An achromatic far field super-resolution lens chip without side lobe and a manufacturing method thereof

Abstract

The application relates to an achromatic side lobe free far field super resolution lens chip and a manufacturing method, wherein the achromatic side lobe free far field super resolution lens chip comprises an ultrasonic lens group layer for eliminating chromatic aberration of a continuous wide wave band; a filter structure layer is arranged at a focal plane of the ultrasonic lens group layer and is bonded with the ultrasonic lens group layer, and is used for eliminating focal plane side lobe and increasing a field of view; meanwhile, the application also provides a manufacturing method of the chip; the application can realize the beneficial effects of simultaneously considering wide wave band achromatism and side lobe energy suppression.

Description

Technical Field

[0001] This invention relates to the field of information optics technology, and more specifically, to an achromatic, sidelobe-free far-field super-resolution lens chip and its fabrication method. Background Technology

[0002] Planar superoscillating lenses, based on the principle of superoscillation, precisely control the diffraction interference effect between individual diffraction units. This allows for electromagnetic oscillations exceeding the system's highest spatial frequency within a local region on the focal plane, thus enabling controllable adjustment of the lateral and axial dimensions of the diffraction focal region. Because planar superoscillating lenses can achieve focusing beyond the diffraction limit in the far field and offer significant advantages in mass production and low-cost deployment, they hold immense application potential in fields such as super-resolution optical microscopy, high-precision laser processing, and nanolithography.

[0003] Existing super-oscillating lenses typically exhibit the following characteristics in terms of focusing performance: firstly, there are unavoidable high-energy side lobes near the focal point; secondly, the focal point has a strong wavelength dependence, meaning the lens exhibits significant dispersion characteristics (the longer the wavelength, the shorter the focal length).

[0004] Because planar super-oscillating lenses possess high-energy sidelobes and severe dispersion, their field of view is small and their operating bandwidth is narrow, directly affecting their actual imaging performance. To address these issues, numerous research groups have produced results, but none of these results can simultaneously achieve both wide-band achromatic correction and sidelobe energy suppression. Summary of the Invention

[0005] The purpose of this invention is to overcome the defects of the prior art and to provide an achromatic, sidelobe-free far-field super-resolution lens chip and its fabrication method.

[0006] The present invention provides an achromatic, sidelobe-free far-field super-resolution lens chip, the technical solution of which is as follows:

[0007] An achromatic, sidelobe-free far-field super-resolution lens chip includes:

[0008] Super-oscillating lens group layer for chromatic aberration elimination across a continuous wide band;

[0009] A filter structure layer disposed at the focal plane of the super-oscillating lens group layer and bonded to the super-oscillating lens group layer, used to eliminate focal plane side lobes and increase the field of view.

[0010] Compared with the prior art, the technical solution provided by this invention application can bring at least the following beneficial effects: by setting a super-oscillating lens group layer and a filter structure layer, and bonding the super-oscillating lens group layer and the filter structure layer to form a chip structure, chromatic aberration is achieved over a wide band while the focal plane sidelobes are eliminated by relying on the filter structure layer, thereby achieving the beneficial effect of simultaneously achieving wide-band chromatic aberration and sidelobe energy suppression.

[0011] Preferably, the super-oscillating lens group layer includes several optical information processing units G for optical field distribution modulation of optical signals. The several optical information processing units G are stacked to form a multi-layer structure, and two adjacent optical information processing units G are seamlessly stacked. In this way, the optical signal can be jointly modulated by these optical information processing units G, thereby optimizing the chromatic aberration elimination mechanism and achieving precise control.

[0012] Preferably, the optical information processing unit G includes:

[0013] A lens layer used to focus multiple wavelength plane waves in the optical signal at the focal plane;

[0014] A spacer layer stacked on the lens layer to space and connect adjacent lens layers;

[0015] This increases the dimension of the structure's control over the light field, enabling the design of a single-layer super-oscillating lens for achromatic correction, which is beneficial for ultimately eliminating chromatic aberration in white light or related optical signals.

[0016] Preferably, the spacer layer includes a light-transmitting medium layer; this ensures optical path connectivity and controls energy flow.

[0017] Preferably, the filter structure layer includes a micro-nano pinhole structure layer; at the focal plane of the lens, the filtering and imaging modules are seamlessly integrated in a discrete manner, achieving the beneficial effect of achromatic white light and other signal light without sidelobes.

[0018] The present invention provides a method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip, the technical solution of which is as follows:

[0019] A method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip includes the following steps:

[0020] Step 1: Fabricate the super-oscillating lens group layer;

[0021] Step 2: Create the filter structure layer;

[0022] Step 3: Place the filter structure layer on the focal plane of the super-oscillating lens group layer, and integrate the super-oscillating lens group layer and the filter structure layer by glass bonding.

[0023] Compared with the prior art, the technical solution provided by this invention application can bring at least the following beneficial effects: This method first fabricates a super-oscillating lens group layer and a filter structure layer, and integrates the two through glass bonding, thereby obtaining an achromatic, sidelobe-free far-field super-resolution lens chip, effectively breaking through the inherent contradiction between field of view, bandwidth and resolution in the classical optical field, and providing a core white light super-resolution lens optical functional chip for the development of miniaturized, low-cost, and high-performance super-resolution microscopes with completely independent intellectual property rights.

[0024] Preferably, step one includes the following steps:

[0025] Step 1.1: Deposit a lens structure layer material on a smooth, visible light-transmitting substrate using plasma-enhanced chemical vapor deposition to form a structure layer;

[0026] Step 1.2: Spin-coat photoresist onto the structural layer, and pattern the structural layer using an ultraviolet lithography machine. After exposure and development, place it in a reactive ion etching machine to etch the phase modulation layer, thus forming a lens layer.

[0027] Step 1.3: Deposit a spacer layer on the lens layer using a coating equipment to form an optical information processing unit;

[0028] Step 1.4: Repeat steps 1.1-1.3 several times to obtain several optical information processing units;

[0029] Step 1.5: Integrate the super-oscillating lens group layer by seamlessly stacking the plurality of optical information processing units;

[0030] By leveraging advanced high-precision micro-nano manufacturing processes, seamless cascading of multi-layer super-oscillating lenses in the longitudinal direction can be achieved, which is beneficial for ultimately obtaining a white light achromatic far-field planar super-oscillating lens without side lobes, thus overcoming the inherent contradiction between large field of view and super-resolution, and between achromatic and super-resolution.

[0031] Preferably, after performing step 1.3 and before performing step 1.4, the following steps are performed:

[0032] Step 1.3.1: Use high-precision polishing equipment to polish and homogenize the excess film in the spacer layer;

[0033] This ensures high-quality coating of the thin film in the adjacent lens layer structure.

[0034] Preferably, step two includes the following steps:

[0035] Step 2.1: Use a silicon wafer with a single-sided silicon oxide thin film as the substrate layer for the filter pinholes;

[0036] Step 2.2: On the silicon oxide film surface of the substrate layer, a micro / nano metal light-blocking film is deposited using a lift-off process as a pinhole structure layer at the focal plane.

[0037] Step 2.3: After photolithography on the other side of the substrate layer, etch silicon vias to use the silicon oxide layer as a stop layer;

[0038] This allows for the successful synthesis of filter structures, achieving sidelobe elimination and effectively overcoming the inherent contradiction between field of view, bandwidth, and resolution in classical optics. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of an achromatic, sidelobe-free far-field super-resolution lens chip structure according to the present invention.

[0040] Figure 2 This is a flowchart illustrating the fabrication process of the super-oscillating lens assembly layer according to an embodiment of the present invention;

[0041] Figure 3 This is a flowchart illustrating the fabrication of the filter structure layer and the synthesis of the final chip in an embodiment of the present invention. Detailed Implementation

[0042] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0043] This invention provides an achromatic, sidelobe-free far-field super-resolution lens chip.

[0044] include:

[0045] Super-oscillating lens group layer for chromatic aberration elimination across a continuous wide band;

[0046] A filter structure layer is set at the focal plane of the super-oscillating lens group layer and bonded to the super-oscillating lens group layer to eliminate focal plane side lobes and increase the field of view.

[0047] In this embodiment, the super-oscillating lens group layer includes several optical information processing units G for optical field distribution modulation of optical signals. These several optical information processing units G are stacked to form a multi-layer structure, and two adjacent optical information processing units G are seamlessly stacked.

[0048] In this embodiment, the optical information processing unit G includes:

[0049] A lens layer used to focus multiple wavelength plane waves in an optical signal onto the focal plane;

[0050] A spacer layer is stacked on the lens layer to separate and connect adjacent lens layers.

[0051] In this embodiment, the spacer layer includes a light-transmitting dielectric layer. The filter structure layer includes a micro / nano pinhole structure layer. The lens layer and spacer layer are considered as an optical information processing unit G. Given multiple wavelengths of light as input, the light field distribution information after the light passes through this unit can be obtained using Rayleigh-Sommerfeld diffraction theory. The specific calculation formula is as follows:

[0052]

[0053] Where: g(ξ,η,f,λ)=exp(iknR)·(ikn-1 / R)·z / R 2 R 2 =ξ 2 +η 2 +f 2 k = 2π / λ, where n is the refractive index of the medium during propagation and λ is the wavelength.

[0054] This embodiment provides a method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip, comprising the following steps:

[0055] Step 1: Fabricate the super-oscillating lens group layer;

[0056] Step 2: Create the filter structure layer;

[0057] Step 3: Place the filter structure layer on the focal plane of the super-oscillating lens group layer, and integrate the super-oscillating lens group layer and the filter structure layer by glass bonding.

[0058] In this embodiment, step one includes the following steps:

[0059] Step 1.1: Deposit a lens structure layer material on a smooth, visible light-transmitting substrate using plasma-enhanced chemical vapor deposition to form a structure layer;

[0060] Step 1.2: Spin-coat photoresist onto the structural layer, and pattern the structural layer using an ultraviolet lithography machine. After exposure and development, place it in a reactive ion etching machine to etch the phase modulation layer, thus forming a lens layer.

[0061] Step 1.3: Deposit a spacer layer on the lens layer using a coating equipment to form an optical information processing unit;

[0062] Step 1.4: Repeat steps 1.1-1.3 several times to obtain several optical information processing units;

[0063] Step 1.5: Integrate these optical information processing units into a super-oscillating lens group layer by seamlessly stacking them.

[0064] In this embodiment, after step 1.3 and before step 1.4, the following steps are performed:

[0065] Step 1.3.1: Use high-precision polishing equipment to polish and homogenize the excess film in the spacer layer, thereby ensuring high-quality coating of the adjacent lens layer structural layer film.

[0066] In this embodiment, step two includes the following steps:

[0067] Step 2.1: Use a silicon wafer with a single-sided silicon oxide thin film as the substrate layer for the filter pinholes;

[0068] Step 2.2: On the silicon oxide film surface of the substrate, a micro / nano metal light-blocking film is deposited using a lift-off process as a pinhole structure layer at the focal plane.

[0069] Step 2.3: After photolithography, etch through-silicon vias on the other side of the substrate layer, using the silicon oxide layer as a stop layer.

[0070] This embodiment integrates a heterogeneous micro-nano pinhole structure at the focal plane of the lens, seamlessly integrating the filtering and imaging modules separately, ultimately obtaining a white light achromatic planar super-oscillating lens chip without side lobes. This effectively overcomes the inherent contradiction between field of view, bandwidth, and resolution in classical optics, providing a core white light super-resolution lens optical functional chip for the development of miniaturized, low-cost, and high-performance super-resolution microscopes with completely independent intellectual property rights.

[0071] Of course, in the actual manufacturing process, to achieve ultra-compact integration of the super-oscillating lens group layer and the filter structure layer, high-precision alignment, matching, and integration must be completed without compromising the optical performance of each module. When manufacturing the super-oscillating lens group layer, a layer-by-layer stacking method can be adopted, such as... Figure 2 As shown.

[0072] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An achromatic, sidelobe-free far-field super-resolution lens chip, characterized in that: include: Super-oscillating lens group layer for chromatic aberration elimination across a continuous wide band; A filter structure layer is disposed at the focal plane of the super-oscillating lens group layer and bonded to the super-oscillating lens group layer, used to eliminate the focal plane side lobes and increase the field of view; The super-oscillating lens group layer includes several optical information processing units G for optical field distribution modulation of optical signals. The several optical information processing units G are stacked to form a multi-layer structure, and two adjacent optical information processing units G are seamlessly stacked. The optical information processing unit G includes: A lens layer used to focus multiple wavelength plane waves in the optical signal at the focal plane; A spacer layer is stacked on the lens layer to space and connect adjacent lens layers.

2. The achromatic, sidelobe-free far-field super-resolution lens chip according to claim 1, characterized in that: The spacer layer includes a light-transmitting medium layer.

3. The achromatic, sidelobe-free far-field super-resolution lens chip according to claim 2, characterized in that: The filter structure layer includes a micro / nano pinhole structure layer.

4. A method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip, characterized in that: The method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip as described in any one of claims 1 to 3 includes the following steps: Step 1: Fabricate the super-oscillating lens group layer; Step 2: Create the filter structure layer; Step 3: Place the filter structure layer on the focal plane of the super-oscillating lens group layer, and integrate the super-oscillating lens group layer and the filter structure layer by glass bonding.

5. The method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip according to claim 4, characterized in that: Step one includes the following steps: Step 1.1: Deposit a lens structure layer material on a smooth, visible light-transmitting substrate using plasma-enhanced chemical vapor deposition to form a structure layer; Step 1.2: Spin-coat photoresist onto the structural layer, and pattern the structural layer using an ultraviolet lithography machine. After exposure and development, place it in a reactive ion etching machine to etch the phase modulation layer, thus forming a lens layer. Step 1.3: Deposit a spacer layer on the lens layer using a coating equipment to form an optical information processing unit; Step 1.4: Repeat steps 1.1-1.3 several times to obtain several optical information processing units; Step 1.5: The plurality of optical information processing units are seamlessly stacked to integrate the super-oscillating lens group layer.

6. The method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip according to claim 5, characterized in that: in After performing step 1.3, and before performing step 1.4, the following steps are performed: Step 1.3.1: Use high-precision polishing equipment to polish and homogenize the excess film in the spacer layer.

7. The method for fabricating an achromatic, sidelobe-free far-field super-resolution lens chip according to claim 6, characterized in that: Step two includes the following steps: Step 2.1: Use a silicon wafer with a single-sided silicon oxide thin film as the substrate layer for the filter pinholes; Step 2.2: On the silicon oxide film surface of the substrate layer, a micro / nano metal light-blocking film is deposited using a lift-off process as a pinhole structure layer at the focal plane. Step 2.3: After photolithography on the other side of the substrate layer, etch through-silicon vias to use the silicon oxide layer as a stop layer.

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