High-precision temporary bonding structure with controllable glue collapse and edge glue overflow and preparation method thereof

Abstract

The application discloses a high-precision temporary bonding structure capable of controlling glue collapse and edge overflow and a preparation method, and belongs to the field of advanced electronic packaging technology. The high-precision temporary bonding structure comprises a bonding sheet, a temporary carrier sheet, an alignment block, an alignment ring, a through channel and temporary bonding glue. One of the bonding sheet and the temporary carrier sheet serves as a substrate for arranging the temporary bonding glue, and the other substrate serves as a substrate for arranging the alignment ring. The alignment block is arranged around the periphery of the temporary bonding glue. The alignment ring is arranged along the periphery of the corresponding area of the temporary bonding glue on the other substrate. The through channel is arranged on the alignment ring, and the alignment block is arranged in correspondence with the through channel.

Description

Technical Field

[0001] This invention belongs to the field of advanced electronic packaging technology, specifically relating to a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow, and its preparation method. Background Technology

[0002] Currently, with Moore's Law, which guides the advancement of technology nodes, slowing down due to the difficulty and cost of R&D, the industry has divided post-Moore's Law era technological development into two directions: continuing Moore's Law and extending Moore's Law. Continuing Moore's Law refers to achieving nodes below 3nm by introducing gate-around nanowires or other new devices, structures, and processes, primarily developed by integrated circuit manufacturers. Extending Moore's Law refers to further improving the overall integration and performance of chips while maintaining cost reduction through 3D integration and 3D packaging technologies. Advanced packaging technology is an important track in extending Moore's Law, offering better compatibility and higher interconnect density, allowing for system integration improvements no longer limited to a single chip.

[0003] Achieving 3D integration using advanced packaging technologies typically requires wafer thinning to achieve high-density product integration. During and after wafer thinning, fragmentation is common, and significant warpage after thinning makes subsequent processes difficult. Therefore, temporary bonding is frequently used in the industry to hold and process thin wafers, with debonding used to separate the wafer from the carrier after processing. However, current temporary bonding technology still suffers from low pre-alignment accuracy, adhesive collapse and misalignment during bonding, and adhesive overflow at the edges after bonding. This leads to insufficient edge support and edge contamination, directly impacting subsequent process steps. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the present invention aims to provide a high-precision temporary bonding structure and preparation method with controllable adhesive collapse and edge overflow, which effectively improves the alignment accuracy of wafer and wafer pre-alignment using mechanical mechanisms or equipment, controls the collapse of temporary bonding adhesive, reduces offset and edge overflow in the bonding process, and further solves the problems of bonding accuracy and edge contamination.

[0005] To achieve the above objectives, the present invention employs the following technical solution:

[0006] This invention provides a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow, including a bonding sheet, a temporary carrier, an alignment block, an alignment ring, a through channel, and temporary bonding adhesive;

[0007] One of the bonding sheet and the temporary carrier serves as the substrate for setting the temporary bonding adhesive, and the other substrate serves as the substrate for setting the alignment ring. The alignment block is arranged around the periphery of the temporary bonding adhesive, and the alignment ring is arranged around the corresponding area of ​​the temporary bonding adhesive on the other substrate. The through channel is formed on the alignment ring, and the alignment block is arranged correspondingly to the through channel.

[0008] In practice, the alignment ring is a ring-shaped raised layer.

[0009] In specific implementation, the distance between the alignment ring and the substrate edge is less than or equal to the distance between the alignment block and the substrate edge.

[0010] In practice, the number of through channels is greater than the number of alignment blocks.

[0011] In specific implementation, the temporary bonding adhesive includes a first layer of temporary bonding adhesive and a second layer of temporary bonding adhesive;

[0012] The first layer of temporary bonding adhesive is disposed in close contact with the bonding surface of the substrate, and the second layer of temporary bonding adhesive is disposed on the first layer of temporary bonding adhesive.

[0013] In the specific implementation process, the first layer of temporary bonding adhesive completely covers the bonding surface of the substrate; the coverage area of ​​the second layer of temporary bonding adhesive is smaller than the coverage area of ​​the first layer of temporary bonding adhesive.

[0014] In the specific implementation process, the second layer of temporary bonding adhesive is connected to the edge of the alignment block, and the alignment ring and the second layer of temporary bonding adhesive form a nested structure.

[0015] In practice, the thickness of the second temporary bonding adhesive layer is greater than the thickness of the alignment ring.

[0016] In the specific implementation process, the length of the edge-removed area of ​​the second layer of temporary bonding adhesive exposed by the first layer of temporary bonding adhesive is 2mm to 10mm.

[0017] This invention also provides a method for preparing a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to any one of the claims, comprising the following steps:

[0018] S1: Select one of the bonding sheet and the temporary carrier as the substrate for setting the temporary bonding adhesive and the alignment block. Prepare the temporary bonding adhesive and the alignment block on the substrate. Prepare the alignment ring on the other substrate and open the through channel on the alignment ring.

[0019] S2: Perform pre-alignment, aligning the temporary bonding adhesive with the alignment ring and the alignment block with the through channel;

[0020] S3: Apply pressure and temperature to bond the bonding surfaces of the two substrates. The alignment block and the through channel are nested together to control the offset during the bonding process. The edge glue overflow is controlled through the through channel to complete the bonding.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention provides a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow. First, the alignment accuracy of the temporary substrate and the bonded substrate is improved by the nested structure of the alignment ring and the temporary bonding adhesive. Second, the alignment accuracy of the temporary substrate and the bonded substrate is further improved and the offset during the bonding process is avoided by the nested structure of the alignment block and the through-channel on the alignment ring. Finally, the position and number of the through-channel on the alignment ring are designed according to the adhesive overflow requirements, which can effectively improve the control of adhesive overflow area, region, and amount. The high-precision temporary bonding structure provided by this invention can effectively solve the problems of insufficient wafer edge support and edge contamination. Attached Figure Description

[0023] Figure 1 This is a cross-sectional schematic diagram of the high-precision temporary bonding structure with controllable adhesive collapse and edge overflow of the present invention.

[0024] Figure 2 This is a top schematic diagram of the alignment ring structure on the bonding sheet of the present invention;

[0025] Figure 3 This is a schematic diagram of the top of the second layer of temporary bonding adhesive structure on the temporary carrier of the present invention;

[0026] Figure 4 This is a cross-sectional structural diagram of the temporary substrate in the form of the present invention.

[0027] Figure 5 This is a schematic cross-sectional view of the first layer of temporary bonding adhesive prepared according to the present invention.

[0028] Figure 6 This is a schematic cross-sectional view of the preparation of a temporary bonding adhesive layer and alignment block according to the present invention.

[0029] Figure 7 This is a schematic cross-sectional view of the temporary carrier and temporary bonding adhesive of the present invention;

[0030] Figure 8 This is a cross-sectional structural diagram of the bonding wafer in its incoming state according to the present invention;

[0031] Figure 9 A schematic cross-sectional view of the alignment ring fabricated according to the present invention;

[0032] Figure 10 This is a schematic cross-sectional view of the pre-aligned bonding sheet and temporary carrier of the present invention.

[0033] Figure 11 This is a schematic cross-sectional view of the bonding sheet and temporary carrier sheet after bonding according to the present invention;

[0034] Figure 12 This is a flowchart illustrating the high-precision temporary bonding preparation process of controllable adhesive collapse and edge overflow according to the present invention.

[0035] Wherein: 1-First layer of temporary bonding adhesive; 2-Alignment block; 3-Second layer of temporary bonding adhesive; 4-Alignment ring; 5-Bump; 6-Through channel; 7-Circuit layer; 100-Bonding sheet; 200-Temporary carrier. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0038] This invention provides a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow, as well as a preparation method thereof.

[0039] The present invention will now be described in further detail with reference to the accompanying drawings:

[0040] The first aspect of this invention provides a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow. The temporary bonding structure includes a temporary carrier 200, temporary bonding adhesive, an alignment block 2, a bonding sheet 100, an alignment ring 4, and a through-channel 6. Both the bonding sheet 100 and the temporary carrier 200 can serve as substrates. The temporary bonding adhesive is selectively disposed on one of the two substrates, and the alignment ring 4 is correspondingly disposed on the other substrate.

[0041] Alignment block 2 is arranged around the periphery of temporary bonding adhesive, alignment ring 4 is arranged around the corresponding area of ​​temporary bonding adhesive on another substrate, through channel 6 is opened on alignment ring 4, and alignment block 2 is arranged correspondingly to through channel 6.

[0042] The temporary carrier 200 serves as a temporary support for the bonding sheet. Its surface is clean and without special structures; it can be made of glass, silicon, metal, ceramic, or other materials, and its shape can theoretically be any. The temporary bonding adhesive is prepared on the entire surface of the temporary carrier 200, with a certain distance removed from the edges. Its function is to adhere the temporary carrier 200 and the bonding sheet 100 together. It can be a single layer, double layer, or multiple layers of adhesive. The bonding sheet 100 is a thinned disc or other shaped sheet, and its surface may have structures such as circuit wiring, dielectric layers, bumps, and microstructures.

[0043] In the specific implementation process, the alignment ring 4 is a ring-shaped raised layer prepared at the edge of the bonding sheet 100. It can be nested with temporary bonding adhesive with a certain distance removed from the edge. Through channels 6 can be prepared regularly or irregularly on the alignment ring 4. It should be noted that the alignment ring 4 can also be prepared on the temporary carrier 200, and the corresponding temporary bonding adhesive can be prepared on the bonding sheet 100, achieving the same effect. The main process is as follows: Figure 12 As shown, the temporary bonding adhesive and alignment ring 4 are interchangeable in the preparation of the substrate.

[0044] In the specific implementation process, the distance between the alignment ring 4 and the substrate edge is less than or equal to the distance between the alignment block 2 and the substrate edge, and the number of through channels 6 opened on the alignment ring 4 is greater than the number of alignment blocks 2.

[0045] In the implementation process with two layers of temporary bonding adhesive, the temporary bonding adhesive includes a first layer of temporary bonding adhesive 1 and a second layer of temporary bonding adhesive 3. The first layer of temporary bonding adhesive 1 is disposed in close contact with the bonding surface of the substrate, and the second layer of temporary bonding adhesive 3 is disposed on the first layer of temporary bonding adhesive 1. The first layer of temporary bonding adhesive 1 completely covers the bonding surface of the substrate; the coverage area of ​​the second layer of temporary bonding adhesive 3 is smaller than the coverage area of ​​the first layer of temporary bonding adhesive 1. The second layer of temporary bonding adhesive 3 is in contact with the edge of the alignment block 2, and the alignment ring 4 and the second layer of temporary bonding adhesive 3 form a nested structure, and the thickness of the second layer of temporary bonding adhesive 3 is greater than the thickness of the alignment ring 4. Preferably, the length of the second layer of temporary bonding adhesive 3 exposing the edge-removed area of ​​the first layer of temporary bonding adhesive 1 is 2mm to 10mm.

[0046] A second aspect of this invention provides a method for preparing a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow, comprising the following steps:

[0047] S1: Select one of the bonding sheet 100 and the temporary carrier 200 as the substrate for setting the temporary bonding adhesive and the alignment block 2. Prepare the temporary bonding adhesive and the alignment block 2 on the substrate. Prepare the alignment ring 4 on the other substrate. Open the through channel 6 on the alignment ring 4.

[0048] S2: Perform pre-alignment, aligning the temporary bonding adhesive with the alignment ring 4 and the alignment block 2 with the through channel 6;

[0049] S3: Apply pressure and temperature to bond the bonding surfaces of the two substrates. Alignment block 2 and through channel 6 are nested together to control the offset during the bonding process. The edge glue overflow is controlled through through channel 6 to complete the bonding.

[0050] More specific temporary bonding processes can be implemented according to the actual product and process conditions. One or more layers of temporary bonding adhesive can be prepared on the temporary carrier 200, and simultaneously, one or more layers of temporary bonding adhesive can be prepared on the bonding sheet 100. For simplicity, the present invention provides a preparation process for preparing two layers of temporary bonding adhesive on the temporary carrier 200, as follows: Figure 2 As shown, the specific preparation process is as follows:

[0051] Step 1: Prepare a first temporary bonding adhesive 1 on the temporary carrier 200. This can be done by coating, lamination, deposition, etc., and the material can be photoresist, organic dielectric, etc.; preferably, coat a light-emitting adhesive layer.

[0052] Step 2: Prepare the alignment block 2 structure on the temporary carrier 200. This can be done by coating, lamination, deposition, photolithography, etching, etc. The material can be photoresist, organic medium, inorganic medium, metal, etc. The alignment block 2 and the alignment ring 4 partially or completely through the channel 6 are nested together. Preferably, a layer of alignment block 2 material is coated, and the structural pattern is prepared by a combination of edge washing and exposure. Then, the alignment block 2 structure is prepared by development.

[0053] Step 3: Prepare a second layer of temporary bonding adhesive 3 on the temporary carrier 200. This can be done by coating, lamination, deposition, photolithography, etching, etc. The edge of the second layer of temporary bonding adhesive 3 is tangent to the edge of the alignment block 2 and nested with the alignment ring 4 on the bonding sheet 100. Preferably, the second layer of temporary bonding adhesive 3 is coated, and the nested structure is achieved by an edge washing process.

[0054] Step 4: Prepare the alignment ring 4 structure on the bonding wafer 100. It can be prepared by coating, lamination, deposition, growth or other methods. The material can be photoresist, organic medium, inorganic medium, metal or other materials. Preferably, a layer of alignment ring 4 material is coated and the alignment ring 4 structure is prepared by cleaning, photolithography, etching or other methods.

[0055] Step 5: Align and nest the temporary carrier 200 and the bonding sheet 100 with each other. Pre-alignment can be performed by mechanical equipment, manual, optical or other methods. Due to the nesting relationship between the second layer of temporary bonding adhesive 3 and the alignment ring 4, and the nesting relationship between the alignment block 2 and the through channel 6, the accuracy of pre-alignment can be effectively improved.

[0056] Step 6: By applying pressure and temperature for a certain period of time, the temporary carrier 200 and the bonding sheet 100 are bonded. Due to the nesting relationship between the alignment block 2 and the through channel 6, the offset during the bonding process can be effectively controlled, and the overflow area and amount of adhesive can be controlled.

[0057] Example

[0058] This embodiment provides a high-precision temporary bonding structure with two layers of temporary bonding adhesive on a temporary carrier 200, exhibiting controllable adhesive collapse and edge overflow. The specific structure is as follows: Figure 1 As shown, the bonding sheet 100 has a circuit layer 7 and bumps 5, and an alignment ring 4 is provided at the edge of the bonding sheet 100. A first layer of temporary bonding adhesive 1 and a second layer of temporary bonding adhesive 3 are sequentially applied to the lower surface of the temporary carrier 200. The first layer of temporary bonding adhesive 1, the alignment block 2, and the second layer of temporary bonding adhesive 3 are located on the temporary carrier 200. The first layer of temporary bonding adhesive 1 completely covers the temporary carrier 200, the alignment block 2 is located at the edge, and the second layer of temporary bonding adhesive 3 covers a large area in the center of the temporary carrier 200, with the edge of the first layer of temporary bonding adhesive 1 exposed and connected to the edge of the alignment block 2. The preferred removal distance of the edge of the second layer of temporary bonding adhesive 3 is within the range of 2mm to 10mm.

[0059] like Figure 2 As shown, the alignment ring 4 on the bonding sheet 100 is located around the edge of the bonding sheet 100, forming a nested structure with the second layer of temporary bonding adhesive 3. A certain number of through channels 6 are prepared on it in a regular or irregular manner, and the through channels 6 are nested with the alignment block 2. The second layer of temporary bonding adhesive 3 can flow to the edge of the bonding sheet 100 through the through channels 6 under controlled conditions, thereby reducing adhesive overflow contamination.

[0060] like Figure 3 As shown, the second layer of temporary bonding adhesive 3 is located in a large area at the center of the temporary carrier 200, with its edge tangent to the alignment block 2 and the distance of its exposed edge equal to the distance of the alignment ring 4, thereby improving the alignment accuracy of the temporary bonding.

[0061] like Figure 4 As shown, the surface of the temporary carrier 200 has no special structure. Preferably, the surface is activated by plasma or solution cleaning to improve the adhesion of subsequent processes; alternatively, a plasma-solution cleaning process can be used.

[0062] like Figure 5As shown, the first layer of temporary bonding adhesive 1 is preferably a photoreactive organic material, but other organic or inorganic materials can also be used. Preparation is preferably done using a coating process, but lamination, deposition, or other processes can also be used. When using a coating process, the method involves first coating a layer of the first layer of temporary bonding adhesive 1 onto the surface of the temporary carrier 200, and then curing the adhesive by baking. The alignment block 2 is preferably made of an organic material, but inorganic media, metals, or other materials can also be used. When an organic material is used as the alignment block 2, it is preferable to coat a layer of alignment block 2 material onto the surface of the temporary carrier 200, with the thickness designed according to the product characteristics, preferably within the range of 2–100 μm. Most of the material is removed through edge washing and photolithography, leaving only a certain number of alignment blocks 2 at a fixed distance from the edge, preferably 2–10 mm from the edge, with the cross-sectional structure as shown. Figure 6 .

[0063] The second temporary bonding adhesive 3 is preferably made of organic material, but inorganic materials can also be used. When an organic material is selected as the second temporary bonding adhesive 3, it is preferable to coat a layer of the second temporary bonding adhesive 3 onto the surface of the temporary carrier 200. The thickness is designed according to the product characteristics, preferably within the range of 2–100 μm. It is also preferable to remove the second temporary bonding adhesive 3 at a fixed edge distance using an edge-washing process, making it tangent to the alignment block 2. The edge removal distance is preferably 2–10 mm, and the cross-sectional structure is as follows: Figure 7 .

[0064] like Figure 8 As shown in the incoming state of the bonding wafer 100, the surface of the bonding wafer 100 has a circuit layer 7 and bumps 5.

[0065] Alignment ring 4 is preferably made of a photosensitive organic material, but non-photosensitive organic materials or inorganic materials can also be used. When a photosensitive organic material is selected, it is preferred to coat it with a layer of photosensitive organic material, but a lamination process can also be used. The thickness should be less than the thickness of the second temporary bonding adhesive 3, and the specific design should be based on the product requirements, within the range of 3 to 90 μm. Figure 9 As shown. When using a coating process, the photosensitive organic material at the edges is first removed using an edge-washing process. Then, an exposure-masking ring with a special pattern is used. A full-surface exposure or edge exposure process combined with a development process is employed to prepare the alignment ring 4. The distance from the edge should be consistent with or slightly smaller than that of the alignment block 2, and the through-channel 6 should partially or completely interlock with the alignment block 2. The preferred range is 2–10 mm. Figure 10 As shown. When non-photosensitive organic or inorganic materials are selected, a layer of material can be prepared by coating, lamination, deposition or other methods, and then the alignment ring 4 can be prepared by patterning, etching and then removing the resist.

[0066] like Figure 10As shown, the bonding sheet 100 prepared with the alignment ring 4 and the temporary carrier 200 prepared with the second layer of temporary bonding adhesive 3 are preferably pre-aligned using a mechanical alignment method. Manual or optical pre-alignment methods can also be used. When using a mechanical alignment method, since the alignment ring 4, the second layer of temporary bonding adhesive 3, the alignment block 2, and the through channel 6 form a nested structure, after mechanical alignment, the alignment status can be determined by checking whether the bonding sheet 100 or the temporary carrier 200 is warped. If any abnormality is found, high-precision alignment can be ensured by re-mechanical alignment or manual adjustment.

[0067] like Figure 11 As shown, the temporary bonding process is completed by applying pressure and temperature for a certain period of time to the bonding sheet 100 and the temporary carrier 200. Since multiple alignment blocks 2 and alignment rings 4 are nested together, slippage in any direction can be prevented during the process. Furthermore, because the alignment rings 4 are provided with a certain number of through channels 6, edge overflow control can be achieved through design, avoiding excessive overflow of temporary bonding adhesive.

[0068] This invention provides a high-precision temporary bonding structure and its fabrication method with controllable adhesive collapse and edge overflow. The nested structure of the alignment ring 4 and the temporary bonding adhesive effectively improves the alignment accuracy of the existing temporary carrier 200 and bonding sheet 100. The nested structure of the alignment block 2 and the through-channel 6 on the alignment ring 4 effectively improves the alignment accuracy of the existing temporary carrier 200 and bonding sheet 100 and avoids misalignment during the bonding process. The through-channel 6 structure can be designed according to the temporary bonding process, and its position and number can be controlled to regulate the location and amount of temporary bonding adhesive overflow during the temporary bonding process, thereby controlling edge overflow. Furthermore, the high-precision temporary bonding structure fabrication method provided by this invention effectively reduces the difficulty of the temporary bonding process.

[0069] The above content is only for illustrating the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made to the technical solution based on the technical concept proposed in this invention shall fall within the scope of protection of the claims of this invention.

Claims

1. A high-precision temporary bonding structure with controllable adhesive collapse and edge overflow, characterized in that, Includes bonding sheet (100), temporary carrier (200), alignment block (2), alignment ring (4), through channel (6) and temporary bonding adhesive; One of the bonding sheet (100) and the temporary carrier (200) serves as the substrate for setting the temporary bonding adhesive, and the other substrate serves as the substrate for setting the alignment ring (4). The alignment block (2) is arranged around the periphery of the temporary bonding adhesive, and the alignment ring (4) is arranged around the periphery of the corresponding area of ​​the temporary bonding adhesive on the other substrate. The through channel (6) is opened on the alignment ring (4), and the alignment block (2) is arranged correspondingly to the through channel (6).

2. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 1, characterized in that, The alignment ring (4) is an annular protrusion layer.

3. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 1, characterized in that, The distance between the alignment ring (4) and the substrate edge is less than or equal to the distance between the alignment block (2) and the substrate edge.

4. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 1, characterized in that, The number of through channels (6) is greater than the number of alignment blocks (2).

5. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 1, characterized in that, The temporary bonding adhesive includes a first layer of temporary bonding adhesive (1) and a second layer of temporary bonding adhesive (3); The first layer of temporary bonding adhesive (1) is disposed in close contact with the bonding surface of the substrate, and the second layer of temporary bonding adhesive (3) is disposed on the first layer of temporary bonding adhesive (1).

6. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 5, characterized in that, The first layer of temporary bonding adhesive (1) completely covers the bonding surface of the substrate; the coverage area of ​​the second layer of temporary bonding adhesive (3) is smaller than the coverage area of ​​the first layer of temporary bonding adhesive (1).

7. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 6, characterized in that, The second layer of temporary bonding adhesive (3) is in contact with the edge of the alignment block (2), and the alignment ring (4) and the second layer of temporary bonding adhesive (3) form a nested structure.

8. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 7, characterized in that, The thickness of the second temporary bonding adhesive (3) is greater than the thickness of the alignment ring (4).

9. The high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to claim 5, characterized in that, The length of the edge-removed area of ​​the second temporary bonding adhesive (3) exposed by the first temporary bonding adhesive (1) is 2mm to 10mm.

10. A method for preparing a high-precision temporary bonding structure with controllable adhesive collapse and edge overflow according to any one of claims 1 to 9, characterized in that, Includes the following steps: S1: Select one of the bonding sheet (100) and the temporary carrier (200) as the substrate for setting the temporary bonding adhesive and the alignment block (2), prepare the temporary bonding adhesive and the alignment block (2) on the substrate, prepare the alignment ring (4) on the other substrate, and open the through channel (6) on the alignment ring (4). S2: Perform pre-alignment, aligning the temporary bonding adhesive with the alignment ring (4) and the alignment block (2) with the through channel (6); S3: Apply pressure and temperature to bond the bonding surfaces of the two substrates. The alignment block (2) and the through channel (6) are nested together to control the offset during the bonding process. The edge overflow of adhesive is controlled through the through channel (6) to complete the bonding.

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