Display panel and manufacturing method of display panel

Abstract

The embodiment of the present application provides a display panel and a manufacturing method of the display panel. In the embodiment, the display panel comprises a driving substrate, a driving electrode located on the driving substrate, a device receiving layer located on the driving substrate and the driving electrode, and a micro light emitting device electrically connected with the driving electrode through the device receiving layer. The device receiving layer has a photocuring material. When the micro light emitting device is transferred to the driving substrate by laser, the photocuring material located on the side of the micro light emitting device is cured or crosslinked to a certain degree when the laser irradiates on the photocuring material, the problem of falling point deviation caused by the flow of the receiving material when the micro light emitting device falls on the device receiving layer can be avoided, and the laser transfer precision of the micro light emitting device is improved, and the manufacturing yield of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel and a method for manufacturing the display panel. Background Technology

[0002] With the continuous development of display technology, miniature light-emitting devices such as mini-LEDs and micro-LEDs are widely used due to their advantages such as excellent brightness, resolution, contrast, energy consumption, lifespan, response speed and thermal stability.

[0003] Display panels using the aforementioned micro-light-emitting devices require the mass transfer of a large number of these devices, fabricated on a growth substrate, to a driving substrate using mass transfer technology during their manufacturing process. Currently, the most common mass transfer technology is laser transfer, which uses a laser to release the micro-light-emitting devices from the carrier substrate and then transfer them in batches to the driving substrate. Laser transfer technology offers high transfer efficiency and flexibility in the area transferred per cycle. However, due to the distance between the carrier substrate and the driving substrate during the transfer process, the landing point of the micro-light-emitting devices can easily shift, affecting the accuracy of the laser transfer and consequently impacting the manufacturing yield of the display panel. Summary of the Invention

[0004] To overcome at least some of the technical problems mentioned in the background section, in a first aspect, embodiments of this application provide a display panel, including...

[0005] Drive substrate;

[0006] The driving electrode is located on the driving substrate;

[0007] A device receiving layer is located on the driving substrate;

[0008] A miniature light-emitting device is placed on the device support layer and electrically connected to the driving electrode;

[0009] The device receiving layer includes a photocurable material.

[0010] Based on one possible implementation of the first aspect, the device receiving layer includes an auxiliary receiving adhesive layer located on the driving substrate and the photocurable material, wherein the photocurable material includes a photocurable material layer located on the auxiliary receiving adhesive layer.

[0011] Based on one possible implementation of the first aspect, the photocurable material layer includes a plurality of photocurable units spaced apart from each other, each photocurable unit corresponding to the position of one of the micro light-emitting devices; the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding photocurable unit on the driving substrate;

[0012] Preferably, the area of ​​the photocuring unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of the corresponding photocuring unit on the driving substrate, and the area of ​​the photocuring unit is larger than the area of ​​the driving electrode.

[0013] Based on one possible implementation of the first aspect, the device receiving layer includes a plurality of device receiving units spaced apart from each other, wherein each device receiving unit corresponds to the position of one of the micro light-emitting devices, and the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding device receiving unit on the driving substrate.

[0014] Based on one possible implementation of the first aspect, the device receiving layer includes an auxiliary receiving adhesive layer located on the driving substrate and a photocurable material layer located on the auxiliary receiving adhesive layer; the auxiliary receiving adhesive layer includes a plurality of auxiliary receiving units spaced apart from each other, and the photocurable material layer includes a plurality of photocurable units spaced apart from each other; one device receiving unit includes one of the auxiliary receiving units and one of the photocurable units stacked together.

[0015] Preferably, the orthographic projection of the photocuring unit on the driving substrate coincides with the orthographic projection of the auxiliary receiving unit on the driving substrate;

[0016] Preferably, the area of ​​the device receiving unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of a corresponding device receiving unit on the driving substrate, and the area of ​​the device receiving unit is larger than the area of ​​the driving electrode.

[0017] Based on one possible implementation of the first aspect, the photocurable material includes an ultraviolet-curable material.

[0018] Secondly, embodiments of this application also provide a method for manufacturing a display panel, the method comprising:

[0019] An auxiliary bonding adhesive layer is formed on a driving substrate with driving electrodes;

[0020] A photocurable material layer is formed on the auxiliary adhesive layer, and the photocurable material layer and the auxiliary adhesive layer form a device receiving layer;

[0021] After aligning the micro-light-emitting device on the carrier substrate with the driving electrode, the micro-light-emitting device is irradiated with a laser from the side of the carrier substrate away from the micro-light-emitting device, causing the micro-light-emitting device to detach from the carrier substrate and transfer to the driving substrate, where it is electrically connected to the driving electrode.

[0022] Based on one possible implementation of the second aspect, a photocurable material layer is formed on the auxiliary receiving adhesive layer, including:

[0023] A photocurable material layer with multiple spaced photocurable units is formed on the auxiliary adhesive layer by a spraying process.

[0024] Preferably, the area of ​​the photocuring unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of the corresponding photocuring unit on the driving substrate, and the area of ​​the photocuring unit is larger than the area of ​​the driving electrode.

[0025] Based on one possible implementation of the second aspect, a photocurable material layer is formed on the auxiliary receiving adhesive layer, including:

[0026] A layer of photocurable material is coated on the auxiliary receiving adhesive layer to form the photocurable material layer;

[0027] The auxiliary adhesive layer and the photocurable material layer of the device receiving layer are patterned to form multiple device receiving units that are spaced apart from each other.

[0028] Each of the device receiving units corresponds to the position of one of the micro light-emitting devices, and the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding device receiving unit on the driving substrate;

[0029] Preferably, the auxiliary receiving adhesive layer includes a plurality of auxiliary receiving units spaced apart from each other, and the photocurable material layer includes a plurality of photocurable units spaced apart from each other; one device receiving unit includes one of the auxiliary receiving units and one of the photocurable units stacked together.

[0030] Preferably, the orthographic projection of the photocuring unit on the driving substrate coincides with the orthographic projection of the auxiliary receiving unit on the driving substrate;

[0031] Preferably, the area of ​​the device receiving unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of a corresponding device receiving unit on the driving substrate, and the area of ​​the device receiving unit is larger than the area of ​​the driving electrode.

[0032] Based on a possible implementation of the second aspect, the characteristic is that the orthogonal projection of the micro light-emitting device on the driving substrate is located within the orthogonal projection of the laser beam irradiating the micro light-emitting device on the driving substrate.

[0033] Preferably, the energy of the laser used to irradiate the micro light-emitting device is lower than the energy density required for the complete curing of the photocurable material, the area of ​​the laser spot is greater than or equal to the area of ​​the photocurable unit, and the orthographic projection of the photocurable unit on the driving substrate is located within the orthographic projection of the laser spot on the driving substrate.

[0034] In summary, compared with the prior art, the display panel and manufacturing method of the display panel provided in this application embodiment provide a photocurable material in the device receiving layer. When the micro light-emitting device is transferred to the driving substrate by laser, the laser emitted from the periphery of the micro light-emitting device irradiates the photocurable material located on the periphery of the micro light-emitting device, causing the photocurable material located on the periphery of the micro light-emitting device to undergo a certain degree of curing or cross-linking. This can avoid the problem of the micro light-emitting device falling onto the device receiving layer and causing the landing point to be misaligned due to the flow of the receiving material, thereby improving the laser transfer accuracy of the micro light-emitting device and increasing the manufacturing yield of the display panel. Attached Figure Description

[0035] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 and Figure 2 This is a schematic diagram of the laser transfer process in a miniature light-emitting device;

[0037] Figure 3 This is one of the structural schematic diagrams of the display panel provided in the embodiments of this application;

[0038] Figure 4 This is a second schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0039] Figure 5 This is the third schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0040] Figure 6 This is a schematic diagram of forming an auxiliary adhesive layer on a driving substrate in the manufacturing method of a display panel provided in this application embodiment;

[0041] Figure 7 This is one of the schematic diagrams showing the formation of a photocurable material layer on the auxiliary adhesive layer in the manufacturing method of the display panel provided in this application embodiment;

[0042] Figure 8 This is one of the schematic diagrams illustrating the transfer of micro-light-emitting devices on a carrier substrate to a driving substrate using laser in the manufacturing method of a display panel provided in this application embodiment;

[0043] Figure 9 This is a second schematic diagram of the formation of a photocurable material layer on the auxiliary adhesive layer in the manufacturing method of the display panel provided in this application embodiment;

[0044] Figure 10 This is a third schematic diagram of the formation of a photocurable material layer on the auxiliary adhesive layer in the manufacturing method of the display panel provided in this application embodiment;

[0045] Figure 11 This is the second schematic diagram of the manufacturing method of the display panel provided in this application, in which a micro light-emitting device on a carrier substrate is transferred to a driving substrate by laser. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0048] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0050] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0051] As mentioned in the background section, such as Figure 1 As shown, in the laser transfer process of commonly used micro-light-emitting devices, an auxiliary receiving adhesive layer 121 is disposed on the driving substrate 100 of the display panel to assist in receiving the micro-light-emitting device 210 that has detached from the carrier substrate 200. Through research on the above-mentioned laser transfer technology, the inventors discovered that this transfer method requires the adhesive material of the auxiliary receiving adhesive layer 121 to maintain a certain degree of wettability during the transfer process. However, after aligning the micro-light-emitting device 210 on the carrier substrate 200 with the driving electrode 110 on the driving substrate 100, when using a laser to peel off the micro-light-emitting device 210 from the carrier substrate 200, the laser irradiating the auxiliary receiving adhesive layer 110 may damage the adhesive material (such as...) in that area. Figure 1 Heating the portion of adhesive material within the dashed circle causes the solvent to evaporate, making this portion of the adhesive material prone to slight flow. This, in turn, causes the micro-light-emitting device 210 to be transferred onto the driving substrate 100, and then the micro-light-emitting device 210 interacts with the driving electrode 110 on the driving substrate 100. Figure 2 The misalignment phenomenon shown affects the transfer landing accuracy of the micro light-emitting device 210, causing the micro light-emitting device 210 to fail to connect electrically with the corresponding driving electrode 110, thereby reducing the manufacturing yield of the display panel.

[0052] It should be noted that the defects in the solutions in the prior art are the result of the inventors’ practice and careful research. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in this embodiment below for the above-mentioned problems should be the inventors’ contributions to this application in the process of invention and creation, and should not be understood as technical content known to those skilled in the art.

[0053] Based on the discovery of the above-mentioned technical problems, the present application provides an innovative display panel and its manufacturing method. By setting a photocurable material on the device receiving layer on the driving substrate of the display panel, the problem of electrical connection failure between the micro light-emitting device and the driving electrode due to possible misalignment of the landing point on the driving substrate during laser transfer is avoided, while improving the transfer efficiency.

[0054] The embodiments for implementing the above-described solutions provided in this application are described below with reference to the accompanying drawings.

[0055] First, please refer to Figure 3 , Figure 3 This is a schematic diagram of a display panel provided in an embodiment of this application.

[0056] The display panel provided in this embodiment includes a driving substrate 100, a driving electrode 110 located on the driving substrate 100, a device support layer 120 located on the driving substrate 100 and the driving electrode 110, and a micro light-emitting device 210 disposed on the device support layer 120 and electrically connected to the driving electrode 110. The device support layer 120 contains a photocurable material.

[0057] The micro light-emitting device 210 may be, but is not limited to, a mini-LED or a micro-LED.

[0058] In one possible implementation of this application, such as Figure 3As shown, the device receiving layer 120 may include an auxiliary receiving adhesive layer 121 located on the driving substrate 100 and a photocurable material layer 122 located on the auxiliary receiving adhesive layer 121. As an alternative example, the auxiliary receiving adhesive layer 121 may be formed of transparent adhesive or flux. For example, the auxiliary receiving adhesive layer 121 may be a transparent optical adhesive layer formed of OCA (Optical Clear Adhesive), OCR (Optical Clear Resin), etc. The photocurable material layer 122 may be an ultraviolet (UV) photocurable material layer. The photocurable material layer 122 may be a single UV photocurable material layer formed on the auxiliary receiving adhesive layer 121 by processes such as spin coating, slot coating, or inkjet printing. The auxiliary receiving adhesive layer 121 may also be a single transparent adhesive layer formed on the driving substrate 100 by processes such as spin coating, slot coating, or inkjet printing. Thus, the orthographic projection of the photocurable material layer 122 on the driving substrate 100 coincides with the orthographic projection of the auxiliary adhesive layer 121 on the driving substrate 100. The orthographic projection on the driving substrate 100 can be understood as the projection on the driving substrate 100 along a direction perpendicular to the plane of the driving substrate 100.

[0059] Please see Figure 4As shown, in another possible implementation of this application, the photocurable material layer 122 includes a plurality of photocurable units 1221 spaced apart from each other, each photocurable unit 1221 corresponding to one of the micro-light-emitting devices 210. Based on this, the orthographic projection of the photocurable material layer 122 on the driving substrate 100 lies within the orthographic projection of the auxiliary adhesive layer 121 on the driving substrate 100, and the orthographic projection of each micro-light-emitting device 210 on the driving substrate 100 lies within the orthographic projection of its corresponding photocurable unit 1221 on the driving substrate 100, such that the area of ​​the photocurable unit 1221 is larger than the area of ​​the micro-light-emitting device 210. Furthermore, the orthographic projection of each driving electrode 110 on the driving substrate 100 lies within the orthographic projection of its corresponding photocurable unit 1221 on the driving substrate 100, such that the area of ​​the photocurable unit 1221 is larger than the area of ​​the driving electrode 110. For example, the area of ​​the photocuring unit 1221 can be slightly larger than the area of ​​the micro-light-emitting device 210, for example, it can be 1.1-1.2 times the area of ​​the micro-light-emitting device 210. The area of ​​the photocuring unit 1221 can also be 1.2-1.5 times the area of ​​the driving electrode 110, but is not limited thereto. The areas of the photocuring unit 1221, the micro-light-emitting device 210, and the driving electrode 110 can be understood as the areas of their respective orthogonal projections onto the driving substrate 100. Thus, by designing the area of ​​the photocuring unit 1221 to be larger than the area of ​​the micro-light-emitting device 210, when the micro-light-emitting device 210 is transferred to the driving substrate 100 by laser, the laser emitted from the periphery of the micro-light-emitting device 210 irradiates the photocuring unit 1221 located on the periphery of the micro-light-emitting device 210. This causes the photocurable material in the photocuring unit 1221 located on the periphery of the micro-light-emitting device 210 to undergo a certain degree of curing or cross-linking. This prevents the micro-light-emitting device 210 from falling onto the device receiving layer 120 due to the flow of the receiving material, thereby improving the laser transfer accuracy of the micro-light-emitting device 210. Furthermore, by setting the photocurable material layer 122 as a plurality of photocurable units 1221 spaced apart from each other, compared to... Figure 3The implementation of the entire photocurable material layer 122 can save on the amount of photocurable material used and reduce production costs. Furthermore, since there is no photocurable material between adjacent photocurable units 1221, during the subsequent laser transfer of the micro-light-emitting device 210, when the photocurable material experiences slight flow due to heating, the reduced amount of photocurable material makes the flow almost imperceptible, further preventing the flow of photocurable material between photocurable units 1221 from affecting the transfer and alignment of the micro-light-emitting device 210.

[0060] Please see Figure 5 As shown, in another possible implementation of this application, the device receiving layer 120 may include a plurality of device receiving units 1201 spaced apart from each other. The auxiliary receiving adhesive layer 121 includes a plurality of auxiliary receiving units 1211 spaced apart from each other, and the photocurable material layer 122 includes a plurality of photocurable units 1221 spaced apart from each other. Each device receiving unit 1201 includes one auxiliary receiving unit 1211 and one photocurable unit 1221, and the auxiliary receiving unit 1211 and the photocurable unit 1221 are stacked sequentially. Each device receiving unit 1201 corresponds to the position of one of the micro-light-emitting devices 210. The orthographic projection of each micro-light-emitting device 210 on the driving substrate 100 lies within the orthographic projection of the corresponding device receiving unit 1201 on the driving substrate 100, and the orthographic projection of the photocurable unit 1221 on the driving substrate 100 may coincide with the orthographic projection of the auxiliary receiving unit 1211 on the driving substrate 100. The orthographic projection of the driving electrode 110 on the driving substrate 100 lies within the orthographic projection of a corresponding device receiving unit 1201 on the driving substrate 100. The device receiving unit 1201 can... Figure 3 The auxiliary adhesive layer 121 and photocurable material layer 122 of the device receiving layer 120 shown are patterned. For example, a patterned photoresist layer can be formed on the photocurable material layer 122, and then the patterned device receiving unit 1201 can be formed by an etching process. This embodiment does not limit the specific formation method of the device receiving unit 1201.

[0061] Thus, the area of ​​the device receiving unit 1201 is designed to be larger than the area of ​​the micro-light-emitting device 210 and the area of ​​the driving electrode 110. When the micro-light-emitting device 210 is transferred to the driving substrate 100 by laser, when the laser emitted from the periphery of the micro-light-emitting device 210 irradiates the photocuring unit 1221 located on the periphery of the micro-light-emitting device 210, the photocuring material located on the periphery of the micro-light-emitting device 210 in the photocuring unit 1221 undergoes a certain degree of curing or cross-linking. This prevents the micro-light-emitting device 210 from falling onto the device receiving layer 120 due to the flow of the receiving material and causing a landing point deviation, thereby improving the laser transfer accuracy of the micro-light-emitting device 210. Furthermore, by setting the device receiving layer 120 as a plurality of device receiving units 1201 spaced apart from each other, compared to... Figure 3 In the embodiment of the entire device receiving layer 120, since there is no photocurable material or auxiliary receiving adhesive between adjacent device receiving units 1201, during the subsequent laser transfer of the micro light-emitting device 210, when the photocurable material and auxiliary receiving adhesive experience slight flow due to heating, the flow is almost imperceptible due to the reduced material usage. This further avoids the impact of the flow of photocurable material and auxiliary receiving adhesive between the photocurable units 1221 on the transfer alignment of the micro light-emitting device 210. The area of ​​the device receiving unit 1201 can also be understood as its orthographic projection area on the driving substrate 100.

[0062] Furthermore, it should be understood that in other implementations, the device receiving layer 120 can also be a separate layer structure. For example, it can be a separate layer structure formed by an auxiliary receiving adhesive material doped with a photocurable material. The auxiliary receiving adhesive material can be, but is not limited to, transparent adhesive, flux, etc. Thus, when forming the device receiving layer 120, a photocurable material can first be doped into the auxiliary receiving adhesive material to form a mixed material composed of the auxiliary receiving adhesive material and the photocurable material. Then, this mixed material is coated on the driving substrate 100 to form the device receiving layer 120. This embodiment does not limit the specific form of the device receiving layer 120.

[0063] In summary, the display panel provided in this application embodiment, by providing a photocurable material layer 122 on the auxiliary receiving adhesive layer 121, when the micro light-emitting device 210 is transferred to the driving substrate 100 by laser, when the laser emitted from the periphery of the micro light-emitting device 210 irradiates the photocurable material layer 122 located on the periphery of the micro light-emitting device 210, the photocurable material on the photocurable material layer 122 located on the periphery of the micro light-emitting device 210 undergoes a certain degree of curing or cross-linking. This can prevent the micro light-emitting device 210 from falling onto the device receiving layer 120 due to the flow of the receiving material and thus improve the laser transfer accuracy of the micro light-emitting device 210.

[0064] Based on the above, this application also provides a method for manufacturing a display panel, which will be described in detail below with reference to the accompanying drawings.

[0065] Step S100, as follows Figure 6 As shown, an auxiliary receiving adhesive layer 121 is formed on a driving substrate 100 having a driving electrode 110.

[0066] Step S200, as follows Figure 7 As shown, a photocurable material layer 122 is formed on the auxiliary receiving adhesive layer 121, and the photocurable material layer 122 and the auxiliary receiving adhesive layer 121 form a device receiving layer 120.

[0067] Step S300, as follows Figure 8 As shown, after aligning the micro-light-emitting device 210 supported on the carrier substrate 200 with the driving electrode 110, the micro-light-emitting device 210 is irradiated with a laser from the side of the carrier substrate 200 away from the micro-light-emitting device 210, so that the micro-light-emitting device 210 is detached from the carrier substrate 200 and transferred to the driving substrate 100, and electrically connected to the driving electrode 110.

[0068] In this embodiment, the energy of the laser used in step S300 is lower than the energy density required for complete curing of the photocurable material in the photocurable material layer 122, and the degree of curing or cross-linking of the photocurable material in the laser-irradiated area is greater than that in the area not irradiated by the laser. For example Figure 8As shown, the area corresponding to the dashed circle is the area irradiated by the laser. The degree of curing or cross-linking of the photocurable material in this area is greater than that of the photocurable material outside the dashed circle. Simultaneously, the orthographic projection of the micro-light-emitting device 210 on the driving substrate 100 lies within the orthographic projection of the laser beam irradiating the micro-light-emitting device 210 on the driving substrate 100. This ensures that a certain range of photocurable material around the micro-light-emitting device 210 is irradiated by the laser and cured or cross-linked, preventing the micro-light-emitting device 210 from being misaligned after landing on the device receiving layer 120 due to the flow of surrounding material.

[0069] After the micro-light-emitting device 210 is detached from the carrier substrate 200 and transferred to the device receiving layer 120, the material between the micro-light-emitting device 210 and the driving electrode 110 can be separated by a bonding and pressing process, thereby forming an electrical connection.

[0070] Furthermore, for step S200, a photocurable material layer 122 having multiple spaced photocurable units 1221 can also be formed on the auxiliary receiving adhesive layer 121 by a spraying process, for example... Figure 9 As shown.

[0071] Alternatively, for step S200, a layer of photocurable material can be coated onto the auxiliary receiving adhesive layer 121 to form a layer such as... Figure 7 The device support layer 120 is shown. Then, as... Figure 10As shown, in step S200, the auxiliary receiving adhesive layer 121 and the photocurable material layer 122 of the device receiving layer 120 can be patterned to form a plurality of device receiving units 1201 spaced apart from each other. Thus, the auxiliary receiving adhesive layer 121 includes a plurality of auxiliary receiving units 1211 spaced apart from each other, and the photocurable material layer 122 includes a plurality of photocurable units 1221 spaced apart from each other. One device receiving unit 1201 is formed by sequentially stacking one auxiliary receiving unit 1211 and one photocurable unit 1221. Each device receiving unit 1201 corresponds to the position of one micro-light-emitting device 210. In this embodiment, the orthographic projection of each micro-light-emitting device 210 on the driving substrate 100 lies within the orthographic projection of a corresponding device receiving unit 1201 on the driving substrate 100, and the orthographic projection of the photocuring unit 1221 on the driving substrate 100 may coincide with the orthographic projection of the auxiliary receiving unit 1211 on the driving substrate 100. For example, the process of patterning the device receiving layer 120 may involve forming a patterned photoresist layer on the photocurable material layer 122, and then forming the patterned device receiving unit 1201 through an etching process. This embodiment does not limit the specific formation method of the device receiving unit 1201.

[0072] In order to further ensure that the micro light-emitting device 210 does not become misaligned during the laser transfer process, the area of ​​the laser spot used to irradiate the micro light-emitting device 210 is greater than or equal to the area of ​​the photocuring unit 1221, and the orthogonal projection of the photocuring unit 1221 on the driving substrate 100 is located within the orthogonal projection of the laser spot on the driving substrate 100.

[0073] To form Figure 10 Taking the patterned multiple device receiving units 1201 as an example, the laser lift-off process for the micro light-emitting device in step S300 is as follows: Figure 11 As shown, when the micro light-emitting device 210 is irradiated with a laser, the photocurable material around the micro light-emitting device 210 is cured or cross-linked to a certain extent due to the laser irradiation. This allows the cured or cross-linked photocurable material to prevent the micro light-emitting device 210 from shifting to the periphery, thereby improving the laser transfer accuracy of the micro light-emitting device 210.

[0074] In summary, the display panel and its manufacturing method provided in this application embodiment, by providing a photocurable material in the device receiving layer 120, when the micro-light-emitting device 210 is transferred to the driving substrate 100 by laser, when the laser emitted from the periphery of the micro-light-emitting device 210 irradiates the photocurable material layer 122 located on the periphery of the micro-light-emitting device 210, the photocurable material located on the periphery of the micro-light-emitting device 210 undergoes a certain degree of curing or cross-linking. This can prevent the micro-light-emitting device 210 from falling onto the device receiving layer 120 due to the flow of the receiving material and causing a landing point deviation, thereby improving the laser transfer accuracy of the micro-light-emitting device 210 and increasing the manufacturing yield of the display panel.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Drive substrate; The driving electrode is located on the driving substrate; A device receiving layer is located on the driving substrate; A miniature light-emitting device is placed on the device support layer and electrically connected to the driving electrode; The device receiving layer includes an auxiliary receiving adhesive layer located on the driving substrate and a photocurable material, wherein the photocurable material includes a photocurable material layer located on the auxiliary receiving adhesive layer; The photocurable material layer includes a plurality of photocurable units spaced apart from each other, each photocurable unit corresponding to the position of one of the micro light-emitting devices; the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding photocurable unit on the driving substrate.

2. The display panel according to claim 1, characterized in that, The area of ​​the photocuring unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of the corresponding photocuring unit on the driving substrate, and the area of ​​the photocuring unit is larger than the area of ​​the driving electrode.

3. The display panel according to claim 1, characterized in that, The device receiving layer includes a plurality of device receiving units spaced apart from each other, wherein each device receiving unit corresponds to the position of one of the micro light-emitting devices, and the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding device receiving unit on the driving substrate.

4. The display panel according to claim 3, characterized in that, The device receiving layer includes an auxiliary receiving adhesive layer located on the driving substrate and a photocurable material layer located on the auxiliary receiving adhesive layer; the auxiliary receiving adhesive layer includes a plurality of auxiliary receiving units spaced apart from each other, and the photocurable material layer includes a plurality of photocurable units spaced apart from each other; each device receiving unit includes a stacked auxiliary receiving unit and a photocurable unit.

5. The display panel according to claim 4, characterized in that, The orthographic projection of the photocuring unit on the driving substrate coincides with the orthographic projection of the auxiliary receiving unit on the driving substrate.

6. The display panel according to claim 4, characterized in that, The area of ​​the device receiving unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of the corresponding device receiving unit on the driving substrate, and the area of ​​the device receiving unit is larger than the area of ​​the driving electrode.

7. The display panel according to claim 1, characterized in that, The photocurable material includes ultraviolet (UV) photocurable material.

8. A method for manufacturing a display panel, characterized in that, The method includes: An auxiliary bonding adhesive layer is formed on a driving substrate with driving electrodes; A photocurable material layer is formed on the auxiliary adhesive layer, and the photocurable material layer and the auxiliary adhesive layer form a device receiving layer; After aligning the micro-light-emitting device on the carrier substrate with the driving electrode, the micro-light-emitting device is irradiated with a laser from the side of the carrier substrate away from the micro-light-emitting device, causing the micro-light-emitting device to detach from the carrier substrate and transfer to the driving substrate, where it is electrically connected to the driving electrode. The photocurable material layer includes a plurality of photocurable units spaced apart from each other, each photocurable unit corresponding to the position of one of the micro light-emitting devices; the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding photocurable unit on the driving substrate.

9. The method for manufacturing a display panel according to claim 8, characterized in that, A photocurable material layer is formed on the auxiliary adhesive layer, including: A photocurable material layer with multiple spaced photocurable units is formed on the auxiliary adhesive layer through a spraying process.

10. The method for manufacturing a display panel according to claim 9, characterized in that, The area of ​​the photocuring unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of the corresponding photocuring unit on the driving substrate, and the area of ​​the photocuring unit is larger than the area of ​​the driving electrode.

11. The method for manufacturing a display panel according to claim 8, characterized in that, A photocurable material layer is formed on the auxiliary adhesive layer, including: A layer of photocurable material is coated on the auxiliary receiving adhesive layer to form the photocurable material layer; The auxiliary adhesive layer and the photocurable material layer of the device receiving layer are patterned to form multiple device receiving units that are spaced apart from each other. Each of the device receiving units corresponds to the position of one of the micro light-emitting devices, and the orthographic projection of each micro light-emitting device on the driving substrate is located within the orthographic projection of the corresponding device receiving unit on the driving substrate.

12. The method for manufacturing a display panel according to claim 11, characterized in that, The auxiliary receiving adhesive layer includes a plurality of auxiliary receiving units spaced apart from each other, and the photocurable material layer includes a plurality of photocurable units spaced apart from each other; one device receiving unit includes one of the auxiliary receiving units and one of the photocurable units stacked together.

13. The method for manufacturing a display panel according to claim 12, characterized in that, The orthographic projection of the photocuring unit on the driving substrate coincides with the orthographic projection of the auxiliary receiving unit on the driving substrate.

14. The method for manufacturing a display panel according to claim 12, characterized in that, The area of ​​the device receiving unit is larger than the area of ​​the micro light-emitting device; the orthographic projection of the driving electrode on the driving substrate is located within the orthographic projection of the corresponding device receiving unit on the driving substrate, and the area of ​​the device receiving unit is larger than the area of ​​the driving electrode.

15. A method for manufacturing a display panel according to any one of claims 8-14, characterized in that, The orthographic projection of the micro-light-emitting device on the driving substrate is located within the orthographic projection of the laser beam irradiating the micro-light-emitting device on the driving substrate.

16. The method for manufacturing a display panel according to claim 15, characterized in that, The energy of the laser used to irradiate the micro light-emitting device is lower than the energy density required for the complete curing of the photocurable material layer. The area of ​​the laser spot is greater than or equal to the area of ​​the photocurable unit, and the orthographic projection of the photocurable unit on the driving substrate is located within the orthographic projection of the laser spot on the driving substrate.

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