Concealed runner injection mold structure

Abstract

An injection mold structure includes a body portion, a core plate, a plurality of runners, a removable metal plate, a top portion, a resin mold. The core plate is in physical communication with and located within the body portion. The removable metal plate is in physical communication with the runners and the core plate. The runners are located between the core plate and the removable metal plate. The top portion includes a cavity for receiving a carbon fiber plate.

Description

Technical Field

[0001] This disclosure generally relates to information processing systems, and more specifically to concealed runner injection mold structures. Background Technology

[0002] As the value and use of information continue to grow, individuals and businesses seek additional ways to process and store information. One option is an information processing system. Information processing systems typically process, compile, store, or transmit information or data for business, personal, or other purposes. The technology and information processing needs and requirements may vary between different applications. Therefore, information processing systems may also differ in terms of what information is processed, how it is processed, how much information is processed, stored, or transmitted, and how quickly and efficiently it can be processed, stored, or transmitted. Variations in information processing systems allow them to be general-purpose or configured for specific users or purposes (such as financial transaction processing, airline ticketing, enterprise data storage, or global communications). Furthermore, information processing systems can include a variety of hardware and software resources that can be configured to process, store, and transmit information, and may include one or more computer systems, graphical interface systems, data storage systems, networking systems, and mobile communication systems. Information processing systems can also implement various virtualization architectures. Data and voice communications in information processing systems can be conducted via networks, which can be wired, wireless, or a combination thereof. Summary of the Invention

[0003] An injection mold structure includes a main body, a core plate, multiple runners, a removable metal plate, a top portion, and a resin mold. The core plate is physically connected to and located within the main body. The removable metal plate is physically connected to the runners and the core plate. The runners are located between the core plate and the removable metal plate. The top portion includes a cavity for receiving a carbon fiber sheet. Attached Figure Description

[0004] It should be understood that, for the sake of simplicity and clarity, the elements shown in the figures are not necessarily drawn to scale. For example, the dimensions of some elements may be exaggerated relative to others. Regarding the embodiments shown and described herein in conjunction with the teachings of this disclosure, in the figures: Figure 1 This is a block diagram of a concealed runner injection mold structure according to at least one embodiment of the present disclosure; Figure 2 This is a block diagram of a concealed runner injection mold structure according to at least one embodiment of the present disclosure; Figure 3It is a diagram illustrating a sequence of steps for forming an injection mold component having a concealed runner injection mold structure according to at least one embodiment of the present disclosure; Figure 4 This is a flowchart of a method for executing an injection mold having a concealed runner, according to at least one embodiment of the present disclosure.

[0005] Figure 5 This is a block diagram of a common information processing system according to the implementation scheme of this disclosure.

[0006] Using the same reference numerals in different figures indicates similar or identical items. Detailed Implementation

[0007] The following description, taken in conjunction with the accompanying drawings, is provided to aid in understanding the teachings disclosed herein. The description focuses on specific implementations and methods of the teachings and is provided to help describe these teachings. This description should not be construed as limiting the scope or applicability of these teachings.

[0008] Figures 1 to 2 A portion of a concealed runner injection mold structure 100 for an information processing system according to at least one embodiment of the present disclosure is shown. For the purposes of this disclosure, an information processing system may include any tool or set of tools operable to calculate, compute, determine, classify, process, transmit, receive, retrieve, initiate, switch, store, display, transmit, indicate, detect, record, reproduce, dispose of, or utilize information, intelligence, or data of any form for commercial, scientific, control, or other purposes. For example, an information processing system may be a personal computer (such as a desktop or laptop computer), a tablet computer, a mobile device (such as a personal digital assistant (PDA) or smartphone), a blade server or rack server, a network storage device, or any other suitable device, and may vary in size, shape, performance, functionality, and price. An information processing system may include random access memory (RAM), one or more processing resources (such as a central processing unit (CPU) or hardware or software control logic), ROM, and / or other types of non-volatile memory. Additional components of the information processing system may include one or more disk drives, one or more network ports for communication with external devices, and various input and output (I / O) devices (such as a keyboard, mouse, touchscreen, and / or video display). The information processing system may also include one or more buses operable to transmit communication between various hardware components.

[0009] The injection mold structure 100 includes a main body 102, a top portion 104, a core plate 106, a resin mold 108, multiple runners 110, and a removable metal plate 112. The top portion includes a cavity 120 for receiving a carbon fiber plate 130. Figure 1 As shown, both the core board 106 and the resin mold 108 can be physically connected to the main body portion 102. In one example, the core board 106 and the resin mold 108 can be securely mounted to the main body portion 102 such that the core board and the resin mold cannot be removed from the main body portion.

[0010] Figure 1 An injection mold structure 100 in a closed position is shown, wherein a top portion 104 is securely connected to a body portion 102. In the closed position, the top portion 104 can form a seal with the bottom portion 102, allowing resin 132 to be injected into the injection mold structure 100 without leakage and guided to a resin mold 120 via a runner 110. As the injected resin 132 cools, the resin can adhere to a carbon fiber plate to form the final product. The top portion 104 can remain physically connected to the body portion 102 for any suitable predetermined amount of time to allow the resin 132 to harden.

[0011] refer to Figure 2 The removable metal plate 112 includes alignment posts 202. In some examples, the removable metal plate 112 may include any suitable number of alignment posts 202 without changing the following: Figure 3 The scope of this disclosure is described.

[0012] Figure 3 The present disclosure illustrates a structure for injection molds via concealed runners (such as...) according to at least one embodiment of the present disclosure. Figure 1 and Figure 2 The sequence 300 of processes 302, 304, 306, and 308 forms the final part 309 from the injection mold structure 100. The final part 309 can be formed using any suitable components, including but not limited to a removable metal plate 310, a core plate 312, multiple runners 314, a body portion 316, and a resin mold 318. The final part 309 includes a resin portion or structure 320 and a carbon fiber plate 322.

[0013] The removable metal plate 310 includes a plurality of alignment posts 330 that can be inserted into alignment holes 332 of the core plate 312. At process 302, the removable metal plate 310 is positioned in physical communication with the core plate 312 and the runner 314. In one example, the alignment posts 330 can be inserted into the alignment holes 332 to ensure that the removable metal plate 310 is properly positioned relative to the core plate 312, the runner 314, the body portion 316, and the resin mold 318.

[0014] After the removable metal plate 310 is positioned in physical communication with the core plate 312, the top portion of the injection mold structure can be positioned in physical communication with the removable metal plate. In one example, the top portion may include a cavity that can then hold the carbon fiber plate 322 for the final part 309. The top portion can form a seal with the body portion 316, allowing resin to be injected into the injection mold structure.

[0015] During process 304, resin is injected into the injection mold structure. In one example, the resin may be injected into the resin mold of the injection mold structure via a runner 314 that is physically connected to the removable metal plate 310 and the core plate 312. In some examples, the runner 314 may direct the resin flow into different portions of the resin mold 318. After the resin is injected into the resin mold 318, the top portion may remain on the body portion for any suitable length of time.

[0016] During process 306, the removable metal plate 310, runner 314, resin structure 320, and carbon fiber plate 322 can be released / removed from the core plate 312 of the injection mold structure. In one example, the removable metal plate 310 can remain physically connected to the resin structure 320 and carbon fiber plate 322 after these components have been removed from the injection mold structure. In response to the removal of the metal plate 310, runner 314, resin structure 320, and carbon fiber plate 322 from the core plate 312, the metal plate and other components can be cooled. In some examples, the removable metal plate 310 can prevent warping of the resin structure 320 and carbon fiber 322 as the resin structure cools from the injection process. Based on the fact that the removable metal plate 310 remains physically connected to the resin structure 320 and carbon fiber 322 during the cooling process, the final part 309 will not need to be reshaped as needed in the previous manufacturing process.

[0017] During process 308, the removable metal plate 310 is heated, allowing the removable metal plate and flow channel 314 to be removed from the resin structure 320 and carbon fiber plate 322. In one example, heating of the removable metal plate 310 may cause the flow channel 314 to adhere to the metal plate, thus allowing the flow channel to be easily removed from the resin structure 320 and core plate 322. The flow channel 314 can then be removed from the metal plate 310, allowing the removable metal plate to be used in another process sequence 300.

[0018] Figure 4 This is a flowchart of a method 400 for producing an injection mold with a concealed runner according to at least one embodiment of the present disclosure, the method beginning at block 402. It should be readily understood that not every method step depicted in this flowchart is always necessary, but certain steps of the method may be combined, performed simultaneously, performed in a different order, or may be omitted without changing the scope of the present disclosure.

[0019] At frame 404, a removable metal plate is placed within the injection mold structure. In one example, the injection mold structure includes a body portion, a core plate, multiple runners, and a resin mold. In some examples, the removable metal plate may be positioned in physical communication with the core plate and the runners. The removable metal plate may include one or more alignment pins / posts, which are then alignable with and inserted into one or more alignment holes in the core plate.

[0020] At frame 406, the top portion of the injection mold structure is positioned in physical communication with a removable metal plate. In one example, the top portion may include a cavity that can hold the carbon fiber plate for use in forming the part via the injection mold structure. The top portion may form a seal with the body portion, allowing resin to be injected into the injection mold structure.

[0021] At box 408, resin is injected into the injection mold structure. In one example, the resin can be injected into the resin mold of the injection mold structure via multiple runners physically communicating with the core plate and the removable metal plate. In some examples, the runners can direct the resin flow to different parts of the resin mold. After the resin is injected into the resin mold of the injection mold structure, the top portion can remain on the body portion for any suitable length of time.

[0022] At box 410, the runner, removable metal plate, resin structure, and carbon fiber plate can be released / removed from the injection mold structure. At box 412, the metal plate and the final part are cooled. In one example, the removable metal plate can maintain physical communication with the carbon fiber plate and resin structure while these parts are being cooled. In one example, the metal plate can hold and support the plastic throughout the cooling phase and prevent plastic shrinkage to reduce part deformation. In some examples, the removable metal plate can prevent warping of the carbon fiber and resin structure as the resin structure cools from the injection process.

[0023] At frame 414, the metal plate and flow channel are removed from the resin structure and core plate, and the process ends at frame 416. In one example, the metal plate can be heated to cause the flow channel to adhere to the metal plate, thus allowing easy removal of the flow channel from the resin structure and carbon fiber plate.

[0024] Figure 5A broad embodiment of an information processing system 500 according to embodiments of the present disclosure is shown. For the purposes of this disclosure, an information processing system may include any tool or set of tools operable to calculate, classify, process, transmit, receive, retrieve, generate, switch, store, display, indicate, detect, record, reproduce, dispose of, or utilize information, intelligence, or data of any form for commercial, scientific, control, entertainment, or other purposes. For example, information processing system 500 may be a personal computer, laptop computer, smartphone, tablet device or other consumer electronic device, network server, network storage device, switch, router, or other network communication device, or any other suitable device, and may vary in size, shape, performance, functionality, and price. Furthermore, information processing system 500 may include processing resources for executing machine-executable code, such as a central processing unit (CPU), a programmable logic array (PLA), an embedded device such as a system-on-a-chip (SoC), or other control logic hardware. Information processing system 500 may also include one or more computer-readable media for storing machine-executable code such as software or data. Additional components of the information processing system 500 may include one or more storage devices capable of storing machine-executable code, one or more communication ports for communicating with external devices, and various input and output (I / O) devices (such as a keyboard, mouse, and video display). The information processing system 500 may also include one or more buses operable to transfer information between various hardware components.

[0025] Information processing system 500 may include devices or modules embodying one or more of the following means or modules, and operates to perform one or more of the following methods. Information processing system 500 includes processors 502 and 504, input / output (I / O) interfaces 510, memory 520 and 525, graphics interface 530, basic input / output system / generic extensible firmware interface (BIOS / UEFI) module 540, disk controller 550, hard disk drive (HDD) 554, optical disk drive (ODD) 556, disk emulator 560 connected to external solid-state drive (SSD) 562, I / O bridge 570, one or more additional resources 574, trusted platform module (TPM) 576, network interface 580, management device 590, and power supply. Processors 502 and 504, I / O interface 510, memory 520, graphics interface 530, BIOS / UEFI module 540, disk controller 550, HDD 554, ODD 556, disk emulator 560, SSD 562, I / O bridge 570, additional resources 574, TPM 576, and network interface 580 operate together to provide a host environment for information processing system 500, which operates to provide the data processing functionality of the information processing system. The host environment operates to execute machine-executable code, including platform BIOS / UEFI code, device firmware, operating system code, applications, programs, etc., to perform data processing tasks associated with information processing system 500.

[0026] In a host environment, processor 502 is connected to I / O interface 510 via processor interface 506, while processor 504 is connected to I / O interface 508. Memory 520 is connected to processor 502 via memory interface 522. Memory 525 is connected to processor 504 via memory interface 527. Graphics interface 530 is connected to I / O interface 510 via graphics interface 532 and provides video display output 536 to video display 534. In a particular embodiment, information processing system 500 includes separate memory dedicated to each of processors 502 and 504 via separate memory interfaces. Examples of memories 520 and 525 include random access memory (RAM) such as static RAM (SRAM), dynamic RAM (DRAM), non-volatile RAM (NV-RAM), etc.), read-only memory (ROM), another type of memory, or a combination thereof.

[0027] The BIOS / UEFI module 540, disk controller 550, and I / O bridge 570 are connected to the I / O interface 510 via I / O channel 512. Examples of I / O channels 512 include a Peripheral Component Interconnect (PCI) interface, a PCI Expansion (PCI-X) interface, a high-speed PCI-Express (PCIe) interface, another industry-standard or proprietary communication interface, or a combination thereof. The I / O interface 510 may also include one or more other I / O interfaces, including an Industry Standard Architecture (ISA) interface, a Small Computer Serial Interface (SCSI) interface, and an Inter-Integrated Circuit (I / O) interface. 2 C) Interfaces such as System Packet Interface (SPI), Universal Serial Bus (USB), another interface, or combinations thereof. The BIOS / UEFI module 540 includes BIOS / UEFI code operable to detect resources within the information processing system 500, provide drivers for those resources, initialize those resources, and access those resources. The BIOS / UEFI module 540 includes code operable to detect resources within the information processing system 500, provide drivers for those resources, initialize those resources, and access those resources.

[0028] Disk controller 550 includes disk interface 552 that connects the disk controller to HDD 554, ODD 556, and disk emulator 560. Examples of disk interface 552 include Integrated Drive Electronics (IDE) interface, Advanced Technology Attachment (ATA) interface (such as Parallel ATA (PATA) or Serial ATA (SATA) interface), SCSI interface, USB interface, proprietary interface, or a combination thereof. Disk emulator 560 allows SSD 564 to be connected to information processing system 500 via external interface 562. Examples of external interface 562 include USB interface, IEEE 3394 (FireWire) interface, proprietary interface, or a combination thereof. Alternatively, solid-state drive 564 may be located within information processing system 500.

[0029] I / O bridge 570 includes peripheral interface 572 that connects the I / O bridge to add-on resources 574, TPM 576, and network interface 580. Peripheral interface 572 can be the same type as I / O channel 512, or it can be a different type of interface. Thus, when peripheral interface 572 and I / O channel 512 are of the same type, I / O bridge 570 expands the capability of the I / O channel; when they are of different types, I / O bridge converts information from a format suitable for the I / O channel to a format suitable for peripheral channel 572. Add-on resources 574 may include a data storage system, an additional graphics interface, a network interface card (NIC), a voice / video processing card, another add-on resource, or a combination thereof. Add-on resources 574 may be located on a main circuit board, on a separate circuit board or expansion card located within the information processing system 500, on a device located outside the information processing system, or a combination thereof.

[0030] Network interface 580 represents a NIC, which is disposed within information processing system 500, located on the main circuit board of information processing system, integrated into another component such as I / O interface 510, located in another suitable location, or a combination thereof. Network interface device 580 includes network channels 582 and 584 that provide interfaces to devices outside information processing system 500. In certain embodiments, network channels 582 and 584 are of a different type from peripheral channel 572, and network interface 580 converts information from a format suitable for peripheral channels to a format suitable for external devices. Examples of network channels 582 and 584 include unlimited bandwidth channels, Fibre Channel channels, Gigabit Ethernet channels, proprietary channel architectures, or combinations thereof. Network channels 582 and 584 can connect to external network resources (not shown). Network resources may include another information processing system, a data storage system, another network, a grid management system, another suitable resource, or a combination thereof.

[0031] Management device 590 refers to one or more processing devices (such as a dedicated board management controller (BMC) system-on-a-chip (SoC) device), one or more associated memory devices, one or more network interface devices, complex programmable logic devices (CPLDs), etc., that operate together to provide a management environment for information processing system 500. Specifically, management device 590 is connected to various components of the host environment via various internal communication interfaces (such as low pin count (LPC) interfaces, integrated circuit bus (I2C) interfaces, PCIe interfaces, etc.) to provide out-of-band (OOB) mechanisms to retrieve information related to the operation of the host environment, provide BIOS / UEFI or system firmware updates, and manage non-processing components of information processing system 500, such as system cooling fans and power supplies. Management device 590 may include a network connection to an external management system, and the management device may communicate with the management system to report status information of information processing system 500, receive BIOS / UEFI or system firmware updates, or perform other tasks for managing and controlling the operation of information processing system 500.

[0032] Management device 590 can operate outside the power plane of components in the host environment, allowing it to receive power to manage information processing system 500 when the information processing system is otherwise shut down. Examples of management device 590 include commercially available BMC products or other devices operating according to the Intelligent Platform Management Initiative (IPMI) specification, the Network Services Management (WSMan) interface, the Redfish application programming interface (API), another Distributed Management Task Force (DMTF), or other management standards, and may include integrated Dell Remote Access Controller (iDRAC), embedded controllers (EC), etc. Management device 590 may also include associated memory devices, logic devices, security devices, etc., as needed or desired.

[0033] Although only a few exemplary embodiments have been described in detail herein, those skilled in the art will readily understand that many modifications may be made to the exemplary embodiments without substantially departing from the novel teachings and advantages of the embodiments of this disclosure. Therefore, all such modifications are intended to be included within the scope of the embodiments of this disclosure as defined in the appended claims. In the claims, the device plus function clause is intended to cover not only structural equivalents but also equivalent structures as described herein.

[0034] The subject matter disclosed above should be considered illustrative rather than restrictive, and the appended claims are intended to cover any and all such modifications, enhancements, and other embodiments falling within the scope of this invention. Therefore, to the fullest extent permitted by law, the scope of this invention will be determined by the broadest permissible interpretation of the appended claims and their equivalents, and should not be construed or limited by the foregoing detailed description.

Claims

1. An injection mold structure, comprising: Main body; A core board, which is physically connected to and located within the main body portion; Multiple flow channels; A removable metal plate, the removable metal plate being physically connected to the flow channel and the core plate, wherein the flow channel is located between the core plate and the removable metal plate, wherein the flow channel is adhered to the removable metal plate based on the removable metal plate being heated; The top portion includes a cavity; and A resin mold, which is physically connected to and located within the cavity of the top portion, wherein a carbon fiber plate is placed in a manner that is physically connected to and located within the cavity of the top portion.

2. The injection mold structure according to claim 1, wherein the removable metal plate includes one or more alignment posts, the core plate includes one or more alignment holes, and the alignment posts are aligned with and inserted into the alignment holes.

3. The injection mold structure according to claim 1, wherein the top portion forms a seal with the body portion, enabling resin to be injected into the injection mold structure.

4. The injection mold structure according to claim 1, wherein the flow channel guides the resin flow into different portions of the resin mold to form a resin structure.

5. The injection mold structure according to claim 4, wherein the runner, the removable metal plate, the resin structure, and the carbon fiber plate are released from the main body portion of the injection mold structure after a predetermined amount of time following the end of the resin flow.

6. The injection mold structure according to claim 5, wherein the physical communication between the removable metal plate and both the resin structure and the carbon fiber plate prevents the carbon fiber plate and the resin structure from warping when the resin structure cools.

7. The injection mold structure according to claim 1, wherein the runner and the removable metal plate are removed from the core plate simultaneously.

8. An injection mold structure, comprising: Main body; A core board, which is physically connected to and located within the body portion, wherein the core board includes one or more alignment holes; Multiple flow channels; A removable metal plate, the removable metal plate being physically connected to the flow channel and the core plate, wherein the removable metal plate includes one or more alignment posts, and the alignment posts are aligned with and inserted into the alignment holes, wherein the flow channel is located between the core plate and the removable metal plate, wherein the flow channel is adhered to the removable metal plate based on the removable metal plate being heated; The top portion includes a cavity, wherein the top portion forms a seal with the body portion, enabling the injection mold structure to be injected with resin. as well as A resin mold, which is physically connected to and located within the cavity of the top portion, wherein a carbon fiber plate is placed in a manner that is physically connected to and located within the cavity of the top portion.

9. The injection mold structure according to claim 8, wherein the runner guides the resin flow into different portions of the resin mold to form a resin structure.

10. The injection mold structure according to claim 9, wherein the runner, the removable metal plate, the resin structure, and the carbon fiber plate are released from the main body portion of the injection mold structure after a predetermined amount of time following the end of the resin flow.

11. The injection mold structure of claim 10, wherein the physical communication between the removable metal plate and both the resin structure and the carbon fiber plate prevents the carbon fiber plate and the resin structure from warping when the resin structure cools.

12. The injection mold structure according to claim 8, wherein the runner and the removable metal plate are removed from the core plate simultaneously.

13. The injection mold structure according to claim 8, wherein after the resin is injected into the injection mold structure, the top portion remains in physical communication with the main body portion for a predetermined amount of time.

14. A method of using the injection mold structure of claim 1, comprising: A removable metal plate is placed in the injection mold structure, wherein the removable metal plate is positioned to be in physical communication with the core plate and runner of the injection mold structure; The top portion of the injection mold structure is positioned in physical communication with the removable metal plate; Resin is injected into the injection mold structure; Remove the runner, the removable metal plate, the resin structure, and the carbon fiber plate from the injection mold structure, wherein the resin structure and the carbon fiber plate are part of the final product; Heating the removable metal plate; and Remove the removable metal plate and the flow channel from the resin structure.

15. The method of claim 14, further comprising, after removing the runner, the removable metal plate, the resin structure, and the carbon fiber plate from the injection mold structure: The removable metal plate is kept in physical communication with the carbon fiber plate and the resin structure for a predetermined amount of time.

16. The method of claim 14, further comprising: Align one or more alignment posts of the removable metal plate with one or more alignment holes of the core plate; as well as The alignment post is inserted into the alignment hole to place the removable metal plate in physical communication with the core plate.

17. The method of claim 14, further comprising: After the resin is injected into the injection mold structure, the top portion is kept in physical communication with the main body portion for a predetermined amount of time.

18. The method of claim 14, wherein during the injection of the resin into the injection mold structure, the flow channel directs the resin flow to different portions of the resin mold.

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