A surface acoustic wave temperature sensing device and temperature sensing system

Abstract

The application provides a surface acoustic wave temperature sensing device and a temperature sensing system, the surface acoustic wave temperature sensing device comprising: a surface acoustic wave sensor module; an antenna module, the antenna module comprising a microwave dielectric substrate, the microwave dielectric substrate having opposite first and second surfaces; the first surface being provided with a patterned antenna, and the second surface serving as a ground plane of the antenna module; one or more resistance through holes being further provided on the microwave dielectric substrate, a rod-shaped resistance being arranged in the resistance through hole or a patch resistance being arranged at one end of the resistance through hole, and two connecting ends of the rod-shaped resistance or the patch resistance being connected with the ground plane and the patterned antenna respectively; wherein the second surface is further provided with a groove structure corresponding to the shape and thickness of the surface acoustic wave sensor module, and the surface acoustic wave sensor module is arranged in the groove structure; and the surface acoustic wave sensor module is electrically connected with the patterned antenna of the first surface of the microwave dielectric substrate through a metallized connecting hole.

Description

Technical Field

[0001] This invention relates primarily to the field of sensing devices, and more particularly to a surface acoustic wave temperature sensing device and a temperature sensing system. Background Technology

[0002] Traditional methods for measuring the temperature of moving parts in mechanical or electrical equipment mainly rely on thermocouple sensors and RFID (Radio Frequency Identification) devices. Thermocouple sensors require openings in the measured equipment, which may affect its structural strength. RFID chips, due to their low operating temperature, are unsuitable for high-temperature environments. Therefore, providing a temperature measurement method that achieves a compact size, high-temperature resistance, and does not damage the structure of the measured component is a problem that needs to be solved. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a surface acoustic wave temperature sensing device and temperature sensing system to realize effective and convenient temperature measurement of moving parts in mechanical or electrical equipment.

[0004] To address the aforementioned technical problems, this invention provides a surface acoustic wave (SAW) temperature sensing device, comprising: a SAW sensor module; and an antenna module, the antenna module including a microwave dielectric substrate having opposing first and second surfaces; a patterned antenna disposed on the first surface, and the second surface serving as a ground plane for the antenna module; the ground plane and the patterned antenna being electrically connected; one or more resistive vias are also provided on the microwave dielectric substrate, each via containing a rod-shaped resistor or a patch resistor at one end, the two ends of which are respectively connected to the ground plane and the patterned antenna; wherein the second surface also has a groove structure corresponding to the shape and thickness of the SAW sensor module, the SAW sensor module being mounted in the groove structure and fixed integrally with the antenna module; the SAW sensor module is electrically connected to the patterned antenna on the first surface of the microwave dielectric substrate via a metallized connection hole.

[0005] In one embodiment of the present invention, the rod-shaped resistor is made of graphite.

[0006] In one embodiment of the present invention, a first via array is provided on the microwave dielectric substrate, and some or all of the vias in the first via array are filled with metal to realize the electrical connection between the ground plane and the patterned antenna.

[0007] In one embodiment of the present invention, the sidewall of the microwave dielectric substrate is provided with a first metal connection portion to realize the electrical connection between the ground plane and the patterned antenna.

[0008] In one embodiment of the present invention, the groove structure is located at the edge of the second surface of the microwave dielectric substrate.

[0009] In one embodiment of the present invention, the surface acoustic wave sensor module is provided with one or more solder points on the surface facing the groove structure, and one or more solder pads are provided in the groove structure accordingly, so that the surface acoustic wave sensor module is fixed in the groove structure by welding.

[0010] In one embodiment of the present invention, when the groove structure is provided with a single pad, the pad is electrically connected to a patterned antenna on the first surface of the microwave dielectric substrate through a metallized connection hole; when the groove structure is provided with multiple pads, some of the pads are electrically connected to a patterned antenna on the first surface of the microwave dielectric substrate through a metallized connection hole.

[0011] In one embodiment of the present invention, the pad is electrically connected to the ground plane.

[0012] In one embodiment of the present invention, the sidewall of the groove structure is provided with a second metal layer, and the pad is electrically connected to the ground plane through the second metal layer.

[0013] In one embodiment of the invention, the patterned antenna has one or more notches.

[0014] In one embodiment of the present invention, the resistive via has a stepped structure at both ends near the first surface or the second surface.

[0015] In one embodiment of the present invention, the stepped structure is provided with metal material.

[0016] In one embodiment of the present invention, the microwave dielectric substrate comprises a ceramic-polyphenylene ether resin material or an alumina ceramic material.

[0017] The present invention also provides a temperature sensing system, including a surface acoustic wave temperature sensing device as described in any of the preceding claims; a wireless receiving antenna configured to receive radio frequency signals emitted by the antenna module of the surface acoustic wave temperature sensing device; and a control module configured to obtain a temperature measurement result based on the parsing operation of the received radio frequency signals.

[0018] In one embodiment of the present invention, the surface acoustic wave temperature sensing device is mounted on the surface of a moving part of a machine.

[0019] In one embodiment of the present invention, the moving component includes an engine connecting rod, a connecting rod bearing, a bearing, or an engine blade.

[0020] Compared with the prior art, the present invention has the following advantages: The technical solution provided by the present invention has the characteristics of small size, compact structure, wireless transmission and high temperature resistance, and does not require damage to the mechanical structure of the original mechanical or electrical equipment, and is suitable for temperature monitoring of moving parts in limited space and high temperature environment. Attached Figure Description

[0021] The accompanying drawings are included to provide a further understanding of this application and form part of this application. The drawings illustrate embodiments of this application and, together with this specification, serve to explain the principles of this application.

[0022] In the attached image:

[0023] Figure 1 This is an exploded perspective view of a surface acoustic wave temperature sensing device according to an embodiment of this application.

[0024] Figure 2 This is a top view of a surface acoustic wave temperature sensing device according to an embodiment of this application.

[0025] Figure 3 This is a top view of a surface acoustic wave temperature sensing device according to another embodiment of this application.

[0026] Figure 4 This is a top view of a surface acoustic wave temperature sensing device according to another embodiment of this application.

[0027] Figure 5 This is a schematic diagram of the S-parameters of an antenna module according to an embodiment of this application.

[0028] Figure 6 This is a schematic diagram of the composition of a temperature sensing system according to an embodiment of this application. Detailed Implementation

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0030] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0031] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the accompanying drawings are not drawn to actual scale.

[0032] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0033] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In addition, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application's specification may have been chosen by the applicant according to his or her judgment, and their detailed meanings are explained in the relevant sections of this description. Moreover, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0034] Embodiments of this application describe a surface acoustic wave temperature sensing device and a temperature sensing system.

[0035] Figure 1 This is an exploded perspective view of a surface acoustic wave temperature sensing device according to an embodiment of this application. Figure 2 This is a top view of a surface acoustic wave temperature sensing device according to an embodiment of this application. Figure 3 This is a top view of a surface acoustic wave temperature sensing device according to another embodiment of this application. Figure 4 This is a top view of a surface acoustic wave temperature sensing device according to another embodiment of this application.

[0036] refer to Figures 1 to 4 The surface acoustic wave temperature sensing device 100 includes a surface acoustic wave sensor module 110 and an antenna module 120.

[0037] The surface acoustic wave (SAW) sensor module 110 includes, for example, an interdigital transducer that characterizes temperature values ​​by responding to the surface acoustic wave’s response to temperature changes on the surface of an object.

[0038] Antenna module 120 includes a microwave dielectric substrate 130, which has a first surface 135 and a second surface 221 facing each other. The first surface 135 is covered with a patterned antenna 121, and the second surface 221 serves as the ground plane GND of antenna module 120.

[0039] The ground plane GND is electrically connected to the patterned antenna 121. One or more resistor vias are also provided on the microwave dielectric substrate 130. Figures 1 to 4 The diagram shows two resistor vias, including a first resistor via 132 and a second resistor via 133. In some embodiments, a rod-shaped resistor 150 is installed in the resistor via, with its two terminals connected to the ground plane GND and the patterned antenna 121, respectively. In other embodiments, a patch resistor (SMDResistor) is provided at one end of the resistor via, with its two terminals connected to the ground plane GND and the patterned antenna 121, respectively. In some embodiments, the rod-shaped resistor (or columnar resistor, the column shape being, for example, cylindrical, square, or elliptical) is made of graphite. Figure 1 The image shows a first rod-shaped resistor 151 and a second rod-shaped resistor 152, which correspond to the first resistor via 132 and the second resistor via 133, respectively.

[0040] In some embodiments, the second surface 221 is further provided with a groove structure 140 corresponding to the shape and thickness of the surface acoustic wave sensor module 110. The surface acoustic wave sensor module 110 is installed in the groove structure 140 and fixed as an integral structure with the antenna module 120. The surface acoustic wave sensor module 110 is electrically connected to the patterned antenna 121 on the first surface 135 of the microwave dielectric substrate 130, for example, through a metallized connection hole 141. The groove structure 140 is, for example, rectangular or other shapes corresponding to the surface acoustic wave sensor module 110. After the surface acoustic wave sensor module 110 is installed in the groove structure 140, its outer surface is, for example, flush with the second surface 221 of the antenna module 120. The metallized connection hole 141 can also serve as a feed via of the antenna module 120, and the distance from the feed via to the edge of the microwave dielectric substrate 130 is the feed position Fx of the antenna module 120.

[0041] In some embodiments, a first via array 131 is provided on the microwave dielectric substrate 130, and some or all of the vias in the first via array 131 are filled with metal to achieve an electrical connection between the ground plane GND and the patterned antenna 121. The filling metal material includes, for example, high-temperature resistant silver paste or other high-temperature resistant metal materials. In other embodiments, a first metal connection portion (not shown) is provided on the sidewall 137 of the microwave dielectric substrate 130 to achieve an electrical connection between the ground plane GND and the patterned antenna 121. The groove structure 140 is located, for example, at the edge of the second surface 221 of the microwave dielectric substrate 130.

[0042] The array of metallized vias formed on the microwave dielectric substrate can influence the length of the current path in the antenna module, thereby controlling the range of the antenna resonant frequency and enabling better matching between the resonant frequencies of the antenna module and the surface acoustic wave (SAW) sensor module. If the impedance of the SAW sensor module at its resonant frequency is, for example, 50 ohms, the impedance of the antenna module can be adjusted to match it, thus achieving maximum signal radiation efficiency.

[0043] In some embodiments, the surface acoustic wave sensor module 110 has one or more solder points on its surface facing the groove structure 140, and one or more solder pads are correspondingly provided in the groove structure 140, so that the surface acoustic wave sensor module 110 is fixed in the groove structure 140 by soldering. Figures 1 to 4 The first solder joint 111, the second solder joint 112, the third solder joint 113 and the fourth solder joint 114 are marked, as are the first pad 231, the second pad 232, the third pad 233 and the fourth pad 234.

[0044] In some embodiments, when the recess structure 140 is provided with a single pad, the pad is electrically connected to the patterned antenna 121 on the first surface 135 of the microwave dielectric substrate 130 through a metallized connection hole 141. When the recess structure 140 is provided with multiple pads, some of the pads are electrically connected to the patterned antenna 121 on the first surface 135 of the microwave dielectric substrate 130 through the metallized connection hole 141.

[0045] The pads are electrically connected to the ground plane GND, for example. In some embodiments, the sidewall 235 of the recess structure 140 is provided with a second metal layer, through which the pads are electrically connected to the ground plane GND.

[0046] In some embodiments, the patterned antenna 121 has one or more notches. For example Figure 1 or Figure 2 The first notch 122 and the second notch 123 are marked in the middle. Figure 3 and Figure 4 The third notch 124 and the fourth notch 125 are shown. Figure 1 and Figure 2 In this context, the notch on the patterned antenna 121 can also be referred to as an H-shaped slot. Figure 3 and Figure 4In this design, the notch on the patterned antenna 121 can also be referred to as an S-shaped slot. The slot further increases the current path on the antenna module, thereby enabling further miniaturization of the antenna and lowering its resonant frequency. Furthermore, adjusting the depth of the H-shaped or S-shaped slot allows control over the range of the antenna's resonant frequency, further matching the resonant frequencies of the antenna module and the surface acoustic wave sensor module. The patterned antenna 121 is implemented, for example, by copper plating, while the notch is fabricated, for example, by an etching process.

[0047] Figure 5 This is a schematic diagram of the S-parameters of an antenna module according to an embodiment of this application. Curve 401 is the S-parameter curve of the antenna module according to an embodiment of this application, and curve 402 is the S-parameter curve of other types of antenna modules, such as antenna modules without resistor vias and rod resistors or SMD resistors. The antenna module of this application has a bandwidth of up to 9.5MHz, achieving a significant improvement in operating bandwidth.

[0048] In some embodiments, the resistive via has a stepped structure at both ends near the first surface 135 or the second surface 221. For example Figure 1 The first resistor via 132 and the second resistor via 133 have stepped structures at both ends near the first surface 135 or the second surface 221. Metal material is distributed on the stepped structures to more tightly fix the rod-shaped resistor 150 in the resistor via.

[0049] In some embodiments, the microwave dielectric substrate 130 comprises a ceramic-polyphenylene oxide (PPO) material or an alumina ceramic material.

[0050] The surface acoustic wave temperature sensing device of this application introduces current loss into the antenna module through a rod-shaped resistor installed in a resistor via or a patch resistor set at one end of the resistor via, thereby effectively improving the bandwidth of the antenna module and the overall temperature resistance of the sensing device, and enabling the temperature measurement parameters of the surface acoustic wave sensing module to be transmitted more quickly, thus achieving effective and accurate measurement of temperature values.

[0051] The surface acoustic wave (SAW) temperature sensing device of this application integrates the SAW sensor module and antenna into a single, compact structure, facilitating mounting on the surface of the object being measured. Furthermore, the SAW temperature sensing device and the object being measured can directly contact each other, resulting in more accurate temperature measurements. This solution can achieve high temperatures of several hundred degrees Celsius, such as surface temperatures of 500 to 600°C, enabling wireless and passive measurement while meeting the requirements for stable and accurate temperature measurement.

[0052] The antenna module of the surface acoustic wave temperature sensing device of this application does not require additional impedance matching components such as inductors and capacitors that are not resistant to high temperatures, nor does it require the use of microstrip lines with narrow bandwidth and large footprint for impedance matching, thus ensuring the miniaturization, high temperature resistance, and wide operating temperature range of the antenna module and the temperature sensing device.

[0053] The present invention also provides a temperature sensing system. Figure 6 This is a schematic diagram of the composition of a temperature sensing system according to an embodiment of this application. (Reference) Figure 6 The temperature sensing system includes a surface acoustic wave temperature sensing device 100 as described above, a wireless receiving antenna 601, and a control module 602.

[0054] In some embodiments, the wireless receiving antenna 601 is configured to receive radio frequency signals emitted by the antenna module of the surface acoustic wave temperature sensing device. The control module 602 is configured to obtain a temperature measurement result based on the parsing operation of the received radio frequency signals.

[0055] In some embodiments, the surface acoustic wave temperature sensor is mounted on the surface of a moving part of a machine. The moving part includes an engine connecting rod, connecting rod bearing, bearing, or engine blade.

[0056] The surface acoustic wave temperature sensing device and temperature sensing system provided by the present invention are small in size, compact in structure, wireless in transmission and high in temperature resistance, and do not require damage to the mechanical structure of the original mechanical or electrical equipment. They are suitable for temperature monitoring of moving parts in space-constrained and high-temperature environments.

[0057] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0058] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0059] Some aspects of this application may be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The aforementioned hardware or software may be referred to as a "data block," "module," "engine," "unit," "component," or "system." The processor may be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. Furthermore, aspects of this application may be manifested as a computer product located on one or more computer-readable media, including computer-readable program code.

[0060] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0061] Although this application has been described with reference to specific embodiments, those skilled in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, any changes or modifications to the above embodiments within the essential spirit of this application will fall within the scope of the claims of this application.

Claims

1. A surface acoustic wave temperature sensing device, comprising: Surface acoustic wave sensor module; An antenna module, the antenna module including a microwave dielectric substrate, the microwave dielectric substrate having opposing first and second surfaces; The first surface is covered with a patterned antenna, and the second surface serves as the ground plane of the antenna module; The ground plane and the patterned antenna are electrically connected; one or more resistor vias are also provided on the microwave dielectric substrate, and a rod-shaped resistor is installed in the resistor via or a patch resistor is provided at one end of the resistor via. The two connection ends of the rod-shaped resistor or the patch resistor are respectively connected to the ground plane and the patterned antenna. The second surface is further provided with a groove structure corresponding to the shape and thickness of the surface acoustic wave sensor module. The surface acoustic wave sensor module is installed in the groove structure and fixed to the antenna module as an integral structure. The surface acoustic wave sensor module is electrically connected to the patterned antenna on the first surface of the microwave dielectric substrate through a metallized connection hole.

2. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The rod-shaped resistor is made of graphite.

3. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The microwave dielectric substrate is provided with a first via array, and some or all of the vias in the first via array are filled with metal to achieve electrical connection between the ground plane and the patterned antenna.

4. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The microwave dielectric substrate has a first metal connection portion on its sidewall to realize the electrical connection between the ground plane and the patterned antenna.

5. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The groove structure is located at the edge of the second surface of the microwave dielectric substrate.

6. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The surface acoustic wave sensor module has one or more solder points on its surface facing the groove structure, and one or more solder pads are correspondingly provided in the groove structure so that the surface acoustic wave sensor module is fixed in the groove structure by welding.

7. The surface acoustic wave temperature sensing device according to claim 6, characterized in that, When the groove structure is provided with a pad, the pad is electrically connected to the patterned antenna on the first surface of the microwave dielectric substrate through a metallized connection hole; When the groove structure is provided with multiple pads, some of the pads are electrically connected to the patterned antenna on the first surface of the microwave dielectric substrate through metallized connection holes.

8. The surface acoustic wave temperature sensing device according to claim 6, characterized in that, The pads are electrically connected to the ground plane.

9. The surface acoustic wave temperature sensing device according to claim 8, characterized in that, The sidewall of the groove structure is provided with a second metal layer, and the pad is electrically connected to the ground plane through the second metal layer.

10. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The patterned antenna has one or more notches.

11. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The resistive via has a stepped structure at both ends near the first or second surface.

12. The surface acoustic wave temperature sensing device according to claim 11, characterized in that, The stepped structure is covered with metal material.

13. The surface acoustic wave temperature sensing device according to claim 1, characterized in that, The microwave dielectric substrate comprises a ceramic-polyphenylene ether resin material or an alumina ceramic material.

14. A temperature sensing system, comprising the surface acoustic wave temperature sensing device as described in any one of claims 1-13; The wireless receiving antenna is configured to receive radio frequency signals emitted by the antenna module of the surface acoustic wave temperature sensing device. The control module is configured to obtain temperature measurement results based on the parsing operation of the received radio frequency signal.

15. The temperature sensing system according to claim 14, characterized in that, The surface acoustic wave temperature sensing device is installed on the surface of the moving parts of the machine equipment.

16. The temperature sensing system according to claim 15, characterized in that, The moving parts include engine connecting rods, connecting rod bearings, bearings, or engine blades.

Images