一种评估热敏电阻在硅压阻传感器硬件补偿中影响的方法
By acquiring the resistance value of the bridge arm in a silicon piezoresistive sensor and using interpolation to expand the data points for circuit simulation calculations, the problem of evaluating the influence of thermistors in the compensation circuit is solved. This achieves accurate evaluation and optimization of compensation parameters, reduces costs, and improves the output accuracy of the sensor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WUHAN AVIATION INSTR
- Filing Date
- 2023-10-20
- Publication Date
- 2026-07-17
AI Technical Summary
In the hardware compensation process of silicon piezoresistive sensors, existing technologies struggle to accurately assess the influence of thermistors, especially the inflection point characteristics of nonlinear NTC thermistors. This results in significant differences in the compensated output characteristics outside the control point, increasing testing costs.
By collecting the resistance values of the bridge arm resistors, a temperature-resistance coordinate system is established. The data points are expanded using interpolation, and circuit simulation calculations are performed to evaluate the influence of the thermistor in the compensation circuit. The interpolation method is used to expand the correlation data between the bridge arm resistance and temperature and pressure, and to guide the selection of compensation parameters.
Without increasing workload, the impact of thermistors on compensation results can be accurately assessed, reducing actual calibration tests, improving compensation accuracy, avoiding out-of-tolerance output characteristics at the inflection point, and reducing costs.
Smart Images
Figure CN117664431B_ABST