A high-reliability drive machine controller

Abstract

The application relates to a high-reliability driving machine controller which comprises an upper protective cover, a lower protective cover, a mounting shell arranged between the upper protective cover and the lower protective cover, a front-end anti-interference assembly, a locking device, a semiconductor inverter assembly and the like, the mounting shell is internally provided with a first shielding cavity, a second shielding cavity, a third shielding cavity and a fourth shielding cavity, the front-end anti-interference assembly is arranged in the first shielding cavity, the locking device, the semiconductor inverter assembly, a three-phase alternating current assembly and a Hall detector are arranged in the second shielding cavity, an energy accumulator and a communication connector are arranged in the third shielding cavity, an integrated circuit board is arranged in the fourth shielding cavity, an input connector is connected with the front-end anti-interference assembly, an input end of the energy accumulator is connected with the front-end anti-interference assembly, an output end of the energy accumulator is connected with the semiconductor inverter assembly, one end of the three-phase alternating current assembly is connected with an output connector through the Hall detector, and the other end of the three-phase alternating current assembly is connected with the semiconductor inverter assembly. Compared with the prior art, the application has the advantages of strong filtering performance and the like.

Description

Technical Field

[0001] This invention relates to drive controllers, and more particularly to a high-reliability drive controller. Background Technology

[0002] The drive controller is one of the core components of an electric vehicle's powertrain system. During operation, the high-speed switching of semiconductor devices in the drive controller often radiates electromagnetic interference, which can severely impact the vehicle's safe operation. Furthermore, the DC current input from the battery to the drive controller typically carries harmonic impurities, potentially damaging the power module. Therefore, EMC (electromagnetic compatibility) design in the drive controller is a key focus of current development. Thermal failure is a significant factor limiting the performance of the drive controller, and an efficient thermal management system can effectively improve its output performance. The core component of the drive controller—the semiconductor switching device—is susceptible to vibration failure under harsh automotive conditions, making the controller's reliability design paramount. Therefore, there is an urgent need to develop a highly reliable drive controller that avoids and optimizes electromagnetic compatibility, heat dissipation, and vibration resistance issues, thereby enabling the entire drive controller to possess advantages such as high filtering capability, high heat dissipation, and high resistance to mechanical vibration. Summary of the Invention

[0003] The purpose of this invention is to provide a highly reliable drive controller, thereby enabling the entire drive controller to have high filtering capability, high heat dissipation and high resistance to mechanical vibration.

[0004] The objective of this invention can be achieved through the following technical solutions:

[0005] A high-reliability drive controller includes an upper protective cover, a lower protective cover, a mounting shell disposed between the upper and lower protective covers, a front-end anti-interference component, a locking device, a semiconductor inverter component, a three-phase AC component, a Hall detector, an energy storage device, a communication connector, an integrated circuit board, an input connector, and an output connector.

[0006] The mounting housing contains a first shielding cavity, a second shielding cavity, a third shielding cavity, and a fourth shielding cavity. The front-end anti-interference component is disposed in the first shielding cavity. The locking device, semiconductor inverter component, three-phase AC component, and Hall detector are disposed in the second shielding cavity. The energy storage device and communication connector are disposed in the third shielding cavity. The integrated circuit board is disposed in the fourth shielding cavity.

[0007] The input connector is connected to the front-end anti-interference component, and the input end of the energy storage device is connected to the front-end anti-interference component; the output end of the energy storage device is connected to the semiconductor inverter component, and one end of the three-phase AC component passes through the Hall detector and is connected to the output connector; the other end is connected to the semiconductor inverter component.

[0008] The controller also includes an outlet pipe and an inlet pipe, which are respectively located at both ends of the mounting housing. The mounting housing also has a cooling water channel that connects the outlet pipe and the inlet pipe, and the cooling water channel passes through the semiconductor inverter assembly.

[0009] The mounting housing is also equipped with a water channel cover.

[0010] The front-end anti-interference component includes a first magnetic core, a mounting carrier, a first set of Y capacitors, a positive copper sheet metal, a negative copper sheet metal, a second magnetic core, a second set of Y capacitors, and a metal shielding cover.

[0011] The mounting carrier includes a first common ground leakage current sheet and a second common ground leakage current sheet, and the mounting carrier is provided with a magnetic core mounting groove, a first groove and a second groove inside.

[0012] The first magnetic core and the second magnetic core are respectively installed into the magnetic core mounting slot of the mounting carrier, and the positive copper sheet metal and the negative copper sheet metal pass through the first magnetic core and the second magnetic core and are fixed on the mounting carrier.

[0013] The first group of Y capacitors is placed in slot 1, and the second group of Y capacitors is placed in slot 2. The pins of the first group of Y capacitors and the second group of Y capacitors are respectively connected to the terminals of the positive copper sheet metal, the negative copper sheet metal, the first common ground leakage current plate, and the second common ground leakage current plate. The metal shielding cover is fixed to the mounting carrier with bolts.

[0014] The locking device includes an inclined iron block, an elastic metal plate, and a metal baffle. The inclined iron block is mounted on the metal baffle via the elastic metal plate.

[0015] The semiconductor inverter assembly includes a semiconductor device and a cooling plate, wherein the semiconductor device is inserted into the cooling plate.

[0016] The three-phase AC assembly includes an AC mounting base, an AC terminal magnetic core, a U-phase copper sheet metal, a V-phase copper sheet metal, and a W-phase copper sheet metal. The AC terminal magnetic core is mounted on and fixed in the AC mounting base. The U-phase, V-phase, and W-phase copper sheet metal are respectively connected to the copper busbar output terminals of the semiconductor device.

[0017] The cooling water channel passes through the cooling plate.

[0018] The first shielding cavity, the second shielding cavity, and the third shielding cavity are located on one side of the mounting shell, and the fourth shielding cavity is located on the other side of the mounting shell.

[0019] The cooling water channel passes sequentially through the third shielding cavity and the semiconductor inverter assembly.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. Excellent Filtering Performance: A highly integrated 4th-order CLCL (capacitor-inductor-capacitor-inductor) anti-interference component is designed at the front end. However, certain frequency noise may not be shielded. Therefore, a metal shielding structure is added to the anti-interference component. This structure forms a magnetically shielded space around the anti-interference component, which can isolate external electromagnetic noise interference and absorb specific frequency harmonics that cannot be filtered out by the magnetic core and Y capacitor. A first, second, third, and fourth shielding cavity are set in the mounting housing. The front-end anti-interference component, semiconductor devices, low-voltage communication connectors, and integrated circuit boards are respectively installed in these four shielding cavities. This effectively prevents high-frequency noise generated by the semiconductor devices from interfering with the bus through spatial coupling, and also avoids high-voltage electromagnetic interference affecting low-voltage communication transmission. Simultaneously, a magnetic core is added to the three-phase output section to filter common-mode electromagnetic interference at the AC end, which helps suppress the generation of motor shaft current. This combined filtering structure design greatly improves the electromagnetic compatibility of the drive controller.

[0022] 2. Integrated Thermal Management System: The drive controller incorporates an integrated cooling water circuit, which cools both the semiconductor devices and the membrane energy storage device simultaneously. Conventional controllers only cool the internal semiconductor devices, neglecting the heat dissipation requirements of the membrane capacitor. With increasing power and frequency, the adverse effects of ESL and ESR (equivalent series inductance and equivalent parasitic resistance) parasitic within the membrane capacitor are amplified, potentially leading to thermal failure of the membrane energy storage device. Therefore, this invention employs an integrated thermal management system to effectively address the risk of thermal failure of the drive controller under harsh operating conditions such as high frequencies.

[0023] 3. Excellent vibration resistance: When the locking device locks the inclined iron block onto the inclined surface of the mounting shell, it generates a horizontal thrust that acts on the elastic metal plate. The elastic metal plate then undergoes a certain amount of elastic deformation, which is stored within it. Under vibration conditions, the elastic metal plate can effectively absorb vibration based on its elastic deformation, thereby improving the vibration resistance of the entire semiconductor device. Especially under harsh conditions of frequent thermal cycling, where the cooling plate undergoes dimensional changes due to thermal expansion and contraction, the elastic metal plate will always maintain a pressing effect on the cooling plate. This structural design significantly improves the vibration resistance of the semiconductor device. Attached Figure Description

[0024] Figure 1 This is an exploded structural diagram of the drive controller of the present invention;

[0025] Figure 2 This is a schematic diagram of the front-end anti-interference structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the mounting carrier in the filtering component of the present invention;

[0027] Figure 4 This is a schematic diagram of the locking device structure of the present invention;

[0028] Figure 5 This is a schematic diagram of the semiconductor inverter component structure of the present invention;

[0029] Figure 6 This is a schematic diagram of the three-phase AC component structure of the present invention;

[0030] Figure 7 This is a schematic diagram of the front structure of the mounting shell of the present invention;

[0031] Figure 8 This is a schematic diagram of the back structure of the mounting shell of the present invention;

[0032] The components include: 1. Upper protective cover; 2. Energy storage device; 3. Water outlet pipe; 4. Front-end anti-interference component; 5. Input connector; 6. Integrated circuit board; 7. Lower protective cover; 8. Water inlet pipe; 9. Locking device; 10. Semiconductor inverter component; 11. Three-phase AC component; 12. Hall detector; 13. Output connector; 14. Communication connector; 15. Mounting shell; 4-1. First magnetic core; 4-2. Mounting carrier; 4-3. First group of Y capacitors; 4-4. Positive copper sheet metal; 4-5. Negative copper sheet metal; 4-6. Second magnetic core; 4-7. Second group of Y capacitors; 4-8. Metal shielding cover; 4-2-1. Magnetic core mounting slot; 4-2 -2. First common ground leakage plate; 4-2-3. No. 1 slot; 4-2-4. Second common ground leakage plate; 4-2-5. No. 2 slot; 9-1. Inclined iron block; 9-2. Elastic metal plate; 9-3. Metal baffle; 10-1. Semiconductor device; 10-2. Cooling plate; 11-1. AC mounting base; 11-2. AC terminal magnetic core; 11-3. U-phase copper sheet metal; 11-4. V-phase copper sheet metal; 11-5. W-phase copper sheet metal; 15-1. First shielding cavity; 15-2. Smooth inclined surface; 15-3. Second shielding cavity; 15-4. Third shielding cavity; 15-5. Water channel cover; 15-6. Fourth shielding cavity. Detailed Implementation

[0033] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0034] A high-reliability drive controller, such as Figures 1 to 8 As shown, it includes an upper protective cover 1, a lower protective cover 7, a mounting shell 15 disposed between the upper protective cover 1 and the lower protective cover 7, a front-end anti-interference component 4, a locking device 9, a semiconductor inverter component 10, a three-phase AC component 11, a Hall detector 12, an energy storage device 2, a communication connector 14, an integrated circuit board 6, an input connector 5, and an output connector 13.

[0035] The mounting housing 15 contains a first shielding cavity 15-1, a second shielding cavity 15-3, a third shielding cavity 15-4, and a fourth shielding cavity 15-6. The front-end anti-interference component 4 is disposed in the first shielding cavity 15-1. The locking device 9, the semiconductor inverter component 10, the three-phase AC component 11, and the Hall detector 12 are disposed in the second shielding cavity 15-3. The energy storage device 2 and the communication connector 14 are disposed in the third shielding cavity 15-4. The integrated circuit board 6 is disposed in the fourth shielding cavity 15-6.

[0036] Input connector 5 is connected to front-end anti-interference component 4, and the input end of energy storage device 2 is connected to front-end anti-interference component 4; the output end of energy storage device 2 is connected to semiconductor inverter component 10, and one end of three-phase AC component 11 passes through Hall detector 12 and is connected to output connector 13; the other end is connected to semiconductor inverter component 10.

[0037] The mounting housing includes a first shielding cavity 15-1, a second shielding cavity 15-3, a third shielding cavity 15-4, and a fourth shielding cavity 15-6. The front-end anti-interference assembly 4, the semiconductor inverter assembly 10, the low-voltage communication connector 14, and the integrated circuit board 6 are respectively installed in the above four shielding cavities. On the one hand, this can effectively prevent the high-frequency noise generated by the semiconductor devices in the semiconductor inverter assembly 10 from interfering with the bus through spatial coupling. On the other hand, it can also avoid the high-voltage side electromagnetic interference from affecting the transmission of low-voltage communication.

[0038] like Figure 2 and Figure 3 As shown, the front-end anti-interference component 4 includes a first magnetic core 4-1, a mounting carrier 4-2, a first group of Y capacitors 4-3, a positive copper sheet metal 4-4, a negative copper sheet metal 4-5, a second magnetic core 4-6, a second group of Y capacitors 4-7, and a metal shielding cover 4-8.

[0039] The mounting carrier 4-2 includes a first common ground leakage piece 4-2-2 and a second common ground leakage piece 4-2-4. The first common ground leakage piece 4-2-2 and the second common ground leakage piece 4-2-4 are integrally injection molded with the plastic body. The mounting carrier 4-2 has a magnetic core mounting groove 4-2-1, a first groove 4-2-3 and a second groove 4-2-5 inside.

[0040] The first magnetic core 4-1 and the second magnetic core 4-6 are respectively installed into the magnetic core mounting groove 4-2-1 of the mounting carrier 4-2 and fixed with potting glue. The positive copper sheet metal 4-4 and the negative copper sheet metal 4-5 pass through the first magnetic core 4-1 and the second magnetic core 4-6 respectively and are fixed on the mounting carrier 4-2.

[0041] The first group of Y capacitors 4-3 is placed in slot 4-2-3, and the second group of Y capacitors 4-7 is placed in slot 4-2-5. They are fixed with potting epoxy resin. The pins of the first group of Y capacitors 4-3 and the second group of Y capacitors 4-7 are electrically connected to the terminals of the positive copper sheet metal 4-4, the negative copper sheet metal 4-5, the first common ground leakage current plate 4-2-2, and the second common ground leakage current plate 4-2-4 respectively by resistance welding. The metal shielding cover 4-8 is fixed above the mounting carrier 4-2 with bolts.

[0042] A highly integrated 4th-order CLCL (capacitor-inductor-capacitor-inductor) anti-interference component 4 was designed at the front end. However, there may be certain frequency bands of impurity noise that cannot be shielded. Therefore, a metal shield 4-8 structure was specially added to the anti-interference component 4. This structure can form a magnetic shielding space around the anti-interference component 4, which can not only isolate external electromagnetic noise interference, but also absorb specific frequency impurity harmonics that cannot be filtered out by the magnetic core and Y capacitor.

[0043] In this embodiment, the controller further includes an outlet pipe 3 and an inlet pipe 8, which are respectively located at both ends of the mounting housing 15. A cooling water channel connecting the outlet pipe 3 and the inlet pipe 8 is also provided inside the mounting housing 15, passing through the semiconductor inverter assembly 10. While cooling the semiconductor devices, the membrane energy storage device is also cooled simultaneously. Conventional controllers only cool the internal semiconductor devices, neglecting the heat dissipation requirements of the membrane capacitor. With increasing power and frequency, the adverse effects of ESL and ESR (equivalent series inductance and equivalent parasitic resistance) parasitic within the membrane capacitor are gradually amplified, potentially leading to thermal failure of the membrane energy storage device. Therefore, the integrated thermal management system of this invention effectively solves the risk of thermal failure of the drive controller under harsh operating conditions such as high frequencies.

[0044] In addition, in this embodiment, the mounting shell 15 is also provided with a water channel cover plate 15-5, which is fixed to the back of the mounting shell 15 by friction stir welding.

[0045] The semiconductor inverter assembly 10 includes a semiconductor device 10-1 and a cooling plate 10-2, wherein the semiconductor device 10-1 is inserted into the cooling plate 10-2, such as... Figure 6 As shown, the three-phase AC assembly 11 consists of an AC mounting base 11-1, an AC terminal magnetic core 11-2, a U-phase copper sheet metal 11-3, a V-phase copper sheet metal 11-4, and a W-phase copper sheet metal 11-5. The AC terminal magnetic core 11-2 is mounted on the AC mounting base 11-1 and fixed by epoxy potting. The U-phase copper sheet metal 11-3, V-phase copper sheet metal 11-4, and W-phase copper sheet metal 11-5 are respectively laser-welded to the copper busbar output terminals of the semiconductor device 10-1.

[0046] Cooling water passes through cooling plate 10-2. Coolant enters the semiconductor inverter assembly 10 from the inlet pipe 8 to cool the semiconductor device first, then flows through the bottom of the energy storage unit 2, and finally flows out from the outlet pipe 3.

[0047] The locking device 9 includes an inclined iron block 9-1, an elastic metal plate 9-2, and a metal baffle 9-3. The inclined iron block 9-1 is mounted on the metal baffle 9-3 via the elastic metal plate 9-2.

[0048] Specifically, the front of the mounting shell 15 is provided with a first shielding cavity 15-1, a smooth inclined surface 15-2, a second shielding cavity 15-3 and a third shielding cavity 15-4; the back of the mounting shell 15 is provided with a water channel cover plate 15-5 and a fourth shielding cavity 15-6.

[0049] The assembly process of this application is as follows:

[0050] First, fix the inlet pipe 8 and the outlet pipe 3 onto the mounting shell 15, and then weld the water channel cover 15-5 to the back of the mounting shell 15 using friction stir welding.

[0051] Furthermore, the first common ground leakage current plate 4-2-2 and the second common ground leakage current plate 4-2-4 are integrally injection molded with the plastic body to obtain the installation carrier 4-2.

[0052] Furthermore, the first magnetic core 4-1 and the second magnetic core 4-6 are respectively installed into the magnetic core mounting groove 4-2-1 of the mounting carrier 4-2 and fixed with potting compound. The positive copper sheet metal 4-4 and the negative copper sheet metal 4-5 pass through the first magnetic core 4-1 and the second magnetic core 4-6 respectively and are fixed on the mounting carrier 4-2.

[0053] Furthermore, the first group of Y capacitors 4-3 and the second group of Y capacitors 4-7 are placed in slot 1 4-2-3 and slot 2 4-2-5 respectively, and fixed with potting epoxy resin; at the same time, the pins of the first group of Y capacitors 4-3 and the second group of Y capacitors 4-7 are electrically connected to the terminals of the positive copper sheet metal 4-4, the negative copper sheet metal 4-5, the first common ground leakage current plate 4-2-2, and the second common ground leakage current plate 4-2-4 respectively by resistance welding.

[0054] Furthermore, the metal shield 4-8 is fixed to the mounting carrier 4-2 with bolts; at this point, the front-end anti-interference component 4 is assembled.

[0055] Furthermore, three semiconductor devices 10-1 are inserted into four cooling plates 10-2 respectively to form a semiconductor inverter assembly 10;

[0056] Furthermore, the AC terminal magnetic ring 11-2 is installed on the AC mounting base 11-1 and fixed by epoxy potting; at the same time, the U-phase copper sheet metal 11-3, V-phase copper sheet metal 11-4 and W-phase copper sheet metal 11-5 are respectively passed through the AC mounting base 11-1 to form a three-phase AC assembly 11;

[0057] Furthermore, the front-end filter assembly 4, energy storage device 2, locking device 9, semiconductor inverter assembly 10, three-phase AC assembly 11, Hall detector 12, output connector 13 and communication connector 14 are sequentially fixed in the first shielding cavity 15-1, the second shielding cavity 15-3 and the third shielding cavity 15-4 of the mounting shell 15;

[0058] The input connector 5 and the output connector 13 are then fixed to both sides of the mounting housing 15 and electrically connected to the front anti-interference component 4 and the three-phase AC component 11 respectively by bolts.

[0059] Furthermore, the integrated circuit board 6 is fixed in the fourth shielding cavity 15-6 on the back of the mounting housing 15, and the pins of the semiconductor device 10-1 are electrically connected to the pin holes of the input connector 5 by wave soldering. At the same time, the lower protective cover 7 is fixed to the back of the mounting housing 15.

[0060] Furthermore, the output terminals of the energy storage device 2 are laser-welded to the positive and negative terminals of the semiconductor device 10-1; the U-phase copper sheet metal 11-3, V-phase copper sheet metal 11-4 and W-phase copper sheet metal 11-5 in the three-phase AC component 11 are laser-welded to the copper busbar output terminals of the semiconductor device 10-1 respectively.

[0061] Next, the upper protective cover 1 is fixed above the mounting housing 15, thus completing the assembly of the drive controller.

Claims

1. A high-reliability drive controller, characterized in that, It includes an upper protective cover (1), a lower protective cover (7), a mounting shell (15) located between the upper protective cover (1) and the lower protective cover (7), a front-end anti-interference component (4), a locking device (9), a semiconductor inverter component (10), a three-phase AC component (11), a Hall detector (12), an energy storage device (2), a communication connector (14), an integrated circuit board (6), an input connector (5), and an output connector (13). The mounting housing (15) is provided with a first shielding cavity (15-1), a second shielding cavity (15-3), a third shielding cavity (15-4), and a fourth shielding cavity (15-6). The front-end anti-interference component (4) is disposed in the first shielding cavity (15-1). The locking device (9), the semiconductor inverter component (10), the three-phase AC component (11), and the Hall detector (12) are disposed in the second shielding cavity (15-3). The energy storage device (2) and the communication connector (14) are disposed in the third shielding cavity (15-4). The integrated circuit board (6) is disposed in the fourth shielding cavity (15-6). The input connector (5) is connected to the front-end anti-interference component (4), and the input end of the energy storage device (2) is connected to the front-end anti-interference component (4); the output end of the energy storage device (2) is connected to the semiconductor inverter component (10), and one end of the three-phase AC component (11) passes through the Hall detector (12) and is connected to the output connector (13); the other end is connected to the semiconductor inverter component (10); The front-end anti-interference component (4) includes a first magnetic core (4-1), a mounting carrier (4-2), a first group of Y capacitors (4-3), a positive copper sheet metal (4-4), a negative copper sheet metal (4-5), a second magnetic core (4-6), a second group of Y capacitors (4-7), and a metal shield (4-8). The metal shield (4-8) is fixed above the mounting carrier (4-2) by bolts. The first group of Y capacitors (4-3), the positive copper sheet metal (4-4), and the negative copper sheet metal (4-5) are all located inside the metal shield (4-8). The locking device (9) includes an inclined iron block (9-1), an elastic metal plate (9-2), and a metal baffle (9-3). The inclined iron block (9-1) is mounted on the metal baffle (9-3) via the elastic metal plate (9-2). The semiconductor inverter assembly (10) includes a semiconductor device (10-1) and a cooling plate (10-2). The semiconductor device (10-1) is inserted into the cooling plate (10-2). When the inclined iron block is locked on the inclined surface of the mounting shell, it generates a horizontal thrust and acts on the elastic metal plate. The elastic metal plate generates elastic deformation and stores it in the elastic metal plate. Under vibration conditions and when the cooling plate undergoes certain dimensional changes due to thermal expansion and contraction, the elastic metal plate always maintains a pressing effect on the cooling plate.

2. The high-reliability drive controller according to claim 1, characterized in that, The controller also includes an outlet pipe (3) and an inlet pipe (8), which are respectively located at both ends of the mounting housing (15). The mounting housing (15) also has a cooling water channel that connects the outlet pipe (3) and the inlet pipe (8), which passes through the semiconductor inverter assembly (10).

3. A high-reliability drive controller according to claim 2, characterized in that, The mounting housing (15) is also provided with a waterway cover (15-5).

4. A high-reliability drive controller according to claim 1, characterized in that, The mounting carrier (4-2) includes a first common ground leakage plate (4-2-2) and a second common ground leakage plate (4-2-4). The mounting carrier (4-2) is provided with a magnetic core mounting groove (4-2-1), a first groove (4-2-3) and a second groove (4-2-5) inside. The first magnetic core (4-1) and the second magnetic core (4-6) are respectively installed in the magnetic core mounting slot (4-2-1) of the mounting carrier (4-2), and the positive electrode copper sheet metal (4-4) and the negative electrode copper sheet metal (4-5) pass through the first magnetic core (4-1) and the second magnetic core (4-6) respectively and are fixed on the mounting carrier (4-2); The first group of Y capacitors (4-3) is located in slot 1 (4-2-3), and the second group of Y capacitors (4-7) is located in slot 2 (4-2-5). The pins of the first group of Y capacitors (4-3) and the second group of Y capacitors (4-7) are respectively connected to the terminals of the positive copper sheet metal (4-4), the negative copper sheet metal (4-5), the first common ground leakage current plate (4-2-2), and the second common ground leakage current plate (4-2-4).

5. A high-reliability drive controller according to claim 2, characterized in that, The cooling water channel passes through the cooling plate (10-2).

6. A high-reliability drive controller according to claim 2, characterized in that, The three-phase AC assembly (11) includes an AC mounting base (11-1), an AC terminal magnetic core (11-2), a U-phase copper sheet metal (11-3), a V-phase copper sheet metal (11-4), and a W-phase copper sheet metal (11-5). The AC terminal magnetic core (11-2) is mounted on the AC mounting base (11-1) and fixed. The U-phase copper sheet metal (11-3), V-phase copper sheet metal (11-4), and W-phase copper sheet metal (11-5) are respectively connected to the copper busbar output terminals of the semiconductor device (10-1).

7. A high-reliability drive controller according to claim 1, characterized in that, The first shielding cavity (15-1), the second shielding cavity (15-3) and the third shielding cavity (15-4) are located on one side of the mounting shell (15), and the fourth shielding cavity (15-6) is located on the other side of the mounting shell (15).

8. A high-reliability drive controller according to claim 2, characterized in that, The cooling water channel passes sequentially through the third shielding cavity (15-4) and the semiconductor inverter assembly (10).

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