corresponding to the e-th function.

[0011] The present invention has achieved at least the following beneficial effects: 1. It can perform multi-level reliability analysis of aerospace electronic products, simplify the cross structure of electronic product components, and realize component-level reliability analysis methods. The final calculation results are more accurate in terms of the calculation targets (such as functional level, packaging circuit level, and component level) and consider more comprehensive factors compared with the method of calculating the reliability of aerospace electronic products using individual electronic components.

[0012] 2. During the calculation process, the cross-existence of components in different functional or packaged circuits is fully considered. At the same time, the calculation order of magnitude is simplified as much as possible by the membership of the components. It can quickly obtain a reliability index relative to the functional level and the packaged circuit level. Attached Figure Description

[0013] To make the objectives, technical solutions, and beneficial effects of this invention clearer, the following figures are provided for illustration: Figure 1 This is a schematic diagram of the structure of a reliability index calculation system for aerospace electronic products based on a digital model, as described in an embodiment of the present invention. Figure 2 This is a schematic diagram illustrating the classification of aerospace electronic products in an embodiment of the present invention. Detailed Implementation

[0014] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0015] To achieve the above objectives, the present invention provides the following technical solution: The present invention provides a reliability index calculation system for aerospace electronic products based on a digital model, with reference to... Figure 1 ,include: The product digitization module is used to obtain fault information of the same type of aerospace electronic products through an IoT-based big data platform, and to build a fault digitization model of aerospace electronic products based on the correspondence between fault modes and product components. The probability analysis module is used to analyze the fault digitization model, determine the fault probability of each electronic component, and generate a component fault probability sequence. The calculation and analysis module is used to calculate the reliability indicators of aerospace electronic products based on the component failure probability sequence.

[0016] The working principle and beneficial effects of the above technical solution are as follows: The product digitization module acquires fault information of the same type of aerospace electronic products through an IoT-based big data platform, and constructs a fault digitization model of the aerospace electronic products based on the correspondence between fault modes and product components. Then, the probability analysis module analyzes the fault digitization model to determine the fault probability of each electronic component and generate a component fault probability sequence. Finally, the calculation and analysis module calculates the reliability index of the aerospace electronic products based on the component fault probability sequence. This invention first digitizes the fault information of aerospace electronic products and establishes a correspondence between product functions and product components. Big data is used to statistically analyze the fault modes under this correspondence and obtain the fault digitization model of the aerospace electronic products. Then, based on the fault information, the probability distribution of functional faults and electronic component faults of the aerospace electronic products is determined. Finally, the reliability index of the aerospace electronic products is calculated based on functional and electronic component failures. This invention enables multi-level reliability analysis of aerospace electronic products, simplifies the cross-structure of electronic components, and simultaneously realizes a component-level reliability analysis method. Compared with the reliability index calculation method using the overall failure state of aerospace electronic products, the final calculation results are more accurate in targeting the calculation objectives (e.g., functional level, packaging circuit level, component level), and consider more comprehensive factors. Furthermore, compared with the method of calculating the reliability of aerospace electronic products using individual electronic components, this invention fully considers the situation where components coexist in different functions or packaging circuits during the calculation process, while simplifying the calculation order of magnitude as much as possible through the membership of components, and can quickly derive a reliability index relative to the functional level and packaging circuit level for different functional levels and packaging circuit levels.

[0017] In a preferred embodiment, refer to Figure 1 and 2 The product digitization module includes: The data acquisition unit is used to determine the model information of aerospace electronic products that need to be calculated for reliability indicators, and to obtain the corresponding fault information of all aerospace electronic products of the same model on the big data platform based on the model information. The hierarchical unit is used to pre-classify aerospace electronic products into three levels based on their functions: functional structure level, packaged component level, and electronic component level. The data processing unit is used to analyze the fault information corresponding to any aerospace electronic product according to the classification results and construct a fault information membership matrix based on the electronic component level of the component that caused the fault. It uses multiple fault information membership matrices to construct a multi-level cross-correlated secondary fault digital model. The data aggregation unit is used to aggregate all secondary fault digital models corresponding to the same type of aerospace electronic product to obtain the fault digital model of that type of aerospace electronic product.

[0018] The working principle and beneficial effects of the above technical solution are as follows: A data acquisition unit determines the model information of the aerospace electronic products for which reliability index calculations are required, and based on this model information, acquires the corresponding fault information of all aerospace electronic products of the same model from a big data platform, achieving big data acquisition of fault information for aerospace electronic products; a hierarchical unit categorizes aerospace electronic products into three levels—functional structure level, packaged component level, and electronic component level—according to their functions, facilitating the construction of a fault information membership matrix at the electronic component level; a data processing unit analyzes the fault information corresponding to any aerospace electronic product based on the hierarchical results and constructs a fault information membership matrix at the electronic component level based on the faulty component, using multiple fault information membership matrices to construct a multi-level cross-correlated secondary fault digitization model; a data aggregation unit aggregates all secondary fault digitization models corresponding to the same type of aerospace electronic product to obtain the fault digitization model for that type of aerospace electronic product. This allows for the construction of the internal structure of aerospace electronic products, establishing the interrelationships between functional structures, packaged components, and electronic components. Based on this, a fault information membership matrix for electronic components is determined. A multi-level, cross-linked secondary fault digitization model is constructed within a single aerospace electronic product based on the fault information membership matrices of multiple electronic components. Using these secondary fault digitization models, a fault digitization model for that type of aerospace electronic product is built. This fault digitization model enables the rapid summarization of the fault mechanism of that type of aerospace electronic product, identifying frequently failing functions, packaged components, and electronic components, and determining the fault correlation mechanism.

[0019] In a preferred embodiment, the data processing unit performs the following: Determine the set of functional structure levels with faults based on the fault information corresponding to any aerospace electronic product. and a set of functional architecture levels that do not have faults Where K represents the total number of functional structure levels of the aerospace electronic product, and n represents the total number of functional structure levels with faults. This represents the i-th functional structure level that has a fault. This represents the j-th functional structure level that does not have a fault. For the j-th functional structure level that does not have faults Determine the corresponding package component level set. ; Determine the set of packaged component levels corresponding to all functional architecture levels that do not have faults. : For the i-th faulty functional structure level Determine the corresponding package component level set. ; For packaged component level collections All packaged components within the scope are included in the first set. and the second set ,in: During the process of including all faulty functional structure levels within the encapsulation component levels, any encapsulation component level is determined to be included in the second set. The total number of occurrences is used as the weighting factor for that package component level; Determine the membership status of the corresponding electronic component level under the package component level, and construct the fault information membership matrix of the electronic component level based on the package component level to which the electronic component level belongs; By utilizing multiple fault information membership matrices and the weighting coefficients of the corresponding electronic component level and its associated packaging component level, a multi-level cross-correlation digital model of secondary faults for this aerospace electronic product is constructed.

[0020] The working principle and beneficial effects of the above technical solution are as follows: By constructing the membership relationship between the functional structure level and the packaged component level, the structure of the packaged component level can be quickly located and detected based on the failure status of the functional structure. For functions without faults or failures, the corresponding packaged component level is determined to be fault-free and included in the first set, which can effectively reduce the amount of fault screening and improve work efficiency. For packaged component levels suspected of having faults, they are included in the second set, and the total number of times they are included in the second set when screening multiple functions is recorded. The total number of times reflects the crossover of the packaged component level in multiple faulty functional structure levels. For example, if packaged component A appears in functions 1, 2, and 3, it can be concluded that packaged component A is not faulty as long as any of the functions is not faulty. However, if functional structure levels 1, 2, and 3 where packaged component A is located are all faulty, then packaged component A has a high probability of being faulty. The more severe the crossover of the functional structure levels corresponding to the packaged component, the more certain the failure probability of packaged component A can be, and the higher the corresponding weighting factor will be. Then, by establishing the membership status of the corresponding electronic components at the assembly level, and constructing a fault information membership matrix for the electronic components based on the packaging assembly level to which each electronic component belongs, a membership relationship between the electronic components and the packaging assembly levels is established. Based on this membership relationship, and the previously constructed membership relationship between the functional structure level and the packaging assembly level, a fault information membership matrix for the electronic components is constructed. Finally, using multiple fault information membership matrices and the weight multiplier coefficients of the corresponding packaging assembly levels to which the electronic components belong, a multi-level cross-association secondary fault digital model of the aerospace electronic product is constructed. This achieves the construction of a multi-level cross-association secondary fault digital model for the aerospace electronic product, resulting in a digital model that reflects internal membership relationships and unit weights.

[0021] In a preferred embodiment, a multi-level cross-correlated secondary fault digital model of the aerospace electronic product is constructed by utilizing multiple fault information membership matrices and the weighting coefficients of the corresponding electronic component level to which the package component level belongs, including: The membership of the corresponding electronic component level to all packaged component levels is determined based on the fault information membership matrix; When the electronic component level belongs to the package component level set When any packaged component level is considered, the failure probability of that electronic component level is determined to be zero. Based on the membership of electronic components to all packaged component levels and the weighting factor of each packaged component level, the failure probability coefficient of the electronic component level is determined: In the formula, This represents the failure probability coefficient at the electronic component level. This indicates the total number of package component levels to which this electronic component level belongs. This represents the weighting factor of the x-th package component level to which this electronic component level belongs. Let x be the conditional probability that the electronic component level will fail when the x-th package component level fails. This represents the probability of a failure occurring at the x-th package component level. This represents the probability that the x-th package component level and the corresponding electronic component level will fail simultaneously. Let x be the total number of electronic component levels within the x-th package component level. Indicates the correction factor at the electronic component level; A secondary fault digitization model is constructed based on the fault information membership matrix of each electronic component level within the aerospace electronic product and the fault probability coefficients corresponding to each electronic component level.

[0022] The working principle and beneficial effects of the above technical solution are as follows: The membership matrix of fault information determines the membership of the corresponding electronic component level to all packaged component levels. Based on this membership, non-faulty electronic components are quickly eliminated. Then, based on the membership of the electronic component level to all packaged component levels and the weighting coefficients of each packaged component level, the fault probability coefficient of the electronic component level is calculated. Finally, a secondary fault digital model is constructed using the fault information membership matrix corresponding to each electronic component level within the aerospace electronic product and the corresponding fault probability coefficients. This enables the calculation of the fault probability coefficients at the electronic component level, improving the targeting and accuracy of the reliability index calculation system for electronic components.

[0023] In a preferred embodiment, the probability analysis module performs the following: Based on the fault digitization model of aerospace electronic products, determine the fault information membership matrix corresponding to each electronic component in the aerospace electronic products; Based on the classification and statistics of the failed functions of aerospace electronic products, the fault information of each electronic component corresponding to the failure of any function of the aerospace electronic product is obtained through the fault information membership matrix, and the failure probability of each electronic component when the function fails is calculated. Generate a sequence of electronic components in descending order of their failure probability when the function fails, and use this sequence as the component failure probability sequence.

[0024] The working principle and beneficial effects of the above technical solution are as follows: After generating a fault digitization model based on big data, the fault information membership matrix corresponding to each electronic component in the aerospace electronic product is determined based on the fault digitization model. Then, based on the failed functions of the aerospace electronic product, classification and statistics are performed. Through the fault information membership matrix, the fault information of each electronic component corresponding to the failure of any function in the aerospace electronic product is obtained, and the failure probability of each electronic component when that function fails is calculated. Based on the statistical failure probability, the fault distribution state at the electronic component level can be determined. According to the failure probability, a sequence of failure probabilities of each electronic component when that function fails, from largest to smallest, is generated as the component failure probability sequence. Through the component failure probability sequence, a direct relationship between the electronic component level and the functional structure level can be established, which facilitates the rapid calculation of reliability indicators relative to the functional level based on the failure probability at the electronic component level. This enables rapid and targeted calculation of reliability indicators at the functional level, such as the calculation of reliability indicators for display functions, measurement functions, self-test functions, etc.

[0025] In a preferred embodiment, the computational analysis module performs the following: Obtain the preset function weight table for aerospace electronic products, and determine the impact weight of the reliability index calculation results of the aerospace electronic products when any function fails based on the function weight table; Determine the failure probability of each electronic component for any function based on the component failure probability sequence. The reliability index of aerospace electronic products is calculated based on the following formula: in, This indicates the reliability index of the aerospace electronic product. This represents the weight of the impact of the failure of the e-th function on the calculated reliability index of the aerospace electronic product. This indicates the total number of designed functions calculated based on reliability metrics. This represents the total number of statistics for the corresponding e-th function. This represents the number of times the e-th function in the statistics fails within its design life. This indicates the correction factor for electronic components. Let f represent the failure probability of the f-th electronic component corresponding to the e-th function. This represents the failure probability coefficient of the f-th electronic component corresponding to the e-th function. This represents the total number of electronic components corresponding to the e-th function.

[0026] The working principle and beneficial effects of the above technical solution are as follows: The calculation and analysis module obtains the preset functional weight table of the aerospace electronic product and determines the impact weight of the failure of any function on the reliability index calculation result of the aerospace electronic product based on the functional weight table; it determines the failure probability of each electronic component corresponding to any function based on the component failure probability sequence; and it calculates the reliability index of the aerospace electronic product through the following formula based on big data failure information such as the failure probability of the function within the design life, thereby finally realizing the calculation of the reliability index.

[0027] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of the present invention.

Claims

1. A reliability index calculation system for aerospace electronic products based on a digital model, characterized in that, include: The product digitization module is used to obtain fault information of the same type of aerospace electronic products through an IoT-based big data platform, and to build a fault digitization model of aerospace electronic products based on the correspondence between fault modes and product components. The probability analysis module is used to analyze the fault digitization model, determine the fault probability of each electronic component, and generate a component fault probability sequence. The calculation and analysis module is used to calculate the reliability indicators of aerospace electronic products based on the component failure probability sequence; The product digitization module includes: The data acquisition unit is used to determine the model information of aerospace electronic products that need to be calculated for reliability indicators, and to obtain the corresponding fault information of all aerospace electronic products of the same model on the big data platform based on the model information. The hierarchical unit is used to pre-classify aerospace electronic products into three levels based on their functions: functional structure level, packaged component level, and electronic component level. The data processing unit is used to analyze the fault information corresponding to any aerospace electronic product according to the classification results and construct a fault information membership matrix based on the electronic component level of the component that caused the fault. It uses multiple fault information membership matrices to construct a multi-level cross-correlated secondary fault digital model. The data aggregation unit is used to aggregate all secondary fault digital models corresponding to the same type of aerospace electronic products to obtain the fault digital model of the same type of aerospace electronic products. The data processing unit performs the following: Determine the set of functional structure levels with faults based on the fault information corresponding to any aerospace electronic product. and a set of functional architecture levels that do not have faults Where K represents the total number of functional structure levels of the aerospace electronic product, and n represents the total number of functional structure levels with faults. This represents the i-th functional structure level that has a fault. This represents the j-th functional structure level that does not have a fault. For the j-th functional structure level that does not have faults Determine the corresponding package component level set. ; Determine the set of packaged component levels corresponding to all functional architecture levels that do not have faults. : For the i-th faulty functional structure level Determine the corresponding package component level set. ; For packaged component level collections All packaged components within the scope are included in the first set. and the second set ,in: During the process of including all faulty functional structure levels within the encapsulation component levels, any encapsulation component level is determined to be included in the second set. The total number of occurrences is used as the weighting factor for that package component level; Determine the membership status of the corresponding electronic component level under the package component level, and construct the fault information membership matrix of the electronic component level based on the package component level to which the electronic component level belongs; By utilizing multiple fault information membership matrices and the weighting coefficients of the corresponding electronic component level and its associated packaging component level, a multi-level cross-correlation digital model of secondary faults for this aerospace electronic product is constructed.

2. The reliability index calculation system for aerospace electronic products based on a digital model according to claim 1, characterized in that, Using multiple fault information membership matrices and the weighting coefficients of the corresponding electronic component level and its associated package level, a multi-level cross-correlation digital model of secondary faults for this aerospace electronic product is constructed, including: The membership of the corresponding electronic component level to all packaged component levels is determined based on the fault information membership matrix; When the electronic component level belongs to the package component level set When any packaged component level is considered, the failure probability of that electronic component level is determined to be zero. Based on the membership of electronic components to all packaged component levels and the weighting factor of each packaged component level, the failure probability coefficient of the electronic component level is determined: In the formula, This represents the failure probability coefficient at the electronic component level. This indicates the total number of package component levels to which this electronic component level belongs. This represents the weighting factor of the x-th package component level to which this electronic component level belongs. Let x be the conditional probability that the electronic component level will fail when the x-th package component level fails. This represents the probability of a failure occurring at the x-th package component level. This represents the probability that the x-th package component level and the corresponding electronic component level will fail simultaneously. Let x be the total number of electronic component levels within the x-th package component level. Indicates the correction factor at the electronic component level; A secondary fault digitization model is constructed based on the fault information membership matrix of each electronic component level in the aerospace electronic product and the fault probability coefficients corresponding to each electronic component level.

3. The reliability index calculation system for aerospace electronic products based on a digital model according to claim 1, characterized in that, The probability analysis module performs the following: Based on the fault digitization model of aerospace electronic products, determine the fault information membership matrix corresponding to each electronic component in the aerospace electronic products; Based on the classification and statistics of the failed functions of aerospace electronic products, the fault information of each electronic component corresponding to the failure of any function of the aerospace electronic product is obtained through the fault information membership matrix, and the failure probability of each electronic component when the function fails is calculated. Generate a sequence of electronic components in descending order of their failure probability when the function fails, and use this sequence as the component failure probability sequence.

4. The reliability index calculation system for aerospace electronic products based on a digital model according to claim 1, characterized in that, The calculation and analysis module performs the following: Obtain the preset function weight table for aerospace electronic products, and determine the impact weight of the reliability index calculation results of the aerospace electronic products when any function fails based on the function weight table; Determine the failure probability of each electronic component for any function based on the component failure probability sequence. The reliability index of aerospace electronic products is calculated based on the following formula: in, This indicates the reliability index of the aerospace electronic product. This represents the weight of the impact of the failure of the e-th function on the calculated reliability index of the aerospace electronic product. This indicates the total number of designed functions calculated based on reliability metrics. This represents the total number of statistics for the corresponding e-th function. This represents the number of times the e-th function in the statistics fails within its design life. This indicates the correction factor for electronic components. Let f represent the failure probability of the f-th electronic component corresponding to the e-th function. This represents the failure probability coefficient of the f-th electronic component corresponding to the e-th function. This represents the total number of electronic components corresponding to the e-th function.

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