Floor panels with exchangeable surface plates and laying and exchange process thereof
By using adhesive film bonding and heat source melting technology, the surface of the wood flooring can be replaced, solving the problems of resource waste and increased costs caused by replacing the whole piece, and realizing an environmentally friendly and efficient replacement process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG YUHUA TIMBER
- Filing Date
- 2023-12-05
- Publication Date
- 2026-08-04
AI Technical Summary
Existing wood flooring can only be replaced as a whole after the surface wears down, which leads to waste of resources, is environmentally unfriendly, and increases the cost of use.
The substrate layer is bonded to the surface panel using an adhesive film. The adhesive film is melted by a heat source and the surface panel is compacted to achieve the installation. The surface panel can be replaced by using the staggered design of the adhesive film and the heat source cutting technology. Combined with low temperature and high pressure curing, a stable bond is formed.
This enables the replacement of wood flooring panels, reducing resource waste, lowering usage costs, and protecting the environment.
Smart Images

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Figure BDA0004587077870000071
Abstract
Description
Technical Field
[0001] This invention relates to the field of flooring manufacturing technology, and in particular to a floor with replaceable top panels and its installation and replacement process. Background Technology
[0002] With the advancement of technology and social development, my country's wood products industry has experienced rapid growth, leading to the rapid development of the wood flooring industry. Currently, wood flooring is typically sold as a single unit, with interlocking blocks and grooves, but it cannot be disassembled. Over time, the surface of wood flooring wears down due to prolonged use, causing the paint to wear away and reducing the user experience.
[0003] In current technology, replacement requires replacing the entire floorboard. However, most of the wood flooring remains intact and undamaged. Such a replacement would be wasteful, detrimental to reducing operating costs, and also harmful to environmental protection. Summary of the Invention
[0004] In view of this, the present invention provides a floor with a replaceable panel and its installation and replacement process to solve the above-mentioned technical problems.
[0005] A process for installing and replacing a floor with a replaceable surface panel, the installation process comprising the following steps:
[0006] Provide multiple substrate layers and fix multiple substrate layers to the surface to be paved;
[0007] Multiple adhesive films are provided and the adhesive films are applied to the substrate layer. The melting temperature of the adhesive films should be between 60 and 140°C.
[0008] Multiple panels are provided, and at least three panels can be adhered to each of the substrate layers;
[0009] Multiple panels are laid on the adhesive film, with the edges of the panels offset from the edges of the substrate layer.
[0010] A heat source is provided, wherein the heating area of the heat source should be larger than the surface area of the panel, and the surface contact temperature provided by the heat source is between 80°C and 160°C.
[0011] A heat source is applied to the surface of the panel for 0.5 min to 5 min to melt the adhesive film, and a pressure of 10 kPa to 30 kPa is continuously applied to the surface of the panel to make the adhesive film adhere to the substrate layer and the panel.
[0012] Remove the heat source and apply continuous pressure to the surface of the panel using a low-temperature, high-quality block to quickly cure the bonded floor and form a stable bond.
[0013] The replacement process includes the following steps:
[0014] Melt the adhesive film under the panel that needs to be replaced;
[0015] Use a knife to cut the adhesive film along the gap between the dashboard panels that need to be replaced;
[0016] Remove the outer panel, clean off any remaining adhesive film on the substrate, and polish the substrate surface smooth.
[0017] Re-lay the adhesive film;
[0018] Re-lay new panels;
[0019] A heat source is attached to the surface plate to melt the adhesive film, and the surface plate is pressed to make the adhesive film adhere to the substrate layer and the surface plate.
[0020] A low-temperature, high-quality block is continuously pressed onto the surface of the panel to rapidly cure the bonded flooring, forming a stable bond.
[0021] Furthermore, each of the substrate layers is secured to the paved surface by fasteners.
[0022] Furthermore, the multiple substrate layers are fixed together by tenon joints.
[0023] Furthermore, the substrate is one of wood-based panels, glass panels, or polymer materials.
[0024] Furthermore, the adhesive film is one of PET, TPU, polyurethane hot melt adhesive, and thermoplastic resin adhesive, and the melting temperature of any one of PET, TPU, polyurethane hot melt adhesive, and thermoplastic resin adhesive is 60-140°C.
[0025] Furthermore, the heat source is a planar or non-planar heat source.
[0026] Furthermore, the heat source is a contact or indirect heat source.
[0027] A floor with replaceable top panels includes at least one substrate layer, an adhesive film laid on the substrate layer, and a top panel laid on the adhesive film, wherein the adhesive film is sandwiched between the substrate layer and the top panel, and the melting temperature of the adhesive film should be between 60 and 140°C. At least three top panels are adhered to each substrate layer, and the edges of each top panel are offset from the edges of the substrate layers to which they are adhered.
[0028] Furthermore, the substrate layer is fixed to the paved surface by fasteners.
[0029] Furthermore, the panel is made of several or a combination of wood, glass, metal or polymer materials. When the panel is a combination of several materials, it is formed into an integral planar or non-planar board through an adhesive or nested structure.
[0030] Compared with existing technologies, the replaceable panel flooring and its installation and replacement process provided by this invention first uses an adhesive film to bond the substrate layer and the panel, which forms the basis for panel replacement. During installation, the adhesive film is melted and compacted with a heat source to complete the installation. During replacement, the adhesive film is melted again with a heat source, and then a knife is used to cut the film along the seam between the two adjacent panel pieces. Since the area of each panel piece is smaller than the area of each substrate layer, and the edges of the panel piece are staggered from the edges of the substrate layer, this ensures that the substrate layer is not pulled up when the panel piece and adhesive film are removed, thus ensuring a smooth replacement process. After removing the old panel piece and adhesive film, a new adhesive film and panel piece can be laid, completing the panel replacement. Detailed Implementation
[0031] The following provides a more detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.
[0032] A replaceable surface panel flooring includes at least one substrate layer, an adhesive film laid on the substrate layer, and a surface panel laid on the adhesive film. The substrate layer can be one of wood-based panels, glass, or a polymer material. During installation, the substrate layer should be laid first on the ground and fixed in place. The melting temperature of the adhesive film should be between 60°C and 140°C to avoid damage to the substrate layer due to excessive heat. The adhesive film can be one of PET, TPU, polyurethane hot melt adhesive, or thermoplastic resin adhesive. The adhesive film is sandwiched between the substrate layer and the surface panel and is fixedly connected between them by melting. The surface panel should be made of wood-based panels, which conforms to people's usage habits. Of course, in some special cases, it can also be made of high-temperature resistant polymer materials. To achieve the replacement of the surface panel, at least three surface panels can be glued to each substrate layer; the specific reasons will be explained in the following process steps.
[0033] The present invention provides a process for installing and replacing a floor with a replaceable surface panel, wherein the installation process includes the following steps:
[0034] STEP101: Provide multiple substrate layers and fix multiple substrate layers to the surface to be covered;
[0035] STEP102: Provide multiple adhesive films and apply the adhesive films to the substrate layer. The melting temperature of the adhesive films should be between 60 and 140°C.
[0036] STEP103: Provide multiple panels, each of which can be bonded to at least three panels;
[0037] STEP104: Lay multiple panels on the adhesive film, with the edges of the panels offset from the edges of the substrate layer;
[0038] STEP105: Provide a heat source, the heating area of which should be larger than the surface area of the panel, and the surface contact temperature provided by the heat source is between 80°C and 160°C;
[0039] STEP106: Apply a heat source to the surface of the panel for 0.5 min to 5 min to melt the adhesive film and apply a pressure of 10 kPa to 30 kPa continuously on the surface of the panel to make the adhesive film adhere to the substrate layer and the panel;
[0040] STEP107: Remove the heat source and apply continuous pressure to the surface of the panel using a low-temperature, high-quality block to quickly cure the bonded flooring and form a stable bond.
[0041] The replacement process includes the following steps:
[0042] STEP201: Melt the adhesive film under the dashboard that needs to be replaced;
[0043] STEP 202: Use a knife to cut the adhesive film along the gap between the dashboard panels that need to be replaced;
[0044] STEP203: Remove the panel, clean off any remaining adhesive film on the substrate, and smooth the surface of the substrate.
[0045] STEP204: Re-lay the adhesive film;
[0046] STEP205: Re-lay new panels;
[0047] STEP206: Apply a heat source to the surface plate to melt the adhesive film and press the surface plate to make the adhesive film adhere to the substrate layer and the surface plate;
[0048] STEP207: A low-temperature, high-quality block is continuously pressed onto the surface of the panel to rapidly cure the already bonded flooring, forming a stable bond.
[0049] In step STEP 101, each of the substrate layers is secured to the surface to be laid using fasteners. Multiple substrate layers are then secured together using a tenon-and-mortise joint.
[0050] In step STEP 103, the area of each panel is smaller than the area of each substrate layer, and at least three panels can be attached to each substrate layer. The edges of the panel are offset from the edges of the substrate layer. This is to make it easier to peel off the panel when replacing it. The reason for this will be explained in detail later.
[0051] In step STEP 104, the heat source used can be a planar or non-planar heat source, and can be a contact or indirect heat source. Specifically, the heat source can be a flat ceramic infrared heater, a blower-type electric heater, etc., which are existing technologies and will not be described in detail. The heating area of the heat source should be slightly larger than the surface area of the panel, so that only one panel needs to be torn off at a time, thereby avoiding pulling up the substrate layer and damaging it.
[0052] In step STEP 201, the heat source is used to melt the adhesive film to facilitate the removal of the panel.
[0053] In step STEP 202, a tool must be used to cut the adhesive film between two adjacent panels. Since the heat source cannot melt the entire adhesive film, it must be melted piece by piece under each panel. Therefore, to avoid damaging the substrate layer due to excessive adhesion between the panel and the substrate layer via the adhesive film when removing the panel, the adhesive film must first be cut. Simultaneously, to prevent the substrate layer from being pulled up when tearing the adhesive film, the area of each panel is smaller than the area of each substrate layer, and the edges of the panel are offset from the edges of the substrate layer.
[0054] In step STEP 203, when peeling off the cover plate, the underlying adhesive film should also be removed. Of course, any remaining adhesive film on the substrate should be completely removed, and the substrate surface should be sanded smooth until it no longer protrudes from or floats on the substrate layer surface.
[0055] In steps STEP204 and 205, the film and panel to be replaced are re-laid. The laying method is the same as that in STEP104 to STEP106, and will not be described again here.
[0056] In steps STEP 107 and STEP 207, the applied weight should provide pressure between 10 kPa and 30 kPa, with a pressing time of 3 to 35 minutes. The weight can be removed once the surface temperature of the substrate drops below 30°C. It's conceivable that the application time may vary depending on the season. In summer, the time should be longer to allow sufficient time for the adhesive film between the surface panel and the substrate to cool and cure without being pressed away. In winter, the time should be shorter because temperatures drop quickly, requiring rapid pressing and bonding of the surface panel before the adhesive film cools below 30°C. Furthermore, the weight of the applied weight should vary depending on the type of adhesive film. For example, a lower density adhesive film requires a lighter weight, while a higher density adhesive film requires a heavier weight. Specific adjustments can be made based on actual needs and will not be elaborated further here.
[0057] Compared with existing technologies, the replaceable panel flooring and its installation and replacement process provided by this invention first uses an adhesive film to bond the substrate layer and the panel, which forms the basis for panel replacement. During installation, the adhesive film is melted and compacted with a heat source to complete the installation. During replacement, the adhesive film is melted again with a heat source, and then a knife is used to cut the film along the seam between the two adjacent panel pieces. Since the area of each panel piece is smaller than the area of each substrate layer, and the edges of the panel piece are staggered from the edges of the substrate layer, this ensures that the substrate layer is not pulled up when the panel piece and adhesive film are removed, thus ensuring a smooth replacement process. After removing the old panel piece and adhesive film, a new adhesive film and panel piece can be laid, completing the panel replacement.
[0058] Example 1
[0059] STEP100: Before laying the floor, prepare for the flooring installation in accordance with the relevant requirements in standard GB / T 20238 "Specifications for Installation, Acceptance and Use of Wood Flooring".
[0060] STEP101: Provide multiple 1000×1000×9.8mm poplar plywood substrate layers and fix multiple of these substrate layers to the surface to be paved;
[0061] STEP102: Provide multiple polyurethane hot melt adhesive films and attach the films to the substrate layer. The melting temperature of the films is 130°C.
[0062] STEP103: Provide multiple oak veneers with dimensions of 198×550×1.2mm, with 5 veneers glued to each substrate layer;
[0063] STEP104: Lay multiple panels on the adhesive film, with the edges of the panels offset from the edges of the substrate layer;
[0064] STEP105: Select a ceramic flat infrared heater to heat the floor surface. The heating area of the heater is 250×600mm, which is larger than the surface area of the panel. The surface contact temperature provided by the heat source can reach 160℃.
[0065] STEP106: Apply a heat source to the surface plate to melt the adhesive film and press the surface plate to make the adhesive film adhere to the substrate layer and the surface plate;
[0066] STEP 107: After heating for 1 minute, remove the heater and press the iron block with a size of 250×600×30mm onto the floor surface. After 5 minutes, remove the iron block. The floor surface is now glued.
[0067] The replacement process includes the following steps:
[0068] STEP201: Melt the adhesive film under the dashboard that needs to be replaced;
[0069] STEP 202: Use a knife to cut the adhesive film along the gap between the dashboard panels that need to be replaced;
[0070] STEP203: Remove the panel, clean off any remaining adhesive film on the substrate, and smooth the surface of the substrate.
[0071] STEP204: Repeat steps SIEP101-STEP107.
[0072] The adhesive strength and impregnation peel performance were tested according to the corresponding methods in the standard GB / T 18103-2022 for engineered wood flooring.
[0073]
[0074]
[0075] Note: Example 1-1 shows the performance test results of the first-time bonded replaceable flooring made by STEP101 to STEP107.
[0076] Examples 1-2 show the floor performance test results after the second replacement of the dashboard panels manufactured by STEP201 to STEP204.
[0077] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions or improvements within the spirit of the present invention are covered within the scope of the claims of the present invention.
Claims
1. An installation process for a floor with a replaceable surface panel, the installation process comprising the following steps: Multiple substrate layers are provided, and multiple substrate layers are fixed to the surface to be paved. The substrate layer is one of wood-based panels, glass panels, or polymer materials. Multiple adhesive films are provided and the adhesive films are attached to the substrate layer. The melting temperature of the adhesive films is between 60 and 140°C. The adhesive films are one type of thermoplastic resin adhesive. Multiple panels are provided, and each of the substrate layers can be used to adhere at least three of the panels; Multiple panels are laid on the adhesive film, with the edges of the panels offset from the edges of the substrate layer. A heat source is provided, wherein the heating area of the heat source is larger than the surface area of the panel, and the surface contact temperature provided by the heat source is between 80°C and 160°C. A heat source is applied to the surface of the panel for 0.5 to 5 minutes to melt the adhesive film, and a pressure of 10 kPa to 30 kPa is continuously applied to the surface of the panel to make the adhesive film adhere to the substrate layer and the panel to form a floor with a replaceable panel. The floor with a replaceable panel includes at least one substrate layer, an adhesive film laid on the substrate layer, and a panel laid on the adhesive film, with the adhesive film sandwiched between the substrate layer and the panel.
2. The installation process of the replaceable surface panel floor as described in claim 1, characterized in that: Each of the substrate layers is secured to the surface to be laid by fasteners.
3. The installation process of the replaceable panel flooring as described in claim 1, characterized in that: Multiple substrate layers are fixed together by tenon joints.
4. The installation process of the replaceable panel flooring as described in claim 1, characterized in that: The heat source is either planar or non-planar.
5. The installation process of the replaceable surface panel floor as described in claim 1, characterized in that: The heat source can be a contact heat source or a non-contact heat source.
6. The installation process of the replaceable panel flooring as described in claim 1, characterized in that: The panel is made of several or a combination of wood, glass, metal or polymer materials. When the panel is a combination of several materials, it is formed into a whole planar or non-planar board through an adhesive or nested structure.
7. A replacement process for a floor with a replaceable panel, the replacement process comprising the following steps: A floor with replaceable panels is provided. The floor with replaceable panels includes at least one substrate layer, an adhesive film laid on the substrate layer, and a panel laid on the adhesive film. The adhesive film is sandwiched between the substrate layer and the panel. The melting temperature of the adhesive film is between 60 and 140°C. At least three panels are adhered to each substrate layer. The edge of each panel is offset from the edge of the substrate layer to which it is adhered. Use a heat source to melt the adhesive film under the panel that needs to be replaced; Use a knife to cut the adhesive film along the gap between the dashboard panels that need to be replaced; Remove the outer panel, clean off any remaining adhesive film on the substrate, and polish the surface of the substrate smooth. Re-lay the adhesive film; Re-lay new panels; A heat source is attached to the surface plate to melt the adhesive film, and the surface plate is pressed to make the adhesive film adhere to the substrate layer and the surface plate. The surface of the panel is continuously pressed with a low-temperature, high-quality block to rapidly cure the already bonded flooring, forming a stable bond.
8. The replacement process for the replaceable panel floor as described in claim 7, characterized in that: Multiple substrate layers are fixed together by tenon joints.
9. The replacement process for the replaceable panel floor as described in claim 7, characterized in that: The heat source is either planar or non-planar.
10. The replacement process for the replaceable panel floor as described in claim 7, characterized in that: The heat source can be a contact heat source or a non-contact heat source.