A method for preventing condensation and an air conditioning system

Abstract

This invention provides an anti-condensation control method and air conditioning system, relating to the field of air conditioning technology, and solves the technical problem of condensation easily occurring in IPM modules during startup and operation. The method is for preventing condensation on the IPM heat sink of a refrigerant pump air conditioning system in a computer room, including acquiring the ambient temperature T; comparing the acquired ambient temperature T with a preset reference temperature; and performing different levels of anti-condensation treatment based on the comparison result. When the system starts up, this invention acquires the ambient temperature and, based on the ambient temperature range and the relationship between the IPM module temperature and the ambient dew point temperature, controls the opening of the liquid injection electronic expansion valve EXV2. The valve is only opened after the module temperature rises to a certain value, thus avoiding the problem of condensation caused by a large refrigerant flow rate after startup, resulting in a low IPM module temperature.

Description

Technical Field

[0001] This invention relates to the field of air conditioning technology, and in particular to an anti-condensation control method and air conditioning system. Background Technology

[0002] In recent years, increasingly intelligent living has greatly improved people's efficiency and communication convenience. At the same time, data centers have also experienced explosive growth. With the advent of the 5G era, due to the inherent technical characteristics of 5G, the density of base stations is high, leading to an increase in the heat dissipation of data centers. This necessitates the deployment and technological development of more and more data center air conditioning systems.

[0003] During the research and development process of introducing new elements, existing problems have gradually emerged. For example, when introducing refrigerant heat dissipation technology into the inverter air conditioners for computer rooms and in-row computer room air conditioners, during the ultra-low temperature start-up phase, due to the low system pressure at the moment of startup, the temperature of the refrigerant heat dissipation pipe is too low. According to the characteristics of the computer room air conditioning system, there will be a large temperature difference between the inverter drive module and the refrigerant heat dissipation pipe. At this time, when the dew point temperature is reached, a large amount of condensation will appear instantly, causing the inverter module to also produce a large amount of condensation. After long-term use of the air conditioner, some of the three-proof adhesive on the main control and drive boards will peel off. When the condensation is generated on the electrical control board, it will cause short circuits and open circuits. In severe cases, it will cause irreversible major accidents such as board burning and fire. Summary of the Invention

[0004] The purpose of this invention is to provide an anti-condensation control method and an air conditioning system to solve the technical problem that condensation easily occurs in the IPM module during startup and operation in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] In a first aspect, the present invention provides an anti-condensation control method for use in preventing condensation on the IPM heat sink of a refrigerant pump air conditioning system in a computer room, the method comprising:

[0007] Obtain the ambient temperature T;

[0008] The acquired ambient temperature T is compared with the preset reference temperature;

[0009] Based on the comparison results, different levels of anti-condensation treatment were implemented.

[0010] Furthermore, based on the comparison results, the implementation of different levels of anti-condensation treatment includes:

[0011] When the ambient temperature T < the first reference temperature TA, implement the first-level anti-condensation treatment;

[0012] When the first reference temperature TA < ambient temperature T ≤ second reference temperature TB, perform level two anti-condensation treatment;

[0013] When the ambient temperature T is greater than the second reference temperature TB, a level 3 anti-condensation treatment shall be implemented.

[0014] Furthermore, the implementation of the first-level anti-condensation treatment includes:

[0015] Adjust the opening of the electronic expansion valve EXV2 for liquid injection to the initial opening +X;

[0016] Get the IPM module temperature Tipm;

[0017] The acquired IPM module temperature Tipm is compared with the preset first module temperature T1.

[0018] Based on the first-level comparison results, the first-level opening adjustment of the spray electronic expansion valve EXV2 is performed.

[0019] Furthermore, the step of adjusting the first-level opening of the spray electronic expansion valve EXV2 based on the comparison results includes:

[0020] When the IPM module temperature Tipm is greater than or equal to the first module temperature T1, the electronic expansion valve EXV2 is opened by step C1. Then, the IPM module temperature Tipm is acquired once every set first time interval. Based on the newly acquired IPM module temperature Tipm, the comparison is performed again, and the opening degree of the electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0021] When the IPM module temperature Tipm is less than the first module temperature T1, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is continuously set to be less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the second module temperature T2, the step count of the spray electronic expansion valve EXV2 is reduced by C1. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0022] Furthermore, the implementation of the secondary anti-condensation treatment includes:

[0023] Adjust the opening of the electronic expansion valve EXV2 to the initial opening +Z;

[0024] Get the IPM module temperature Tipm;

[0025] The acquired IPM module temperature Tipm is compared with the preset third module temperature T3 in a secondary comparison.

[0026] Based on the results of the secondary comparison, the secondary opening adjustment of the spray electronic expansion valve EXV2 is performed.

[0027] Furthermore, the step of adjusting the secondary opening of the spray electronic expansion valve EXV2 based on the secondary comparison results includes:

[0028] When the temperature Tipm of the IPM module is greater than or equal to the temperature of the third module T3, the electronic expansion valve EXV2 is opened by step C2. Then, the temperature Tipm of the IPM module is acquired once every set first time interval. Based on the newly acquired temperature Tipm of the IPM module, the comparison is performed again, and the opening degree of the electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0029] When the IPM module temperature Tipm is less than the third module temperature T3, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the fourth module temperature T4, the step count of the spray electronic expansion valve EXV2 is reduced by C2. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0030] Furthermore, the implementation of the three-level anti-condensation treatment includes:

[0031] Adjust the opening of the electronic expansion valve EXV2 to the initial opening + Y;

[0032] Get the IPM module temperature Tipm;

[0033] The acquired IPM module temperature Tipm is compared with the preset fifth module temperature T5 in three levels.

[0034] Based on the three-level comparison results, the three-level opening adjustment of the spray electronic expansion valve EXV2 is executed.

[0035] Furthermore, the three-stage opening adjustment of the spray electronic expansion valve EXV2 based on the three-stage comparison results includes:

[0036] When the temperature Tipm of the IPM module is greater than or equal to the temperature of the fifth module T5, the opening of the spray electronic expansion valve EXV2 is increased by step C3. Then, the temperature Tipm of the IPM module is acquired once every set first time interval. Based on the newly acquired temperature Tipm of the IPM module, the comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0037] When the IPM module temperature Tipm is less than the fifth module temperature T5, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the sixth module temperature T6, the step count of the spray electronic expansion valve EXV2 is reduced by C3. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0038] The anti-condensation control method provided by this invention is an anti-condensation control method for the IPM module of a computer room air conditioning refrigerant pump system. When the system starts up, the ambient temperature is acquired, and the opening degree of the liquid injection electronic expansion valve EXV2 is controlled according to the ambient temperature range and the relationship between the IPM module temperature and the ambient dew point temperature. The valve is opened only after the module temperature rises to a certain value to avoid the problem of condensation caused by the large refrigerant flow rate after startup and the low temperature of the IPM module.

[0039] Secondly, the present invention provides an air conditioning system for performing the method.

[0040] Furthermore, the air conditioning system includes an evaporator, an IPM heat dissipation circuit, an IPM heat dissipation plate, a liquid injection electronic expansion valve EXV2, a capillary tube, and a liquid injection return temperature sensing bulb. The two ends of the IPM heat dissipation circuit are respectively connected to the upstream and downstream sides of the evaporator. The IPM heat dissipation plate is installed in the IPM heat dissipation circuit. The liquid injection electronic expansion valve EXV2 and the capillary tube are sequentially connected to the IPM heat dissipation circuit on one side of the IPM heat dissipation plate. The liquid injection return temperature sensing bulb is connected to the IPM heat dissipation circuit on the other side of the IPM heat dissipation plate.

[0041] The air conditioning system provided by this invention adds an IPM heat dissipation circuit to the original refrigerant pump system in the computer room to meet and execute anti-condensation control. This IPM heat dissipation circuit is equipped with a liquid injection electronic expansion valve EXV2, a capillary tube, and a liquid injection return gas temperature sensing bulb. An IPM heat sink is also placed on the IPM heat dissipation circuit. By adding some components, the system can realize anti-condensation logic, avoiding and solving the problem of condensation in the IPM module during startup and operation. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a control flowchart of an anti-condensation control method according to the present invention;

[0044] Figure 2 A flowchart of an embodiment of the anti-condensation control method for computer room modules according to the present invention;

[0045] Figure 3 This is a system structure diagram of the air conditioning system of the present invention.

[0046] In the diagram: 1. Evaporator; 2. IPM heat sink; 3. Liquid spray electronic expansion valve EXV2; 4. Capillary tube; 5. Liquid spray return temperature sensor. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0048] like Figure 1 As shown, the present invention provides an anti-condensation control method for an IPM heat sink in a computer room refrigerant pump air conditioning system. The method includes:

[0049] S10, Obtain the ambient temperature T;

[0050] S20. Compare the acquired ambient temperature T with the preset reference temperature;

[0051] S30. Based on the comparison results, implement different levels of anti-condensation treatment, including:

[0052] (1) When the ambient temperature T < the first reference temperature TA, implement Level 1 anti-condensation treatment, including:

[0053] Adjust the opening of the electronic expansion valve EXV2 for liquid injection to the initial opening +X;

[0054] Obtain the IPM module temperature Tipm; it should be noted here that the IPM module temperature Tipm is the liquid return temperature (the temperature of the IPM module outlet pipe), which is the temperature value obtained through the liquid return temperature sensor.

[0055] The obtained IPM module temperature Tipm is compared with the preset first module temperature T1. Based on the obtained Tipm temperature, it can be determined whether it is lower than the dew point temperature. If it is lower than the dew point temperature, water will be generated in the module, and corresponding adjustment processing will be performed.

[0056] Based on the first-level comparison results, the first-level opening adjustment of the spray electronic expansion valve EXV2 is performed, specifically as follows:

[0057] When the IPM module temperature Tipm is greater than or equal to the first module temperature T1, the electronic expansion valve EXV2 is opened by step C1. Then, the IPM module temperature Tipm is acquired once every set first time interval. Based on the newly acquired IPM module temperature Tipm, the comparison is performed again, and the opening degree of the electronic expansion valve EXV2 is dynamically adjusted according to the comparison result. The first time interval is 30 minutes.

[0058] When the IPM module temperature Tipm is less than the first module temperature T1, the step count of the spray electronic expansion valve EXV2 remains constant. Then, when the EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the second module temperature T2, the EXV2 step count is reduced by C1. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result. The second time period is 2 minutes. The second module temperature T2 = the first module temperature T1 - 15℃.

[0059] Based on the obtained Tipm temperature, the electronic expansion valve is controlled in stages for more precise and gradual control, preventing module condensation problems.

[0060] like Figure 2 As shown, when the machine room refrigerant pump air conditioner is turned on, when the ambient temperature T < the first reference temperature TA and the compressor is detected to be turned on, the liquid injection electronic expansion valve EXV2 is adjusted to the initial opening degree +X, and the IPM module temperature is detected.

[0061] When the temperature Tipm of the IPM module is detected to be greater than or equal to the temperature of the first module T1, the electronic expansion valve EXV2 of the liquid spraying system opens C1 by step number.

[0062] When the temperature Tipm of the IPM module is detected to be less than the temperature of the first module T1, the step count of the spray electronic expansion valve EXV2 remains unchanged.

[0063] Continuing the monitoring, when the temperature of the liquid injection electronic expansion valve EXV2 (TEXV2 ≤ Tdt) is continuously detected for 2 minutes, and Tipm ≤ T2 (T1 - 15℃ = T2), the liquid injection electronic expansion valve EXV2 is closed by step C1. Here, the temperature TEXV2 of the liquid injection electronic expansion valve refers to the temperature between the outlet pipe of the liquid injection electronic expansion valve EXV2 and the inlet pipe of the IPM module. This prevents the expansion valve from being oversized, which could lead to premature refrigerant leakage; thus, the electronic expansion valve is not opened initially to ensure reliability. In this invention, all temperatures are obtained through hardware temperature sensors, and then the unit software acquires the data.

[0064] The IPM module temperature is checked every 30 minutes and dynamically adjusted.

[0065] (2) When the first reference temperature TA < ambient temperature T ≤ second reference temperature TB, perform secondary anti-condensation treatment, including:

[0066] Adjust the opening of the electronic expansion valve EXV2 to the initial opening +Z;

[0067] Get the IPM module temperature Tipm;

[0068] The acquired IPM module temperature Tipm is compared with the preset third module temperature T3 in a secondary comparison.

[0069] Based on the secondary comparison results, the secondary opening adjustment of the spray electronic expansion valve EXV2 is performed, specifically as follows:

[0070] When the temperature Tipm of the IPM module is greater than or equal to the temperature of the third module T3, the electronic expansion valve EXV2 is opened by step C2. Then, the temperature Tipm of the IPM module is acquired once every set first time interval. Based on the newly acquired temperature Tipm of the IPM module, the comparison is performed again, and the opening degree of the electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0071] When the IPM module temperature Tipm is less than the third module temperature T3, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the fourth module temperature T4, the step count of the spray electronic expansion valve EXV2 is reduced by C2. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0072] like Figure 2 As shown, upon powering on, the refrigerant pump air conditioner in the computer room starts running. When the ambient temperature TA≤T≤TB and the compressor is detected to be running, EXV2 is adjusted to the initial opening degree +Z, and the temperature of the IPM module is detected.

[0073] When Timm ≥ T3 is detected, the spray electronic expansion valve EXV2 opens C2 by the next step.

[0074] When Tipm < T3 is detected, the EXV2 step count of the liquid injection electronic expansion valve remains unchanged.

[0075] Continue testing. When TEXV2≤Tdt and Tipm≤T4 (T3-15℃=T4) are detected for 2 consecutive minutes, the electronic expansion valve EXV2 is closed by step C2.

[0076] The IPM module temperature is checked every 30 minutes and dynamically adjusted.

[0077] (3) When the ambient temperature T > the second reference temperature TB, implement Level 3 anti-condensation treatment, including:

[0078] Adjust the opening of the electronic expansion valve EXV2 to the initial opening + Y;

[0079] Get the IPM module temperature Tipm;

[0080] The acquired IPM module temperature Tipm is compared with the preset fifth module temperature T5 in three levels.

[0081] Based on the three-level comparison results, the three-level opening adjustment of the spray electronic expansion valve EXV2 is executed, specifically as follows:

[0082] When the temperature Tipm of the IPM module is greater than or equal to the temperature of the fifth module T5, the opening of the spray electronic expansion valve EXV2 is increased by step C3. Then, the temperature Tipm of the IPM module is acquired once every set first time interval. Based on the newly acquired temperature Tipm of the IPM module, the comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0083] When the IPM module temperature Tipm is less than the fifth module temperature T5, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the sixth module temperature T6, the step count of the spray electronic expansion valve EXV2 is reduced by C3. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

[0084] like Figure 2 As shown, upon power-on, the refrigerant pump air conditioner in the computer room starts running. When the ambient temperature T > TB, the compressor is detected to be running, EXV2 is adjusted to the initial opening degree + Y, and the temperature of the IPM module is detected.

[0085] When Timm ≥ T5 is detected, the spray electronic expansion valve EXV2 opens C3 by the next step.

[0086] When it is detected that T≥T5, the number of steps of the spray electronic expansion valve EXV2 remains unchanged.

[0087] Continue testing. When TEXV2≤Tdt and Tipm≤T6 (T5-15℃=T6) are detected for 2 consecutive minutes, the electronic expansion valve EXV2 is closed by step C3.

[0088] The IPM module temperature is checked every 30 minutes and dynamically adjusted.

[0089] It should be noted here that the first reference temperature TA < the second reference temperature TB, T1 < T3 < T5, X < Z < Y, T2 < T4 < T6, and C1 < C2 < C3.

[0090] The anti-condensation control method provided by this invention is an anti-condensation control method for the IPM module of a computer room air conditioning refrigerant pump system. When the system starts up, the ambient temperature is acquired, and the opening degree of the liquid injection electronic expansion valve EXV2 is controlled according to the ambient temperature range and the relationship between the IPM module temperature and the ambient dew point temperature. The valve is opened only after the module temperature rises to a certain value to avoid the problem of condensation caused by the large refrigerant flow rate after startup and the low temperature of the IPM module.

[0091] like Figure 3 As shown, the present invention provides an air conditioning system for performing a method.

[0092] Furthermore, the air conditioning system includes an evaporator 1, an IPM heat dissipation circuit, an IPM heat dissipation plate 2, an electronic expansion valve EXV23, a capillary tube 4, and an injection return gas temperature sensing bulb 5. The two ends of the IPM heat dissipation circuit are connected to the upstream and downstream sides of the evaporator 1, respectively. The IPM heat dissipation plate 2 is installed in the IPM heat dissipation circuit. The electronic expansion valve EXV23 and the capillary tube 4 are connected in sequence to the IPM heat dissipation circuit on one side of the IPM heat dissipation plate 2. The injection return gas temperature sensing bulb 5 is connected to the IPM heat dissipation circuit on the other side of the IPM heat dissipation plate 2.

[0093] The air conditioning system provided by this invention adds an IPM heat dissipation circuit to the original refrigerant pump system in the computer room to meet and execute anti-condensation control. This IPM heat dissipation circuit is equipped with a liquid injection electronic expansion valve EXV2, a capillary tube, and a liquid injection return gas temperature sensing bulb. An IPM heat sink is also placed on the IPM heat dissipation circuit. By adding some components, the system can realize anti-condensation logic, avoiding and solving the problem of condensation in the IPM module during startup and operation.

[0094] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for preventing condensation control, characterized in that, A method for preventing condensation on an IPM heat sink plate in a refrigerant pump air conditioning system for a computer room, wherein the air conditioning system includes an evaporator, an IPM heat sink plate, an IPM heat dissipation circuit, and a liquid injection electronic expansion valve EXV2; the two ends of the IPM heat dissipation circuit are respectively connected to the upstream and downstream sides of the evaporator; the IPM heat sink plate is installed in the IPM heat dissipation circuit; the liquid injection electronic expansion valve EXV2 is connected to the IPM heat dissipation circuit on one side of the IPM heat sink plate; the method includes: Obtain the ambient temperature T; The acquired ambient temperature T is compared with the preset reference temperature; When the ambient temperature T < the first reference temperature TA, the first-level anti-condensation treatment is performed, including: controlling the opening of the spray electronic expansion valve EXV2 to the initial opening +X; acquiring the IPM module temperature Tipm; comparing the acquired IPM module temperature Tipm with the preset first module temperature T1; and adjusting the first-level opening of the spray electronic expansion valve EXV2 based on the first-level comparison result. When the first reference temperature TA < ambient temperature T ≤ second reference temperature TB, a secondary anti-condensation treatment is performed, including: adjusting the opening of the spray electronic expansion valve EXV2 to the initial opening + Z; acquiring the IPM module temperature Tipm; comparing the acquired IPM module temperature Tipm with the preset third module temperature T3 in a secondary manner; and adjusting the secondary opening of the spray electronic expansion valve EXV2 based on the secondary comparison result. When the ambient temperature T > the second reference temperature TB, a three-level anti-condensation treatment is performed, including: adjusting the opening of the spray electronic expansion valve EXV2 to the initial opening + Y; acquiring the IPM module temperature Tipm; comparing the acquired IPM module temperature Tipm with the preset fifth module temperature T5 in three levels; and adjusting the opening of the spray electronic expansion valve EXV2 in three levels based on the three-level comparison results.

2. The method according to claim 1, characterized in that, The step of adjusting the first-level opening of the spray electronic expansion valve EXV2 based on the first-level comparison results includes: When the IPM module temperature Tipm is greater than or equal to the first module temperature T1, the electronic expansion valve EXV2 is opened by step C1. Then, the IPM module temperature Tipm is acquired once every set first time interval. Based on the newly acquired IPM module temperature Tipm, the comparison is performed again, and the opening degree of the electronic expansion valve EXV2 is dynamically adjusted according to the comparison result. When the IPM module temperature Tipm is less than the first module temperature T1, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is continuously set to be less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the second module temperature T2, the step count of the spray electronic expansion valve EXV2 is reduced by C1. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

3. The method according to claim 1, characterized in that, The step of adjusting the secondary opening of the spray electronic expansion valve EXV2 based on the secondary comparison results includes: When the temperature Tipm of the IPM module is greater than or equal to the temperature of the third module T3, the electronic expansion valve EXV2 is opened by step C2. Then, the temperature Tipm of the IPM module is acquired once every set first time interval. Based on the newly acquired temperature Tipm of the IPM module, the comparison is performed again, and the opening degree of the electronic expansion valve EXV2 is dynamically adjusted according to the comparison result. When the IPM module temperature Tipm is less than the third module temperature T3, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the fourth module temperature T4, the step count of the spray electronic expansion valve EXV2 is reduced by C2. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

4. The method according to claim 1, characterized in that, The three-stage opening adjustment of the spray electronic expansion valve EXV2 based on the three-stage comparison results includes: When the temperature Tipm of the IPM module is greater than or equal to the temperature of the fifth module T5, the opening of the spray electronic expansion valve EXV2 is increased by step C3. Then, the temperature Tipm of the IPM module is acquired once every set first time interval. Based on the newly acquired temperature Tipm of the IPM module, the comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result. When the IPM module temperature Tipm is less than the fifth module temperature T5, the step count of the spray electronic expansion valve EXV2 remains unchanged. Then, when the spray electronic expansion valve EXV2 temperature TEXV2 obtained within the second time period is less than or equal to the ambient dew point temperature Tdt, and the newly obtained IPM module temperature Tipm is less than or equal to the sixth module temperature T6, the step count of the spray electronic expansion valve EXV2 is reduced by C3. Finally, the IPM module temperature Tipm is obtained once every first time interval. Based on the newly obtained IPM module temperature Tipm, a comparison is performed again, and the opening of the spray electronic expansion valve EXV2 is dynamically adjusted according to the comparison result.

5. An air conditioning system, characterized in that, Used to perform the method as described in any one of claims 1-4.

6. The air conditioning system according to claim 5, characterized in that, The air conditioning system includes a capillary tube and a liquid injection return temperature sensing bulb. The liquid injection electronic expansion valve EXV2 and the capillary tube are sequentially connected to the IPM heat dissipation circuit on one side of the IPM heat sink. The liquid injection return temperature sensing bulb is connected to the IPM heat dissipation circuit on the other side of the IPM heat sink.

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