An apparatus and method for processing an electrode catheter

Abstract

The application relates to a processing device of an electrode catheter, which comprises a pressing mechanism, a glue dipping mechanism and a curing mechanism. The pressing mechanism comprises an upper die, a lower die and a driving part. The upper surface of the lower die is provided with a groove, and the groove penetrates at least one end in the extension direction. The glue dipping mechanism comprises a glue dipping main body, which is provided with a glue dipping cavity. The glue dipping cavity has a side edge part around the periphery. The opposite side edge parts are provided with support openings for supporting the catheter. The curing mechanism comprises a cover body, a carrier plate and a curing light source. The cover body is provided with an insertion opening. The carrier plate can be inserted into the insertion opening and make the placing groove in the cover body. A processing method of the electrode catheter is realized by the processing device of the electrode catheter. The device can be used for processing electrode catheters of different specifications through pressing, glue dipping and curing. The device has high specialization, strong applicability, reasonable and novel overall structure design, low cost and convenient use, and greatly improves the processing efficiency.

Description

Technical Field

[0001] This invention belongs to the field of medical device processing technology, specifically relating to a processing device and method for an electrode catheter. Background Technology

[0002] Medical devices play a vital role in the healthcare field, among which interventional medical devices are an important category widely used in the treatment and diagnosis of diseases. Interventional medical devices are medical equipment that enters the human body through blood vessels, skin, or natural cavities to assist doctors in treatment, diagnosis, and prevention. Electrode catheters are one of the commonly used interventional medical devices.

[0003] Common electrode catheters include ablation electrode catheters and shockwave balloon catheters. Ablation electrode catheters ablate abnormal tissue by releasing a high-frequency current from the electrodes; shockwave balloon catheters, on the other hand, generate shock waves by stimulating the fluid in the balloon through current conduction between the electrode pairs to impact the abnormal tissue. Both ablation electrode catheters and shockwave balloon catheters require electrodes.

[0004] In existing electrode conduits: electrode connecting wires form an electrode structure to achieve conductivity, and the electrode structure is then fixed to the outer periphery of the conduit to complete the electrode conduit fabrication. Currently, there is no dedicated device for fabricating electrode conduits. Summary of the Invention

[0005] One object of the present invention is to provide a processing apparatus specifically for electrode conduits.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] An apparatus for processing electrode conduits, comprising:

[0008] Pressing mechanism: used to press an electrode with a wire threaded through it to a set thickness. The pressing mechanism includes an upper mold, a lower mold, and a driving component. The upper surface of the lower mold has a groove that extends through at least one end in its extending direction. The groove is used to place the electrode with the wire threaded through it. The depth of the groove is equal to the set thickness. The driving component is connected to the upper mold and drives the upper mold to move relative to the lower mold.

[0009] Impregnation mechanism: used to impregnate a conduit connected to an electrode with adhesive. The impregnation mechanism includes an impregnation body, which is provided with an impregnation cavity. The impregnation cavity has four enclosed side portions, and support ports for supporting the conduit can be opened on the opposite side portions.

[0010] Curing mechanism: used to cure the electrode conduit after impregnation with resin. The curing mechanism includes a cover, a carrier plate and a curing light source. The cover has an insertion port. The carrier plate is provided with multiple placement slots. The carrier plate can be inserted into the insertion port and the placement slots are located inside the cover. The curing light source is located inside the cover.

[0011] Preferably, the groove in the above technical solution includes a first groove and a second groove, wherein the length of the first groove is greater than the length of the second groove, and wires of different lengths can be pressed together by the first groove and the second groove with different lengths.

[0012] Preferably, in the above technical solution, the first groove and the second groove intersect.

[0013] Preferably, in the above technical solution, the first groove and the second groove are perpendicular.

[0014] Preferably, the side portion of the above technical solution has multiple notches, which connect the inner and outer sides of the impregnation cavity;

[0015] The adhesive impregnation mechanism also includes a first piece, which can be inserted into the notch to close the notch. The first piece is cut open to form the support opening, thereby minimizing the amount of adhesive overflowing from the support opening.

[0016] More preferably, slots are provided on both sides of the notch, and the first piece is inserted into the slots. The first piece can be replaced by plugging and unplugging.

[0017] More preferably, the slots of multiple notches on one of the side portions are connected, and inserting one of the first pieces can close the multiple notches simultaneously. In use, it is only necessary to cut the first piece within the desired notch.

[0018] Preferably, in the above technical solution, the impregnation cavity is provided with a first side group and a second side group, both of which include opposing side portions. The spacing between the side portions in the first side group is greater than the spacing between the side portions in the second side group. The first side group and the second side group with different spacing can support catheters of different lengths.

[0019] In a preferred embodiment of the above technical solution, the impregnation body is further provided with an overflow groove, which is located around the outside of the impregnation cavity to prevent glue leakage.

[0020] Preferably, in the above technical solution, a second piece is provided in the placement groove. The second piece is cut to form a slit for fixing the conduit, thus creating a snug fit and support.

[0021] Preferably, in the above technical solution, the carrier plate includes a frame and a plate body. The frame is at least located on the top and both sides of the plate body. The thickness of the frame is greater than the thickness of the plate body. The placement slot is located on the plate body. The thickness of the plate body matches the width of the insertion port. When the carrier plate is inserted into the insertion port: the plate body is located inside the insertion port, and the frame is located outside the insertion port and fits against the edge of the insertion port. The frame shields the perimeter of the insertion port to prevent ultraviolet light from escaping.

[0022] In a preferred embodiment of the above technical solution, a hollow portion is provided in the middle of the loading plate, and the placement slots are disposed on the loading plates on both sides of the hollow portion.

[0023] Preferably, in the above technical solution, the placement groove extends in the horizontal direction.

[0024] One object of the present invention is to provide a method for processing an electrode conduit.

[0025] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0026] A method for processing an electrode conduit, the method being implemented using the electrode conduit processing apparatus, includes the following steps:

[0027] S1: Insert the wire into the annular metal tube, place the metal tube with the wire inside into the groove of the lower mold of the pressing mechanism, and drive the upper mold to press down, flattening the metal tube to a thickness equal to the depth of the groove, so that the wire is pressed inside the metal tube, forming an electrode connected with the wire.

[0028] S2: Connect the electrode to the conduit to form an electrode conduit. Open the support port on the side of the opposite sides of the impregnation mechanism. Add glue into the impregnation cavity. Support both ends of the conduit at the support port. The electrode is impregnated in the impregnation cavity.

[0029] S3: Take out the dipped conduit, wipe off the excess glue on the electrode surface, place both ends of the dipped conduit into the placement slot of the carrier plate, and then insert the carrier plate into the insertion port of the cover. The glue on the electrode conduit is cured by the curing light source inside the cover.

[0030] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0031] The device of the present invention can be applied to the processing of electrode conduits of different specifications from pressing, impregnation and curing. It is highly specialized and versatile. The overall structure of the device is reasonably and innovative, with low cost and convenient use, which greatly improves the processing efficiency. Attached Figure Description

[0032] Appendix Figure 1 This is a schematic diagram of the pressing mechanism in this invention;

[0033] Appendix Figure 2 This is a schematic diagram of the lower mold of the pressing mechanism in this invention;

[0034] Appendix Figure 3 This is a schematic diagram of the impregnation mechanism in this invention;

[0035] Appendix Figure 4 This is a schematic diagram of the impregnation body of the impregnation mechanism in this invention;

[0036] Appendix Figure 5 This is a schematic diagram of the curing mechanism in this invention;

[0037] Appendix Figure 6 This is a schematic diagram of the curing mechanism carrier plate in this invention.

[0038] In the attached diagrams above:

[0039] 10. Base; 11. Bracket; 12. Upper mold; 13. Lower mold; 130. First groove; 1300. Side inlet; 131. Second groove; 1310. Front inlet; 14. Drive component;

[0040] 20. Base; 21. Support; 22. Impregnated body; 220. Impregnation cavity; 221. Glue overflow groove; 222. Side; 2220. Notch; 2221. Slot; 223. First piece; 2230. Support opening;

[0041] 30. Base plate; 31. Cover body; 310. Insertion port; 32. Loading plate; 320. Placement slot; 321. Hollow part; 322. Frame; 323. Plate body. Detailed Implementation

[0042] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] An electrode conduit processing apparatus mainly includes a pressing mechanism, a resin impregnation mechanism, and a curing mechanism. The following is a detailed description of each mechanism:

[0045] like Figure 1 As shown: The pressing mechanism is used to press the electrode with the wire threaded through it to a set thickness.

[0046] The pressing mechanism includes a base 10, a support 11, an upper mold 12, a lower mold 13, and a driving component 14 (such as a cylinder). The support 11 and lower mold 13 are directly mounted on the base 10. The driving component 14 is connected to the support 11, and the upper mold 12 is connected to the driving component 14. The upper mold 12 is driven by the driving component 14 to move relative to the lower mold 12, thus completing the mold closing.

[0047] The lower surface of the upper mold 12 is smooth; the upper surface of the lower mold 13 has a groove, which extends through at least one end in its extension direction to form an inlet. The depth of the groove is equal to the set thickness, so that different products can be pressed to the set thickness.

[0048] In one embodiment of this invention: the groove includes a first groove 130 and a second groove 131. Both ends of the first groove 130 and the second groove 131 extend through to form insertion inlets. Both ends of the first groove 130 form side insertion inlets 1300. The second groove 131 is blocked at its rear by the bracket 11, with only its front end forming a front insertion inlet 1310. The length of the first groove 130 is greater than the length of the second groove 131. Thus, the first groove 130 can press longer wires, and the second groove 131 can press shorter wires. Figure 2 As shown: the first groove 130 and the second groove 131 are perpendicular and intersect, forming a cross shape.

[0049] The impregnation mechanism is used to impregnate the pressed electrode conduit with resin.

[0050] like Figure 3 , 4As shown: The dipping mechanism includes a base 20, a support 21, and a dipping body 22. The support 21 is mounted on the base 20, and the dipping body 22 is mounted on the support 21. The dipping body 22 has a dipping cavity 220 and an overflow trough 221. The overflow trough 221 is located around the perimeter of the dipping cavity 220. The dipping cavity 220 is used to hold glue and soak the product, while the overflow trough 221 is used to collect glue overflowing from the dipping cavity 220 and prevent glue dripping.

[0051] The impregnation cavity 220 has four surrounding side portions 222, and support openings 2230 for supporting the product can be provided on the opposite side portions 222.

[0052] In one embodiment of this invention, the impregnation cavity 220 is rectangular, having a first side group (the short side of the rectangular impregnation cavity 220) and a second side group (the long side of the rectangular impregnation cavity 220). Both the first and second side groups include opposing side portions 222, with the spacing between the side portions 222 in the first side group being greater than the spacing between the side portions 222 in the second side group. Thus, the support openings 2230 of the side portions 222 in the first side group can support longer products, while the support openings 2230 of the side portions 222 in the second side group can support shorter products.

[0053] Multiple notches 2220 are provided on the side portion 222, connecting the inner and outer sides of the impregnation cavity 220, i.e., connecting the impregnation cavity 220 and the overflow groove 221. In the figure, the notches 2220 are U-shaped. A first piece 223 can be inserted into the notch 2220 to close the notch 2220 and prevent glue from overflowing. After the first piece 223 is cut longitudinally, a support opening 2230 is formed, thereby fixing the product. The first piece 223 can be made of silicone sheet, which can fix the product and prevent damage to the product.

[0054] In one embodiment of this invention: slots 2221 are provided on both sides of the notch 2220, and the first piece 223 is inserted into the slot 2221, that is, the first piece 223 is insertable and replaceable. Preferably, the slots 2221 of the multiple notches 2220 of a side portion 222 are connected, and inserting a first piece 223 can close the multiple notches 2220 at the same time. When fixing the product, it is only necessary to cut the first piece 223 in the required notch 2220 longitudinally.

[0055] The curing mechanism is used to cure the dipped electrode conduit.

[0056] like Figure 5 , 6As shown: The curing mechanism includes a base plate 30, a cover 31, a carrier plate 32, and a curing light source (ultraviolet light source). Specifically: the cover 31 is mounted on the base plate 30 and has an insertion port 310; the carrier plate 32 has multiple placement slots 320, which can be inserted into the insertion port 310, placing the placement slots 320 within the cover 31; and the curing light source is located within the cover 31 to cure the products within the placement slots 320.

[0057] The cover 31 is made of a dark, opaque material to prevent damage from the curing light source (ultraviolet light). An insertion port 310 is located in the middle of the cover 31; alternatively, two covers 31 can be used, with the insertion port 310 formed between them. A hollow portion 321 is formed in the middle of the carrying plate 32, and placement slots 320 are provided on the carrying plates 32 on both sides of the hollow portion 321. The placement slots 320 extend horizontally, and multiple placement slots 320 are distributed vertically.

[0058] In one embodiment of this invention: a second sheet (not shown) is provided in the placement groove 320. The second sheet is cut to form a space for fixing the conduit. The product is pressed into the bottom of the placement groove 320 through the cut space of the second sheet to be fixed, greatly saving product fixing time and facilitating product placement and removal. The second sheet can be made of silicone, cut to different sizes according to the dimensions of different products, fixing the product while preventing damage.

[0059] In one embodiment of this invention: the carrier plate 32 includes a frame 322 and a plate body 323. The frame 322 is at least disposed on the top and both sides of the plate body 323. The thickness of the frame 322 is greater than the thickness of the plate body 323, that is, a step is formed between the frame 322 and the plate body 323. The placement groove 320 is disposed on the plate body 323. The thickness of the plate body 323 matches the width of the insertion port 310. Thus, when the carrier plate 320 is inserted into the insertion port 310: the plate body 323 is located inside the insertion port 310, and the frame 322 is located outside the insertion port 310 and fits against the edge of the insertion port 310, preventing the curing light source (ultraviolet light source) from overflowing.

[0060] The following describes in detail the method for processing electrode conduits using the processing apparatus of this embodiment:

[0061] Pressing step: Insert the wire into the annular metal tube, and place the metal tube with the wire inside into the groove of the lower mold 12. The first groove 130 or the second groove 131 can be selected according to the size of the tube (length, diameter, etc.) and the position of the metal tube. The driving component 14 drives the upper mold 12 to press down, flattening the metal tube to a thickness equal to the depth of the groove, and also pressing the wire inside the metal tube. The flattened metal tube forms an electrode connected with the wire.

[0062] Impregnation step: Connect the electrode with the wire to the conduit to form an electrode conduit. Impregnation is used to reliably connect and fix the electrode and the conduit, preventing the electrode from moving during discharge and causing product failure. Depending on the size of the conduit and the position of the electrode, select either the first side group or the second side group for support. Make a longitudinal cut in the first piece 223 of the opposite side 222 to form a support opening 2230. Add glue into the impregnation cavity 220, and insert both ends of the conduit into the support opening 2230 formed by the cut. The electrode is then impregnated in the impregnation cavity 220. UV glue can be selected. After impregnation, remove the electrode conduit.

[0063] Curing steps: Cut open the second piece in the placement groove 320 of the carrier plate 32, and place the two ends of the dipped conduit into the cut of the second piece to fix it. The conduits on both sides of the electrode are fixed in the placement grooves 320 on both sides of the hollow part 321, and the electrode is located in the area of ​​the hollow part 321. Insert the carrier plate 32 into the insertion port 310 of the cover 31, and cure the UV glue on the electrode conduit with the curing light source in the cover 31. The curing light source can be selected as an ultraviolet light source. After curing is completed, remove the carrier plate 32 and remove the electrode conduit.

[0064] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A processing apparatus for electrode conduits, characterized in that: include: Pressing mechanism: used to press a metal tube with wires inserted to a set thickness to form an electrode connected with wires. The pressing mechanism includes an upper mold, a lower mold, and a driving component. The upper surface of the lower mold has a groove that extends through at least one end in its extending direction. The groove is used to place the metal tube with wires inserted, and the depth of the groove is equal to the set thickness. The driving component is connected to the upper mold and drives the upper mold to move relative to the lower mold. Impregnation mechanism: used to impregnate a conduit connected to an electrode with adhesive. The impregnation mechanism includes an impregnation body and a first piece. The impregnation body is provided with an impregnation cavity. The impregnation cavity has four enclosed side portions. Support openings for supporting the conduit are opened on opposite sides of the side portions. Multiple notches are opened on the side portions. The notches connect the inner and outer sides of the impregnation cavity. The first piece is inserted into the notches to close the notches. The first piece is cut to form the support openings. Curing mechanism: used to cure the electrode conduit after impregnation with resin. The curing mechanism includes a cover, a carrier plate and a curing light source. The cover has an insertion port. The carrier plate is provided with multiple placement slots. The carrier plate is inserted into the insertion port and the placement slots are located in the cover. The curing light source is located in the cover. A second piece is provided in the placement slot. The second piece is cut to form a slit for fixing the conduit.

2. The electrode conduit processing apparatus according to claim 1, characterized in that: The groove includes a first groove and a second groove, wherein the length of the first groove is greater than the length of the second groove.

3. The electrode conduit processing apparatus according to claim 2, characterized in that: The first groove and the second groove intersect; The first groove and the second groove are perpendicular.

4. The electrode conduit processing apparatus according to claim 1, characterized in that: Slots are provided on both sides of the notch, and the first piece is inserted into the slots.

5. The electrode conduit processing apparatus according to claim 4, characterized in that: A slot with multiple notches on one of the side portions is connected, and a first piece is inserted to simultaneously close the multiple notches.

6. The electrode conduit processing apparatus according to claim 1, characterized in that: The impregnation cavity is provided with a first side group and a second side group. The first side group and the second side group each include opposite side portions. The spacing between the side portions in the first side group is greater than the spacing between the side portions in the second side group.

7. The electrode conduit processing apparatus according to claim 1, characterized in that: The impregnation body is also provided with an overflow groove, which is located around the outside of the impregnation cavity.

8. The electrode conduit processing apparatus according to claim 1, characterized in that: The loading plate includes a frame and a plate body. The frame is at least located on the top and both sides of the plate body. The thickness of the frame is greater than the thickness of the plate body. The placement slot is located on the plate body. The thickness of the plate body matches the width of the insertion port. When the loading plate is inserted into the insertion port: the plate body is located inside the insertion port, and the frame is located outside the insertion port and fits against the edge of the insertion port.

9. The electrode conduit processing apparatus according to claim 1, characterized in that: The loading plate has a hollow section in the middle, and the placement slots are arranged on the loading plate on both sides of the hollow section.

10. The electrode conduit processing apparatus according to claim 1, characterized in that: The placement groove extends horizontally.

11. A method for processing an electrode conduit, characterized in that: This method is implemented using the electrode conduit processing apparatus according to any one of claims 1 to 10, and includes the following steps: S1: Insert the wire into the annular metal tube, place the metal tube with the wire inside into the groove of the lower mold of the pressing mechanism, and drive the upper mold to press down, flattening the metal tube to a thickness equal to the depth of the groove, so that the wire is pressed inside the metal tube, forming an electrode connected with the wire. S2: Connect the electrode to the conduit to form an electrode conduit. Open the support port on the side of the opposite sides of the impregnation mechanism. Add glue into the impregnation cavity. Support both ends of the conduit at the support port. The electrode is impregnated in the impregnation cavity. S3: Take out the dipped electrode conduit, wipe off the excess glue on the electrode surface, place both ends of the dipped conduit into the placement slot of the carrier plate, and then insert the carrier plate into the insertion port of the cover. The glue on the electrode conduit is cured by the curing light source inside the cover.

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