Copper residue slow cooling device and slow cooling process
By installing insulation plates and water guide plates on the outer wall of the slag bag to form a partition cavity, the problem of the inability to adjust the cooling rate during the air cooling stage of copper slag is solved, achieving efficient recovery of copper from copper slag and shortening the slag bag turnover time, resulting in significant economic benefits.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI BAOSTEEL METALLURGICAL CONSTRUCTION CORP
- Filing Date
- 2023-11-29
- Publication Date
- 2026-07-21
AI Technical Summary
In existing technologies, the cooling rate during the air cooling stage of copper slag cannot be adjusted, resulting in insufficient copper recovery from the slag and a long slag bag turnover time.
Insulation plates and water guide plates are installed on the outer wall of the slag bag to form a partition cavity. The water guide plates obstruct air flow during the air cooling stage and guide water flow along the outer wall of the cylinder into the partition cavity during the water cooling stage, thereby slowing down or accelerating the cooling rate.
By adjusting the cooling rate of copper slag, the crystallization size of copper grains can be increased, the copper recovery rate can be improved, and the slag bag turnover time can be shortened, resulting in significant economic and social benefits.
Smart Images

Figure CN117660769B_ABST