Detection circuit

Abstract

This invention relates to a detection circuit used to detect a circuit component under test. The detection circuit utilizes a power supply measurement unit to provide a test power source. Simultaneously, a switching module connects a probe module to the power supply measurement unit, forming a loop with the circuit component under test. The test power source is then supplied to the circuit component under test via the probe module, generating a corresponding test voltage. This allows for the detection of the quantifiable electrical properties of the circuit component under test.

Description

Technical Field

[0001] This invention relates to a test circuit, and more particularly to a detection circuit, for detecting the electrical properties of a circuit element under test. Background Technology

[0002] The manufacturing of integrated circuits (ICs) or chips begins with upstream IC design companies proposing circuit design schemes. Midstream semiconductor foundries then provide the corresponding semiconductor manufacturing processes based on these designs. Finally, downstream packaging and testing plants conduct circuit testing on the ICs or chips manufactured by the foundries. Therefore, circuit testing is an indispensable stage in the manufacturing process of integrated circuits (ICs) or chips. Regardless of whether traditional packaging or wafer-level packaging is used, both wafer-level and packaged integrated circuits (ICs) or chips must undergo a specific testing procedure to ensure that every electronic component within the integrated circuit or chip functions correctly.

[0003] Furthermore, after integrated circuits (ICs) or chips are placed on a circuit board, the circuit layout on the circuit board also needs to be tested and verified. For example, circuit testing and verification of printed circuit boards (PCBs) are now being carried out using automated test equipment (ATE) to automatically test electronic components on circuit boards, and even test integrated circuits (ICs) or chips on circuit boards.

[0004] However, the testing process typically involves using probes to contact test pads or pins on the circuit board. The test voltage can potentially generate sparks, and automated testing equipment fails to provide testers with effective quantitative data. For example, the testing device described in Nidec Reed Ltd.'s Chinese Patent No. CN104422860B uses a judgment unit to determine whether a constant current source provides a constant current to the circuit under test and whether the test voltage of the circuit under test maintains a certain voltage slope to determine if the circuit is faulty. However, it fails to obtain precise, quantifiable values.

[0005] To address the aforementioned problems, this invention provides a detection circuit that uses a switching module to connect a probe module and a power measurement unit, thereby enabling the circuit element under test coupled to the probe module to form a loop with the probe module and the power measurement unit. A test voltage is obtained from the circuit element under test using a test power supply, thereby allowing the detection circuit to obtain quantifiable data from the circuit element under test. Summary of the Invention

[0006] One objective of this invention is to provide a detection circuit that couples a power measurement unit, a switching module, and an impedance element via a probe module. The probe module detects a circuit element under test, and the switching module turns on the power measurement unit and the probe module to supply test power to the circuit element under test, thereby obtaining the corresponding test voltage. Thus, quantifiable data can be obtained from the circuit element under test.

[0007] To achieve the aforementioned objectives, the present invention provides a detection circuit for detecting a circuit element under test (DUT), comprising: a probe module; a power measurement unit coupled to the probe module and a ground terminal; a switching module coupled to both the probe module and the power measurement unit; and an impedance element, a first terminal coupled to the probe module, and a second terminal coupled to the power measurement unit and the ground terminal; wherein, when the switching module conducts the circuit, forming a loop with the probe module and the power measurement unit, the power measurement unit provides a test power supply, which is supplied to the DUT via the probe module to generate a first test voltage.

[0008] The present invention further provides an embodiment in which, when the circuit impedance value of the circuit element under test is less than the default impedance value of the power supply measurement unit, the power supply measurement unit switches the test power supply to a current source, supplies power to the circuit element under test through the probe module, and generates a second test voltage accordingly.

[0009] The present invention further provides an embodiment in which there is a difference between a first test impedance value corresponding to the second test voltage and the test power supply and a second test impedance value of the impedance element, the difference corresponding to an electrical insulation strength of the circuit element under test.

[0010] The present invention further provides an embodiment in which the difference is 100 ohms to 10k ohms.

[0011] The present invention further provides an embodiment in which the current source is a constant current, which is a certain value between 1 mA and 30 mA.

[0012] The present invention further provides an embodiment in which a processing unit is coupled to the probe module, the processing unit being used to determine that when the first test voltage exceeds a threshold value, the first test voltage corresponds to a normal state of the circuit element under test.

[0013] The present invention further provides an embodiment in which the circuit element under test includes a first circuit and a second circuit, and the probe module includes a first probe element and a second probe element. When the first probe element and the second probe element are respectively coupled to the first circuit and the second circuit, and the switch module is turned on, the probe module, the power measurement unit and the impedance element form a loop with the circuit element under test.

[0014] The present invention further provides an embodiment in which the first test voltage is a default voltage setpoint. Attached Figure Description

[0015] Figure 1 This is a system schematic diagram of an embodiment of the present invention; Figure 2 This is a schematic diagram of an open-circuit switch module according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the switching module being turned on according to an embodiment of the present invention; Figure 4 It is a signal curve diagram of the normal state according to an embodiment of the present invention; and Figure 5 This is a signal curve diagram of an abnormal state according to an embodiment of the present invention.

[0016] [Figure Number Reference Guide] 10 Detection Circuit 12-probe module 122 First probe element 124 Second Probe Element 14 Power Measurement Unit 16-switch module 18 impedance units 20 processing units 22 sensing units C1 First Circuit C2 Second Circuit DET detection control signal FB feedback signal GND ground terminal P test power supply PCB circuit components under test SEN sensing signal SGND system grounding level SW switch signal TH1 threshold value V S Voltage detection signal V S1 First test voltage V S2 Second test voltage Detailed Implementation

[0017] To provide a better understanding of the structural features and effects achieved by the present invention, preferred embodiments and detailed descriptions are provided below: Certain terms are used in the specification and claims to refer to specific elements. However, those skilled in the art will understand that the same element may be referred to by different names. Furthermore, the specification and claims do not distinguish elements by differences in name, but rather by differences in the overall technical aspects of the elements. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." Moreover, the term "coupled" here includes any direct and indirect means of connection. Therefore, if a first device is described as coupled to a second device, it means that the first device can be directly connected to the second device, or can be indirectly connected to the second device through other devices or other means of connection.

[0018] In view of the fact that the automated testing device in the aforementioned prior art does not provide quantifiable testing data, it is impossible to provide quantifiable values ​​so that users can intuitively understand the circuit testing status.

[0019] The invention will be described in detail below by way of the drawings illustrating various embodiments thereof. However, the concept of the invention may be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein.

[0020] First, please refer to Figure 1 This is a system schematic diagram of an embodiment of the present invention. As shown in the figure, the detection circuit 10 of an embodiment of the present invention includes a probe module 12, a power measurement unit 14, a switch module 16, and an impedance element 18. The probe module 12 in this embodiment is used to detect a circuit element PCB, such as detecting circuit elements on a printed circuit board, integrated circuits on a wafer, etc. The power measurement unit 14 is coupled to the probe module 12 and a ground terminal GND. In particular, the switch module 16 is provided between the probe module 12 and the power measurement unit 14, so that the switch module 16 is coupled to the probe module 12 and the power measurement unit 14 respectively. A first end of the impedance element 18 is coupled to the probe module 12, and a second end of the impedance element 18 is coupled to the power measurement unit 14 and coupled to the ground terminal GND.

[0021] Continuing from the above, such as Figure 2 As shown, when the switch module 16 is open-circuited, the probe module 12, the power measurement unit 14, and the PCB of the circuit component under test do not form a loop. Figure 3 As shown, when the switch module 16 turns on the probe module 12 and the power measurement unit 14 to form a loop with the PCB of the circuit under test, the power measurement unit 14 provides a test power supply P, which is supplied to the PCB of the circuit under test through the probe module 12, thereby generating a voltage detection signal V. S .like Figure 4 As shown, the high level (ON) of the detection control signal DET indicates the detection period of the probe module 12 in detecting the PCB of the circuit under test. The switch control signal SW indicates the switching period of the switch module 16. ON means that the switch module 16 is turned on, and OFF means that the switch module 16 is open. The voltage detection signal V S This indicates the voltage level obtained by the detection circuit 10. When the circuit impedance value of the PCB of the circuit component under test is greater than the default impedance value of the power supply measurement unit 14, the power supply measurement unit 14 switches the test power supply P to a voltage source (e.g., a 250V voltage source, whose voltage is 250V relative to the system ground level SGND). At this time, the voltage detection signal V... S That is, the first test voltage V S1 When the first test voltage V S1 When the voltage exceeds a threshold value TH1 (e.g., a 200V voltage level), that is, when it is greater than the threshold value TH1, the first test voltage V... S1 This corresponds to the PCB of the circuit component under test being in a normal state.

[0022] like Figure 5 As shown, when the circuit impedance of the PCB of the circuit element under test is less than a default impedance value of the power supply measurement unit 14, the power supply measurement unit 14 switches the test power supply P to a current source, which supplies power to the PCB of the circuit element under test through the probe module 12, and the corresponding voltage detection signal V is generated. S That is, a second test voltage V S2 The test power supply P corresponds to a first test impedance value R. S1 A second test impedance value R of the impedance element 18 S2 There is a difference between them, and the first test impedance value R S1 The circuit impedance value corresponding to the PCB of the circuit element under test is calculated using the following formula: RSPK=[(V S / I S )-R S2 ]=[R S1 -RS2 ] Among them, I S This refers to the current value when the test power supply P switches to the current source. RSPK is the difference, which corresponds to the electrical insulation strength of the PCB of the circuit component under test. This difference is approximately between 100 ohms and 10k ohms.

[0023] When the test power supply P provided by the power measurement unit 14 in the above embodiment is a current source, the current source is a constant current, which is a certain value between 1 mA and 30 mA. Additionally, the first test voltage V... S1 This is a default voltage setting.

[0024] See also Figure 1 and Figure 2 As can be seen, the detection circuit 10 in this example further includes a processing unit 20 and a sensing unit 22. The processing unit 20 is coupled to the probe module 12, and the processing unit 20 determines the first test voltage V based on the detection control signal DET. S1 With the second test voltage V S2 When the sensing unit 22 obtains the first test voltage V that is greater than the threshold value TH1, S1 At that time, the processing unit 20 determines that the PCB of the circuit component under test is the first test voltage V. S1 A corresponding normal state, and when the sensing unit 22 obtains the second test voltage V which is less than the threshold value TH1. S2 At that time, the processing unit 20 determines that the PCB of the circuit component under test is the second test voltage V. S2 This corresponds to an abnormal state. Without needing to gradually change the voltage level of the test power supply P by controlling the power measurement unit 14, the PCB of the circuit under test can be directly measured to obtain quantifiable values ​​and determine whether the PCB of the circuit under test is abnormal.

[0025] Furthermore, the processing unit 20 can be further coupled to the power measurement unit 14, so that the processing unit 20 obtains a value of the test power supply P through a feedback signal FB from the power measurement unit 14. In this embodiment, the processing unit 20 is coupled to the probe module 12 through the sensing unit 22, so that when the switching module 16 is turned on, the sensing unit 22 can measure the corresponding test power supply V. S1 With the second test voltage V S2 The corresponding sensing signal SEN is generated and sent to the processing unit 20, thereby allowing the processing unit 20 to obtain the test power supply V through the sensing signal SEN. S1 With the second test voltage V S2 The corresponding measurement values.

[0026] See also Figure 1 The circuit PCB under test includes a first circuit C1 and a second circuit C2. The probe module 12 includes a first probe element 122 and a second probe element 124. When the first probe element 122 and the second probe element 124 are respectively coupled to the first circuit C1 and the second circuit C2, and the first circuit C1 and the second circuit C2 are electrically connected, when the switch module 16 is turned on, the probe module 12, the power measurement unit 14 and the impedance element 18 form a loop with the circuit PCB under test.

[0027] In summary, the present invention provides a detection circuit that detects a circuit component under test through a probe module and controls it through a power measurement unit and a switching module. For example, when the circuit impedance value of the circuit component under test is less than the default impedance value of the power measurement unit, the power measurement unit is driven to switch its test power supply to a certain current source, thereby detecting and obtaining abnormal measurement values ​​and providing quantifiable data, which is no longer a traditional detection method, thus avoiding errors or mistakes.

[0028] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A detection circuit, characterized in that, It is used to test a circuit component under test, the test circuit comprising: One probe module; A power measurement unit is coupled to the probe module and a ground terminal respectively; A switch module, each of which is respectively coupled to the probe module and the power measurement unit; as well as An impedance element, a first end of which is coupled to the probe module, and a second end of which is coupled to the power measurement unit and the ground terminal; When the switch module connects the probe module and the power measurement unit to form a loop with the circuit element under test, the power measurement unit provides a test power supply, which is then supplied to the circuit element under test via the probe module to generate a first test voltage.

2. The detection circuit as described in claim 1, characterized in that, When the circuit impedance value of the circuit element under test is less than the default impedance value of the power supply measurement unit, the power supply measurement unit switches the test power supply to a current source, which supplies power to the circuit element under test through the probe module, thereby generating a second test voltage.

3. The detection circuit of claim 2, wherein, There is a difference between a first test impedance value corresponding to the test power supply and a second test impedance value of the impedance element, and this difference corresponds to an electrical insulation strength of the circuit element under test.

4. The detection circuit of claim 3, wherein, The difference is between 100 ohms and 10k ohms.

5. The detection circuit of claim 2, wherein, The current source is a constant current, which is a certain value between 1 mA and 30 mA.

6. The detection circuit of claim 1, wherein, The device further includes a processing unit coupled to the probe module, which is used to determine whether the first test voltage corresponds to a normal state of the circuit element under test when the first test voltage exceeds a threshold value.

7. The detection circuit of claim 1, wherein, The circuit under test includes a first circuit and a second circuit. The probe module includes a first probe element and a second probe element. When the first probe element and the second probe element are respectively coupled to the first circuit and the second circuit, and the switch module is turned on, the probe module, the power measurement unit and the impedance element form a loop with the circuit under test.

8. The detection circuit of claim 1, wherein, The first test voltage is a default voltage setting.

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