Wafer handling device and wafer handling method for facilitating positioning

Abstract

The application discloses a wafer carrying device and a wafer carrying method, wherein the wafer carrying device comprises a wafer processing assembly and a wafer placing assembly, the wafer processing assembly comprises a mechanical arm for transmitting a wafer, the wafer placing assembly comprises a wafer carrying bottom plate, a driving element, a positioning unit and a controller, the wafer carrying bottom plate is provided with a wafer placing position, the driving element is connected with the wafer carrying bottom plate, the positioning unit is used for detecting the relative position between the wafer placing position and the mechanical arm, and the controller controls the driving element to drive the wafer carrying bottom plate to move according to the detection result of the positioning unit until the wafer placing position is adapted to the position of the mechanical arm. The wafer carrying device and the wafer carrying method can improve the positioning accuracy of the wafer placing assembly, and improve the wafer carrying efficiency and the carrying accuracy.

Description

Technical Field

[0001] This invention relates to the technical field of wafer handling, and more particularly to a wafer handling device and method that facilitates positioning. Background Technology

[0002] In the semiconductor wafer manufacturing and transfer process, the interoperability between various equipment is crucial, and the position of the wafer transferred from one process to the next must be precise. That is, when a wafer processed in the wafer processing unit needs to be output, the robotic arm in the wafer processing unit outputs the wafer to the wafer placement unit, which is movable. Before each wafer transfer, the wafer placement unit must be accurately moved within the transfer range of the robotic arm.

[0003] In existing technologies, wafer placement assemblies include a profile holder with multiple pads bearing sealing strips at the wafer placement positions. A simulated wafer is placed on these pads, and the profile holder is moved to the position of the robotic arm in the wafer processing assembly. The position of the simulated wafer relative to the robotic arm is visually assessed, and the number and position of the pads are manually adjusted to ensure the simulated wafer is within the robotic arm's range of motion, meeting the requirements for wafer handling. For example, when the height of the simulated wafer needs adjustment, it must be achieved by adding or removing pads, which is cumbersome and inconvenient, and results in significant dimensional deviations; it also poses a risk of wafer damage. Summary of the Invention

[0004] This invention aims to at least partially solve one of the problems in related technologies. Therefore, the object of this invention is to provide a wafer handling device and method that facilitates positioning, thereby improving the positioning accuracy of wafer placement components and increasing wafer handling efficiency and accuracy.

[0005] To achieve the above objectives, this application adopts the following technical solution: a wafer handling device for easy positioning, comprising: Wafer processing assembly, including a robotic arm for transporting wafers; A wafer placement assembly includes a wafer mounting base, a driver, a positioning unit, and a controller. The wafer mounting base has a wafer placement position, and the driver is connected to the wafer mounting base. The positioning unit is used to detect the relative position between the wafer placement position and the robotic arm. The controller controls the driver to move the wafer mounting base according to the detection result of the positioning unit until the wafer placement position is matched with the position of the robotic arm. The wafer placement assembly further includes a profile frame (11) and a mounting plate (13) located in the profile frame (11), and the driving component is located in the mounting plate (13); the end of the driving component is connected to the wafer mounting base plate (23), and the driving component is capable of driving the wafer mounting base plate (23) to move in three-dimensional space; The wafer processing assembly has a first panel (41) and a second panel (42) that are perpendicular to each other on the side near the wafer placement assembly. Both the first panel (41) and the second panel (42) are perpendicular to the ground. The positioning unit includes a first laser sensor (28), a second laser sensor (29), and a third laser sensor (210), which are perpendicular to each other. The first laser sensor (28) and the second laser sensor (29) are used to detect the distance between the first panel (41) and the second panel (42), respectively; the third laser sensor (210) is used to detect the distance to the ground. The third laser sensor (210) is located on the side of the wafer mounting base (23) near the ground, and the mounting plate (13) is provided with a detection notch (20) adapted to the third laser sensor (210).

[0006] Furthermore, the bottom of the profile frame is equipped with casters.

[0007] Furthermore, the driving component includes a first linear motor group, a second linear motor group, and a third linear motor group. The first linear motor group, the second linear motor group, and the third linear motor group are perpendicular to each other, and the first linear motor group is set perpendicular to the ground. The second linear motor group is slidably disposed in the third linear motor group, and the first linear motor group is slidably disposed in the second linear motor group. The wafer mounting base is slidably disposed in the first linear motor group.

[0008] Furthermore, the first laser sensor and the second laser sensor are located on the side of the wafer mounting base away from the ground. When the wafer placement assembly moves to the side of the wafer processing assembly, the first laser sensor and the second laser sensor are respectively aligned with the first panel and the second panel in the wafer processing assembly.

[0009] Furthermore, the upper surface edge of the wafer mounting base is uniformly provided with pad mounting blocks, which are arranged in a circle to fit the wafer; and the pad mounting blocks are provided with pads to support the wafer.

[0010] Furthermore, an in-situ sensor is disposed at the center of the upper surface of the wafer mounting base. The in-situ sensor is communicatively connected to the control terminal and is used to detect whether there is a wafer in the wafer placement position.

[0011] This application provides a wafer handling method, comprising: Move the wafer placement assembly to the side of the wafer processing assembly; The positioning unit detects the relative position between the wafer placement position and the robotic arm, and transmits the detection results to the controller. The controller controls the drive unit to move the wafer mounting base plate according to the detection results until the wafer placement position is within the transmission range of the robotic arm; The robotic arm places the wafers from the wafer processing assembly into the wafer placement positions.

[0012] Compared with the prior art, the technical solution provided in this application has the following advantages: This application provides a wafer handling device for easy positioning, comprising a wafer processing component and a wafer placement component. The wafer processing component includes a robotic arm for transferring wafers; the wafer placement component includes a wafer mounting base, a drive unit, a positioning unit, and a controller. The wafer mounting base has a wafer placement position, and the drive unit is connected to the wafer mounting base. The positioning unit detects the relative position between the wafer placement position and the robotic arm. The controller controls the drive unit to move the wafer mounting base according to the detection result of the positioning unit until the wafer placement position matches the position of the robotic arm. In this application, after the position of the wafer placement component is fixed, the positioning unit can detect the relative distance between the wafer placement position and the robotic arm. The controller can control the drive unit to move the wafer placement position in the wafer mounting base to the working range of the robotic arm according to the detection result, improving the positioning accuracy of the wafer placement position, increasing wafer handling efficiency, and avoiding the risk of wafer damage caused by improper wafer placement.

[0013] This application provides a wafer handling method. After the position of the wafer placement assembly is fixed, the positioning unit can detect the relative distance between the wafer placement position and the robotic arm. The controller can control the drive component to move the wafer placement position in the wafer mounting base to the working range of the robotic arm based on the detection result. This improves the positioning accuracy of the wafer placement position, increases the wafer handling efficiency, and avoids the risk of wafer damage caused by improper wafer placement. Attached Figure Description

[0014] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of the wafer placement assembly in this application; Figure 2This is an exploded view of the wafer placement assembly of this application; Figure 3 This is an enlarged schematic diagram of the wafer mounting substrate of this application; Figure 4 This is an overall schematic diagram of the wafer handling device of this application.

[0017] Reference numerals: 4. Wafer; 11. Profile frame; 12. Casters; 13. Mounting plate; 20. Detection notch; 21. In-situ sensor; 22. In-situ sensor fixture; 23. Wafer mounting base; 24. Top layer pad; 25. Bottom layer pad; 26. Pad mounting block; 27. Connecting and fixing plate; 28. First laser sensor; 29. ​​Second laser sensor; 210. Third laser sensor; 211. Laser sensor fixture; 31. First linear motor assembly; 32. Second linear motor assembly; 33. Third linear motor assembly; 41. First panel; 42. Second panel. Detailed Implementation

[0018] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the referred mechanism or element must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0019] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0020] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail. Example

[0021] Please see Figures 1-4 This application provides a wafer handling device for easy positioning, comprising: The wafer processing assembly includes a robotic arm for transferring wafer 4; The wafer placement assembly includes a wafer mounting base 23, a drive unit, a positioning unit, and a controller. The wafer mounting base 23 has a wafer placement position. The drive unit is connected to the wafer mounting base 23. The positioning unit is used to detect the relative position between the wafer placement position and the robotic arm. The controller controls the drive unit to move the wafer mounting base 23 according to the detection result of the positioning unit until the wafer placement position is matched with the position of the robotic arm.

[0022] After the wafer placement assembly is fixed in position in this application, the positioning unit can detect the relative distance between the wafer placement position and the robotic arm. The controller can control the drive component to move the wafer placement position in the wafer mounting base 23 to the working range of the robotic arm based on the detection result, thereby improving the positioning accuracy of the wafer placement position, improving the wafer handling efficiency, and avoiding the risk of wafer damage caused by improper wafer placement. Example

[0023] This application provides a wafer handling device for easy positioning, comprising: The wafer processing assembly includes a robotic arm for transferring wafer 4; The wafer placement assembly includes a wafer mounting base 23, a drive unit, a positioning unit, and a controller. The wafer mounting base 23 has a wafer placement position. The drive unit is connected to the wafer mounting base 23. The positioning unit is used to detect the relative position between the wafer placement position and the robotic arm. The controller controls the drive unit to move the wafer mounting base 23 according to the detection result of the positioning unit until the wafer placement position is matched with the position of the robotic arm.

[0024] Furthermore, the wafer placement assembly in this application includes a profile frame 11 and a mounting plate 13 located in the profile frame 11, and the driving component is located in the mounting plate 13; the end of the driving component is connected to the wafer mounting base 23, and the driving component can drive the wafer mounting base 23 to move in three-dimensional space.

[0025] In this application, the profile frame 11 can be a cuboid frame or other polygonal frame. The bottom of the profile frame 11 is provided with casters 12, which can drive the entire profile frame 11 to move, so that the profile frame 11 can be moved to the side position of the wafer processing assembly.

[0026] A mounting plate 13 is provided on the upper surface of the profile frame 11. The mounting plate 13 is a horizontal plate parallel to the ground. A drive component is fixed to the upper surface of the mounting plate 13. The drive component includes a wafer mounting base 23, and the drive component can move the wafer mounting base 23 in three-dimensional space. When the profile frame 11 is fixed in position, the drive component can still move the wafer mounting base 23 in three-dimensional space, causing the relative position between the wafer mounting base 23 and the robotic arm or wafer processing assembly to change. This eliminates the need for adjusting the number or position of pads to adjust the wafer placement position, as described in the prior art.

[0027] Furthermore, the driving components in this application include a first linear motor assembly 31, a second linear motor assembly 32, and a third linear motor assembly 33. The first linear motor assembly 31, the second linear motor assembly 32, and the third linear motor assembly 33 are perpendicular to each other, and the first linear motor assembly 31 is set perpendicular to the ground. The second linear motor assembly 32 is slidably disposed in the third linear motor assembly 33, and the first linear motor assembly 31 is slidably disposed in the second linear motor assembly 32. The wafer mounting base plate 23 is slidably disposed in the first linear motor assembly 31.

[0028] In this application, the first linear motor group 31 is set perpendicular to the ground, that is, the extension direction of the first linear motor group 31 is the vertical direction, which is assumed to be the Z-axis direction; then the extension directions of the second linear motor group 32 and the third linear motor group 33 are the X-axis direction and the Y-axis direction, respectively. The first linear motor group 31, the second linear motor group 32, and the third linear motor group 33 in this application have similar structures, each including a corresponding motor and a linear guide rail. For example, the first linear motor group 31 includes a first motor and a first linear guide rail, with the first linear guide rail extending along the Z-axis; the second linear motor group 32 includes a second motor and a second linear guide rail, with the second linear guide rail extending along the X-axis; and the third linear motor group 33 includes a third motor and a third linear guide rail, with the third linear guide rail extending along the Y-axis. The controller is communicatively connected to the first motor, the second motor, and the third motor, and can control the operation of the third motor to adjust the position of the second linear motor group 32 in the Y-axis; the controller can control the operation of the second motor to adjust the position of the first linear motor group 31 in the X-axis; and the controller can control the operation of the first motor to adjust the position of the wafer mounting base 23 in the Z-axis. Therefore, in this application, the controller can adjust the position of the wafer mounting base 23 in three-dimensional space using the first linear motor group 31, the second linear motor group 32, and the third linear motor group 33.

[0029] In this application, a connecting and fixing plate 27 perpendicular to the wafer mounting base 23 can be provided on the side of the wafer mounting base 23, and the wafer mounting base 23 is fixed in the first linear motor group 31 through the connecting and fixing plate 27.

[0030] In this application, a first panel 41 and a second panel 42 that are perpendicular to each other are provided on the side of the wafer processing component near the wafer placement component, and both the first panel 41 and the second panel 42 are perpendicular to the ground. The positioning unit includes a first laser sensor 28, a second laser sensor 29, and a third laser sensor 210, which are perpendicular to each other. The first laser sensor 28 and the second laser sensor 29 are used to detect the distance between the first panel and the second panel, respectively. The third laser sensor 210 is used to detect the distance to the ground.

[0031] Furthermore, the third laser sensor 210 is located on the side of the wafer mounting base 23 closest to the ground. The mounting plate 13 has a detection notch 20 adapted to the third laser sensor 210, or the mounting plate 13 can be configured as a hollow structure. The third laser sensor 210 measures the distance between itself and the ground through the detection notch 20 and feeds the result back to the controller. In this application, the third laser sensor 210 is used to detect the height of the wafer mounting base 23 from the ground. When the height does not reach the set value, the controller can adjust the height of the wafer mounting base 23 through the first linear motor group 31.

[0032] In this application, the first laser sensor 28 and the second laser sensor 29 are located on the side of the wafer mounting base 23 away from the ground. When the wafer placement assembly moves to the side of the wafer processing assembly, the first laser sensor 28 and the second laser sensor 29 are respectively aligned with the first panel 41 and the second panel 42 in the wafer processing assembly. The first laser sensor 28 and the second laser sensor 29 can be fixed in the wafer mounting base 23 by an L-shaped laser sensor holder 211.

[0033] The positions of the first panel 41 and the second panel 42 are fixed, and they are located at the opening of the wafer processing assembly. The robotic arm can extend or retract from the opening to transport the wafer 4. In this application, the positions of the wafer processing assembly are fixed, that is, the positions of the first panel 41, the second panel 42, the opening, and the robotic arm are fixed. The wafer placement assembly can move. When the position of the profile holder 11 is fixed, the driving component can also drive the wafer mounting base 23 to adjust its position in three-dimensional space.

[0034] The upper surface edge of the wafer mounting base 23 is uniformly provided with pad mounting blocks 26, which form a circle adapted to the wafer 4; the pad mounting blocks 26 are provided with pads to support the wafer 4. Figure 2 As shown, there can be three pad mounting blocks, which are evenly distributed at the edge of the upper surface of the wafer mounting base 23. Each pad mounting block 26 has a pad on the side near the center of the wafer mounting base 23. The three pads are used to support the wafer 4 at three positions on the edge, forming a wafer placement position.

[0035] Furthermore, in this application, multiple pads can be set from top to bottom in the same pad mounting block 26, such as... Figure 2As shown, if two pads are provided in the same pad mounting block 26, the upper pad is the top pad 24 and the lower pad is the bottom pad 25. All the top pads 24 are located in the same horizontal plane, forming a wafer placement position; all the bottom pads 25 are located in the same horizontal plane, forming a wafer placement position. This application can also set the distance between the top pad 24 and the bottom pad 25, as well as the distance between the bottom pad 25 and the wafer mounting base plate 23, so that the distance meets the gripping and placement work of the fingers in the robotic arm, avoiding interference with the gripping and placement operation of the robotic arm on the wafer 4.

[0036] In this application, an in-situ sensor 21 is provided at the center of the upper surface of the wafer mounting base 23. The in-situ sensor 21 is communicatively connected to the control terminal and is used to detect whether there is a wafer 4 in the wafer placement position.

[0037] The in-situ sensor 21 can be a laser reflection sensor. The laser emitted by the laser reflection sensor is directed towards the wafer placement position. When the laser emitted by the laser emission sensor is reflected back by the wafer 4, it indicates that the wafer 4 is placed at the wafer placement position. If the laser emitted by the laser emission sensor is not reflected back by the wafer 4, it indicates that the wafer 4 is not placed at the wafer placement position.

[0038] In this application, the positions of the wafer processing components remain fixed, namely, the positions of the first panel 41, the second panel 42, the opening, and the robotic arm. The wafer placement component can move relative to the wafer processing component. When the profile holder 11 moves toward the wafer processing component, the controller controls the first linear motor group 31, the second linear motor group 32, and the third linear motor group 33 to all be at the starting point. When the profile holder 11 moves to the side of the wafer processing component, the third laser sensor 210 measures its distance from the ground through the detection notch 20 in the mounting plate 13. At this time, the first laser sensor 28 and the second laser sensor 29 are facing the first panel 41 and the second panel 42, respectively measuring their distances from the first panel 41 and the second panel 42. The controller calculates the relative position between the wafer placement position and the robotic arm based on the distances measured by the first laser sensor 28, the second laser sensor 29, and the third laser sensor 210. During this calculation, a coordinate system is established with a fixed position within the wafer processing assembly as the origin (the wafer processing assembly remains stationary, ensuring the origin remains fixed). The specific coordinates of the wafer placement position are calculated based on the distances detected by the three laser sensors, while maintaining a constant relative distance between the three laser sensors and the wafer placement position. Finally, based on the specific coordinates of the wafer placement position and the target coordinates, the controller operates the first linear motor group 31, the second linear motor group 32, and the third linear motor group 33, ensuring that the adjusted coordinates of the wafer placement position are at the target coordinate location. During the movement of the wafer 4 mounting plate driven by the drive unit, the three laser sensors continuously measure the distances between the wafer 4 mounting plate and the ground, the first panel, and the second panel. The controller calculates the coordinates of the wafer placement position in real time and continuously adjusts the position of the wafer mounting base plate 23 in three-dimensional space until the wafer mounting base plate 23 is located at the target coordinates.

[0039] It should be noted that in this application, the relative positions of the wafer mounting base 23 and the pad mounting block 26, the first laser sensor 28, the second laser sensor 29 and the third laser sensor 210 fixed on it are all fixed. The distance detected by each laser sensor can be converted into the coordinates of any position in the wafer mounting base 23 in the coordinate system.

[0040] This application also provides a wafer 4 handling method, including the following steps; S1: Move the wafer placement assembly to the side of the wafer processing assembly; the controller controls the first linear motor group 31, the second linear motor group 32, and the third linear motor group 33 to all be located at the starting point. At this time, the third laser sensor 210 is facing the ground through the detection notch 20 in the mounting plate 13, and the first laser sensor 28 and the second laser sensor 29 are facing the first panel and the second panel respectively.

[0041] S2: The positioning unit detects the relative position between the wafer placement position and the robotic arm, and transmits the detection result to the controller. Specifically, the third laser sensor 210 measures its distance from the ground through the detection notch 20 in the mounting plate 13, while the first laser sensor 28 and the second laser sensor 29 measure their distances from the first panel and the second panel, respectively. The distances measured by the first laser sensor 28, the second laser sensor 29, and the third laser sensor 210 are transmitted to the controller.

[0042] S3: The controller controls the drive unit to move the wafer mounting base 23 according to the detection result until the wafer placement position is within the transmission range of the robotic arm.

[0043] The controller calculates the relative position between the wafer placement position and the robotic arm based on the distances measured by the first laser sensor 28, the second laser sensor 29, and the third laser sensor 210. During this calculation, a coordinate system can be established with a fixed location within the wafer processing assembly as the origin. Since the wafer processing assembly remains stationary, using it as the reference point ensures that the origin remains constant. The specific coordinates of the wafer placement position are calculated based on the distances detected by the three laser sensors, while maintaining a constant relative distance between the three laser sensors and the wafer placement position.

[0044] Based on the specific coordinates of the wafer placement position and the target coordinates, the first linear motor group 31, the second linear motor group 32, and the third linear motor group 33 are controlled to operate, ensuring that the adjusted coordinates of the wafer placement position are at the target coordinate location. During the movement of the wafer 4 mounting plate driven by the drive unit, three laser sensors measure the distance between the wafer 4 mounting plate and the ground, the first panel, and the second panel in real time. The controller calculates the coordinates of the wafer placement position in real time and continuously adjusts the position of the wafer mounting base plate 23 in three-dimensional space until the wafer mounting base plate 23 is located at the target coordinates. At this point, the wafer placement position is located at the action point of the robotic arm; that is, when the robotic arm extends from the opening of the wafer processing component, the fingers in the robotic arm are precisely positioned at the wafer placement position. At this time, the robotic arm releases the wafer 4, allowing it to be placed on the wafer placement position. Alternatively, the wafer 4 on the wafer placement position is directly opposite the fingers in the robotic arm; when the fingers tighten, the wafer 4 on the wafer placement position can be gripped.

[0045] S4: The robotic arm places wafer 4 from the wafer processing assembly into the wafer placement position.

[0046] After the wafer placement assembly is fixed in position in this application, the positioning unit can detect the relative distance between the wafer placement position and the robotic arm. The controller can control the drive component to move the wafer placement position in the wafer mounting base 23 to the working range of the robotic arm based on the detection result, thereby improving the positioning accuracy of the wafer placement position, improving the handling efficiency of the wafer 4, and avoiding the risk of damage to the wafer 4 caused by improper placement.

[0047] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A wafer handling device for easy positioning, characterized in that, include: A wafer processing assembly, including a robotic arm for transferring wafers (4); The wafer placement assembly includes a wafer mounting base (23), a drive unit, a positioning unit, and a controller. The wafer mounting base (23) has a wafer placement position, and the drive unit is connected to the wafer mounting base (23). The positioning unit is used to detect the relative position between the wafer placement position and the robotic arm. The controller controls the drive unit to move the wafer mounting base (23) according to the detection result of the positioning unit until the wafer placement position matches the position of the robotic arm. The wafer placement assembly further includes a profile frame (11) and a mounting plate (13) located in the profile frame (11), and the driving component is located in the mounting plate (13); the end of the driving component is connected to the wafer mounting base plate (23), and the driving component can drive the wafer mounting base plate (23) to move in three-dimensional space; The wafer processing assembly has a first panel (41) and a second panel (42) that are perpendicular to each other on the side near the wafer placement assembly. Both the first panel (41) and the second panel (42) are perpendicular to the ground. The positioning unit includes a first laser sensor (28), a second laser sensor (29), and a third laser sensor (210), which are perpendicular to each other. The first laser sensor (28) and the second laser sensor (29) are used to detect the distance between the first panel (41) and the second panel (42), respectively; the third laser sensor (210) is used to detect the distance to the ground. The third laser sensor (210) is located on the side of the wafer mounting base (23) near the ground, and the mounting plate (13) is provided with a detection notch (20) adapted to the third laser sensor (210).

2. The wafer handling device according to claim 1, characterized in that, The bottom of the profile frame (11) is equipped with casters (12).

3. The wafer handling device according to claim 1, characterized in that, The driving components include a first linear motor assembly (31), a second linear motor assembly (32), and a third linear motor assembly (33). The first linear motor assembly (31), the second linear motor assembly (32), and the third linear motor assembly (33) are perpendicular to each other, and the first linear motor assembly (31) is set perpendicular to the ground. The second linear motor assembly (32) is slidably disposed in the third linear motor assembly (33), and the first linear motor assembly (31) is slidably disposed in the second linear motor assembly (32). The wafer mounting base plate (23) is slidably disposed in the first linear motor assembly (31).

4. The wafer handling device according to claim 3, characterized in that, The first laser sensor (28) and the second laser sensor (29) are located on the side of the wafer mounting base (23) away from the ground. When the wafer placement assembly moves to the side of the wafer processing assembly, the first laser sensor (28) and the second laser sensor (29) are respectively aligned with the first panel (41) and the second panel (42) in the wafer processing assembly.

5. The wafer handling device according to claim 1, characterized in that, The upper surface edge of the wafer mounting base (23) is uniformly provided with pad mounting blocks (26), which form a circle that fits the wafer (4); the pad mounting blocks (26) are provided with pads to support the wafer (4).

6. The wafer handling apparatus according to claim 1, characterized in that, A presence sensor (21) is provided at the center of the upper surface of the wafer mounting base (23). The presence sensor (21) is connected to the control terminal and is used to detect whether there is a wafer (4) in the wafer placement position.

7. A method for wafer handling based on the wafer handling apparatus according to any one of claims 1-6, characterized in that, include: Move the wafer placement assembly to the side of the wafer processing assembly; The positioning unit detects the relative position between the wafer placement position and the robotic arm, and transmits the detection results to the controller. The controller controls the drive unit to move the wafer mounting base (23) according to the detection results until the wafer placement position is within the transmission range of the robotic arm; The robotic arm places the wafer (4) from the wafer processing assembly into the wafer placement position.

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