Copper residue slow cooling device and slow cooling process

By installing insulation plates and water guide plates on the outer wall of the slag bag to form a partition cavity, the problem of the inability to adjust the cooling rate during the air cooling stage of copper slag is solved, achieving efficient recovery of copper from copper slag and shortening the slag bag turnover time, resulting in significant economic benefits.

CN117660769BActive Publication Date: 2026-07-21SHANGHAI BAOSTEEL METALLURGICAL CONSTRUCTION CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI BAOSTEEL METALLURGICAL CONSTRUCTION CORP
Filing Date
2023-11-29
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing technologies, the cooling rate during the air cooling stage of copper slag cannot be adjusted, resulting in insufficient copper recovery from the slag and a long slag bag turnover time.

Method used

Insulation plates and water guide plates are installed on the outer wall of the slag bag to form a partition cavity. The water guide plates obstruct air flow during the air cooling stage and guide water flow along the outer wall of the cylinder into the partition cavity during the water cooling stage, thereby slowing down or accelerating the cooling rate.

Benefits of technology

By adjusting the cooling rate of copper slag, the crystallization size of copper grains can be increased, the copper recovery rate can be improved, and the slag bag turnover time can be shortened, resulting in significant economic and social benefits.

✦ Generated by Eureka AI based on patent content.

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    Figure CN117660769B_ABST
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Abstract

A copper slag slow cooling device and slow cooling process, the slow cooling device, the outer wall of the barrel is provided with a heat preservation plate, and a gap is formed between the heat preservation plate and the outer wall of the barrel; the heat preservation plate and the barrel are connected through a rib plate and a fixed plate; the upper end of the heat preservation plate is provided with a water guide plate, a gap is formed between the water guide plate and the outer wall of the barrel, and the water guide plate is inclined to guide the water flow towards the outer wall of the barrel; in the air cooling section, the water guide plate is used to hinder the air flow in the gap; the copper slag slow cooling process, the copper slag cooling includes an air cooling section and a water cooling section, the outer wall of the slag ladle in the air cooling section is provided with a heat preservation plate, and the heat preservation plate and the barrel form at least one gap; in the air cooling section, the gap is used to hinder the air flow and slow down the heat loss rate of the slag ladle; in the water cooling section, the overflowed water enters the gap, flows down along the outer wall of the barrel to the lower ring, and the heat preservation plate and the gap are used to limit the downward flow of the water flow along the outer wall of the barrel, so that the water flow does not deviate from the outer wall of the barrel or drips under the action of gravity.
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