一种提高制程稳定性的加工工艺
By using a two-die process, the problem of poor process stability in die-cut products was solved, and the dimensional and process stability of the black protective film and double-sided tape were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU ANJIE TECH
- Filing Date
- 2023-12-06
- Publication Date
- 2026-07-17
AI Technical Summary
In the current die-cutting process, there are too many dimensional relationships between the die-cutting molds, resulting in poor process stability. Adjusting the size of one die-cutting mold will affect the size of other die-cutting molds, making it difficult to achieve the stability requirements.
The process employs a two-die process. The first die is used to process the initial shaping of the black protective film and double-sided adhesive. The second die integrally shapes the inner and outer frames and the double-sided adhesive. The third die punches out the details, reducing the number of workstations and improving process stability.
The dimensional stability of the inner and outer frames of the black protective film and the double-sided adhesive was achieved, with a tolerance within ±0.15mm, reducing the number of workstations and improving the overall stability of the process.
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Figure CN117644555B_ABST