Sealing and bonding tool structure and manufacturing method thereof, and adhesive tape bonding method

Abstract

The application provides a sealing and bonding tool structure and a manufacturing method thereof and a tape bonding method. The sealing and bonding tool structure comprises: at least one patterned sealing tape, which is matched with a region to be sealed and seals the region to be sealed in a bonded manner; an upper layer of film, which is arranged on the upper surface of the at least one patterned sealing tape; a lower layer of film, which is arranged on the lower surface of the at least one patterned sealing tape and is provided with a first positioning structure; and a tool plate, wherein the first positioning structure is used for bonding and positioning the patterned sealing tape and the tool plate. According to the technical scheme of the application, the first positioning structure can cooperate with a second positioning structure on the tool plate to realize the positioning connection of the tool plate and the patterned sealing tape, so that the tool plate can accurately position and bond the patterned sealing tape on the region to be sealed subsequently.

Description

Technical Field

[0001] This invention relates to the field of sealing equipment technology, and particularly to a sealing and bonding tooling structure and tooling plate. Background Technology

[0002] In related technologies, sealing tape can be used as a sealing element to adhere and seal gaps or holes between components to be sealed. However, when the width of the sealing tape is slightly larger than the width of the gap to be sealed, it is difficult to achieve precise positioning and effective adhesion during the application process, resulting in poor sealing performance.

[0003] In other words, the sealing tape in the relevant technology has the problem of not being able to be accurately positioned when applied. Summary of the Invention

[0004] To address the problems in the prior art, this application proposes a sealing and bonding fixture structure and its manufacturing method, as well as a tape bonding method, which solves the problem of inaccurate positioning when applying sealing tape.

[0005] The sealing and bonding fixture structure of the present invention includes: at least one patterned sealing tape adapted to the area to be sealed, wherein the at least one patterned sealing tape seals the area to be sealed by means of adhesion; an upper film disposed on the upper surface of the at least one patterned sealing tape; a lower film disposed on the lower surface of the at least one patterned sealing tape, wherein a first positioning structure is disposed on the lower film; the sealing and bonding fixture structure further includes a fixture plate, wherein the first positioning structure is used for the adhesion and positioning of the patterned sealing tape and the fixture plate.

[0006] In one embodiment, a second positioning structure is provided on the tooling plate, corresponding to the first positioning structure. When the second positioning structure mates with the first positioning structure, the patterned sealing tape can be positioned and adhered to the tooling plate. In another embodiment, a third positioning structure is provided on the area to be sealed, corresponding to the second positioning structure. When the third positioning structure mates with the second positioning structure, the patterned sealing tape can be positioned and adhered to the area to be sealed.

[0007] In one embodiment, the first positioning structure, the second positioning structure, and the third positioning structure are all positioned using positioning holes.

[0008] In one embodiment, the first positioning structure includes a plurality of first positioning holes, the second positioning structure includes a plurality of second positioning holes, and the third positioning structure includes a plurality of third positioning holes. The plurality of first positioning holes are configured in a one-to-one correspondence with the plurality of second positioning holes, and the plurality of third positioning holes are configured in a one-to-one correspondence with the plurality of second positioning holes.

[0009] In one embodiment, the bonding area of ​​the patterned sealing tape is d1, and the area of ​​the region to be sealed is d2, wherein the value range of d1 / d2 is: 1.2≤d1 / d2≤1.5.

[0010] In one embodiment, the sealing and bonding fixture structure includes a first patterned sealing tape and a second patterned sealing tape, which are spaced apart.

[0011] The present invention also provides a method for manufacturing a sealing and bonding fixture structure. The method is used to manufacture the aforementioned sealing and bonding fixture structure, which includes a first patterned sealing tape and a second patterned sealing tape. The manufacturing method includes the following steps:

[0012] Step 1: Apply a film to the upper and lower surfaces of the first patterned sealing tape, with the lower film having a first positioning structure.

[0013] Step two, place the first patterned mold on it and cut along the edges;

[0014] Step 3: Remove the first patterned mold, excess first patterned sealing tape, and upper film;

[0015] Step four: Apply a film to the upper and lower surfaces of the second patterned sealing tape, with the lower film having a first positioning structure.

[0016] Step 5: Place the second patterned mold on it and cut along the edges;

[0017] Step six: Remove the second patterned mold, excess second patterned sealing tape, and top film;

[0018] Step 7: Transfer the remaining second patterned sealing tape and its upper coating onto the lower coating at the bottom of the remaining first patterned sealing tape.

[0019] This invention also provides a tape bonding method, which employs the aforementioned sealing and bonding fixture structure. The patterned sealing tape includes a release film layer, an adhesive layer, a main body layer, and a hydrophobic film layer. The release film layer is connected to a lower overlay, the adhesive layer is disposed on the release film layer, and the main body layer is disposed on the adhesive layer. The hydrophobic film layer is disposed on the main body layer and is connected to an upper overlay. The tape bonding method includes the following steps:

[0020] Step 1: Remove the top layer of film from the patterned sealing tape;

[0021] Step 2: Position and bond the tooling plate to the upper surface of the patterned sealing tape;

[0022] The second positioning structure on the tooling plate cooperates with the first positioning structure on the lower film.

[0023] Step 3: Remove the lower layer of film and its release film from the patterned sealing tape;

[0024] Step 4: Position and adhere the adhesive layer of the patterned sealing tape onto the area to be sealed;

[0025] The second positioning structure on the tooling plate cooperates with the third positioning structure on the area to be sealed.

[0026] In one embodiment, the third positioning structure includes a plurality of third positioning holes, and the second positioning structure includes a plurality of second positioning holes, with the plurality of third positioning holes corresponding one-to-one with the plurality of second positioning holes; step four specifically includes the following steps:

[0027] The first step is to align the multiple second positioning holes with the multiple third positioning holes one by one;

[0028] The second step is to insert multiple positioning pins into the multiple second positioning holes and multiple third positioning holes one by one.

[0029] The third step is to slide along the axial direction of the locating pin to adhere the adhesive layer of the patterned sealing tape to the area to be sealed.

[0030] The above-mentioned technical features can be combined in various suitable ways or replaced by equivalent technical features, as long as the purpose of the present invention can be achieved.

[0031] The sealing and bonding fixture structure and its manufacturing method, as well as the tape bonding method provided by this invention, have at least the following advantages compared with the prior art:

[0032] The first positioning structure can cooperate with the second positioning structure on the tooling plate to achieve positioning and connection between the tooling plate and the patterned sealing tape. This ensures that the tooling plate can accurately position and bond the patterned sealing tape to the area to be sealed, avoiding the problem of poor sealing effect caused by inaccurate positioning of the sealing tape during the bonding process. This, in turn, ensures the sealing effect of the patterned sealing tape. Attached Figure Description

[0033] The invention will now be described in more detail with reference to embodiments and the accompanying drawings.

[0034] Figure 1 A schematic diagram of the sealing and bonding fixture structure of Embodiment 1 of the present invention is shown (the fixture plate is not shown);

[0035] Figure 2 Showing Figure 1 A schematic diagram of the first patterned sealing tape structure in the image;

[0036] Figure 3 Showing Figure 1 A schematic diagram of the second patterned sealing tape structure in the diagram;

[0037] Figure 4 Showing Figure 1 A schematic diagram of the structure of the component to be sealed, which is used to bond the patterned sealing tape.

[0038] Figure 5 Showing Figure 1 Patterned sealing tape is bonded in Figure 4 A schematic diagram of the structure on the component to be sealed;

[0039] Figure 6 This invention is shown. Figure 1 Sealing and bonding tooling structure and Figure 4 A schematic diagram showing the positioning of the component to be sealed.

[0040] Figure 7a , 7b Figures 7c, 7d, 7e, and 7f show the fabrication process of the sealing and bonding fixture structure according to Embodiment 1 of the present invention.

[0041] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not to scale.

[0042] Figure label:

[0043] 10. Patterned sealing tape; 11. Release film layer; 12. Adhesive layer; 121. First plate; 122. Second plate; 123. Third plate; 13. Main layer; 14. Hydrophobic film layer; 20. Upper coating; 30. Lower coating; 31. First positioning structure; 100. Sealing and bonding fixture structure; 40. Fixture plate; 41. Second positioning structure; 300. Component to be sealed; 301. Third positioning structure; 400. Gap; 500. Hole. Detailed Implementation

[0044] The invention will now be further described with reference to the accompanying drawings.

[0045] It should be noted that the number of components 300 to be sealed in this application is multiple, and they are spaced apart along the horizontal direction (not limited to the horizontal direction). There is a height difference between the upper surfaces of two adjacent components 300, and a gap 400 to be sealed exists between the upper surfaces of two adjacent components. The area to be sealed in this application includes the gap 400 or the hole 500 (see...). Figure 4 ).

[0046] It should be noted that the shape of the patterned sealing tape 10 in this application is complementary to the patterned shape of the pre-adhesive area (for example, if the patterned shape of the pre-adhesive area is stepped, the shape of the patterned sealing tape 10 is also stepped to ensure that the pre-adhesive area is covered). In this application, "patterned" means complementary to or adapted to the patterned shape of the pre-adhesive area.

[0047] It should be noted that, as Figure 5 As shown, the sealing and bonding fixture structure 100 in this embodiment of the application is used to seal the gap 400 between two adjacent parts 300 to be sealed, and the hole 500 provided on one of the parts 300 to be sealed.

[0048] It should be noted that the gap 400 in this application is not limited to curves of various types such as straight lines, broken lines, and arcs.

[0049] like Figure 1 As shown, the present invention provides a sealing and bonding fixture structure 100, which includes at least one patterned sealing tape 10, an upper coating 20, and a lower coating 30. The at least one patterned sealing tape 10 is adapted to the area to be sealed, sealing the area by adhesive bonding. The upper coating 20 is disposed on the upper surface of the patterned sealing tape 10, and the lower coating 30 is disposed on the lower surface of the at least one patterned sealing tape 10. A first positioning structure 31 is provided on the lower coating 30. The sealing and bonding fixture structure 100 also includes a fixture plate 40, and the first positioning structure 31 is used for the adhesive positioning of the patterned sealing tape 10 and the fixture plate 40.

[0050] In the above configuration, the first positioning structure 31 can cooperate with the tooling plate 40 to achieve positioning connection between the tooling plate 40 and the patterned sealing tape 10. This ensures that the tooling plate 40 can accurately position and bond the patterned sealing tape 10 to the area to be sealed, avoiding poor sealing effect caused by inaccurate positioning of the sealing tape during the bonding process. This, in turn, ensures the sealing effect of the patterned sealing tape 10.

[0051] Specifically, in one embodiment, a second positioning structure 41 is provided on the tooling plate 40, and the second positioning structure 41 is correspondingly provided with the first positioning structure 31. When the second positioning structure 41 cooperates with the first positioning structure 31, the patterned sealing tape 10 can be positioned and adhered to the tooling plate 40.

[0052] In the above configuration, the first positioning structure 31 can cooperate with the second positioning structure 41 to achieve positioning and connection between the tooling plate 40 and the patterned sealing tape 10. This ensures that the tooling plate can accurately position and bond the patterned sealing tape 10 to the area to be sealed, avoiding poor sealing effect caused by inaccurate positioning of the sealing tape during the bonding process. This, in turn, ensures the sealing effect of the patterned sealing tape 10.

[0053] Specifically, in one embodiment, a third positioning structure 301 is provided on the area to be sealed. The third positioning structure 301 is correspondingly provided with the second positioning structure 41. When the third positioning structure 301 and the second positioning structure 41 cooperate, the patterned sealing tape 10 can be positioned and adhered to the area to be sealed.

[0054] Specifically, in one embodiment, the first positioning structure 31, the second positioning structure 41, and the third positioning structure 301 are all positioned using positioning holes.

[0055] Specifically, in one embodiment, the first positioning structure 31 includes a plurality of first positioning holes, the second positioning structure 41 includes a plurality of second positioning holes, and the third positioning structure 301 includes a plurality of third positioning holes. The plurality of first positioning holes are configured in a one-to-one correspondence with the plurality of second positioning holes, and the plurality of third positioning holes are configured in a one-to-one correspondence with the plurality of second positioning holes.

[0056] Specifically, in one embodiment, the outer contour shape of the patterned sealing tape 10 is circular, rectangular, rhomboid, or hexagonal.

[0057] It should be noted that the outer contour shape of the patterned sealing tape 10 can be adapted to the area to be sealed.

[0058] Specifically, in one embodiment, the bonding area of ​​the patterned sealing tape 10 is d1, and the area of ​​the region to be sealed is d2, wherein the value range of d1 / d2 is: 1.2≤d1 / d2≤1.5.

[0059] In the above settings, setting the values ​​of d1 / d2 within the above range can ensure that the patterned sealing tape 10 can seal the area to be sealed well, avoiding the problem that the patterned sealing tape 10 cannot completely cover the area to be sealed, thus ensuring that the patterned sealing tape 10 can achieve its sealing function.

[0060] Example 1

[0061] Specifically, such as Figure 1 As shown, in one embodiment, the sealing and bonding tooling structure 100 includes a first patterned sealing tape (located on the left) and a second patterned sealing tape (located on the right).

[0062] Specifically, such as Figure 1 As shown, in one embodiment, both the first patterned sealing tape and the second patterned sealing tape include a release film layer 11, an adhesive layer 12, a main body layer 13, and a hydrophobic film layer 14. The release film layer 11 is connected to the lower cover film 30; the adhesive layer 12 is disposed on the release film layer 11; the main body layer 13 is disposed on the adhesive layer 12; and the hydrophobic film layer 14 is disposed on the main body layer 13 and connected to the upper cover film 20.

[0063] In the above configuration, the adhesive layer 12 has an adhesive function, used to bond and seal the area to be sealed. The main body layer 13 supports the adhesive layer 12, enhancing the compressive and tensile strength of the patterned sealing tape 10. The hydrophobic film layer 14 has a hydrophobic function, solving the problem of the patterned sealing tape 10 surface being wetted by water. The release film layer 11 protects the adhesive layer 12 and can be removed before the adhesive layer 12 is bonded to the area to be sealed.

[0064] It should be noted that, Figure 1 Neither the first nor the second patterned sealing tape in the diagram shows its internal structural layers; only its external outline is visible.

[0065] Specifically, such as Figure 2 As shown, in one embodiment, the adhesive layer 12 of the first patterned sealing tape has a stepped plate structure, which includes a first plate 121, a second plate 122 and a third plate 123.

[0066] Wherein, one end of the second plate 122 is bent and connected to the first plate 121; the other end of the third plate 123 is bent and connected to the second plate 122; the first plate 121 and the third plate 123 are arranged in parallel and are respectively located on opposite sides of the second plate 122.

[0067] In the above configuration, the adhesive layer 12 has a stepped plate structure, which enables the adhesive layer 12 to bond and seal multiple parts 300 that have a height difference, that is, to seal the gap 400 between two adjacent parts 300, thereby expanding the application range of the patterned sealing tape 10.

[0068] Specifically, such as Figure 2 As shown, in one embodiment, the stepped plate structure has two layers of steps. Of course, in alternative embodiments not shown in the accompanying drawings of this application, the stepped plate structure can have three or more layers of steps.

[0069] Specifically, such as Figure 3 As shown, in one embodiment, the adhesive layer 12 of the second patterned sealing tape has a straight plate structure.

[0070] In the above configuration, the adhesive layer 12 has a straight plate structure, which allows the adhesive layer 12 to bond and seal multiple components 300 with the same sealing height, thereby sealing the gap 400 between two adjacent components 300.

[0071] Of course, in alternative embodiments not shown in the accompanying drawings, the sealing and bonding fixture structure 100 may be configured to include only a first patterned sealing tape or a second patterned sealing tape. The sealing and bonding fixture structure 100 may also be configured to include a combination of multiple first patterned sealing tapes and multiple second patterned sealing tapes.

[0072] Specifically, in one embodiment, a second positioning structure 41 is provided on the tooling plate 40, and the second positioning structure 41 is provided corresponding to the first positioning structure 31.

[0073] In the above configuration, the first positioning structure 31 can cooperate with the second positioning structure 41 on the tooling plate to achieve the positioning connection between the tooling plate 40 and the patterned sealing tape 10, thereby ensuring that the tooling plate can accurately position and bond the patterned sealing tape 10 to the area to be sealed, so as to achieve the sealing function of the patterned sealing tape 10.

[0074] It should be noted that, as Figure 6 As shown, before the patterned sealing tape 10 is connected to the tooling plate 40, the upper cover film 20 needs to be removed. Before connecting the patterned sealing tape 10 to the tooling plate 40, the second positioning structure 41 on the tooling plate 40 needs to be aligned with the first positioning structure 31 on the lower cover film 30 to achieve a positioning connection between the tooling plate 40 and the patterned sealing tape 10. After the tooling plate 40 and the patterned sealing tape 10 are positioned and connected, before the patterned sealing tape 10 is bonded to the part 300 to be sealed, the release film layer 11 on the patterned sealing tape 10 and the lower cover film 30 disposed thereunder need to be removed.

[0075] It should be noted that a third positioning structure 301 is provided on the component to be sealed 300. The third positioning structure 301 cooperates with the second positioning structure 41 to accurately position the adhesive layer 12 of the patterned sealing tape 10 on the area to be sealed on the component to be sealed 300, thereby ensuring that the patterned sealing tape 10 can seal the area to be sealed.

[0076] Specifically, such as Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, in one embodiment, the first positioning structure 31, the second positioning structure 41 and the third positioning structure 301 all adopt positioning holes, and the positioning function is achieved by aligning the positioning holes.

[0077] It should be noted that positioning pins are inserted into the third positioning structure 301 and the second positioning structure 41 to achieve the positioning function.

[0078] Example 2

[0079] The present invention also provides a method for manufacturing a sealing and bonding fixture structure 100, the sealing and bonding fixture structure 100 including a first patterned sealing tape and a second patterned sealing tape, the manufacturing method including the following steps:

[0080] Step 1: Apply a film to the upper and lower surfaces of the first patterned sealing tape, and then apply a positioning hole (with a first positioning structure) to the lower film.

[0081] Step two: Place the first patterned mold on top and cut along the edge, carefully controlling the cutting depth to ensure the cutter reaches the upper film and patterned sealing tape, but not beyond the lower film. The cut edges must be free of burrs or other defects.

[0082] Step 3: After cutting, remove the first patterned mold. The cut patterned sealing tape can be separated along the cut upper film, removing the excess, leaving the first patterned sealing tape (with the upper film on it) and the lower film with positioning holes (see reference). Figure 7e ).

[0083] Step four: Apply a film to both the top and bottom surfaces of the other patterned sealing tape, with the lower film layer having positioning holes (see reference). Figure 7a ).

[0084] Step 5: Place the second patterned mold on top and cut along the edge. Carefully control the cutting depth to ensure the cutter reaches the upper film and patterned sealing tape, but not beyond the lower film. The cut edges must be free of burrs or other defects (see reference). Figure 7b ).

[0085] Step Six: After cutting, remove the second patterned mold. The cut patterned sealing tape can be separated along the cut upper film, removing the excess, leaving the second patterned sealing tape (with the upper film on it) and the lower film with positioning holes (see reference). Figure 7c and Figure 7d ).

[0086] Step 7: Transfer the second patterned sealing tape and its upper coating onto the lower coating at the bottom of the first patterned sealing tape (see reference). Figure 7f ).

[0087] Specifically, in step seven, a tooling plate is placed on the upper film of the second patterned sealing tape. Positioning holes on the tooling plate are used to align with positioning holes on the lower film of the bottom of the first patterned sealing tape. After positioning, the second patterned sealing tape and its upper film are positioned and bonded to the lower film at the bottom of the first patterned sealing tape (see reference). Figure 7f ).

[0088] It should be noted that, Figure 7e and Figure 7f The patterned sealing tapes in the images do not show their internal structural layers, only their external outlines.

[0089] In the description of this invention, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0090] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A sealing and bonding tooling structure, characterized in that, include: At least one patterned sealing tape is adapted to the area to be sealed, and the at least one patterned sealing tape seals the area to be sealed by means of adhesion; An upper coating is disposed on the upper surface of the at least one patterned sealing tape; A lower coating is disposed on the lower surface of the at least one patterned sealing tape, and a first positioning structure is provided on the lower coating; The sealing and bonding fixture structure also includes a fixture plate, and the first positioning structure is used for the bonding and positioning of the patterned sealing tape and the fixture plate. The tooling plate is provided with a second positioning structure, which is corresponding to the first positioning structure. When the second positioning structure cooperates with the first positioning structure, the patterned sealing tape can be positioned and adhered to the tooling plate. A third positioning structure is provided on the area to be sealed. The third positioning structure is corresponding to the second positioning structure. When the third positioning structure cooperates with the second positioning structure, the patterned sealing tape can be positioned and adhered to the area to be sealed. The first positioning structure includes a plurality of first positioning holes, the second positioning structure includes a plurality of second positioning holes, and the third positioning structure includes a plurality of third positioning holes. The plurality of first positioning holes and the plurality of second positioning holes are configured in a one-to-one correspondence, and the plurality of third positioning holes and the plurality of second positioning holes are configured in a one-to-one correspondence. The sealing and bonding tooling structure includes a first patterned sealing tape and a second patterned sealing tape, wherein the first patterned sealing tape and the second patterned sealing tape are spaced apart. The shape of the patterned sealing tape is complementary to the pattern shape of the pre-bonded area. When the pattern shape of the pre-bonded area is stepped, the shape of the patterned sealing tape is also stepped.

2. The sealing and bonding fixture structure according to claim 1, characterized in that, The bonding area of ​​the patterned sealing tape is d1, and the area of ​​the area to be sealed is d2, wherein the value range of d1 / d2 is: 1.2≤d1 / d2≤1.

5.

3. A method for manufacturing a sealing and bonding tooling structure, characterized in that, The manufacturing method is used to manufacture the sealing and bonding fixture structure according to any one of claims 1 to 2, the sealing and bonding fixture structure comprising a first patterned sealing tape and a second patterned sealing tape, the manufacturing method comprising the following steps: Step 1: The upper and lower surfaces of the first patterned sealing tape are coated with a film, and the lower film is provided with a first positioning structure. Step two, place the first patterned mold on it and cut along the edges; Step 3: Remove the first patterned mold, excess first patterned sealing tape, and upper film; Step four: Apply a film to the upper and lower surfaces of the second patterned sealing tape, with the lower film having a first positioning structure. Step 5: Place the second patterned mold on it and cut along the edges; Step six: Remove the second patterned mold, excess second patterned sealing tape, and top film; Step 7: Transfer the remaining second patterned sealing tape and its upper coating onto the lower coating at the bottom of the remaining first patterned sealing tape.

4. A method for bonding adhesive tape, characterized in that, The tape bonding method employs the sealing and bonding fixture structure as described in any one of claims 1 to 2. The patterned sealing tape includes a release film layer, an adhesive layer, a main body layer, and a hydrophobic film layer. The release film layer is connected to the lower cover film, the adhesive layer is disposed on the release film layer, and the main body layer is disposed on the adhesive layer. The hydrophobic film layer is disposed on the main body layer and is connected to the upper cover film. The tape bonding method includes the following steps: Step 1: Remove the top layer of film from the patterned sealing tape; Step 2: Position and bond the tooling plate to the upper surface of the patterned sealing tape; The second positioning structure on the tooling plate cooperates with the first positioning structure on the lower film. Step 3: Remove the lower layer of film and its release film from the patterned sealing tape; Step 4: Position and adhere the adhesive layer of the patterned sealing tape onto the area to be sealed; The second positioning structure on the tooling plate cooperates with the third positioning structure on the area to be sealed.

5. The tape bonding method according to claim 4, characterized in that, The third positioning structure includes a plurality of third positioning holes, and the second positioning structure includes a plurality of second positioning holes, wherein the plurality of third positioning holes and the plurality of second positioning holes are respectively configured in a one-to-one correspondence; step four specifically includes the following steps: The first step is to align the plurality of second positioning holes with the plurality of third positioning holes one by one; The second step is to insert multiple positioning pins into the multiple second positioning holes and the multiple third positioning holes in a one-to-one correspondence. The third step involves sliding along the axial direction of the positioning pin to adhere the adhesive layer of the patterned sealing tape to the area to be sealed.

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